类别是'存储器'
存储器 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 包装/外壳 | 表面安装 | 终端数量 | 操作温度 | 包装 | 系列 | JESD-609代码 | 无铅代码 | ECCN 代码 | 类型 | 端子表面处理 | 附加功能 | HTS代码 | 子类别 | 技术 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | 引脚数量 | JESD-30代码 | 资历状况 | 电源电压-最大值(Vsup) | 电源 | 温度等级 | 电源电压-最小值(Vsup) | 内存大小 | 端口的数量 | 操作模式 | 电源电流-最大值 | 访问时间 | 建筑学 | 组织结构 | 输出特性 | 座位高度-最大 | 内存宽度 | 地址总线宽度 | 产品类别 | 密度 | 待机电流-最大值 | 记忆密度 | 筛选水平 | 并行/串行 | I/O类型 | 内存IC类型 | 串行总线类型 | 耐力 | 写入周期时间 - 最大值 | 数据保持时间 | 写入保护 | 待机电压-最小值 | 备用内存宽度 | 产品类别 | 长度 | 宽度 | |||||||||||||||||||||||||||||||||||||||||||||
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![]() | GS8161E32DGT-200IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 200 MHz | + 85 C | 2.7 V | - 40 C | 18 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | Details | SDR | SRAM | TQFP-100 | 有 | Tray | GS8161E32DGT | DCD Pipeline/Flow Through | Memory & Data Storage | 18 Mbit | 225 mA, 230 mA | 6.5 ns | 512 k x 32 | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342DT07BGD-333 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | FBGA | QDR | 1.8000 V | Synchronous | 4 MWords | 8 Bit | 表面贴装 | 有 | 333 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | Details | DDR | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 3 | 4000000 | PLASTIC/EPOXY | BGA165,11X15,40 | 未说明 | 0.45 ns | 85 °C | 有 | GS8342DT07BGD-333 | 333 MHz | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.36 | BGA | Commercial grade | SRAM | BGA-165 | YES | 165 | 333 MHz | 0 to 85 °C | Tray | GS8342DT07BGD | e1 | 有 | 3A991.B.2.B | SigmaQuad-II+ B4 | Tin/Silver/Copper (Sn/Ag/Cu) | Memory & Data Storage | CMOS | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | 165 | R-PBGA-B165 | 不合格 | 1.9 V | 1.5/1.8,1.8 V | OTHER | 1.7 V | 36 Mbit | 2 | SYNCHRONOUS | 605 mA | Pipelined | 4 M x 8 | 3-STATE | 1.4 mm | 8 | 20 Bit | 36 Mbit | 33554432 bit | Commercial | PARALLEL | SEPARATE | QDR SRAM | 1.7 V | SRAM | 15 mm | 13 mm | ||||||||||||||
![]() | GS880Z18CGT-200 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | TQFP | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 512 kWords | 18 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 200 MHz | + 70 C | 3.6 V | 0 C | 72 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | Details | SDR | Commercial grade | SRAM | TQFP-100 | 153.8@Flow-Through/200@Pipelined MHz | 0 to 70 °C | Tray | GS880Z18CGT | NBT | Memory & Data Storage | 100 | 9 Mbit | 1 | 130 mA, 155 mA | 6.5 ns | Flow-Through/Pipelined | 512 k x 18 | 18 Bit | 9 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS816236DGD-333V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 512 kWords | 36 Bit | 2, 2.7 V | 表面贴装 | 有 | 333 MHz | + 70 C | 2.7 V | 0 C | 18 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | Commercial grade | SRAM | BGA-165 | 200@Flow-Through/333@Pipelined MHz | 0 to 85 °C | Tray | GS816236DGD | Pipeline/Flow Through | Memory & Data Storage | 165 | 18 Mbit | 4 | 240 mA, 310 mA | 5 ns | Flow-Through/Pipelined | 512 k x 36 | 19 Bit | 18 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS88218CB-150I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | + 85 C | 3.6 V | - 40 C | 2.3 V | SMD/SMT | Parallel | BGA-119 | 150 MHz | GS88218CB | 9 Mbit | 140 mA, 150 mA | 7.5 ns | 512 k x 18 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342QT07BGD-200I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 8 Bit | 1.9 V | 表面贴装 | 有 | 200 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | Details | DDR | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 3 | 4000000 | PLASTIC/EPOXY | BGA165,11X15,40 | -40 °C | 未说明 | 0.45 ns | 85 °C | 有 | GS8342QT07BGD-200I | 200 MHz | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.22 | BGA | Industrial grade | SRAM | BGA-165 | YES | 165 | 200 MHz | -40 to 100 °C | Tray | GS8342QT07BGD | e1 | 有 | 3A991.B.2.B | SigmaQuad-II+ B2 | Tin/Silver/Copper (Sn/Ag/Cu) | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | 165 | R-PBGA-B165 | 不合格 | 1.9 V | 1.5/1.8,1.8 V | INDUSTRIAL | 1.7 V | 36 Mbit | 2 | SYNCHRONOUS | 565 mA | Pipelined | 4 M x 8 | 3-STATE | 1.4 mm | 8 | 21 Bit | 36 Mbit | 33554432 bit | Industrial | PARALLEL | SEPARATE | QDR SRAM | 1.7 V | SRAM | 15 mm | 13 mm | |||||||||
![]() | GS8342DT07BD-300 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | FBGA | QDR | 1.8000 V | Synchronous | 4 MWords | 8 Bit | 表面贴装 | 有 | 300 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | N | DDR | Commercial grade | SRAM | BGA-165 | 300 MHz | 0 to 85 °C | Tray | GS8342DT07BD | SigmaQuad-II+ B4 | Memory & Data Storage | 165 | 36 Mbit | 2 | 530 mA | Pipelined | 4 M x 8 | 20 Bit | 36 Mbit | Commercial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8322Z18AGB-333 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 2 MWords | 18 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 333 MHz | + 70 C | 3.6 V | 0 C | 14 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | Details | SDR | BGA, BGA119,7X17,50 | 网格排列 | 3 | 2000000 | PLASTIC/EPOXY | BGA119,7X17,50 | 未说明 | 4.5 ns | 70 °C | 有 | GS8322Z18AGB-333 | 333 MHz | 2.5 V | BGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.13 | BGA | Commercial grade | SRAM | BGA-119 | YES | 119 | 222.2@Flow-Through/333@Pipelined MHz | 0 to 85 °C | Tray | GS8322Z18AGB | e1 | 有 | 3A991.B.2.B | NBT Pipeline/Flow Through | Tin/Silver/Copper (Sn/Ag/Cu) | ALSO OPERATES AT 3.3V SUPPLY, PIPELINED ARCHITECTURE, FLOW THROUGH | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 260 | 1 | 1.27 mm | compliant | 119 | R-PBGA-B119 | 不合格 | 2.7 V | 2.5/3.3 V | COMMERCIAL | 2.3 V | 36 Mbit | 2 | SYNCHRONOUS | 235 mA, 320 mA | 4.5 ns | Flow-Through/Pipelined | 2 M x 18 | 3-STATE | 1.99 mm | 18 | 21 Bit | 36 Mbit | 0.03 A | 37748736 bit | Commercial | PARALLEL | COMMON | ZBT SRAM | 2.3 V | SRAM | 22 mm | 14 mm | ||||||||
![]() | GS8672D38BGE-500I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 500 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | Details | QDR-II | SRAM | BGA-165 | 有 | Tray | GS8672D38BGE | SigmaQuad-II+ B4 | Memory & Data Storage | 72 Mbit | 2.25 A | 2 M x 36 | 72 | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8161E36DGD-150V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 512 kWords | 36 Bit | 2, 2.7 V | 表面贴装 | 有 | 150 MHz | + 70 C | 2.7 V | 0 C | 18 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | Commercial grade | SRAM | BGA-165 | 133.3@Flow-Through/150@Pipelined MHz | 0 to 70 °C | Tray | GS8161E36DGD | DCD Pipeline/Flow Through | Memory & Data Storage | 165 | 18 Mbit | 4 | 175 mA, 190 mA | 7.5 ns | Flow-Through/Pipelined | 512 k x 36 | 19 Bit | 18 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342D09BD-250I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 1.8000 V | 1.7 V | Synchronous | 9 Bit | 1.9 V | 有 | 250 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II | DDR | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 4000000 | PLASTIC/EPOXY | BGA165,11X15,40 | -40 °C | 0.45 ns | 85 °C | 无 | GS8342D09BD-250I | 250 MHz | 4194304 words | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.35 | BGA | Industrial grade | SRAM | BGA-165 | YES | 165 | 250 MHz | -40 to 100 °C | Tray | GS8342D09BD | 3A991.B.2.B | SigmaQuad-II | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 1 | 1 mm | compliant | 165 | R-PBGA-B165 | 不合格 | 1.9 V | 1.5/1.8,1.8 V | INDUSTRIAL | 1.7 V | 36 Mbit | SYNCHRONOUS | 470 mA | 0.45 | 4 M x 9 | 3-STATE | 1.4 mm | 9 | 0.195 A | 36 | Industrial | PARALLEL | SEPARATE | QDR SRAM | 1.7 V | SRAM | 15 mm | 13 mm | |||||||||||||||||||||
![]() | GS8672Q18BGE-200I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | + 85 C | 1.9 V | - 40 C | 1.7 V | SMD/SMT | Parallel | BGA-165 | 200 MHz | 72 Mbit | 870 mA | 4 M x 18 | 72 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342QT37BGD-200 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 1 MWords | 36 Bit | 1.9 V | 表面贴装 | 有 | 200 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | Details | DDR | Commercial grade | SRAM | BGA-165 | 200 MHz | 0 to 85 °C | Tray | GS8342QT37BGD | SigmaQuad-II+ B2 | Memory & Data Storage | 165 | 36 Mbit | 2 | 640 mA | Pipelined | 1 M x 36 | 19 Bit | 36 Mbit | Commercial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342T06BD-400 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | FBGA | DDR | 1.8000 V | Synchronous | 4 MWords | 8 Bit | 表面贴装 | 400 MHz | + 70 C | 1.9 V | 0 C | 1.7 V | SMD/SMT | Parallel | Commercial grade | BGA-165 | 400 MHz | 0 to 85 °C | 165 | 36 Mbit | 1 | 600 mA | Pipelined | 4 M x 8 | 36 Mbit | Commercial | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8161Z36DGT-250IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | TQFP | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 512 kWords | 36 Bit | 2, 2.7 V | 表面贴装 | Industrial grade | 181.8@Flow-Through/250@Pipelined MHz | -40 to 100 °C | 100 | 4 | Flow-Through/Pipelined | 19 Bit | 18 Mbit | Industrial | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8160E18DGT-200I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 200 MHz | + 100 C | 3.6 V | - 40 C | 36 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | SRAM | TQFP-100 | 有 | Tray | GS8160E18DGT | Pipeline/Flow Through | Memory & Data Storage | 18 Mbit | 215 mA | 6.5 ns | 1 M x 18 | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342Q19BGD-200I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 18 Bit | 1.9 V | 表面贴装 | 有 | 200 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | Details | DDR | Industrial grade | SRAM | BGA-165 | 200 MHz | -40 to 100 °C | Tray | GS8342Q19BGD | SigmaQuad-II+ B2 | Memory & Data Storage | 165 | 36 Mbit | 2 | 565 mA | Pipelined | 2 M x 18 | 20 Bit | 36 Mbit | Industrial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 93LC56C-I/PG | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | IN-LINE | 128 | PLASTIC/EPOXY | DIP8,.3 | -40 °C | 未说明 | 85 °C | 有 | 93LC56C-I/PG | 2 MHz | 128 words | 5 V | DIP | RECTANGULAR | Microchip Technology Inc | 活跃 | MICROCHIP TECHNOLOGY INC | 5.25 | DIP | NO | 8 | DIP, DIP8,.3 | e3 | 有 | EAR99 | Matte Tin (Sn) | 8542.32.00.51 | EEPROMs | CMOS | DUAL | THROUGH-HOLE | 未说明 | 1 | 2.54 mm | compliant | 8 | R-PDIP-T8 | 不合格 | 5.5 V | 3/5 V | INDUSTRIAL | 2.5 V | SYNCHRONOUS | 0.002 mA | 128X16 | 5.334 mm | 16 | 0.000001 A | 2048 bit | SERIAL | EEPROM | MICROWIRE | 1000000 Write/Erase Cycles | 6 ms | 200 | SOFTWARE | 8 | 9.271 mm | 7.62 mm | |||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8182D18BGD-333 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 333 MHz | + 70 C | 1.9 V | 0 C | 18 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II | Details | DDR | LBGA, | GRID ARRAY, LOW PROFILE | 3 | 1000000 | PLASTIC/EPOXY | 未说明 | 0.45 ns | 70 °C | 有 | GS8182D18BGD-333 | 1048576 words | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.18 | BGA | SRAM | BGA-165 | YES | 165 | 有 | Tray | GS8182D18BGD | e1 | 有 | 3A991.B.2.B | SigmaQuad-II | Tin/Silver/Copper (Sn/Ag/Cu) | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | 165 | R-PBGA-B165 | 不合格 | 1.9 V | COMMERCIAL | 1.7 V | 18 Mbit | SYNCHRONOUS | 515 mA | 1 M x 18 | 1.4 mm | 18 | 18874368 bit | PARALLEL | DDR SRAM | SRAM | 15 mm | 13 mm | ||||||||||||||||||||||||||||||||
![]() | GS8672Q38BE-450I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 450 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | QDR-II | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 2000000 | PLASTIC/EPOXY | BGA165,11X15,40 | -40 °C | 0.45 ns | 85 °C | 无 | GS8672Q38BE-450I | 450 MHz | 2097152 words | 1.8 V | LBGA | RECTANGULAR | Obsolete | GSI TECHNOLOGY | 5.92 | BGA | SRAM | BGA-165 | YES | 165 | 有 | Tray | GS8672Q38BE | 3A991.B.2.B | SigmaQuad-II+ B2 | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 1 | 1 mm | compliant | 165 | R-PBGA-B165 | 不合格 | 1.9 V | 1.5,1.8 V | INDUSTRIAL | 1.7 V | 72 Mbit | SYNCHRONOUS | 2.07 A | 2 M x 36 | 3-STATE | 1.4 mm | 36 | 72 | PARALLEL | SEPARATE | QDR SRAM | 1.7 V | SRAM | 15 mm | 13 mm | ||||||||||||||||||||||||||||||||
![]() | GS832218AB-250 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 2 MWords | 18 Bit | 2.7, 3.6 V | 表面贴装 | 250 MHz | + 70 C | 3.6 V | 0 C | 2.3 V | SMD/SMT | Parallel | BGA, BGA119,7X17,50 | 网格排列 | 2000000 | PLASTIC/EPOXY | BGA119,7X17,50 | 未说明 | 5.5 ns | 70 °C | 无 | GS832218AB-250 | 250 MHz | 2.5 V | BGA | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.11 | BGA | Commercial grade | BGA-119 | YES | 119 | 181.8@Flow-Through/250@Pipelined MHz | 0 to 85 °C | e0 | 无 | 3A991.B.2.B | Tin/Lead (Sn/Pb) | ALSO OPERATES AT 3.3V SUPPLY, PIPELINED ARCHITECTURE, FLOW THROUGH | 8542.32.00.41 | SRAMs | CMOS | BOTTOM | BALL | 未说明 | 1 | 1.27 mm | compliant | 119 | R-PBGA-B119 | 不合格 | 2.7 V | 2.5/3.3 V | COMMERCIAL | 2.3 V | 36 Mbit | 2 | SYNCHRONOUS | 215 mA, 255 mA | 5.5 ns | Flow-Through/Pipelined | 2 M x 18 | 3-STATE | 1.99 mm | 18 | 21 Bit | 36 Mbit | 0.03 A | 37748736 bit | Commercial | PARALLEL | COMMON | 缓存SRAM | 2.3 V | 22 mm | 14 mm | ||||||||||||||||||||
![]() | GS8342Q18BGD-333 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 18 Bit | 1.9 V | 表面贴装 | 有 | 333 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II | Details | DDR | Commercial grade | SRAM | BGA-165 | 333 MHz | 0 to 85 °C | Tray | GS8342Q18BGD | SigmaQuad-II | Memory & Data Storage | 165 | 36 Mbit | 2 | 885 mA | Pipelined | 2 M x 18 | 20 Bit | 36 Mb | Commercial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS88236CB-250 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 250 MHz | + 70 C | 3.6 V | 0 C | 42 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | N | SDR | BGA, | 网格排列 | 256000 | PLASTIC/EPOXY | 未说明 | 5.5 ns | 70 °C | 无 | GS88236CB-250 | 262144 words | 2.5 V | BGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.13 | BGA | SRAM | BGA-119 | YES | 119 | 有 | Tray | GS88236CB | e0 | 无 | 3A991.B.2.B | Pipeline/Flow Through | Tin/Lead (Sn/Pb) | PIPELINED/FLOW-THROUGH ARCHITECTURE, IT ALSO OPERATES WITH 3 V TO 3.6 V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1.27 mm | compliant | 119 | R-PBGA-B119 | 不合格 | 2.7 V | COMMERCIAL | 2.3 V | 9 Mbit | SYNCHRONOUS | 155 mA, 195 mA | 5.5 ns | 256 k x 36 | 1.77 mm | 36 | 9437184 bit | PARALLEL | 缓存SRAM | SRAM | 22 mm | 14 mm | ||||||||||||||||||||||||||||||||
![]() | GS8161E18DGD-200I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 1 MWords | 18 Bit | 2.7, 3.6 V | 表面贴装 | LBGA, | GRID ARRAY, LOW PROFILE | 1000000 | PLASTIC/EPOXY | -40 °C | 未说明 | 6.5 ns | 85 °C | 有 | GS8161E18DGD-200I | 2.5 V | LBGA | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.29 | BGA | Industrial grade | YES | 165 | 153.8@Flow-Through/200@Pipelined MHz | -40 to 85 °C | 3A991.B.2.B | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY | 8542.32.00.41 | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | 165 | R-PBGA-B165 | 不合格 | 2.7 V | INDUSTRIAL | 2.3 V | 2 | SYNCHRONOUS | Flow-Through/Pipelined | 1MX18 | 1.4 mm | 18 | 20 Bit | 18 Mbit | 18874368 bit | Industrial | PARALLEL | 缓存SRAM | 15 mm | 13 mm | |||||||||||||||||||||||||||||||||||||||||
![]() | GS8182S36BD-167 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | + 70 C | 1.9 V | 0 C | 1.7 V | SMD/SMT | Parallel | BGA-165 | 167 MHz | GS8182S36BD | 18 Mbit | 380 mA | 512 k x 36 |