类别是'评估板 - 嵌入式 - 复杂逻辑器件（FPGA, CPLD）'
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 终端数量 | 厂商 | 操作温度 | 系列 | JESD-609代码 | 无铅代码 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 端子间距 | Reach合规守则 | 频率 | 引脚数量 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源 | 温度等级 | 最大电源电压 | 最小电源电压 | 内存大小 | 工作电源电流 | 内存大小 | 传播延迟 | 接通延迟时间 | 输入数量 | 组织结构 | 座位高度-最大 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 阀门数量 | 最高频率 | LABs数量/ CLBs数量 | 逻辑块数(LABs) | 速度等级 | 输出功能 | 宏细胞数 | 寄存器数量 | CLB-Max的组合延时 | 逻辑块数量 | JTAG BST | 逻辑单元数 | 等效门数 | 系统内可编程 | 高度 | 长度 | 宽度 | 辐射硬化 | 无铅 | ||||||||||||||||||||||||||||||
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 | A3P400-FG484I | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 无 | Obsolete | MICROSEMI CORP | BGA, | 7.76 | 350 MHz | 3 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | SQUARE | 网格排列 | 1.575 V | 1.5 V | 30 | 1.425 V | YES | 484 | A3P400-FG484I | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B484 | 不合格 | INDUSTRIAL | 9216 CLBS, 400000 GATES | 2.44 mm | 现场可编程门阵列 | 9216 | 400000 | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A3P600-FGG144 | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Production (Last Updated: 1 month ago) | 有 | 活跃 | MICROSEMI CORP | LBGA, | 0.76 | 350 MHz | 3 | 85 °C | PLASTIC/EPOXY | LBGA | SQUARE | GRID ARRAY, LOW PROFILE | 1.575 V | 1.5 V | 40 | 8542310000/8542310000/8542310000/8542310000/8542310000 | 97 | Compliant | Tray | A3P600 | 活跃 | 1.425 V | 13.5 kB | 表面贴装 | 表面贴装 | 144-LBGA | YES | 144 | 144-FPBGA (13x13) | 144 | 微芯片技术 | A3P600-FGG144 | 0°C ~ 85°C (TJ) | ProASIC3 | e1 | 3A001.A.7.A | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | 8542.39.00.01 | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | 231 MHz | S-PBGA-B144 | 不合格 | 1.5 V | COMMERCIAL | 1.575 V | 1.425 V | 5 mA | 13.5 kB | 13824 CLBS, 600000 GATES | 1.55 mm | 现场可编程门阵列 | 6500 | 110592 | 600000 | 231 MHz | STD | 13824 | 13824 | 600000 | 1.05 mm | 13 mm | 13 mm | 无 | 无铅 | ||||||||||||||||||||||||||
| APA450-FG484I | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Production (Last Updated: 1 month ago) | 无 | 活跃 | MICROSEMI CORP | BGA, BGA484,22X22,40 | 5.25 | 180 MHz | 2.7 V | 2.5 V | 30 | 网格排列 | SQUARE | BGA484,22X22,40 | BGA | PLASTIC/EPOXY | -40 °C | 85 °C | 3 | 344 | Compliant | Tray | APA450 | 活跃 | 2.3 V | Lead, Tin | 表面贴装 | 表面贴装 | 484-BGA | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | 微芯片技术 | APA450-FG484I | -40°C ~ 85°C (TA) | ProASICPLUS | e0 | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | 8542.39.00.01 | 2.3V ~ 2.7V | BOTTOM | BALL | 225 | 1 mm | unknown | 180 MHz | S-PBGA-B484 | 344 | 不合格 | 2.5 V | 2.5,2.5/3.3 V | INDUSTRIAL | 2.7 V | 2.3 V | 13.5 kB | 344 | 450000 GATES | 2.44 mm | 现场可编程门阵列 | 110592 | 450000 | 180 MHz | STD | 12288 | 12288 | 450000 | 1.73 mm | 25 mm | 25 mm | 无 | 含铅 | ||||||||||||||||||||||||
| AFS250-FG256I | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Production (Last Updated: 2 months ago) | 无 | 活跃 | MICROSEMI CORP | LBGA, | 1.8 | 3 | 85 °C | -40 °C | PLASTIC/EPOXY | LBGA | SQUARE | GRID ARRAY, LOW PROFILE | 1.575 V | 1.5 V | 30 | 1.5000 V | 114 | Tray | AFS250 | 活跃 | Compliant | 1.425 V | 表面贴装 | 表面贴装 | 256-LBGA | YES | 256 | 256-FPBGA (17x17) | 400.011771 mg | 256 | 微芯片技术 | AFS250-FG256I | -40 to 85 °C | Fusion® | e0 | 3A001.A.7.A | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | 8542.39.00.01 | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | unknown | 1.0989 GHz | S-PBGA-B256 | 不合格 | 1.5 V | INDUSTRIAL | 1.575 V | 1.425 V | 4.5 kB | 6144 CLBS, 250000 GATES | 1.68 mm | 现场可编程门阵列 | 36864 | 250000 | 1.0989 GHz | STD | 6144 | 6144 | 250000 | 1.2 mm | 17 mm | 17 mm | 无 | |||||||||||||||||||||||||||||
| AX125-1FGG256 | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Obsolete (Last Updated: 2 months ago) | 有 | Obsolete | MICROSEMI CORP | LBGA, BGA256,16X16,40 | 5.8 | 763 MHz | 3 | 70 °C | PLASTIC/EPOXY | LBGA | BGA256,16X16,40 | SQUARE | GRID ARRAY, LOW PROFILE | 1.575 V | 1.5 V | 40 | 138 | Compliant | 1.425 V | 表面贴装 | YES | 256 | 400.011771 mg | 256 | AX125-1FGG256 | e1 | 锡银铜 | 70 °C | 0 °C | 125000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | BOTTOM | BALL | 260 | 1 mm | compliant | 763 MHz | S-PBGA-B256 | 168 | 不合格 | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | COMMERCIAL | 1.575 V | 1.425 V | 2.3 kB | 850 ps | 850 ps | 168 | 1344 CLBS, 125000 GATES | 1.7 mm | 现场可编程门阵列 | 1344 | 125000 | 763 MHz | 1344 | 1 | 1344 | 0.84 ns | 1344 | 2016 | 125000 | 1.2 mm | 17 mm | 17 mm | 无 | |||||||||||||||||||||||||||||||
| A1440A-1TQG176I | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 85 °C | -40 °C | PLASTIC/EPOXY | LFQFP | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | 5.5 V | 5 V | 40 | 150 MHz | 5.76 | LFQFP, | MICROSEMI CORP | Obsolete | 有 | A1440A-1TQG176I | 4.5 V | YES | 176 | 3 | e3 | 哑光锡 | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | S-PQFP-G176 | 不合格 | INDUSTRIAL | 564 CLBS, 4000 GATES | 1.6 mm | 现场可编程门阵列 | 2.6 ns | 564 | 4000 | 24 mm | 24 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A1240A-1TQG176C | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 有 | Obsolete | MICROSEMI CORP | 1.40 MM, TQFP-176 | 5.8 | 80 MHz | 3 | 70 °C | PLASTIC/EPOXY | LFQFP | QFP176,1.0SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | 5.25 V | 5 V | 40 | 104 | Compliant | 4.75 V | 表面贴装 | YES | 176 | 176 | A1240A-1TQG176C | e3 | 哑光锡 | 70 °C | 0 °C | MAX 104 I/OS | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | 110 MHz | S-PQFP-G176 | 104 | 不合格 | 5 V | 5 V | COMMERCIAL | 5.25 V | 4.75 V | 4.3 ns | 104 | 684 CLBS, 4000 GATES | 1.6 mm | 现场可编程门阵列 | 684 | 4000 | 684 | 1 | 568 | 4.3 ns | 684 | 684 | 4000 | 24 mm | 24 mm | 无 | ||||||||||||||||||||||||||||||||||||||
| A3P400-FG484 | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 无 | Obsolete | MICROSEMI CORP | BGA, | 7.76 | 350 MHz | 3 | 85 °C | PLASTIC/EPOXY | BGA | SQUARE | 网格排列 | 1.575 V | 1.5 V | 30 | 1.425 V | YES | 484 | A3P400-FG484 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B484 | 不合格 | COMMERCIAL | 9216 CLBS, 400000 GATES | 2.44 mm | 现场可编程门阵列 | 9216 | 400000 | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A3P400-FG144 | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 无 | 活跃 | MICROSEMI CORP | 13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144 | 5.25 | 350 MHz | 3 | 85 °C | PLASTIC/EPOXY | LBGA | SQUARE | GRID ARRAY, LOW PROFILE | 1.575 V | 1.5 V | 30 | 1.5000 V | 1.425 V | 1.575 V | 97 | Tray | A3P400 | 活跃 | 1.425 V | 表面贴装 | 144-LBGA | YES | 144-FPBGA (13x13) | 144 | 微芯片技术 | A3P400-FG144 | 0 to 70 °C | ProASIC3 | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B144 | 不合格 | COMMERCIAL | 9216 CLBS, 400000 GATES | 1.55 mm | 现场可编程门阵列 | 55296 | 400000 | STD | 9216 | 400000 | 13 mm | 13 mm | ||||||||||||||||||||||||||||||||||||||||||||
| A10V10B-PLG68C | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 有 | Obsolete | MICROSEMI CORP | QCCJ, LDCC68,1.0SQ | 5.81 | 50 MHz | 3 | 70 °C | PLASTIC/EPOXY | QCCJ | LDCC68,1.0SQ | SQUARE | CHIP CARRIER | 3.6 V | 3.3 V | 40 | 57 | Compliant | 3 V | 表面贴装 | YES | 68 | A10V10B-PLG68C | e3 | 哑光锡 | 70 °C | 0 °C | MAX 57 I/OS | QUAD | J BEND | 245 | 1.27 mm | compliant | S-PQCC-J68 | 57 | 不合格 | 3.3 V | 3.3 V | COMMERCIAL | 6.5 ns | 57 | 295 CLBS, 1200 GATES | 4.445 mm | 现场可编程门阵列 | 1200 | 295 | 147 | 4.5 ns | 295 | 295 | 1200 | 24.13 mm | 24.13 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||
| A3P600-FG484 | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Production (Last Updated: 1 month ago) | PLASTIC/EPOXY | BGA | SQUARE | 网格排列 | 1.575 V | 1.5 V | 30 | 3 | 350 MHz | 1.54 | 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484 | MICROSEMI CORP | 活跃 | 无 | A3P600-FG484 | 8542310000/8542310000/8542310000/8542310000/8542310000 | 235 | Compliant | Tray | A3P600 | 活跃 | 1.425 V | 表面贴装 | 表面贴装 | 484-BGA | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | 微芯片技术 | 85 °C | 0°C ~ 85°C (TJ) | ProASIC3 | e0 | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | 8542.39.00.01 | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B484 | 不合格 | 1.5 V | COMMERCIAL | 1.575 V | 1.425 V | 13.5 kB | 13824 CLBS, 600000 GATES | 2.44 mm | 现场可编程门阵列 | 110592 | 600000 | 231 MHz | STD | 13824 | 13824 | 600000 | 1.73 mm | 23 mm | 23 mm | 无 | |||||||||||||||||||||||||||||||
| AX250-FG484I | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 无 | 活跃 | MICROSEMI CORP | BGA, BGA484,22X22,40 | 1.64 | 649 MHz | 3 | 85 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA484,22X22,40 | SQUARE | 网格排列 | 1.575 V | 1.5 V | 30 | 1.5000 V | 1.425 V | 1.575 V | 248 | Tray | AX250 | 活跃 | 1.425 V | 表面贴装 | 484-BGA | YES | 484-FPBGA (23x23) | 484 | 微芯片技术 | AX250-FG484I | -40 to 85 °C | Axcelerator | e0 | Tin/Lead (Sn/Pb) | 250000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | unknown | S-PBGA-B484 | 248 | 不合格 | 1.5,1.5/3.3,2.5/3.3 V | INDUSTRIAL | 248 | 2816 CLBS, 250000 GATES | 2.44 mm | 现场可编程门阵列 | 55296 | 250000 | 4224 | STD | 0.99 ns | 2816 | 4224 | 250000 | 27 mm | 27 mm | |||||||||||||||||||||||||||||||||||
| A1280A-1PQ160I | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 无 | Obsolete | MICROSEMI CORP | PLASTIC, QFP-160 | 5.84 | 75 MHz | 3 | 85 °C | -40 °C | PLASTIC/EPOXY | QFP | QFP160,1.2SQ | SQUARE | FLATPACK | 5.5 V | 5 V | 30 | 125 | Compliant | 4.5 V | 表面贴装 | YES | 160 | 160 | A1280A-1PQ160I | e0 | EAR99 | 锡铅 | 85 °C | -40 °C | MAX 125 I/OS | 8542.39.00.01 | QUAD | 鸥翼 | 225 | 0.65 mm | compliant | 90 MHz | S-PQFP-G160 | 125 | 不合格 | 5 V | 5 V | INDUSTRIAL | 5.5 V | 4.5 V | 4.3 ns | 4.3 ns | 125 | 1232 CLBS, 8000 GATES | 4.1 mm | 现场可编程门阵列 | 1232 | 8000 | 1232 | 1 | 998 | 4.3 ns | 1232 | 1232 | 8000 | 28 mm | 28 mm | 无 | ||||||||||||||||||||||||||||||||||
| A14V60A-PQ208C | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 无 | Obsolete | MICROSEMI CORP | PLASTIC, QFP-208 | 5.88 | 75 MHz | 3 | 70 °C | PLASTIC/EPOXY | FQFP | SQUARE | FLATPACK, FINE PITCH | 3.6 V | 3.3 V | 30 | 167 | Compliant | 3 V | 表面贴装 | YES | 208 | 208 | A14V60A-PQ208C | e0 | 锡铅 | 70 °C | 0 °C | MAX 167 I/OS | 8542.39.00.01 | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | 75 MHz | S-PQFP-G208 | 不合格 | 3.3 V | COMMERCIAL | 3.6 V | 3 V | 3.9 ns | 3.9 ns | 848 CLBS, 6000 GATES | 4.1 mm | 现场可编程门阵列 | 848 | 6000 | 848 | 768 | 3.9 ns | 848 | 6000 | 28 mm | 28 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||
| A14100A-CQ256M | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Obsolete | MICROSEMI CORP | HERMETIC SEALED, CERAMIC, QFP-256 | 8.42 | 100 MHz | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | GQFF | TPAK256,3SQ,20 | SQUARE | FLATPACK, GUARD RING | 5.5 V | 5 V | 8542390000/8542390000/8542390000/8542390000/8542390000 | 228 | Compliant | 4.5 V | 表面贴装 | YES | 256 | 256 | A14100A-CQ256M | 3A001.A.2.C | 125 °C | -55 °C | 8542.39.00.01 | QUAD | FLAT | 0.5 mm | compliant | 100 MHz | S-CQFP-F256 | 228 | 不合格 | 5 V | 5 V | MILITARY | 5.5 V | 4.5 V | 3 ns | 3 ns | 228 | 1377 CLBS, 10000 GATES | 3.3 mm | 现场可编程门阵列 | 1377 | 10000 | 1377 | 1153 | 3 ns | 1377 | 1377 | 10000 | 36 mm | 36 mm | 无 | |||||||||||||||||||||||||||||||||||||||||
| A1415A-VQ100C | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 无 | Obsolete | MICROSEMI CORP | TFQFP, | 5.91 | 125 MHz | 3 | 70 °C | PLASTIC/EPOXY | TFQFP | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | 5.25 V | 5 V | 30 | 4.75 V | YES | 100 | A1415A-VQ100C | e0 | Tin/Lead (Sn/Pb) | MAX 80 I/OS | 8542.39.00.01 | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | S-PQFP-G100 | 不合格 | COMMERCIAL | 200 CLBS, 1500 GATES | 1.2 mm | 现场可编程门阵列 | 3 ns | 200 | 1500 | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A1020B-PLG84M | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 有 | Obsolete | MICROSEMI CORP | QCCJ, | 5.76 | 3 | 125 °C | -55 °C | PLASTIC/EPOXY | QCCJ | SQUARE | CHIP CARRIER | 5.5 V | 5 V | 40 | 69 | Compliant | 4.5 V | 表面贴装 | YES | 84 | 84 | A1020B-PLG84M | e3 | 3A001.A.2.C | 哑光锡 | 125 °C | -55 °C | 8542.39.00.01 | QUAD | J BEND | 245 | 1.27 mm | compliant | 48 MHz | S-PQCC-J84 | 不合格 | 5 V | MILITARY | 5.5 V | 4.5 V | 4.5 ns | 547 CLBS, 2000 GATES | 4.572 mm | 现场可编程门阵列 | 547 | 2000 | 547 | 273 | 547 | 2000 | 29.3116 mm | 29.3116 mm | |||||||||||||||||||||||||||||||||||||||||||||
| A1440A-VQ100I | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 无 | Obsolete | MICROSEMI CORP | TFQFP, | 5.84 | 125 MHz | 3 | 85 °C | -40 °C | PLASTIC/EPOXY | TFQFP | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | 5.5 V | 5 V | 30 | 4.5 V | YES | 100 | A1440A-VQ100I | e0 | 锡铅 | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | S-PQFP-G100 | 不合格 | INDUSTRIAL | 564 CLBS, 4000 GATES | 1.2 mm | 现场可编程门阵列 | 3 ns | 564 | 4000 | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A1425A-PQ160I | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 无 | Obsolete | MICROSEMI CORP | PLASTIC, QFP-160 | 5.88 | 125 MHz | 3 | 85 °C | -40 °C | PLASTIC/EPOXY | QFP | SQUARE | FLATPACK | 5.5 V | 5 V | 30 | 4.5 V | YES | 160 | A1425A-PQ160I | e0 | 锡铅 | MAX 100 I/OS | QUAD | 鸥翼 | 225 | 0.65 mm | compliant | S-PQFP-G160 | 不合格 | INDUSTRIAL | 310 CLBS, 2500 GATES | 4.1 mm | 现场可编程门阵列 | 3 ns | 310 | 2500 | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A1280A-PL84C | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 3 | 70 °C | PLASTIC/EPOXY | QCCJ | SQUARE | CHIP CARRIER | 5.25 V | 5 V | 30 | 8.78 | PLASTIC, MS-007-AE, LCC-84 | MICROSEMI CORP | Obsolete | 无 | A1280A-PL84C | 4.75 V | YES | 84 | 50 MHz | e0 | EAR99 | Tin/Lead (Sn/Pb) | MAX 72 I/OS | 8542.39.00.01 | QUAD | J BEND | 225 | 1.27 mm | unknown | S-PQCC-J84 | 不合格 | COMMERCIAL | 1232 CLBS, 8000 GATES | 4.45 mm | 现场可编程门阵列 | 5 ns | 1232 | 1232 | 8000 | 29.21 mm | 29.21 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AGLN030V5-ZVQG100 | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 有 | Obsolete | MICROSEMI CORP | TFQFP, | 7.8 | 70 °C | -20 °C | PLASTIC/EPOXY | TFQFP | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | 1.575 V | 1.5 V | 未说明 | 1.425 V | YES | 100 | AGLN030V5-ZVQG100 | e3 | TIN | 8542.39.00.01 | QUAD | 鸥翼 | 未说明 | 0.5 mm | compliant | S-PQFP-G100 | 不合格 | OTHER | 768 CLBS, 30000 GATES | 1.2 mm | 现场可编程门阵列 | 768 | 30000 | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCR3384XL-12PQG208Q | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 有 | 不推荐 | XILINX INC | QFP | PLASTIC, QFP-208 | 5.42 | 87 MHz | 3 | 172 | 125 °C | -40 °C | PLASTIC/EPOXY | FQFP | SQUARE | FLATPACK, FINE PITCH | 3.6 V | 3.3 V | 30 | 3 V | YES | 208 | XCR3384XL-12PQG208Q | e3 | 有 | Matte Tin (Sn) | 8542.39.00.01 | QUAD | 鸥翼 | 245 | 0.5 mm | compliant | 208 | S-PQFP-G208 | 不合格 | AUTOMOTIVE | 12 ns | 0 DEDICATED INPUTS, 172 I/O | 4.1 mm | EE PLD | MACROCELL | 28 mm | 28 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC95288XV-10PQG208I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 有 | Obsolete | XILINX INC | QFP | PLASTIC, QFP-208 | 5.62 | 100 MHz | 3 | 168 | 85 °C | -40 °C | PLASTIC/EPOXY | FQFP | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | 2.62 V | 2.5 V | 30 | 2.37 V | YES | 208 | XC95288XV-10PQG208I | e3 | Matte Tin (Sn) | YES | 8542.39.00.01 | QUAD | 鸥翼 | 245 | 0.5 mm | unknown | 208 | S-PQFP-G208 | 不合格 | 1.8/3.3,2.5 V | INDUSTRIAL | 10 ns | 0 DEDICATED INPUTS, 168 I/O | 4.1 mm | 闪存 PLD | MACROCELL | 288 | YES | YES | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||
| XC95288XV-10TQG144I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 有 | Obsolete | XILINX INC | QFP | TQFP-144 | 5.62 | 100 MHz | 3 | 117 | 85 °C | -40 °C | PLASTIC/EPOXY | LFQFP | QFP144,.87SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | 2.62 V | 2.5 V | 40 | 2.37 V | YES | 144 | XC95288XV-10TQG144I | e3 | Matte Tin (Sn) | YES | 8542.39.00.01 | QUAD | 鸥翼 | 260 | 0.5 mm | unknown | 144 | S-PQFP-G144 | 不合格 | 1.8/3.3,2.5 V | INDUSTRIAL | 10 ns | 0 DEDICATED INPUTS, 117 I/O | 1.6 mm | 闪存 PLD | MACROCELL | 288 | YES | YES | 20 mm | 20 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||
| XC95288XV-6TQG144C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 有 | Obsolete | XILINX INC | QFP | TQFP-144 | 5.61 | 208 MHz | 3 | 117 | 70 °C | PLASTIC/EPOXY | LFQFP | QFP144,.87SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | 2.62 V | 2.5 V | 30 | 2.37 V | YES | 144 | XC95288XV-6TQG144C | e3 | EAR99 | Matte Tin (Sn) | YES | 8542.39.00.01 | QUAD | 鸥翼 | 260 | 0.5 mm | unknown | 144 | S-PQFP-G144 | 不合格 | 1.8/3.3,2.5 V | COMMERCIAL | 6 ns | 0 DEDICATED INPUTS, 117 I/O | 1.6 mm | 闪存 PLD | MACROCELL | 288 | YES | YES | 20 mm | 20 mm |