N/A

-

Production (Last Updated: 2 months ago)

Details

12084 LE

233 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

60

IGLOO2

1.2 V

Tray

M2GL010

活跃

表面贴装

FPBGA-484

484

484-FPBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

M2GL010

100 °C

-40 °C

1.14V ~ 2.625V

1.2 V

114 kB

12084

933888

1

N/A

-

Details

56520 LE

207 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

90

IGLOO2

1.2 V

Tray

M2GL060

活跃

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.2 V

30

有

M2GL060T-VFG400I

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.25

表面贴装

VFPBGA-400

YES

400-VFBGA (17x17)

400

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

M2GL060T

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B400

1.2 V

1.51 mm

现场可编程门阵列

56520

1869824

4 Transceiver

17 mm

17 mm

N/A

-

N

56520 LE

200 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

176

IGLOO2

1.2 V

Tray

M2GL060

活跃

BGA,

网格排列

PLASTIC/EPOXY

1.2 V

20

无

M2GL060TS-1FCS325I

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

表面贴装

FCBGA-325

YES

325-FCBGA (11x11)

325

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

M2GL060TS

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

compliant

S-PBGA-B325

1.2 V

现场可编程门阵列

56520

1869824

2 Transceiver

N/A

-

Details

56520 LE

207 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

90

IGLOO2

1.2 V

Tray

M2GL060

活跃

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.2 V

30

有

M2GL060T-1VFG400I

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.26

表面贴装

VFPBGA-400

YES

400-VFBGA (17x17)

400

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

M2GL060T

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B400

1.2 V

1.51 mm

现场可编程门阵列

56520

1869824

4 Transceiver

17 mm

17 mm

N/A

-

N

86184 LE

425 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

40

IGLOO2

Tray

M2GL090

活跃

1.2 V

27 X 27 MM, 1 MM PITCH, FBGA-676

网格排列

3

PLASTIC/EPOXY

BGA676,26X26,40

1.2 V

20

85 °C

无

M2GL090TS-FG676

BGA

SQUARE

活跃

MICROSEMI CORP

5.27

表面贴装

FPBGA-676

YES

676-FBGA (27x27)

676

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

M2GL090TS

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B676

425

不合格

1.2 V

1.2 V

OTHER

425

2.44 mm

现场可编程门阵列

86184

2648064

4 Transceiver

86316

27 mm

27 mm

N/A

-

Production (Last Updated: 2 months ago)

Details

27696 LE

207 I/O

1.14 V

0 C

+ 85 C

SMD/SMT

有

90

IGLOO2

Tray

M2GL025

活跃

8542390000

1.26 V

LFBGA, BGA400,20X20,32

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

未说明

85 °C

有

M2GL025-VFG400

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.52

BGA

表面贴装

VFBGA-400

YES

400

400-VFBGA (17x17)

400

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

M2GL025

有

85 °C

0 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

未说明

0.8 mm

compliant

400

S-PBGA-B400

207

不合格

1.2 V

1.2 V

OTHER

138 kB

667 Mb/s

207

1.51 mm

现场可编程门阵列

27696

1130496

4 Transceiver

27696

17 mm

17 mm

N/A

-

N

56520 LE

200 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

176

IGLOO2

1.2 V

Tray

M2GL060

活跃

BGA,

网格排列

PLASTIC/EPOXY

1.2 V

20

85 °C

无

M2GL060TS-FCS325

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

表面贴装

FCBGA-325

YES

325-FCBGA (11x11)

325

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

M2GL060TS

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

compliant

S-PBGA-B325

1.2 V

OTHER

现场可编程门阵列

56520

1869824

2 Transceiver

N/A

-

N

有

24

IGLOO2

1.2000 V

1.14 V

1.26 V

574

Tray

M2GL150

活跃

35 X 35 MM, 1 MM PITCH, FBGA-1152

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

1.2 V

20

1.14 V

85 °C

无

M2GL150TS-1FC1152

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

表面贴装

1152-BBGA, FCBGA

YES

1152-FCBGA (35x35)

1152

微芯片技术

This product may require additional documentation to export from the United States.

0 to 85 °C

Tray

M2GL150TS

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

1152

S-PBGA-B1152

574

不合格

1.2 V

OTHER

574

2.9 mm

现场可编程门阵列

146124

5120000

1

146124

35 mm

35 mm

N/A

-

N

86184 LE

180 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

176

IGLOO2

1.2 V

Tray

M2GL090

活跃

BGA, BGA325,21X21,20

网格排列

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

20

无

M2GL090-FCS325I

BGA

SQUARE

活跃

MICROSEMI CORP

5.27

表面贴装

FCBGA-325

YES

325-FCBGA (11x11)

325

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

M2GL090

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

240

compliant

S-PBGA-B325

180

不合格

1.2 V

1.2 V

180

现场可编程门阵列

86184

2648064

86316

N/A

-

Production (Last Updated: 2 months ago)

N

有

84

IGLOO2

248

Tray

M2GL150

活跃

FBGA,

GRID ARRAY, FINE PITCH

PLASTIC/EPOXY

1.2 V

20

1.14 V

85 °C

无

M2GL150T-FCV484

FBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

表面贴装

484-BFBGA

YES

484-FBGA (19x19)

484

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

M2GL150T

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B484

OTHER

3.15 mm

现场可编程门阵列

146124

5120000

19 mm

19 mm

N/A

-

N

56520 LE

207 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

90

IGLOO2

1.2 V

Tray

M2GL060

活跃

LFBGA,

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

1.2 V

20

无

M2GL060T-1VF400I

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.7

表面贴装

VFPBGA-400

YES

400-VFBGA (17x17)

400

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

M2GL060T

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B400

1.2 V

1.51 mm

现场可编程门阵列

56520

1869824

4 Transceiver

17 mm

17 mm

N/A

-

Production (Last Updated: 2 months ago)

N

12084 LE

233 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

60

IGLOO2

1.2 V

Tray

M2GL010

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

20

85 °C

无

M2GL010T-1FG484

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

表面贴装

FPBGA-484

YES

484-FPBGA (23x23)

484

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

M2GL010T

85 °C

0 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B484

233

不合格

1.2 V

1.2 V

OTHER

114 kB

233

2.44 mm

现场可编程门阵列

12084

933888

4 Transceiver

12084

23 mm

23 mm

N/A

-

Details

56520 LE

387 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

40

IGLOO2

1.2 V

Tray

M2GL060

活跃

表面贴装

FPBGA-676

676-FBGA (27x27)

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

M2GL060TS

1.14V ~ 2.625V

1.2 V

56520

1869824

4 Transceiver

N/A

-

Production (Last Updated: 2 months ago)

6060 LE

171 I/O

1.14 V

0 C

+ 85 C

SMD/SMT

有

90

IGLOO2

1.26 V

Tray

M2GL005

活跃

LFBGA, BGA400,20X20,32

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

30

85 °C

有

M2GL005-VFG400

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.29

87.9 kB

表面贴装

VFBGA-400

YES

400

400-VFBGA (17x17)

400

微芯片技术

Details

0°C ~ 85°C (TJ)

Tray

M2GL005

85 °C

0 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

not_compliant

S-PBGA-B400

171

不合格

1.2 V

1.2 V

OTHER

128 kB

667 Mb/s

171

1.51 mm

现场可编程门阵列

6060

719872

400 MHz

11

STD

6060

17 mm

17 mm

N/A

-

Details

有

24

IGLOO2

574

Tray

M2GL150

活跃

BGA, BGA1152,34X34,40

网格排列

4

PLASTIC/EPOXY

BGA1152,34X34,40

1.2 V

30

1.14 V

85 °C

有

M2GL150T-1FCG1152

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.3

表面贴装

1152-BBGA, FCBGA

YES

1152-FCBGA (35x35)

1152

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

M2GL150T

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B1152

574

不合格

1.2 V

OTHER

574

2.9 mm

现场可编程门阵列

146124

5120000

1

146124

35 mm

35 mm

N/A

-

Details

56520 LE

387 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

40

IGLOO2

1.2 V

Tray

M2GL060

活跃

表面贴装

FBGA-676

676-FBGA (27x27)

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

M2GL060T

1.14V ~ 2.625V

1.2 V

667 Mb/s

56520

1869824

4 Transceiver

N/A

-

Production (Last Updated: 2 months ago)

N

86184 LE

425 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

40

IGLOO2

1.2 V

Tray

M2GL090

活跃

27 X 27 MM, 1 MM PITCH, FBGA-676

网格排列

3

PLASTIC/EPOXY

BGA676,26X26,40

1.2 V

20

85 °C

无

M2GL090T-1FG676

BGA

SQUARE

活跃

MICROSEMI CORP

5.27

表面贴装

FPBGA-676

YES

676-FBGA (27x27)

676

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

M2GL090T

85 °C

0 °C

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B676

425

不合格

1.2 V

1.2 V

OTHER

323.3 kB

425

2.44 mm

现场可编程门阵列

86316

2648064

4 Transceiver

86316

27 mm

27 mm

N/A

-

146124 LE

248 I/O

1.14 V

- 40 C

+ 100 C

SMD/SMT

有

84

IGLOO2

1.26 V

Tray

M2GL150

活跃

19 X 19 MM, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-484

GRID ARRAY, FINE PITCH

4

PLASTIC/EPOXY

1.2 V

30

有

M2GL150-FCVG484I

FBGA

SQUARE

活跃

MICROSEMI CORP

5.27

表面贴装

FCBGA-484

YES

484-BGA

484

微芯片技术

Details

-40°C ~ 100°C (TJ)

Tray

M2GL150

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B484

1.2 V

667 Mb/s

3.15 mm

现场可编程门阵列

146124

5120000

4 Transceiver

19 mm

19 mm

N/A

-

N

12084 LE

233 I/O

1.14 V

- 55 C

+ 125 C

SMD/SMT

有

60

IGLOO2

0.761080 oz

1.26 V

Tray

M2GL010

活跃

23 X 23 MM, 1 MM PITCH, FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-55 °C

1.2 V

20

125 °C

无

M2GL010T-1FG484M

BGA

SQUARE

活跃

MICROSEMI CORP

5.27

表面贴装

FBGA-484

YES

484-FPBGA (23x23)

484

微芯片技术

This product may require additional documentation to export from the United States.

-55°C ~ 125°C (TJ)

Tray

M2GL010T

3A001.A.2.C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B484

233

不合格

1.2 V

1.2 V

MILITARY

667 Mb/s

233

2.44 mm

现场可编程门阵列

12084

933888

4 Transceiver

12084

23 mm

23 mm

N/A

-

Details

56520 LE

387 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

40

IGLOO2

1.2 V

Tray

M2GL060

活跃

27 X 27 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-676

网格排列

3

PLASTIC/EPOXY

1.2 V

有

M2GL060T-1FGG676I

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

表面贴装

FPBGA-676

YES

676-FBGA (27x27)

676

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

M2GL060T

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

1 mm

compliant

30

S-PBGA-B676

1.2 V

2.44 mm

现场可编程门阵列

56520

1869824

4 Transceiver

27 mm

27 mm

N/A

-

Production (Last Updated: 2 months ago)

Details

12084 LE

195 I/O

1.14 V

0 C

+ 85 C

SMD/SMT

有

90

IGLOO2

3 oz

1.26 V

Tray

M2GL010

活跃

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

30

85 °C

有

M2GL010T-VFG400

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.29

表面贴装

VFBGA-400

YES

400

400-VFBGA (17x17)

400

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

M2GL010T

85 °C

0 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B400

195

不合格

1.2 V

1.2 V

OTHER

114 kB

667 Mb/s

195

1.51 mm

现场可编程门阵列

12084

933888

4 Transceiver

12084

17 mm

17 mm

N/A

-

Production (Last Updated: 2 months ago)

N

12084 LE

233 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

60

IGLOO2

Tray

M2GL010

活跃

8542390000, 8542390000/8542390000, 8542390000/8542390000/8542390000, 8542390000/8542390000/8542390000/8542390000

1.2 V

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

20

无

M2GL010T-1FG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

表面贴装

FPBGA-484

YES

484-FPBGA (23x23)

484

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

M2GL010T

100 °C

-40 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B484

233

不合格

1.2 V

1.2 V

114 kB

233

2.44 mm

现场可编程门阵列

12084

933888

1

4 Transceiver

12084

23 mm

23 mm

N/A

-

Details

27696 LE

180 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

176

IGLOO2

1.2 V

Tray

M2GL025

活跃

BGA, BGA325,21X21,20

网格排列

3

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

30

有

M2GL025TS-FCSG325I

BGA

SQUARE

活跃

MICROSEMI CORP

5.2

表面贴装

FCBGA-325

YES

325-FCBGA (11x11)

325

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

M2GL025TS

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

260

compliant

S-PBGA-B325

180

不合格

1.2 V

1.2 V

180

现场可编程门阵列

27696

1130496

2 Transceiver

27696

N/A

-

N

12084 LE

233 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

60

IGLOO2

Tray

M2GL010

活跃

1.2 V

23 X 23 MM, 1 MM PITCH, FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

20

无

M2GL010-FG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.27

表面贴装

FPBGA-484

YES

484-FPBGA (23x23)

484

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

M2GL010

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B484

233

不合格

1.2 V

1.2 V

233

2.44 mm

现场可编程门阵列

12084

933888

STD

12084

23 mm

23 mm

N/A

-

Details

有

176

IGLOO2

200

Tray

M2GL050

活跃

11 X 11 MM, 0.50 MM PITCH, ROHS COMPLIANT, FBGA-325

网格排列

3

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

1.14 V

85 °C

有

M2GL050TS-1FCSG325

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

表面贴装

325-TFBGA, FCBGA

YES

325-FCBGA (11x11)

325

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

M2GL050TS

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

260

compliant

30

S-PBGA-B325

200

不合格

1.2 V

OTHER

200

现场可编程门阵列

56340

1869824

56340