834000T00000
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HEATSINK, SURFACEMOUNT, D2PAK, TO263, COPPER, 12C/W, TIN, 19.3LX25.4WX.19.3HMM
规格参数
- 类型参数全选
底架
Surface Mount
材料
Copper
形状
Rectangular, Fins
包装冷却
TO-263 (D2Pak)
材料处理
Tin
已出版
2006
零件状态
Obsolete
湿度敏感性等级(MSL)
Not Applicable
类型
Board Level
附着方法
SMD Pad
离底高度(鳍的高度)
0.450 11.43mm
强制空气流动时的热阻
4.00°C/W @ 200 LFM
自然的热阻
12 °C/W
温度上升时的耗散功率
1.5W @ 20°C
高度
11.4mm
长度
0.763 19.38mm
宽度
1.000 25.40mm
RoHS状态
RoHS Compliant
无铅
Lead Free
相关型号
- 图片产品型号品牌MaterialMountThermal Resistance @ Forced Air FlowNatural Thermal ResistanceShapeLengthWidthHeight
834000T00000
Copper
Surface Mount
4.00°C/W @ 200 LFM
12 °C/W
Rectangular, Fins
0.763 (19.38mm)
1.000 (25.40mm)
11.4 mm
Copper
PCB, Surface Mount
4.00°C/W @ 600 LFM
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Rectangular, Fins
0.500 (12.70mm)
1.220 (30.99mm)
10.2 mm
Copper
Surface Mount
3.00°C/W @ 300 LFM
-
Rectangular, Fins
0.763 (19.38mm)
1.000 (25.40mm)
11 mm
Copper
Surface Mount
3.00°C/W @ 300 LFM
-
Rectangular, Fins
0.763 (19.38mm)
1.000 (25.40mm)
11.43 mm
Copper
Surface Mount
-
-
Rectangular, Fins
0.763 (19.38mm)
1.000 (25.40mm)
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834000T00000 PDF数据手册
- 数据表 :