null 产品销售 - PDF - null - 页 130 - 深圳市佳达源电子有限公司

类别是'嵌入式 - 片上系统（SoC）'

嵌入式 - 片上系统（SoC） (6000)

产品型号	品牌	数据表	有效性	单价(CNY)	询价	安装类型	包装/外壳	表面安装	越来越多的功能	外壳材料	供应商器件包装	插入材料	终端数量	后壳材料，电镀																	厂商																															操作温度	包装	系列	尺寸/尺寸	容差	零件状态	终止次数	终端	温度系数	连接器类型	类型	电阻	定位的数量	组成	颜色	应用	行数	功率(瓦特)	HTS代码	电容量	紧固类型	子类别	触点类型	额定电流	螺距	技术	电压 - 供电	端子位置	方向	终端形式	屏蔽/屏蔽	峰值回流焊温度（摄氏度）	入口保护	端子间距	样式	Reach合规守则	频率	频率稳定性	输出量	外壳完成	外壳尺寸-插入	JESD-30代码	功能	基本谐振器	最大电流源	输出的数量	资历状况	失败率	引线间距	电源	温度等级	电流 - 电源（禁用）（最大值）	行间距	注意	速度	内存大小	外壳尺寸，MIL	引线样式	核心处理器	周边设备	程序内存大小	扩频带宽	连接方式	电缆开口	重置	建筑学	电压 - 阈值	监测的电压数量	触点终端	重置超时	输入数量	座位高度-最大	使用的 IC/零件	提供的内容	可编程逻辑类型	产品类别	第一个连接器	第二个连接器	绝对牵引范围 (APR)	主要属性	嵌入式	逻辑单元数	核数量	特征	产品类别
AGFA023R25A2E4X	Intel	数据表	N/A	-	最小起订量: 1 倍率: 1	表面贴装	活跃	510KBA	480	4-SMD, No Lead				-				Skyworks Solutions Inc.	Strip	-40°C ~ 85°C		Si510	0.197 L x 0.126 W (5.00mm x 3.20mm)							XO (Standard)																1.8V										100 MHz	±25ppm	CMOS				Enable/Disable	Crystal	26mA							18mA			1.4GHz	256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG			MPU, FPGA													-	FPGA - 2.3M Logic Elements					-			0.050 (1.28mm)						-
10AS032E1F29E1SG	ALTERA	数据表	N/A	-	最小起订量: 1 倍率: 1	活跃	360	Non-Compliant	29 X 29 MM, ROHS COMPLIANT, FBGA-780	网格排列	PLASTIC/EPOXY	0.9 V	0.87 V	100 °C	有	10AS032E1F29E1SG	BGA	SQUARE	Intel Corporation	Obsolete	INTEL CORP	0.93 V	5.66		780-BBGA, FCBGA	YES			780-FBGA (29x29)		780		Fox Electronics	Tape & Reel (TR)	0°C ~ 100°C (TJ)	Tray	*			Discontinued at Digi-Key													8542.39.00.01									BOTTOM		BALL				1 mm		compliant						S-PBGA-B780									OTHER				1.5GHz	256KB			Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT			EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG			MCU, FPGA						3.35 mm			现场可编程门阵列					FPGA - 320K Logic Elements					--				29 mm	29 mm
10AS027E3F27I2SG	ALTERA	数据表	N/A	-	最小起订量: 1 倍率: 1	RJMG2	Obsolete	240	Non-Compliant	有	This product may require additional documentation to export from the United States.	2 x 32 kB	1.2 GHz	270000 LE	1	SMD/SMT	33750 LAB	964925	Intel	Intel / Altera	Arria 10 SoC	2 x 32 kB	-	BGA, BGA672,26X26,40	网格排列	PLASTIC/EPOXY	BGA672,26X26,40	-40 °C	0.9 V	未说明	0.87 V	100 °C	有	10AS027E3F27I2SG	BGA	SQUARE	活跃	INTEL CORP	0.93 V	5.43	SoC FPGA		FBGA-672	YES					672		Amphenol ICC (Commercial Products)	Tray	-40°C ~ 100°C (TJ)	Tray	-			活跃													8542.39.00.01			SOC - Systems on a Chip				CMOS		BOTTOM		BALL		未说明		1 mm		compliant						S-PBGA-B672				240	不合格			0.9 V	INDUSTRIAL				1.5GHz	256KB			Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	-		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG			MCU, FPGA					240	3.25 mm			现场可编程门阵列				FPGA - 270K Logic Elements			270000	2 Core	--		SoC FPGA		27 mm	27 mm
10AS032H4F34I3LG	ALTERA	数据表	N/A	-	最小起订量: 1 倍率: 1	MAX147	Obsolete	384	有	This product may require additional documentation to export from the United States.	2 x 32 kB	1.2 GHz	320000 LE	1	SMD/SMT	40000 LAB	965347	Intel	Intel / Altera	Arria 10 SoC	Details	2 x 32 kB	-	BGA, BGA1152,34X34,40	网格排列	PLASTIC/EPOXY	BGA1152,34X34,40	-40 °C	0.9 V	未说明	0.87 V	100 °C	有	10AS032H4F34I3LG	BGA	SQUARE	活跃	INTEL CORP	0.93 V	5.45	SoC FPGA		FBGA-1152	YES					1152		Analog Devices Inc./Maxim Integrated	Box	-40°C ~ 100°C (TJ)	Tray	-			活跃					电源管理								8542.39.00.01			SOC - Systems on a Chip				CMOS		BOTTOM		BALL		未说明		1 mm		compliant						S-PBGA-B1152	电池充电器			384	不合格			0.9 V	INDUSTRIAL				1.5GHz	256KB			Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	-		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG			MCU, FPGA					384	3.65 mm	MAX14750	Board(s)	现场可编程门阵列				-	-	-	320000	2 Core	--		SoC FPGA		35 mm	35 mm
10AS032E3F27I2SG	ALTERA	数据表	N/A	-	最小起订量: 1 倍率: 1	ERC55	活跃	240	有	This product may require additional documentation to export from the United States.	2 x 32 kB	1.2 GHz	320000 LE	1	SMD/SMT	40000 LAB	965290	Intel	Intel / Altera	Arria 10 SoC	Details	2 x 32 kB	-	BGA, BGA672,26X26,40	网格排列	PLASTIC/EPOXY	BGA672,26X26,40	-40 °C	0.9 V	未说明	0.87 V	100 °C	有	10AS032E3F27I2SG	BGA	SQUARE	活跃	INTEL CORP	0.93 V	5.45	SoC FPGA		Axial	YES			Axial		672		Vishay Dale	Tape & Reel (TR)	-65°C ~ 175°C	Tray	ERC	0.097 Dia x 0.280 L (2.46mm x 7.11mm)	±1%	活跃	2		±50ppm/°C			127 kOhms		Metal Film				0.25W, 1/4W	8542.39.00.01			SOC - Systems on a Chip				CMOS		BOTTOM		BALL		未说明		1 mm		compliant						S-PBGA-B672				240	不合格	-		0.9 V	INDUSTRIAL				1.5GHz	256KB			Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	-		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG			MCU, FPGA					240	3.25 mm			现场可编程门阵列				FPGA - 320K Logic Elements			320000	2 Core	--	Moisture Resistant	SoC FPGA	-	27 mm	27 mm
10AS057N3F40I2SG	ALTERA	数据表	N/A	-	最小起订量: 1 倍率: 1	121121	活跃	588	有	This product may require additional documentation to export from the United States.	2 x 32 kB	1.2 GHz	570000 LE	21	SMD/SMT	71250 LAB	964986	Intel	Intel / Altera	Arria 10 SoC	-	2 x 32 kB	Details	BGA, BGA1517,39X39,40	网格排列	PLASTIC/EPOXY	BGA1517,39X39,40	-40 °C	0.9 V	未说明	0.87 V	100 °C	有	10AS057N3F40I2SG	BGA	SQUARE	活跃	INTEL CORP	0.93 V	5.45	SoC FPGA		1517-BBGA, FCBGA	YES			1517-FCBGA (40x40)		1517		Molex	Bulk	-40°C ~ 100°C (TJ)	Tray	*			活跃													8542.39.00.01			SOC - Systems on a Chip				CMOS		BOTTOM		BALL		未说明		1 mm		compliant						S-PBGA-B1517				588	不合格			0.9 V	INDUSTRIAL				1.5GHz	256KB			Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	-		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG			MCU, FPGA					588	3.5 mm			现场可编程门阵列				FPGA - 570K Logic Elements			570000	2 Core	--		SoC FPGA		40 mm	40 mm
10AS066H3F34E2LG	ALTERA	数据表	N/A	-	最小起订量: 1 倍率: 1	Surface Mount, MLCC	Obsolete	100V	492	BGA, BGA1152,34X34,40	网格排列	PLASTIC/EPOXY	BGA1152,34X34,40	0.9 V	未说明	0.87 V	100 °C	有	10AS066H3F34E2LG	BGA	SQUARE	Intel Corporation	活跃	INTEL CORP	0.93 V	5.45	0603 (1608 Metric)	YES			1152-FCBGA (35x35)		1152		Vishay Vitramon	Tape & Reel (TR)	-55°C ~ 150°C	Tray	GA	0.063 L x 0.031 W (1.60mm x 0.80mm)	±0.5pF	活跃			C0G, NP0							汽车			8542.39.00.01	1.5 pF		现场可编程门阵列				CMOS		BOTTOM		BALL		未说明		1 mm		compliant						S-PBGA-B1152				492	不合格	-	-	0.9 V	OTHER				1.5GHz	256KB		-	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT			EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG			MCU, FPGA					492	3.65 mm			现场可编程门阵列					FPGA - 660K Logic Elements			660000		--	-		-	35 mm	35 mm	0.038 (0.97mm)			AEC-Q200
10AS048E3F29E2SG	ALTERA	数据表	N/A	-	最小起订量: 1 倍率: 1	Surface Mount, MLCC	VJ0603	活跃	50V	360	BGA, BGA780,28X28,40	网格排列	PLASTIC/EPOXY	BGA780,28X28,40	0.9 V	未说明	0.87 V	100 °C	有	10AS048E3F29E2SG	BGA	SQUARE	Intel Corporation	活跃	INTEL CORP	0.93 V	5.46	0603 (1608 Metric)	YES					780		Vishay Vitramon	Tape & Reel (TR)	-55°C ~ 125°C	Tray	VJ HIFREQ	0.063 L x 0.031 W (1.60mm x 0.80mm)	±0.5pF	活跃			C0G, NP0							RF, Microwave, High Frequency			8542.39.00.01	4.7 pF		现场可编程门阵列				CMOS		BOTTOM		BALL		未说明		1 mm		compliant						S-PBGA-B780				360	不合格		-	0.9 V	OTHER				1.5GHz	256KB		-	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT			EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG			MCU, FPGA					360	3.35 mm			现场可编程门阵列					FPGA - 480K Logic Elements			480000		--	High Q, Low Loss		-	29 mm	29 mm	0.037 (0.94mm)			-
10AS057K2F35E2LG	ALTERA	数据表	N/A	-	最小起订量: 1 倍率: 1	Tape & Reel (TR)	396	BGA, BGA1152,34X34,40	网格排列	PLASTIC/EPOXY	BGA1152,34X34,40	0.9 V	未说明	0.87 V	100 °C	有	10AS057K2F35E2LG	BGA	SQUARE	Intel Corporation	活跃	INTEL CORP	0.93 V	5.45		1206 (3216 Metric)	YES			1206		1152		Vishay Dale	活跃	-55°C ~ 125°C	Tray	TNPU e3	0.126 L x 0.063 W (3.20mm x 1.60mm)	±0.1%	活跃	2		±5ppm/°C			46.4 kOhms		Thin Film				0.25W, 1/4W	8542.39.00.01			现场可编程门阵列				CMOS		BOTTOM		BALL		未说明		1 mm		compliant						S-PBGA-B1152				396	不合格	-		0.9 V	OTHER				1.5GHz	256KB			Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT			EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG			MCU, FPGA					396	3.5 mm			现场可编程门阵列					FPGA - 570K Logic Elements			570000		--	Anti-Sulfur, Automotive AEC-Q200, Moisture Resistant		0.026 (0.65mm)	35 mm	35 mm				AEC-Q200
10AS066K2F35I1SG	ALTERA	数据表	N/A	-	最小起订量: 1 倍率: 1	121129	活跃	396	35 X 35 MM, ROHS COMPLIANT, FBGA-1152	网格排列	PLASTIC/EPOXY	-40 °C	0.9 V	0.87 V	100 °C	有	10AS066K2F35I1SG	BGA	SQUARE	Intel Corporation	Obsolete	INTEL CORP	0.93 V	5.66		1152-BBGA, FCBGA	YES			1152-FBGA (35x35)		1152		Molex	Bulk	-40°C ~ 100°C (TJ)	Tray	*			Discontinued at Digi-Key													8542.39.00.01									BOTTOM		BALL				1 mm		compliant						S-PBGA-B1152									INDUSTRIAL				1.5GHz	256KB			Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT			EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG			MCU, FPGA						3.5 mm			现场可编程门阵列					FPGA - 660K Logic Elements					--				35 mm	35 mm
10AS016E4F27I3SG	ALTERA	数据表	N/A	-	最小起订量: 1 倍率: 1	活跃	240	Non-Compliant	有	2 x 32 kB	1.2 GHz	160000 LE	1	SMD/SMT	20000 LAB	964720	Intel	Intel / Altera	Arria 10 SoC	2 x 32 kB	-	BGA, BGA672,26X26,40	网格排列	PLASTIC/EPOXY	BGA672,26X26,40	-40 °C	0.9 V	未说明	0.87 V	100 °C	有	10AS016E4F27I3SG	BGA	SQUARE	活跃	INTEL CORP	0.93 V	1.95	SoC FPGA		Axial	YES			Axial		672		Stackpole Electronics Inc	Tape & Box (TB)	-55°C ~ 155°C	Tray	RNF	0.093 Dia x 0.250 L (2.35mm x 6.35mm)	±1%	活跃	2		±100ppm/°C			124 kOhms		Metal Film				0.25W, 1/4W	8542.39.00.01			SOC - Systems on a Chip				CMOS		BOTTOM		BALL		未说明		1 mm		compliant						S-PBGA-B672				240	不合格	-		0.9 V	INDUSTRIAL				1.5GHz	256KB			Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	-		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG			MCU, FPGA					240	3.25 mm			现场可编程门阵列				FPGA - 160K Logic Elements			160000	2 Core	--	Flame Retardant Coating, Safety	SoC FPGA	-	27 mm	27 mm
10AS057N3F40E2SG	ALTERA	数据表	N/A	-	最小起订量: 1 倍率: 1	表面贴装	MAX16073	活跃	588	有	This product may require additional documentation to export from the United States.	2 x 32 kB	1.2 GHz	570000 LE	21	SMD/SMT	71250 LAB	965073	Intel	Intel / Altera	Arria 10 SoC	Details	2 x 32 kB	-	BGA, BGA1517,39X39,40	网格排列	PLASTIC/EPOXY	BGA1517,39X39,40	0.9 V	未说明	0.87 V	100 °C	有	10AS057N3F40E2SG	BGA	SQUARE	活跃	INTEL CORP	0.93 V	5.45	SoC FPGA	4-WFBGA, CSPBGA	YES			4-UCSP (1x1)		1517		Analog Devices Inc./Maxim Integrated	Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;	-40°C ~ 85°C (TA)	Tray	nanoPower			活跃					Simple Reset/Power-On Reset								8542.39.00.01			SOC - Systems on a Chip				CMOS		BOTTOM		BALL		未说明		1 mm		compliant			Push-Pull, Totem Pole			S-PBGA-B1517				588	不合格			0.9 V	OTHER				1.5GHz	256KB			Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	-		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		高电平	MCU, FPGA	3.08V	1		34ms Minimum	588	3.5 mm			现场可编程门阵列				FPGA - 570K Logic Elements			570000	2 Core	--		SoC FPGA		40 mm	40 mm
10AS066N4F40E3LG	ALTERA	数据表	N/A	-	最小起订量: 1 倍率: 1	TNPW2512	活跃	588	BGA, BGA1517,39X39,40	网格排列	PLASTIC/EPOXY	BGA1517,39X39,40	0.9 V	未说明	0.87 V	100 °C	有	10AS066N4F40E3LG	BGA	SQUARE	Intel Corporation	活跃	INTEL CORP	0.93 V	5.46		2512 (6432 Metric)	YES			2512		1517		Vishay Dale	Tape & Reel (TR)	-55°C ~ 155°C	Tray	TNPW e3	0.248 L x 0.122 W (6.30mm x 3.10mm)	±0.1%	活跃	2		±25ppm/°C			169 Ohms		Thin Film				0.5W, 1/2W	8542.39.00.01			现场可编程门阵列				CMOS		BOTTOM		BALL		未说明		1 mm		compliant						S-PBGA-B1517				588	不合格	-		0.9 V	OTHER				1.5GHz	256KB			Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT			EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG			MCU, FPGA					588	3.5 mm			现场可编程门阵列					FPGA - 660K Logic Elements			660000		--	Moisture Resistant		0.030 (0.75mm)	40 mm	40 mm				-
10AS032H4F35I3LG	ALTERA	数据表	N/A	-	最小起订量: 1 倍率: 1	面板安装	Bulk	Composite	ACT90	Discontinued at Digi-Key	Copper Alloy	Gold	384	BGA, BGA1152,34X34,40	网格排列	PLASTIC/EPOXY	BGA1152,34X34,40	-40 °C	0.9 V	未说明	0.87 V	100 °C	有	10AS032H4F35I3LG	BGA	SQUARE	Intel Corporation	活跃	INTEL CORP	0.93 V	5.45		YES	Flange	Composite		Thermoplastic	1152	-	TE Connectivity Deutsch 连接器	-	-65°C ~ 200°C	Tray	MIL-DTL-38999 Series III, ACT			活跃		Crimp		Receptacle, Male Pins			6		Silver	Aerospace, Military			8542.39.00.01		Threaded	现场可编程门阵列		23A		CMOS		BOTTOM	N (Normal)	BALL	Shielded	未说明	抗环境干扰	1 mm		compliant				Nickel	17-6	S-PBGA-B1152				384	不合格			0.9 V	INDUSTRIAL				1.5GHz	256KB	E		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT			EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	-		MCU, FPGA					384	3.5 mm			现场可编程门阵列					FPGA - 320K Logic Elements			320000		--	-			35 mm	35 mm		-	-
10AS048K2F35E2LG	ALTERA	数据表	N/A	-	最小起订量: 1 倍率: 1	Surface Mount, MLCC	活跃	50V	396	有	This product may require additional documentation to export from the United States.	2 x 32 kB	1.2 GHz	480000 LE	1	SMD/SMT	60000 LAB	973520	Intel	Intel / Altera	Arria 10 SoC	Details	2 x 32 kB	-	BGA, BGA1152,34X34,40	网格排列	PLASTIC/EPOXY	BGA1152,34X34,40	0.9 V	未说明	0.87 V	100 °C	有	10AS048K2F35E2LG	BGA	SQUARE	活跃	INTEL CORP	0.93 V	5.47	SoC FPGA	1812 (4532 Metric)	YES					1152		Vishay Vitramon	Tape & Reel (TR)	-55°C ~ 150°C	Tray	GA	0.177 L x 0.126 W (4.50mm x 3.20mm)	±2%	活跃			C0G, NP0							汽车			8542.39.00.01	0.012 µF		SOC - Systems on a Chip				CMOS		BOTTOM		BALL		未说明		1 mm		compliant						S-PBGA-B1152				396	不合格	-	-	0.9 V	OTHER				1.5GHz	256KB		-	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	-		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG			MCU, FPGA					396	3.5 mm			现场可编程门阵列				FPGA - 480K Logic Elements			480000	2 Core	--	-	SoC FPGA	-	35 mm	35 mm	0.086 (2.18mm)		AEC-Q200
10AS032H3F35E2LG	ALTERA	数据表	N/A	-	最小起订量: 1 倍率: 1	203152	活跃	384	有	This product may require additional documentation to export from the United States.	2 x 32 kB	1.2 GHz	320000 LE	1	SMD/SMT	40000 LAB	965060	Intel	Intel / Altera	Arria 10 SoC	Details	2 x 32 kB	-	BGA, BGA1152,34X34,40	网格排列	PLASTIC/EPOXY	BGA1152,34X34,40	0.9 V	未说明	0.87 V	100 °C	有	10AS032H3F35E2LG	BGA	SQUARE	活跃	INTEL CORP	0.93 V	5.45	SoC FPGA		FBGA-1152	YES					1152		Molex	Bulk	0°C ~ 100°C (TJ)	Tray	*			活跃													8542.39.00.01			SOC - Systems on a Chip				CMOS		BOTTOM		BALL		未说明		1 mm		compliant						S-PBGA-B1152				384	不合格			0.9 V	OTHER				1.5GHz	256KB			Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	-		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG			MCU, FPGA					384	3.5 mm			现场可编程门阵列				FPGA - 320K Logic Elements			320000	2 Core	--		SoC FPGA		35 mm	35 mm
10AS032H4F34I3SG	ALTERA	数据表	N/A	-	最小起订量: 1 倍率: 1	Free Hanging (In-Line)	034985	活跃	384	有	This product may require additional documentation to export from the United States.	2 x 32 kB	1.2 GHz	320000 LE	1	SMD/SMT	40000 LAB	965297	Intel	Intel / Altera	Arria 10 SoC	Details	2 x 32 kB	-	BGA, BGA1152,34X34,40	网格排列	PLASTIC/EPOXY	BGA1152,34X34,40	-40 °C	0.9 V	未说明	0.87 V	100 °C	有	10AS032H4F34I3SG	BGA	SQUARE	活跃	INTEL CORP	0.93 V	5.45	SoC FPGA	FBGA-1152	YES					1152		Molex	Bulk	-40°C ~ 100°C (TJ)	Tray	MX150 34985			活跃				Receptacle			16		Black		2		8542.39.00.01		插销座	SOC - Systems on a Chip	内螺纹插座		0.138 (3.50mm)	CMOS		BOTTOM		BALL		未说明		1 mm		compliant						S-PBGA-B1152				384	不合格			0.9 V	INDUSTRIAL		-	不包括触点	1.5GHz	256KB			Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	-		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG			MCU, FPGA			Crimp		384	3.65 mm			现场可编程门阵列				FPGA - 320K Logic Elements			320000	2 Core	--	Sealed	SoC FPGA		35 mm	35 mm
10AS027H4F35E3SG	ALTERA	数据表	N/A	-	最小起订量: 1 倍率: 1	221050	活跃	384	有	This product may require additional documentation to export from the United States.	2 x 32 kB	1.2 GHz	270000 LE	1	SMD/SMT	33750 LAB	964945	Intel	Intel / Altera	Arria 10 SoC	Details	2 x 32 kB	-	BGA, BGA1152,34X34,40	网格排列	PLASTIC/EPOXY	BGA1152,34X34,40	0.9 V	未说明	0.87 V	100 °C	有	10AS027H4F35E3SG	BGA	SQUARE	活跃	INTEL CORP	0.93 V	1.92	SoC FPGA		FBGA-1152	YES					1152		Molex	Bulk	0°C ~ 100°C (TJ)	Tray	*			活跃													8542.39.00.01			SOC - Systems on a Chip				CMOS		BOTTOM		BALL		未说明		1 mm		compliant						S-PBGA-B1152				384	不合格			0.9 V	OTHER				1.5GHz	256KB			Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	-		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG			MCU, FPGA					384	3.5 mm			现场可编程门阵列				FPGA - 270K Logic Elements			270000	2 Core	--		SoC FPGA		35 mm	35 mm
10AS022E3F27I1SG	ALTERA	数据表	N/A	-	最小起订量: 1 倍率: 1	RN731J	Obsolete	240	Non-Compliant	27 X 27 MM, ROHS COMPLIANT, FBGA-672	网格排列	PLASTIC/EPOXY	BGA672,26X26,40	-40 °C	0.9 V	未说明	0.87 V	100 °C	有	10AS022E3F27I1SG	BGA	SQUARE	Intel Corporation	Obsolete	INTEL CORP	0.93 V	5.67		0603 (1608 Metric)	YES			0603		672		KOA Speer Electronics, Inc.	Tape & Reel (TR)	-55°C ~ 155°C	Tray	RN73	0.063 L x 0.031 W (1.60mm x 0.80mm)	±0.1%	Discontinued at Digi-Key	2		±50ppm/°C			34 Ohms		Thin Film				0.063W, 1/16W	8542.39.00.01			现场可编程门阵列				CMOS		BOTTOM		BALL		未说明		1 mm		compliant						S-PBGA-B672				240	不合格			0.9 V	INDUSTRIAL				1.5GHz	256KB			Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT			EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG			MCU, FPGA					240	3.25 mm			现场可编程门阵列					FPGA - 220K Logic Elements			220000		--	Moisture Resistant		0.022 (0.55mm)	27 mm	27 mm
10AS027E3F27E2LG	ALTERA	数据表	N/A	-	最小起订量: 1 倍率: 1	CRCW1210	活跃	240	有	This product may require additional documentation to export from the United States.	2 x 32 kB	1.2 GHz	270000 LE	1	SMD/SMT	33750 LAB	964924	Intel	Intel / Altera	Arria 10 SoC	Details	2 x 32 kB	-	BGA, BGA672,26X26,40	网格排列	PLASTIC/EPOXY	BGA672,26X26,40	0.9 V	未说明	0.87 V	100 °C	有	10AS027E3F27E2LG	BGA	SQUARE	活跃	INTEL CORP	0.93 V	5.43	SoC FPGA		1210 (3225 Metric)	YES			1210		672		Vishay Dale	Tape & Reel (TR)	-55°C ~ 155°C	Tray	CRCW	0.126 L x 0.098 W (3.20mm x 2.50mm)	±1%	活跃	2		±100ppm/°C			3.9 Ohms		厚膜				0.5W, 1/2W	8542.39.00.01			SOC - Systems on a Chip				CMOS		BOTTOM		BALL		未说明		1 mm		compliant						S-PBGA-B672				240	不合格	-		0.9 V	OTHER				1.5GHz	256KB			Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	-		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG			MCU, FPGA					240	3.25 mm			现场可编程门阵列				FPGA - 270K Logic Elements			270000	2 Core	--	Automotive AEC-Q200	SoC FPGA	0.024 (0.60mm)	27 mm	27 mm			AEC-Q200
10AS057N2F40E2LG	ALTERA	数据表	N/A	-	最小起订量: 1 倍率: 1	MS27473T22B	活跃	588	有	This product may require additional documentation to export from the United States.	2 x 32 kB	1.2 GHz	570000 LE	21	SMD/SMT	71250 LAB	965018	Intel	Intel / Altera	Arria 10 SoC	Details	2 x 32 kB	-	BGA, BGA1517,39X39,40	网格排列	PLASTIC/EPOXY	BGA1517,39X39,40	0.9 V	未说明	0.87 V	100 °C	有	10AS057N2F40E2LG	BGA	SQUARE	活跃	INTEL CORP	0.93 V	5.45	SoC FPGA		1517-BBGA, FCBGA	YES			1517-FCBGA (40x40)		1517		Souriau-Sunbank by Eaton	Bag	0°C ~ 100°C (TJ)	Tray	*			活跃													8542.39.00.01			SOC - Systems on a Chip				CMOS		BOTTOM		BALL		未说明		1 mm		compliant						S-PBGA-B1517				588	不合格			0.9 V	OTHER				1.5GHz	256KB			Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	-		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG			MCU, FPGA					588	3.5 mm			现场可编程门阵列				FPGA - 570K Logic Elements			570000	2 Core	--		SoC FPGA		40 mm	40 mm
10AS027H2F34E2SG	ALTERA	数据表	N/A	-	最小起订量: 1 倍率: 1	通孔	活跃	100V	384	有	This product may require additional documentation to export from the United States.	2 x 32 kB	1.2 GHz	270000 LE	1	SMD/SMT	33750 LAB	964783	Intel	Intel / Altera	Arria 10 SoC	Details	2 x 32 kB	-	BGA, BGA1152,34X34,40	网格排列	PLASTIC/EPOXY	BGA1152,34X34,40	0.9 V	未说明	0.87 V	100 °C	有	10AS027H2F34E2SG	BGA	SQUARE	活跃	INTEL CORP	0.93 V	5.43	SoC FPGA	Radial	YES					1152		KYOCERA AVX	Tape & Reel (TR)	-55°C ~ 125°C	Tray	SkyCap® SR	0.150 L x 0.100 W (3.81mm x 2.54mm)	±5%	活跃			C0G, NP0							通用型			8542.39.00.01	1000 pF		SOC - Systems on a Chip				CMOS		BOTTOM		BALL		未说明		1 mm		compliant						S-PBGA-B1152				384	不合格		0.100 (2.54mm)	0.9 V	OTHER				1.5GHz	256KB		Straight	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	-		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG			MCU, FPGA					384	3.65 mm			现场可编程门阵列				FPGA - 270K Logic Elements			270000	2 Core	--	-	SoC FPGA	0.150 (3.81mm)	35 mm	35 mm	-		-
AGFB022R31C2I3V	Intel	数据表	N/A	-	最小起订量: 1 倍率: 1	Bag	50 Ohms	Q-2I01A0	活跃	Male	6 GHz	RG-316	720		-				-				Amphenol Custom Cable	Male	-		-												Copper																		-		MCX to N-Type																				1.4GHz	256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT			EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG			MPU, FPGA											MCX Plug, Right Angle	N-Type Plug		FPGA - 2.2M Logic Elements					-	Shielded			39.4 (1.0m) 3.3
10AS057N4F40I3LG	ALTERA	数据表	N/A	-	最小起订量: 1 倍率: 1	面板安装	Bulk	Metal	M83723/74	Discontinued at Digi-Key	-	Gold	588	有	This product may require additional documentation to export from the United States.	2 x 32 kB	1.2 GHz	570000 LE	21	SMD/SMT	71250 LAB	965074	Intel	Intel / Altera	Arria 10 SoC	Details	2 x 32 kB	-	BGA, BGA1517,39X39,40	网格排列	PLASTIC/EPOXY	BGA1517,39X39,40	-40 °C	0.9 V	未说明	0.87 V	100 °C	有	10AS057N4F40I3LG	BGA	SQUARE	活跃	INTEL CORP	0.93 V	5.45	SoC FPGA	1517-BBGA, FCBGA	YES	Bulkhead - Front Side Nut	Aluminum	1517-FCBGA (40x40)	硅橡胶	1517	-	TE Connectivity Deutsch 连接器	-	-55°C ~ 200°C	Tray	Military, MIL-DTL-83723 Series III			活跃		Crimp		Receptacle, Male Pins			43		-	Aviation, Automotive, Military			8542.39.00.01		卡口锁	SOC - Systems on a Chip		7.5A, 13A		CMOS		BOTTOM	6	BALL	-	未说明	抗环境干扰	1 mm		compliant				化学镍	24-43	S-PBGA-B1517				588	不合格			0.9 V	INDUSTRIAL				1.5GHz	256KB	-		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	-		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	-		MCU, FPGA					588	3.5 mm			现场可编程门阵列				FPGA - 570K Logic Elements			570000	2 Core	--	-	SoC FPGA	40 mm	40 mm	50.0µin (1.27µm)	-
10AS048K3F35I2LG	ALTERA	数据表	N/A	-	最小起订量: 1 倍率: 1	RN732B	Obsolete	396	有	This product may require additional documentation to export from the United States.	2 x 32 kB	1.2 GHz	480000 LE	1	SMD/SMT	60000 LAB	965083	Intel	Intel / Altera	Arria 10 SoC	Details	2 x 32 kB	-	BGA, BGA1152,34X34,40	网格排列	PLASTIC/EPOXY	BGA1152,34X34,40	-40 °C	0.9 V	未说明	0.87 V	100 °C	有	10AS048K3F35I2LG	BGA	SQUARE	活跃	INTEL CORP	0.93 V	5.47	SoC FPGA		1206 (3216 Metric)	YES			1206		1152		KOA Speer Electronics, Inc.	Tape & Reel (TR)	-55°C ~ 155°C	Tray	RN73	0.126 L x 0.063 W (3.20mm x 1.60mm)	±1%	活跃	2		±25ppm/°C			759 Ohms		Thin Film				0.125W, 1/8W	8542.39.00.01			SOC - Systems on a Chip				CMOS		BOTTOM		BALL		未说明		1 mm		compliant						S-PBGA-B1152				396	不合格			0.9 V	INDUSTRIAL				1.5GHz	256KB			Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	-		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG			MCU, FPGA					396	3.5 mm			现场可编程门阵列				FPGA - 480K Logic Elements			480000	2 Core	--	Moisture Resistant	SoC FPGA	0.028 (0.70mm)	35 mm	35 mm

嵌入式 - 片上系统（SoC） (6000)