类别是'嵌入式 - 微处理器'
嵌入式 - 微处理器 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 安装类型 | 包装/外壳 | 表面安装 | 供应商器件包装 | 终端数量 | 操作温度 | 包装 | JESD-609代码 | 无铅代码 | 零件状态 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 引脚数量 | JESD-30代码 | 资历状况 | 电源 | 温度等级 | 速度 | uPs/uCs/外围ICs类型 | 核心处理器 | 电源电流-最大值 | 位元大小 | 座位高度-最大 | 地址总线宽度 | 边界扫描 | 低功率模式 | 外部数据总线宽度 | 格式 | 集成缓存 | 内存(字) | 电压 - I/O | 以太网 | 核数/总线宽度 | 图形加速 | 内存控制器 | USB | 附加接口 | 协处理器/DSP | 外部中断数量 | 保安功能 | 显示和界面控制器 | 长度 | 宽度 | |||||||||||||||||
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![]() | SC1100UFH-233F | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Obsolete | ADVANCED MICRO DEVICES INC | BGA | HBGA, BGA388,26X26,50 | 27 MHz | 3 | 85 °C | PLASTIC/EPOXY | HBGA | BGA388,26X26,50 | SQUARE | GRID ARRAY, HEAT SINK/SLUG | 1.89 V | 1.71 V | 1.8 V | YES | 388 | 有 | e2 | 3A991.A.2 | 锡银 | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.27 mm | compliant | 388 | S-PBGA-B388 | 不合格 | OTHER | 233 MHz | MICROPROCESSOR | 32 | 2.59 mm | 13 | YES | YES | 64 | 浮点 | YES | 35 mm | 35 mm | ||||||||||||||||||||||||||
![]() | MC6800CLD | Freescale Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Obsolete | MOTOROLA SEMICONDUCTOR PRODUCTS | DIP, DIP40,.6 | 85 °C | -40 °C | CERAMIC | DIP | DIP40,.6 | RECTANGULAR | IN-LINE | NO | 40 | 无 | e0 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-XDIP-T40 | INDUSTRIAL | 1 MHz | MICROPROCESSOR, RISC | 8 | ||||||||||||||||||||||||||||||||||||||||||||
![]() | OSA248FAA5BL | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ADVANCED MICRO DEVICES INC | PGA | SPGA, PGA940,31X31,50 | PLASTIC/EPOXY | SPGA | PGA940,31X31,50 | SQUARE | GRID ARRAY, SHRINK PITCH | NO | 940 | Obsolete | 3A991.A.2 | 8542.31.00.01 | PERPENDICULAR | PIN/PEG | 1.27 mm | unknown | 940 | S-PPGA-P940 | 不合格 | 2200 MHz | MICROPROCESSOR, RISC | 64 | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | TMPR4938XBG-333 | Toshiba America Electronic Components | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Obsolete | TOSHIBA CORP | BGA | BGA, BGA484,26X26,50 | 133.3 MHz | 70 °C | PLASTIC/EPOXY | BGA | BGA484,26X26,50 | SQUARE | 网格排列 | 1.6 V | 1.4 V | 1.5 V | YES | 484 | 有 | 有 | 3A991.A.2 | ALSO REQUIRES 3.3V SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 未说明 | 1.27 mm | unknown | 未说明 | 484 | S-PBGA-B484 | 不合格 | COMMERCIAL | 333 MHz | MICROPROCESSOR, RISC | 64 | 2.46 mm | 20 | YES | YES | 64 | 浮点 | YES | 35 mm | 35 mm | ||||||||||||||||||||||||||
![]() | AV8062701147401 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | INTEL CORP | HBGA, | 100 MHz | PLASTIC/EPOXY | HBGA | SQUARE | GRID ARRAY, HEAT SINK/SLUG | 1.52 V | 0.3 V | YES | 1284 | Obsolete | 5A992.C | 8542.31.00.01 | BOTTOM | BALL | 1.106 mm | compliant | S-PBGA-B1284 | 1500 MHz | MICROPROCESSOR | 64 | 16 | YES | YES | 64 | 固定点 | YES | 37.5 mm | 37.5 mm | |||||||||||||||||||||||||||||||||||||||
![]() | EM78P142SS10J | ELAN Microelectronics Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ELAN MICROELECTRONICS CORP | , | 接触制造商 | 8542.31.00.01 | unknown | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | EE80C188EA25 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Obsolete | INTEL CORP | QCCJ, LDCC68,1.0SQ | 70 °C | PLASTIC/EPOXY | QCCJ | LDCC68,1.0SQ | SQUARE | CHIP CARRIER | 5 V | YES | 68 | 有 | 8542.31.00.01 | QUAD | J BEND | 1.27 mm | unknown | S-PQCC-J68 | 不合格 | COMMERCIAL | 25 MHz | MICROPROCESSOR, RISC | 105 mA | 16 | ||||||||||||||||||||||||||||||||||||||||||||
![]() | IDT79R3000-20G | Integrated Device Technology Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Obsolete | INTEGRATED DEVICE TECHNOLOGY INC | PGA, PGA144,15X15 | 80 MHz | 70 °C | CERAMIC | PGA | PGA144,15X15 | SQUARE | 网格排列 | 5.25 V | 4.75 V | 5 V | NO | 144 | 无 | e0 | 无 | 3A991.A.2 | 锡铅 | 8542.31.00.01 | PERPENDICULAR | PIN/PEG | 2.54 mm | not_compliant | S-XPGA-P144 | 不合格 | COMMERCIAL | 20 MHz | MICROPROCESSOR, RISC | 650 mA | 32 | 32 | NO | 32 | 固定点 | |||||||||||||||||||||||||||||||||
![]() | GX2-X28-TD | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ADVANCED MICRO DEVICES INC | PLASTIC/EPOXY | BGA | BGA368,26X26,50 | SQUARE | 网格排列 | YES | 368 | 活跃 | 8542.31.00.01 | BOTTOM | BALL | 1.27 mm | compliant | S-PBGA-B368 | 不合格 | 366 MHz | MICROPROCESSOR, RISC | 32 | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MC68322FT16 | Freescale Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | FREESCALE SEMICONDUCTOR INC | QFP | QFP, | 33.334 MHz | 70 °C | PLASTIC/EPOXY | QFP | SQUARE | FLATPACK | 5.5 V | 4.5 V | 5 V | YES | 160 | Obsolete | EAR99 | 8542.31.00.01 | QUAD | 鸥翼 | 0.65 mm | unknown | 160 | S-PQFP-G160 | 不合格 | COMMERCIAL | 16.667 MHz | MICROPROCESSOR, RISC | 16 | 3.85 mm | 26 | NO | NO | 16 | 固定点 | NO | 28 mm | 28 mm | ||||||||||||||||||||||||||||||||
![]() | MC68322FT16 | Motorola Mobility LLC | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Obsolete | MOTOROLA INC | QFP | QFP, QFP160,1.2SQ | 33.334 MHz | 5 V | 4.5 V | 5.5 V | FLATPACK | SQUARE | QFP160,1.2SQ | QFP | PLASTIC/EPOXY | 70 °C | YES | 160 | 无 | e0 | 3A991.A.2 | 锡铅 | 8542.31.00.01 | QUAD | 鸥翼 | 0.65 mm | unknown | 160 | S-PQFP-G160 | 不合格 | COMMERCIAL | 16.667 MHz | MICROPROCESSOR, RISC | 32 | 3.85 mm | 25 | NO | NO | 16 | 固定点 | NO | 28 mm | 28 mm | ||||||||||||||||||||||||||||
![]() | XPC8240RZU250D | Freescale Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | FREESCALE SEMICONDUCTOR INC | 35 X 35 MM, 1.65 MM HEIGHT, 1.27 MM PITCH, TBGA-352 | PLASTIC/EPOXY | BGA | BGA352,26X26,50 | SQUARE | 网格排列 | YES | 352 | Obsolete | BOTTOM | BALL | 1.27 mm | unknown | S-PBGA-B352 | 不合格 | 2.5,3.3 V | 250 MHz | MICROPROCESSOR, RISC | 32 | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | SAA7215HS/C2 | Philips Semiconductors | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Transferred | 飞利浦半导体 | QFP, QFP208,1.2SQ,20 | PLASTIC/EPOXY | QFP | QFP208,1.2SQ,20 | SQUARE | FLATPACK | 3.3 V | YES | 208 | 无 | e0 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | QUAD | 鸥翼 | 0.5 mm | unknown | S-PQFP-G208 | 不合格 | 消费电路 | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | PPC460EX-NUB800T | MACOM | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Obsolete | M/A-COM TECHNOLOGY SOLUTIONS INC | 35 X 35 MM, ROHS COMPLIANT, PLASTIC, MS-034, TEEBGA-728 | 100 MHz | 85 °C | -40 °C | PLASTIC/EPOXY | BGA | SQUARE | 网格排列 | 1.3 V | 1.2 V | 1.25 V | YES | 728 | 有 | 3A991.A.2 | 8542.31.00.01 | BOTTOM | BALL | 未说明 | 1 mm | compliant | 未说明 | S-PBGA-B728 | INDUSTRIAL | 800 MHz | MICROPROCESSOR, RISC | 2.65 mm | 32 | YES | YES | 32 | 浮点 | YES | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||
![]() | R65C02P3 | Conexant Systems Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Obsolete | 康讯系统 | DIP | DIP, DIP40,.6 | 3 MHz | 70 °C | PLASTIC/EPOXY | DIP | DIP40,.6 | RECTANGULAR | IN-LINE | 5.25 V | 4.75 V | 5 V | NO | 40 | 无 | e0 | 锡铅 | 8542.31.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | compliant | 40 | R-PDIP-T40 | 不合格 | COMMERCIAL | 3 MHz | MICROPROCESSOR | 12 mA | 8 | 5.08 mm | 16 | NO | YES | 8 | 固定点 | NO | 0 | 2 | 52.07 mm | 15.24 mm | ||||||||||||||||||||||||||
![]() | XPC823ZT25Z3 | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NXP SEMICONDUCTORS | BGA, | 70 °C | PLASTIC/EPOXY | BGA | SQUARE | 网格排列 | YES | 256 | Obsolete | 8542.31.00.01 | BOTTOM | BALL | unknown | S-PBGA-B256 | COMMERCIAL | 25 MHz | MICROPROCESSOR | 32 | YES | YES | 固定点 | YES | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | XPC823ZT25Z3 | Freescale Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | FREESCALE SEMICONDUCTOR INC | BGA, | 70 °C | PLASTIC/EPOXY | BGA | SQUARE | 网格排列 | YES | 256 | Transferred | 8542.31.00.01 | BOTTOM | BALL | unknown | S-PBGA-B256 | COMMERCIAL | 25 MHz | MICROPROCESSOR | 32 | YES | YES | 固定点 | YES | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | HM1-6100-2 | Intersil Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Obsolete | INTERSIL CORP | 125 °C | -55 °C | CERAMIC | DIP | DIP40,.6 | RECTANGULAR | IN-LINE | NO | 40 | 无 | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 8542.31.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | not_compliant | R-XDIP-T40 | 不合格 | MILITARY | 2.5 MHz | MICROPROCESSOR, RISC | 12 | |||||||||||||||||||||||||||||||||||||||||||
![]() | UPD70208GF-10-3B9 | Renesas Electronics Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Obsolete | RENESAS ELECTRONICS CORP | QFP | QFP-80 | 85 °C | -40 °C | PLASTIC/EPOXY | QFP | QFP80,.7X.9,32 | RECTANGULAR | FLATPACK | 5.5 V | 4.5 V | 5 V | YES | 80 | 无 | e0 | 锡铅 | 8542.31.00.01 | QUAD | 鸥翼 | 0.8 mm | unknown | 80 | R-PQFP-G80 | 不合格 | INDUSTRIAL | 10 MHz | MICROPROCESSOR | 120 mA | 8 | 3 mm | 20 | NO | YES | 8 | 固定点 | NO | 5 | 20 mm | 14 mm | |||||||||||||||||||||||||||
![]() | IDT79R3052E-40MJ | Integrated Device Technology Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Obsolete | INTEGRATED DEVICE TECHNOLOGY INC | QFN | QCCJ, LDCC84,1.2SQ | 80 MHz | 1 | 70 °C | PLASTIC/EPOXY | QCCJ | LDCC84,1.2SQ | SQUARE | CHIP CARRIER | 5.25 V | 4.75 V | 5 V | YES | 84 | 无 | e0 | 无 | 3A991.A.2 | 锡铅 | 35 DHYRSTONE MIPS; BURST BUS; 5 PIPELINE STAGES | 8542.31.00.01 | QUAD | J BEND | 225 | 1.27 mm | not_compliant | 30 | 84 | S-PQCC-J84 | 不合格 | COMMERCIAL | 40 MHz | MICROPROCESSOR, RISC | 500 mA | 32 | 4.57 mm | 32 | NO | NO | 32 | 固定点 | NO | 0 | 6 | 29.083 mm | 29.083 mm | ||||||||||||||||||||
![]() | PPC4406X-3CF667C | Applied Micro Circuits Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | BXCP-40H-11M-J19-3-A1-00-0-3 | Bridgelux Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | S80C188XL-16 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 活跃 | INTEL CORP | QFP, QFP80,.7X.9,32 | 70 °C | PLASTIC/EPOXY | QFP | QFP80,.7X.9,32 | RECTANGULAR | FLATPACK | 5 V | YES | 80 | 无 | e0 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | QUAD | 鸥翼 | 0.8 mm | compliant | R-PQFP-G80 | 不合格 | COMMERCIAL | 16 MHz | MICROPROCESSOR, RISC | 80 mA | 16 | ||||||||||||||||||||||||||||||||||||||||||
![]() | MT8370IV/KZA | MediaTek | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 1204-VFBGA | 1204-VFBGA (15x15) | -40°C ~ 105°C (TJ) | Tape & Reel (TR);Cut Tape (CT);Digi-Reel® | 活跃 | 2GHz, 2.2GHz | ARM® Cortex®-A55, ARM® Cortex®-A78 | 1.2V, 1.8V | MII, RGMII, RMII | 4, 2 Core, 64-Bit | 有 | LPDDR4x | USB 2.0 (2), USB 3.1 (1) | I2C, I2S, MMC/SD/SDIO, PCM, SPI, UART | ARM® Mali-G57MC2 | AES | MIPI-CSI | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MT8370AV/AZA | MediaTek | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 1204-VFBGA | 1204-VFBGA (15x15) | -20°C ~ 95°C (TJ) | Tape & Reel (TR);Cut Tape (CT);Digi-Reel® | 活跃 | 2GHz, 2.2GHz | ARM® Cortex®-A55, ARM® Cortex®-A78 | 1.2V, 1.8V | MII, RGMII, RMII | 4, 2 Core, 64-Bit | 有 | LPDDR4x | USB 2.0 (2), USB 3.1 (1) | I2C, I2S, MMC/SD/SDIO, PCM, SPI, UART | ARM® Mali-G57MC2 | AES | MIPI-CSI |