类别是'嵌入式 - CPLD(复杂可编程逻辑器件)'
嵌入式 - CPLD(复杂可编程逻辑器件) (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 终端数量 | 厂商 | 操作温度 | 包装 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 子类别 | 技术 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | Reach合规守则 | 频率 | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源 | 温度等级 | 可编程类型 | 最大电源电压 | 最小电源电压 | 传播延迟 | 接通延迟时间 | 组织结构 | 座位高度-最大 | 可编程逻辑类型 | 逻辑元件/单元数 | 阀门数量 | 最高频率 | 可编程I/O数 | 逻辑块数(LABs) | 速度等级 | 输出功能 | 宏细胞数 | JTAG BST | 内部供电电压 | 延迟时间 tpd(1)最大 | 逻辑元素/块的数量 | 系统内可编程 | 长度 | 宽度 | 辐射硬化 | 无铅 | ||||||||||||||||||||||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | SLG46110V | Renesas | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tape & Reel (TR) | 7 | 活跃 | + 85 C | - 40 C | SMD/SMT | 表面贴装 | 12-UFQFN | 12-STQFN (1.6x1.6) | Renesas Design Germany GmbH | 7 | -40°C ~ 85°C (TA) | - | 1.8 V to 5 V | OTP | 1.71V ~ 1.89V, 3V ~ 3.6V, 4.5V ~ 5.5V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | EPM7064SLC4410 | ALTERA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 64 | PLASTIC, LCC-44 | CHIP CARRIER | 1 | PLASTIC/EPOXY | LDCC44,.7SQ | 5 V | 30 | 4.75 V | 70 °C | 无 | EPM7064SLC44-10 | 125 MHz | QCCJ | SQUARE | Intel Corporation | Obsolete | 36 | Programmable Logic Device | INTEL CORP | 5.25 V | 7.63 | 表面贴装 | 44-LCC (J-Lead) | YES | 44-PLCC (16.59x16.59) | 44 | 36 | 0°C ~ 70°C (TA) | Tube | MAX® 7000S | e0 | Obsolete | Tin/Lead (Sn/Pb) | YES | 8542.39.00.01 | 可编程逻辑器件 | CMOS | QUAD | J BEND | 220 | 1.27 mm | compliant | EPM7064 | S-PQCC-J44 | 不合格 | 5 V | COMMERCIAL | 系统内可编程 | 10 ns | 0 DEDICATED INPUTS, 36 I/O | 4.572 mm | EE PLD | 1250 | MACROCELL | 64 | YES | 4.75 V ~ 5.25 V | 10.0ns | 4 | YES | 16.5862 mm | 16.5862 mm | ||||||||||||||||||||||||||||||||
![]() | EPM7032BUC49-3N | ALTERA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 32 | LFBGA, BGA49,7X7,32 | GRID ARRAY, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | BGA49,7X7,32 | 2.5 V | 40 | 2.375 V | 70 °C | 有 | EPM7032BUC49-3N | 303 MHz | LFBGA | SQUARE | Altera Corporation | Obsolete | 36 | ALTERA CORP | 2.625 V | 5.63 | BGA | 表面贴装 | 49-LFBGA | YES | 49-UBGA (7x7) | 49 | 36 | 0°C ~ 70°C (TA) | Tray | MAX® 7000B | e1 | Obsolete | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | 8542.39.00.01 | 可编程逻辑器件 | CMOS | BOTTOM | BALL | 260 | 0.8 mm | compliant | EPM7032 | 49 | S-PBGA-B49 | 不合格 | 1.8/3.3,2.5 V | COMMERCIAL | 系统内可编程 | 3.5 ns | 0 DEDICATED INPUTS, 36 I/O | 1.55 mm | EE PLD | 600 | MACROCELL | 32 | YES | 2.375 V ~ 2.625 V | 3.5ns | 2 | YES | 7 mm | 7 mm | ||||||||||||||||||||||||||||||
![]() | EPM7064SLC84-10 | ALTERA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 64 | QCCJ, LDCC84,1.2SQ | CHIP CARRIER | 3 | PLASTIC/EPOXY | LDCC84,1.2SQ | 5 V | 30 | 4.75 V | 70 °C | 无 | EPM7064SLC84-10 | 125 MHz | QCCJ | SQUARE | Intel Corporation | Obsolete | 68 | INTEL CORP | 5.25 V | 5.03 | 表面贴装 | 84-LCC (J-Lead) | YES | 84-PLCC (29.31x29.31) | 84 | 68 | 0°C ~ 70°C (TA) | Tray | MAX® 7000S | e0 | Obsolete | Tin/Lead (Sn/Pb) | CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V | 8542.39.00.01 | 可编程逻辑器件 | CMOS | QUAD | J BEND | 220 | 1.27 mm | compliant | EPM7064 | S-PQCC-J84 | 不合格 | 3.3/5,5 V | COMMERCIAL | 系统内可编程 | 10 ns | 0 DEDICATED INPUTS, 68 I/O | 5.08 mm | EE PLD | 1250 | MACROCELL | 64 | YES | 4.75 V ~ 5.25 V | 10.0ns | 4 | YES | 29.3116 mm | 29.3116 mm | |||||||||||||||||||||||||||||||||
![]() | EPM7064QC100-12 | ALTERA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 64 | 活跃 | EPM7064 | Bulk | 表面贴装 | 100-BQFP | 100-PQFP (20x14) | Altera | 68 | 0°C ~ 70°C (TA) | Tray | MAX® 7000 | Obsolete | EPM7064 | EE PLD | 1250 | 4.75 V ~ 5.25 V | 12.0ns | 4 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | EPM7064BTC44-5 | ALTERA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 64 | Bulk | EPM7064 | 活跃 | 表面贴装 | 44-TQFP | 44-TQFP (10x10) | Altera | 36 | 0°C ~ 70°C (TA) | Tray | MAX® 7000B | Obsolete | EPM7064 | 系统内可编程 | 1250 | 2.375 V ~ 2.625 V | 5.0ns | 4 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | EPM2210GF324C5 | ALTERA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1700 | BGA, BGA324,18X18,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA324,18X18,40 | 1.8 V | 30 | 1.71 V | 85 °C | 无 | EPM2210GF324C5 | BGA | SQUARE | Intel Corporation | 活跃 | 272 | INTEL CORP | 1.89 V | 5.02 | 表面贴装 | 324-BGA | YES | 324-FBGA (19x19) | 324 | 272 | 0°C ~ 85°C (TJ) | Tray | MAX® II | e0 | 活跃 | 3A991 | 锡铅 | YES | 8542.39.00.01 | 可编程逻辑器件 | CMOS | BOTTOM | BALL | 220 | 1 mm | compliant | EPM2210 | S-PBGA-B324 | 不合格 | 1.5/3.3,1.8 V | 商业扩展 | 系统内可编程 | 11.2 ns | 0 DEDICATED INPUTS, 272 I/O | 2.2 mm | 闪存 PLD | MACROCELL | 1700 | YES | 1.71 V ~ 1.89 V | 7.0ns | 2210 | YES | 19 mm | 19 mm | ||||||||||||||||||||||||||||||||||
![]() | EPM7064LC84-10 | ALTERA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 64 | PLASTIC, LCC-84 | CHIP CARRIER | 2 | PLASTIC/EPOXY | LDCC84,1.2SQ | 5 V | 30 | 4.75 V | 70 °C | 无 | EPM7064LC84-10 | 125 MHz | QCCJ | SQUARE | Altera Corporation | Transferred | 68 | ALTERA CORP | 5.25 V | 4.44 | LCC | 表面贴装 | 84-LCC (J-Lead) | YES | 84-PLCC (29.31x29.31) | 84 | 68 | 0°C ~ 70°C (TA) | Tube | MAX® 7000 | e0 | 无 | Obsolete | Tin/Lead (Sn/Pb) | CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V | 8542.39.00.01 | 可编程逻辑器件 | CMOS | QUAD | J BEND | 220 | 1.27 mm | unknown | EPM7064 | 84 | S-PQCC-J84 | 不合格 | 3.3/5,5 V | COMMERCIAL | EE PLD | 10 ns | 0 DEDICATED INPUTS, 68 I/O | 5.08 mm | EE PLD | 1250 | MACROCELL | 64 | NO | 4.75 V ~ 5.25 V | 10.0ns | 4 | NO | 29.3116 mm | 29.3116 mm | ||||||||||||||||||||||||||||||
![]() | EPM7064QC100-7 | ALTERA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 64 | QFP, QFP100,.7X.9 | FLATPACK | 3 | PLASTIC/EPOXY | QFP100,.7X.9 | 5 V | 30 | 4.75 V | 70 °C | 无 | EPM7064QC100-7 | 166.7 MHz | QFP | RECTANGULAR | Intel Corporation | Obsolete | 68 | INTEL CORP | 5.25 V | 8.52 | 表面贴装 | 100-BQFP | YES | 100-PQFP (20x14) | 100 | 68 | 0°C ~ 70°C (TA) | Tray | MAX® 7000 | e0 | Obsolete | 锡铅 | CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V | 8542.39.00.01 | 可编程逻辑器件 | CMOS | QUAD | 鸥翼 | 220 | 0.65 mm | compliant | EPM7064 | R-PQFP-G100 | 不合格 | 3.3/5,5 V | COMMERCIAL | EE PLD | 7.5 ns | 0 DEDICATED INPUTS, 68 I/O | 3.65 mm | EE PLD | 1250 | MACROCELL | 64 | NO | 4.75 V ~ 5.25 V | 7.5ns | 4 | NO | 20 mm | 14 mm | |||||||||||||||||||||||||||||||||
![]() | EPM7192SQC160-7 | ALTERA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 192 | QFP, QFP160,1.2SQ | FLATPACK | 3 | PLASTIC/EPOXY | QFP160,1.2SQ | 5 V | 30 | 4.75 V | 70 °C | 无 | EPM7192SQC160-7 | 166.7 MHz | QFP | SQUARE | Intel Corporation | Obsolete | 124 | INTEL CORP | 5.25 V | 5.21 | 表面贴装 | 160-BQFP | YES | 160-PQFP (28x28) | 160 | 124 | 0°C ~ 70°C (TA) | Tray | MAX® 7000S | e0 | Obsolete | Tin/Lead (Sn/Pb) | CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V | 8542.39.00.01 | 可编程逻辑器件 | CMOS | QUAD | 鸥翼 | 220 | 0.65 mm | compliant | EPM7192 | S-PQFP-G160 | 不合格 | 3.3/5,5 V | COMMERCIAL | 系统内可编程 | 7.5 ns | 0 DEDICATED INPUTS, 124 I/O | 4.07 mm | EE PLD | 3750 | MACROCELL | 192 | YES | 4.75 V ~ 5.25 V | 7.5ns | 12 | YES | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||
![]() | EPM7512BUC169-7 | ALTERA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 512 | Bulk | EPM7512 | 活跃 | 表面贴装 | 160-LFBGA | 169-UBGA (11x11) | Altera | 141 | 0°C ~ 70°C (TA) | Tray | MAX® 7000B | Obsolete | EPM7512 | 系统内可编程 | 10000 | 2.375 V ~ 2.625 V | 7.5ns | 32 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | EPM7192SQC160-7N | ALTERA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 192 | QFP, QFP160,1.2SQ | FLATPACK | 3 | PLASTIC/EPOXY | QFP160,1.2SQ | 5 V | 40 | 4.75 V | 70 °C | 有 | EPM7192SQC160-7N | 166.7 MHz | QFP | SQUARE | Altera Corporation | Transferred | 124 | ALTERA CORP | 5.25 V | 3.73 | QFP | 表面贴装 | 160-BQFP | YES | 160-PQFP (28x28) | 160 | 124 | 0°C ~ 70°C (TA) | Tray | MAX® 7000S | e3 | 有 | Obsolete | EAR99 | Matte Tin (Sn) | CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V | 8542.39.00.01 | 可编程逻辑器件 | CMOS | QUAD | 鸥翼 | 245 | 0.65 mm | compliant | EPM7192 | 160 | S-PQFP-G160 | 不合格 | 3.3/5,5 V | COMMERCIAL | 系统内可编程 | 7.5 ns | 0 DEDICATED INPUTS, 124 I/O | 4.07 mm | EE PLD | 3750 | MACROCELL | 192 | YES | 4.75 V ~ 5.25 V | 7.5ns | 12 | YES | 28 mm | 28 mm | |||||||||||||||||||||||||||||
![]() | EPM2210GF256I5N | ALTERA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1700 | BGA, BGA256,16X16,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA256,16X16,40 | 1.8 V | 40 | 1.71 V | 有 | EPM2210GF256I5N | BGA | SQUARE | Intel Corporation | 活跃 | 204 | INTEL CORP | 1.89 V | 1.23 | 表面贴装 | 256-BGA | YES | 256-FBGA (17x17) | 256 | 204 | -40°C ~ 100°C (TJ) | Tray | MAX® II | e1 | 活跃 | 3A991 | 锡银铜 | IT CAN ALSO OPERATE AT 3.3V | 8542.39.00.01 | 可编程逻辑器件 | CMOS | BOTTOM | BALL | 260 | 1 mm | compliant | EPM2210 | S-PBGA-B256 | 不合格 | 1.5/3.3,1.8 V | 系统内可编程 | 11.2 ns | 0 DEDICATED INPUTS, 204 I/O | 2.2 mm | 闪存 PLD | MACROCELL | 1700 | YES | 1.71 V ~ 1.89 V | 7.0ns | 2210 | YES | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||
![]() | EPM7128BFC256-4 | ALTERA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 128 | Bulk | EPM7128 | 活跃 | 表面贴装 | 256-BGA | 256-FBGA (17x17) | Altera | 100 | 0°C ~ 70°C (TA) | Tray | MAX® 7000B | Obsolete | EPM7128 | 系统内可编程 | 2500 | 2.375 V ~ 2.625 V | 4.0ns | 8 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | EPM9560RC240-20 | ALTERA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 560 | FQFP, HQFP240,1.37SQ,20 | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | HQFP240,1.37SQ,20 | 5 V | 30 | 4.75 V | 70 °C | 无 | EPM9560RC240-20 | 100 MHz | FQFP | SQUARE | Intel Corporation | Obsolete | 191 | INTEL CORP | 5.25 V | 5.4 | 表面贴装 | 240-BFQFP Exposed Pad | YES | 240-RQFP (32x32) | 240 | 191 | 0°C ~ 70°C (TA) | Tray | MAX® 9000 | e0 | Obsolete | Tin/Lead (Sn/Pb) | 772 FLIP FLOPS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V | 8542.39.00.01 | 可编程逻辑器件 | CMOS | QUAD | 鸥翼 | 220 | 0.5 mm | compliant | EPM9560 | S-PQFP-G240 | 不合格 | 3.3/5,5 V | COMMERCIAL | 系统内可编程 | 23.6 ns | 0 DEDICATED INPUTS, 191 I/O | 4.1 mm | EE PLD | 12000 | MACROCELL | 560 | YES | 4.75 V ~ 5.25 V | 20.0ns | 35 | YES | 32 mm | 32 mm | |||||||||||||||||||||||||||||||||
![]() | EPM7512BFC256-5 | ALTERA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 512 | 8542390000, 8542390000/8542390000/8542390000/8542390000/8542390000 | Compliant | EEPROM | BGA, BGA256,16X16,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA256,16X16,40 | 2.5 V | 30 | 2.375 V | 70 °C | 无 | EPM7512BFC256-5 | 163.9 MHz | BGA | SQUARE | Intel Corporation | Obsolete | 212 | INTEL CORP | 2.625 V | 8.23 | 表面贴装 | 256-BGA | YES | 256 | 256-FBGA (17x17) | 256 | 212 | 0°C ~ 70°C (TA) | Tray | MAX® 7000B | e0 | Obsolete | 3A991 | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | YES | 8542.39.00.01 | 可编程逻辑器件 | CMOS | BOTTOM | BALL | 220 | 1 mm | compliant | 166.67 MHz | EPM7512 | S-PBGA-B256 | 不合格 | 2.5 V | 1.8/3.3,2.5 V | COMMERCIAL | 系统内可编程 | 2.625 V | 2.375 V | 5.5 ns | 5.5 ns | 0 DEDICATED INPUTS, 212 I/O | 3.5 mm | EE PLD | 32 | 10000 | 163.9 MHz | 212 | 32 | MACROCELL | 512 | YES | 2.375 V ~ 2.625 V | 5.5ns | 32 | YES | 17 mm | 17 mm | 无 | 含铅 | ||||||||||||||
![]() | EPM3064ALC44-4N | ALTERA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 64 | QCCJ, LDCC44,.7SQ | CHIP CARRIER | 3 | PLASTIC/EPOXY | LDCC44,.7SQ | 3.3 V | 40 | 3 V | 70 °C | 有 | EPM3064ALC44-4N | 222.2 MHz | QCCJ | SQUARE | Intel Corporation | Obsolete | 34 | INTEL CORP | 3.6 V | 5.21 | 表面贴装 | 44-LCC (J-Lead) | YES | 44-PLCC (16.59x16.59) | 44 | 34 | 0°C ~ 70°C (TA) | Tray | MAX® 3000A | e3 | Obsolete | EAR99 | Matte Tin (Sn) | YES | 8542.39.00.01 | 可编程逻辑器件 | CMOS | QUAD | J BEND | 245 | 1.27 mm | compliant | EPM3064 | S-PQCC-J44 | 不合格 | 2.5/3.3,3.3 V | COMMERCIAL | 系统内可编程 | 4.5 ns | 0 DEDICATED INPUTS, 34 I/O | 4.572 mm | EE PLD | 1250 | MACROCELL | 64 | YES | 3 V ~ 3.6 V | 4.5ns | 4 | YES | 16.5862 mm | 16.5862 mm | ||||||||||||||||||||||||||||||||
![]() | EPM7256BFC256-10 | ALTERA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 256 | BGA, BGA256,16X16,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA256,16X16,40 | 2.5 V | 30 | 2.375 V | 70 °C | 无 | EPM7256BFC256-10 | 188.7 MHz | BGA | SQUARE | Intel Corporation | Obsolete | 164 | INTEL CORP | 2.625 V | 5.1 | 表面贴装 | 256-BGA | YES | 256-FBGA (17x17) | 256 | 164 | 0°C ~ 70°C (TA) | Tray | MAX® 7000B | e0 | Obsolete | EAR99 | Tin/Lead (Sn/Pb) | YES | 8542.39.00.01 | 可编程逻辑器件 | CMOS | BOTTOM | BALL | 220 | 1 mm | compliant | EPM7256 | S-PBGA-B256 | 不合格 | 1.8/3.3,2.5 V | COMMERCIAL | 系统内可编程 | 5 ns | 0 DEDICATED INPUTS, 164 I/O | 3.5 mm | EE PLD | 5000 | MACROCELL | 256 | YES | 2.375 V ~ 2.625 V | 10.0ns | 16 | YES | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||
![]() | EPM3064ATC100-7N | ALTERA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 64 | TQFP-100 | FLATPACK, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | TQFP100,.63SQ | 3.3 V | 40 | 3 V | 70 °C | 有 | EPM3064ATC100-7N | 135.1 MHz | LFQFP | SQUARE | Altera Corporation | Transferred | 66 | ALTERA CORP | 3.6 V | 5.2 | QFP | 表面贴装 | 100-TQFP | YES | 100-TQFP (14x14) | 100 | 66 | 0°C ~ 70°C (TA) | Tray | MAX® 3000A | e3 | 有 | Obsolete | EAR99 | Matte Tin (Sn) - annealed | YES | 8542.39.00.01 | 可编程逻辑器件 | CMOS | QUAD | 鸥翼 | 260 | 0.5 mm | unknown | EPM3064 | 100 | S-PQFP-G100 | 不合格 | 2.5/3.3,3.3 V | COMMERCIAL | 系统内可编程 | 7.5 ns | 0 DEDICATED INPUTS, 66 I/O | 1.27 mm | EE PLD | 1250 | MACROCELL | 64 | YES | 3 V ~ 3.6 V | 7.5ns | 4 | YES | 14 mm | 14 mm | |||||||||||||||||||||||||||||
![]() | EPM7064STI100-7N | ALTERA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 64 | LFQFP, TQFP100,.63SQ | FLATPACK, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | TQFP100,.63SQ | -40 °C | 5 V | 40 | 4.5 V | 85 °C | 有 | EPM7064STI100-7N | 166.7 MHz | LFQFP | SQUARE | Altera Corporation | Transferred | 68 | ALTERA CORP | 5.5 V | 2.95 | QFP | 表面贴装 | 100-TQFP | YES | 100-TQFP (14x14) | 100 | 68 | -40°C ~ 85°C (TA) | Tray | MAX® 7000S | e3 | 有 | Obsolete | EAR99 | Matte Tin (Sn) | 64 MACROCELLS; 4 LABS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V | 8542.39.00.01 | 可编程逻辑器件 | CMOS | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | EPM7064 | 100 | S-PQFP-G100 | 不合格 | 3.3/5,5 V | INDUSTRIAL | 系统内可编程 | 7.5 ns | 0 DEDICATED INPUTS, 68 I/O | 1.27 mm | EE PLD | 1250 | MACROCELL | 64 | NO | 4.5 V ~ 5.5 V | 7.5ns | 4 | YES | 14 mm | 14 mm | ||||||||||||||||||||||||||||
![]() | EPM7064AELC44-10 | ALTERA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 64 | Compliant | EEPROM | QCCJ, LDCC44,.7SQ | CHIP CARRIER | 1 | PLASTIC/EPOXY | LDCC44,.7SQ | 3.3 V | 30 | 3 V | 70 °C | 无 | EPM7064AELC44-10 | 100 MHz | QCCJ | SQUARE | Intel Corporation | 活跃 | 36 | INTEL CORP | 3.6 V | 1.64 | 表面贴装 | 44-LCC (J-Lead) | YES | 44 | 44-PLCC (16.59x16.59) | 44 | 36 | 0°C ~ 70°C (TA) | Tube | MAX® 7000A | e0 | 活跃 | EAR99 | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | 64 MICROCELLS; 4 LABS; CONFIGURABLE I/O OPERATION WITH 2.5 OR 3.3 | 8542.39.00.01 | 可编程逻辑器件 | CMOS | QUAD | J BEND | 220 | 1.27 mm | compliant | 125 MHz | EPM7064 | S-PQCC-J44 | 不合格 | 3.3 V | 2.5/3.3,3.3 V | COMMERCIAL | 系统内可编程 | 3.6 V | 3 V | 10 ns | 10 ns | 0 DEDICATED INPUTS, 36 I/O | 4.57 mm | EE PLD | 4 | 1250 | 222.2 MHz | 36 | 4 | 10 | MACROCELL | 64 | YES | 3 V ~ 3.6 V | 10.0ns | 4 | YES | 16.5862 mm | 16.5862 mm | 无 | 含铅 | ||||||||||||||
![]() | EPM7128SQC100-6N | ALTERA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 128 | 8542390000/8542390000, 8542390000/8542390000/8542390000/8542390000/8542390000 | Compliant | EEPROM | QFP, QFP100,.7X.9 | FLATPACK | 3 | PLASTIC/EPOXY | QFP100,.7X.9 | 5 V | 40 | 4.75 V | 70 °C | 有 | EPM7128SQC100-6N | 166.7 MHz | QFP | RECTANGULAR | Intel Corporation | Obsolete | 84 | INTEL CORP | 5.25 V | 7.67 | 表面贴装 | 100-BQFP | YES | 100 | 100-PQFP (20x14) | 100 | 84 | 0°C ~ 70°C (TA) | Tray | MAX® 7000S | e3 | Obsolete | EAR99 | Matte Tin (Sn) | 70 °C | 0 °C | CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V | 8542.39.00.01 | 可编程逻辑器件 | CMOS | QUAD | 鸥翼 | 245 | 0.65 mm | compliant | 166.7 MHz | EPM7128 | R-PQFP-G100 | 不合格 | 5 V | 3.3/5,5 V | COMMERCIAL | 系统内可编程 | 5.25 V | 4.75 V | 6 ns | 6 ns | 0 DEDICATED INPUTS, 84 I/O | 3.65 mm | EE PLD | 8 | 2500 | 147.1 MHz | 84 | 8 | 6 | MACROCELL | 128 | YES | 4.75 V ~ 5.25 V | 6.0ns | 8 | YES | 20 mm | 14 mm | 无 | 无铅 | |||||||||||||
![]() | EPM7128EQC160-12 | ALTERA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | FLATPACK | 3 | PLASTIC/EPOXY | QFP160,1.2SQ | 5 V | 20 | 4.75 V | 70 °C | 无 | EPM7128EQC160-12 | 125 MHz | QFP | SQUARE | Intel Corporation | Obsolete | 100 | INTEL CORP | 5.25 V | 5.57 | YES | 160 | QFP, QFP160,1.2SQ | e0 | EAR99 | 锡铅 | CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V | 8542.39.00.01 | 可编程逻辑器件 | CMOS | QUAD | 鸥翼 | 220 | 0.65 mm | compliant | S-PQFP-G160 | 不合格 | 3.3/5,5 V | COMMERCIAL | 12 ns | 0 DEDICATED INPUTS, 100 I/O | 4.07 mm | EE PLD | MACROCELL | 128 | NO | NO | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | EPM7160EQC160-12 | ALTERA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 160 | PLASTIC, QFP-160 | FLATPACK | 3 | PLASTIC/EPOXY | QFP160,1.2SQ | 5 V | 20 | 4.75 V | 70 °C | 无 | EPM7160EQC160-12 | 125 MHz | QFP | SQUARE | Altera Corporation | Transferred | 104 | ALTERA CORP | 5.25 V | 3.65 | QFP | 表面贴装 | 160-BQFP | YES | 160-PQFP (28x28) | 160 | 104 | 0°C ~ 70°C (TA) | Tray | MAX® 7000 | e0 | 无 | Obsolete | Tin/Lead (Sn/Pb) | CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V | 8542.39.00.01 | 可编程逻辑器件 | CMOS | QUAD | 鸥翼 | 220 | 0.65 mm | compliant | EPM7160 | 160 | S-PQFP-G160 | 不合格 | 3.3/5,5 V | COMMERCIAL | EE PLD | 12 ns | 0 DEDICATED INPUTS, 104 I/O | 4.07 mm | EE PLD | 3200 | MACROCELL | 160 | NO | 4.75 V ~ 5.25 V | 12.0ns | 10 | NO | 28 mm | 28 mm | ||||||||||||||||||||||||||||||
![]() | EP600PC-45 | ALTERA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Bulk | 16 | 活跃 | 通孔 | 24-DIP | 24-PDIP | Altera | 16 | 0°C ~ 70°C (TA) | - | EPLD | 4.75V ~ 5.25V | 45 ns |