类别是'专用'
专用 (1453)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 表面安装 | 终端数量 | JESD-609代码 | 无铅代码 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 引脚数量 | JESD-30代码 | 资历状况 | 电源电压-最大值(Vsup) | 温度等级 | 电源电压-最小值(Vsup) | 操作模式 | 电源电流-最大值 | 组织结构 | 座位高度-最大 | 内存宽度 | 待机电流-最大值 | 记忆密度 | 内存IC类型 | 混合内存类型 | 长度 | 宽度 | |||||||||||||||||
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![]() | XC17S30PDG8I | AMD Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NO | Obsolete | XILINX INC | DIP | DIP, | 1 | 247968 words | 247968 | 85 °C | -40 °C | PLASTIC/EPOXY | DIP | RECTANGULAR | IN-LINE | 5 V | 8 | 有 | e3 | EAR99 | 哑光锡 | 8542.32.00.71 | DUAL | THROUGH-HOLE | 250 | 1 | 2.54 mm | compliant | 30 | 8 | R-PDIP-T8 | 不合格 | 5.5 V | INDUSTRIAL | 4.5 V | SYNCHRONOUS | 247968X1 | 4.5974 mm | 1 | 247968 bit | 存储器电路 | 9.3599 mm | 7.62 mm | ||||||||
![]() | FM3135-GTR | Ramtron International Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | RAMTRON INTERNATIONAL CORP | SOIC | , | PLASTIC/EPOXY | RECTANGULAR | 小概要 | 20 | Obsolete | EAR99 | 8542.32.00.71 | DUAL | 鸥翼 | unknown | 20 | R-PDSO-G20 | 不合格 | 存储器电路 | ||||||||||||||||||||||||||||||||
![]() | EN71SN10F-45EBWP | Eon Silicon Solution Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | EON SILICON SOLUTION INC | BGA | VFBGA, | 33554432 words | 32000000 | 85 °C | -25 °C | PLASTIC/EPOXY | VFBGA | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | 1.8 V | 130 | Transferred | EAR99 | 8542.32.00.71 | BOTTOM | BALL | 1 | 0.65 mm | unknown | 130 | R-PBGA-B130 | 1.95 V | OTHER | 1.7 V | SYNCHRONOUS | 32MX16 | 1 mm | 16 | 536870912 bit | 存储器电路 | 9 mm | 8 mm | |||||||||||||||
![]() | EN71SN10F-45EBWP | Elite Semiconductor Memory Technology Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | ELITE SEMICONDUCTOR MEMORY TECHNOLOGY INC | VFBGA, | 33554432 words | 32000000 | 85 °C | -25 °C | PLASTIC/EPOXY | VFBGA | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | 1.8 V | 130 | 接触制造商 | EAR99 | 8542.32.00.71 | BOTTOM | BALL | 1 | 0.65 mm | unknown | R-PBGA-B130 | 1.95 V | OTHER | 1.7 V | SYNCHRONOUS | 32MX16 | 1 mm | 16 | 536870912 bit | 存储器电路 | 9 mm | 8 mm | |||||||||||||||||
![]() | RD38F3040L0YTQ0 | Numonyx Memory Solutions | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Transferred | NUMONYX | FBGA, BGA88,8X12,32 | 88 ns | PLASTIC/EPOXY | FBGA | BGA88,8X12,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | 1.8 V | 88 | 无 | EAR99 | 8542.32.00.71 | BOTTOM | BALL | 0.8 mm | unknown | R-PBGA-B88 | 不合格 | 0.035 mA | 存储器电路 | FLASH+PSRAM | ||||||||||||||||||||||||||
![]() | RD38F3040L0YTQ0 | Micron Technology Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | MICRON TECHNOLOGY INC | FBGA, BGA88,8X12,32 | 88 ns | PLASTIC/EPOXY | FBGA | BGA88,8X12,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | 1.8 V | 88 | 无 | EAR99 | 8542.32.00.71 | BOTTOM | BALL | 0.8 mm | unknown | R-PBGA-B88 | 不合格 | 0.035 mA | 存储器电路 | FLASH+PSRAM | ||||||||||||||||||||||||||
![]() | S71JL064H80BAW010 | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Transferred | ADVANCED MICRO DEVICES INC | BGA | LFBGA, BGA73,10X12,32 | 70 ns | 4194304 words | 4000000 | 85 °C | -25 °C | PLASTIC/EPOXY | LFBGA | BGA73,10X12,32 | RECTANGULAR | GRID ARRAY, LOW PROFILE, FINE PITCH | 3 V | 73 | 有 | EAR99 | SRAM IS ORGANIZED AS 512K X 16 / 1M X 8; FLASH CAN ALSO BE ORGANIZED AS 8M X 8 | 8542.32.00.71 | BOTTOM | BALL | 未说明 | 1 | 0.8 mm | compliant | 未说明 | 73 | R-PBGA-B73 | 不合格 | 3.3 V | OTHER | 2.7 V | ASYNCHRONOUS | 0.045 mA | 4MX16 | 1.4 mm | 16 | 67108864 bit | 存储器电路 | FLASH+SRAM | 11.6 mm | 8 mm | ||||||
![]() | S71JL064H80BAW010 | Spansion | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | SPANSION INC | BGA | LFBGA, | 3 | 4194304 words | 4000000 | 85 °C | -25 °C | PLASTIC/EPOXY | LFBGA | RECTANGULAR | GRID ARRAY, LOW PROFILE, FINE PITCH | 3 V | 73 | 无 | e0 | EAR99 | 锡铅 | STATIC RAM IS ORGANIZED AS 512K X 16/1M X 8; FLASH CAN ALSO BE ORGANIZED AS 8M X 8 | 8542.32.00.71 | BOTTOM | BALL | 1 | 0.8 mm | compliant | 73 | R-PBGA-B73 | 不合格 | 3.3 V | OTHER | 2.7 V | ASYNCHRONOUS | 4MX16 | 1.4 mm | 16 | 67108864 bit | 存储器电路 | 11.6 mm | 8 mm | |||||||||
![]() | S71PL127JB0BFW9Z | Spansion | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | SPANSION INC | BGA | TFBGA, | 3 | 8388608 words | 8000000 | 85 °C | -25 °C | PLASTIC/EPOXY | TFBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | 3 V | 64 | 有 | e1 | EAR99 | 锡银铜 | PSEUDO STATIC RAM IS ORGANIZED AS 2M X 16 | 8542.32.00.71 | BOTTOM | BALL | 1 | 0.8 mm | compliant | 64 | R-PBGA-B64 | 不合格 | 3.6 V | OTHER | 2.7 V | ASYNCHRONOUS | 8MX16 | 1.2 mm | 16 | 134217728 bit | 存储器电路 | 11.6 mm | 8 mm | |||||||||
![]() | S71GL512NC0BFWEZ2 | Spansion | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | SPANSION INC | BGA | 9 X 12 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-84 | 3 | 33554432 words | 32000000 | 85 °C | -25 °C | PLASTIC/EPOXY | TFBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | 3 V | 84 | 有 | e1 | EAR99 | 锡银铜 | PSRAM IS ORGANIZED AS 4M X 16 | 8542.32.00.71 | BOTTOM | BALL | 260 | 1 | 0.8 mm | unknown | 40 | 84 | R-PBGA-B84 | 不合格 | 3.6 V | OTHER | 2.7 V | ASYNCHRONOUS | 32MX16 | 1.2 mm | 16 | 536870912 bit | 存储器电路 | 12 mm | 9 mm | |||||||
![]() | M4-4112RS-Z2 | Moujen Switch | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | S71VS256RD0AHKBL0 | Cypress Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Transferred | CYPRESS SEMICONDUCTOR CORP | 85 °C | -25 °C | PLASTIC/EPOXY | FBGA | BGA56,10X14,20 | RECTANGULAR | GRID ARRAY, FINE PITCH | 1.8 V | 56 | 有 | EAR99 | 8542.32.00.71 | BOTTOM | BALL | 0.5 mm | compliant | R-PBGA-B56 | 不合格 | OTHER | 存储器电路 | FLASH+PSRAM | ||||||||||||||||||||||||||
![]() | SST32HF3281-70-4E-LSE | Greenliant Systems Ltd | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | GREENLIANT SYSTEMS LTD | , | Obsolete | EAR99 | 8542.32.00.71 | compliant | ||||||||||||||||||||||||||||||||||||||||||||
![]() | NAND98R3M0AZBB5E | Numonyx Memory Solutions | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | NUMONYX | BGA | FBGA, BGA107,10X14,32 | 85 °C | -30 °C | PLASTIC/EPOXY | FBGA | BGA107,10X14,32 | RECTANGULAR | 网格排列 | 1.8 V | 107 | 有 | 有 | EAR99 | 8542.32.00.71 | BOTTOM | BALL | 未说明 | 0.8 mm | unknown | 未说明 | 107 | R-PBGA-B107 | 不合格 | OTHER | 存储器电路 | FLASH+SDRAM | ||||||||||||||||||||
![]() | MD3831-D32-V3-X-P | M-Systems Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | M-SYSTEMS CORP | FBGA, BGA107,10X12,32 | 70 ns | 85 °C | -40 °C | PLASTIC/EPOXY | FBGA | BGA107,10X12,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | 3.3 V | 107 | 有 | EAR99 | 8542.32.00.71 | BOTTOM | BALL | 260 | 0.8 mm | unknown | R-PBGA-B107 | 不合格 | INDUSTRIAL | 0.045 mA | 0.00004 A | 存储器电路 | FLASH+PSRAM | |||||||||||||||||||||
![]() | XC17S05XLVOG8C | AMD Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | XILINX INC | TSOP | TSOP2, | 3 | 54544 words | 54544 | 70 °C | PLASTIC/EPOXY | TSOP2 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | 3.3 V | 8 | 有 | e3 | 有 | EAR99 | Matte Tin (Sn) | 8542.32.00.71 | DUAL | 鸥翼 | 260 | 1 | 1.27 mm | compliant | 30 | 8 | R-PDSO-G8 | 不合格 | 3.6 V | COMMERCIAL | 3 V | SYNCHRONOUS | 54544X1 | 1.2 mm | 1 | 54544 bit | 存储器电路 | 4.9 mm | 3.9 mm | ||||||||
![]() | S71GL256NB0BAWAZ3 | Spansion | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | SPANSION INC | BGA | TFBGA, | 16777216 words | 16000000 | 85 °C | -25 °C | PLASTIC/EPOXY | TFBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | 3 V | 84 | 无 | e0 | EAR99 | 锡铅 | PSRAM IS ORGANIZED AS 2M X 16 | 8542.32.00.71 | BOTTOM | BALL | 1 | 0.8 mm | compliant | 84 | R-PBGA-B84 | 不合格 | 3.1 V | OTHER | 2.7 V | ASYNCHRONOUS | 16MX16 | 1.2 mm | 16 | 268435456 bit | 存储器电路 | 11.6 mm | 8 mm | ||||||||||
![]() | XC17S50XLPDG8C | AMD Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NO | Obsolete | XILINX INC | DIP | DIP, | 1 | 559232 words | 559232 | 70 °C | PLASTIC/EPOXY | DIP | RECTANGULAR | IN-LINE | 3.3 V | 8 | 有 | e3 | 有 | EAR99 | Matte Tin (Sn) | 8542.32.00.71 | DUAL | THROUGH-HOLE | 250 | 1 | 2.54 mm | compliant | 30 | 8 | R-PDIP-T8 | 不合格 | 3.6 V | COMMERCIAL | 3 V | SYNCHRONOUS | 559232X1 | 4.5974 mm | 1 | 559232 bit | 存储器电路 | 9.3599 mm | 7.62 mm | ||||||||
![]() | M4-4112S-Z3 | Moujen Switch | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC17S150XLPDG8I | AMD Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NO | Obsolete | XILINX INC | DIP | DIP, | 1 | 1040128 words | 1040128 | 85 °C | -40 °C | PLASTIC/EPOXY | DIP | RECTANGULAR | IN-LINE | 3.3 V | 8 | 有 | e3 | 有 | EAR99 | Matte Tin (Sn) | 8542.32.00.71 | DUAL | THROUGH-HOLE | 250 | 1 | 2.54 mm | compliant | 30 | 8 | R-PDIP-T8 | 不合格 | 3.6 V | INDUSTRIAL | 3 V | SYNCHRONOUS | 1040128X1 | 4.5974 mm | 1 | 1040128 bit | 存储器电路 | 9.3599 mm | 7.62 mm | |||||||
![]() | M4-4102R-Z2 | Moujen Switch | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | ICM-45631 | TDK Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC17S30PDG8C | AMD Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NO | Obsolete | XILINX INC | DIP | DIP, | 1 | 247968 words | 247968 | 70 °C | PLASTIC/EPOXY | DIP | RECTANGULAR | IN-LINE | 5 V | 8 | 有 | e3 | 有 | EAR99 | Matte Tin (Sn) | 8542.32.00.71 | DUAL | THROUGH-HOLE | 250 | 1 | 2.54 mm | compliant | 30 | 8 | R-PDIP-T8 | 不合格 | 5.25 V | COMMERCIAL | 4.75 V | SYNCHRONOUS | 247968X1 | 4.5974 mm | 1 | 247968 bit | 存储器电路 | 9.3599 mm | 7.62 mm | ||||||||
![]() | M4-4111S-Z2 | Moujen Switch | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | S72NS256PD0AJBLG2 | Spansion | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | SPANSION INC | BGA | 8 X 8 MM, 0.50 MM PITCH, LEAD FREE, FBGA-133 | 3 | 16777216 words | 16000000 | 85 °C | -25 °C | PLASTIC/EPOXY | TFBGA | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | 1.8 V | 133 | 有 | e2 | EAR99 | TIN SILVER COPPER NICKEL | DRAM IS ORGANISED AS 16M X 16; SYNCHRONOUS BURST MODE ALSO POSSIBLE | 8542.32.00.71 | BOTTOM | BALL | 260 | 1 | 0.5 mm | unknown | 40 | 133 | S-PBGA-B133 | 不合格 | 1.95 V | OTHER | 1.7 V | ASYNCHRONOUS | 16MX16 | 1.1 mm | 16 | 268435456 bit | 存储器电路 | 8 mm | 8 mm |