类别是'存储器'
存储器 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 终端数量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 类型 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 子类别 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 温度等级 | 电源电压-最小值(Vsup) | 界面 | 最大电源电压 | 最小电源电压 | 内存大小 | 端口的数量 | 操作模式 | 时钟频率 | 电源电流-最大值 | 访问时间 | 内存格式 | 内存接口 | 建筑学 | 数据总线宽度 | 组织结构 | 输出特性 | 座位高度-最大 | 内存宽度 | 写入周期时间 - 字符、页面 | 地址总线宽度 | 产品类别 | 密度 | 待机电流-最大值 | 记忆密度 | 最高频率 | 筛选水平 | 访问时间(最大) | 并行/串行 | I/O类型 | 内存IC类型 | 串行总线类型 | 耐力 | 写入周期时间 - 最大值 | 数据保持时间 | 写入保护 | 待机电压-最小值 | 页面尺寸 | I2C控制字节 | 反向引脚排列 | 产品类别 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | BR24G08FV-3GTE2 | ROHM Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Tin | 表面贴装 | 表面贴装 | 8-LSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2013 | 活跃 | 1 (Unlimited) | 8 | 1.6V~5.5V | DUAL | 未说明 | 1 | 2.5V | 0.65mm | 未说明 | BR24G08 | 5.5V | 1.6V | 2-Wire, I2C, Serial | 8Kb 1K x 8 | SYNCHRONOUS | 400kHz | 900 ns | EEPROM | I2C | 1 | 5ms | 8 kb | I2C | 5ms | 1.1mm | 4.4mm | 3mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | BR24A08F-WME2 | ROHM Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | Automotive grade | 表面贴装 | 8-SOIC (0.173, 4.40mm Width) | YES | 8 | Non-Volatile | -40°C~105°C TA | Cut Tape (CT) | 2013 | Automotive, AEC-Q100 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 2.5V~5.5V | DUAL | 未说明 | 1 | 1.27mm | 未说明 | 8 | 不合格 | 5.5V | 3/5V | 2.5V | 8Kb 1K x 8 | SYNCHRONOUS | 400kHz | EEPROM | I2C | 8 | 5ms | 0.000002A | 4096 bit | SERIAL | I2C | 100000 Write/Erase Cycles | 5ms | 40 | HARDWARE | 1010DMMR | 5mm | 4.4mm | Unknown | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | SST26VF032BT-104V/MF | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 表面贴装 | 8-WDFN Exposed Pad | 8 | Non-Volatile | -40°C~105°C TA | Tape & Reel (TR) | 2016 | SST26 SQI® | e3 | 活跃 | 3 (168 Hours) | Matte Tin (Sn) - annealed | 2.7V~3.6V | SST26VF032 | SPI, Serial | 32Mb 4M x 8 | 104MHz | FLASH | SPI - Quad I/O | 1.5ms | 32 Mb | SPI | HARDWARE/SOFTWARE | 256B | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8182D18BGD-250 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 1 MWords | 18 Bit | 1.9 V | 表面贴装 | 有 | 250 MHz | + 70 C | 1.9 V | 0 C | 18 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II | Details | DDR | Commercial grade | SRAM | BGA-165 | 250 MHz | 0 to 70 °C | Tray | GS8182D18BGD | SigmaQuad-II | Memory & Data Storage | 165 | 18 Mbit | 2 | 420 mA | Pipelined | 1 M x 18 | 18 Bit | 18 Mbit | Commercial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS816136DGT-150 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 150 MHz | + 70 C | 3.6 V | 0 C | 36 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | QFP, | FLATPACK | 512000 | PLASTIC/EPOXY | 未说明 | 7.5 ns | 70 °C | 有 | GS816136DGT-150 | 524288 words | 2.5 V | QFP | RECTANGULAR | 活跃 | GSI TECHNOLOGY | QFP | 5.26 | SRAM | TQFP-100 | YES | 100 | 有 | Tray | GS816136DGT | 3A991.B.2.B | Pipeline/Flow Through | FLOW THROUGH OR PIPELINED ARCHITECTURE, ALSO OPERATES AT 3.3V | 8542.32.00.41 | Memory & Data Storage | CMOS | QUAD | 鸥翼 | 未说明 | 1 | compliant | 100 | R-PQFP-G100 | 2.7 V | COMMERCIAL | 2.3 V | 18 Mbit | SYNCHRONOUS | 180 mA, 190 mA | 7.5 ns | 512 k x 36 | 36 | 18874368 bit | PARALLEL | 缓存SRAM | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8321E36AGD-150 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 1 MWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 150 MHz | + 70 C | 3.6 V | 0 C | 18 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 3 | 1000000 | PLASTIC/EPOXY | BGA165,11X15,40 | 未说明 | 7.5 ns | 85 °C | 有 | GS8321E36AGD-150 | 150 MHz | 2.5 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.31 | BGA | Commercial grade | SRAM | BGA-165 | YES | 165 | 133@Flow-Through/150@Pipelined MHz | 0 to 85 °C | Tray | GS8321E36AGD | e1 | 有 | 3A991.B.2.B | DCD Pipeline/Flow Through | 锡银铜 | IT ALSO OPERATES AT 3 V TO 3.6 V SUPPLY VOLTAGE | Memory & Data Storage | CMOS | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | 165 | R-PBGA-B165 | 不合格 | 2.7 V | 2.5/3.3 V | OTHER | 2.3 V | 36 Mbit | 4 | SYNCHRONOUS | 190 mA, 200 mA | 7.5 ns | Flow-Through/Pipelined | 1 M x 36 | 3-STATE | 1.4 mm | 36 | 20 Bit | 36 Mbit | 0.03 A | 37748736 bit | Commercial | PARALLEL | COMMON | 缓存SRAM | 2.3 V | SRAM | 15 mm | 13 mm | |||||||||||||||||||||||||||||||||||||||||||
![]() | GS8161E36DD-250V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 512 kWords | 36 Bit | 2, 2.7 V | 表面贴装 | 有 | 250 MHz | + 70 C | 2.7 V | 0 C | 18 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | SDR | Commercial grade | SRAM | BGA-165 | 181.8@Flow-Through/250@Pipelined MHz | 0 to 70 °C | Tray | GS8161E36DD | DCD Pipeline/Flow Through | Memory & Data Storage | 165 | 18 Mbit | 4 | 225 mA, 245 mA | 5.5 ns | Flow-Through/Pipelined | 512 k x 36 | 19 Bit | 18 Mbit | Commercial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8161E32DGT-250 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 250 MHz | + 70 C | 3.6 V | 0 C | 36 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | Details | SDR | SRAM | TQFP-100 | 有 | Tray | GS8161E32DGT | DCD Pipeline/Flow Through | Memory & Data Storage | 18 Mbit | 230 mA, 250 mA | 5.5 ns | 512 k x 32 | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8321E36AD-200 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 1 MWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | 200 MHz | + 70 C | 3.6 V | 0 C | 2.3 V | SMD/SMT | Parallel | Commercial grade | BGA-165 | 153.8@Flow-Through/200@Pipelined MHz | 0 to 85 °C | GS8321E36AD | 165 | 36 Mbit | 4 | 205 mA, 240 mA | 6.5 ns | Flow-Through/Pipelined | 1 M x 36 | 20 Bit | 36 Mbit | Commercial | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS882Z18CGB-250 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | + 70 C | 3.6 V | 0 C | 2.3 V | SMD/SMT | Parallel | BGA-119 | 250 MHz | GS882Z18CGB | 9 Mbit | 145 mA, 180 mA | 5.5 ns | 512 k x 18 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8161E32DGT-250I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 250 MHz | + 85 C | 3.6 V | - 40 C | 36 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | Details | SDR | SRAM | TQFP-100 | 有 | Tray | GS8161E32DGT | DCD Pipeline/Flow Through | Memory & Data Storage | 18 Mbit | 250 mA, 270 mA | 5.5 ns | 512 k x 32 | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS816236DB-375I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 512 kWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 375 MHz | + 85 C | 3.6 V | - 40 C | 21 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | SDR | BGA, | 网格排列 | 512000 | PLASTIC/EPOXY | -40 °C | 未说明 | 4.2 ns | 85 °C | 无 | GS816236DB-375I | 2.5 V | BGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.25 | BGA | Industrial grade | SRAM | BGA-119 | YES | 119 | FBGA | -40 to 100 °C | Tray | GS816236DB | 3A991.B.2.B | Pipeline/Flow Through | ALSO OPERATES AT 3.3V | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1.27 mm | compliant | 119 | R-PBGA-B119 | 2.7 V | INDUSTRIAL | 2.3 V | 18 Mbit | 4 | SYNCHRONOUS | 290 mA, 370 mA | 4.2 ns | Flow-Through/Pipelined | 512 k x 36 | 1.99 mm | 36 | 18 Mbit | 18874368 bit | Industrial | PARALLEL | 缓存SRAM | SRAM | 22 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 93LC56A/SM | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 小概要 | 256 | PLASTIC/EPOXY | SOP8,.3 | 40 | 70 °C | 有 | 93LC56A/SM | 2 MHz | 256 words | 3 V | SOP | RECTANGULAR | Microchip Technology Inc | 活跃 | MICROCHIP TECHNOLOGY INC | 5.17 | SOIC | YES | 8 | SOP, SOP8,.3 | e3 | 有 | EAR99 | Matte Tin (Sn) | 1000000 ERASE/WRITE CYCLES MIN; DATA RETENTION > 200 YEARS | 8542.32.00.51 | EEPROMs | CMOS | DUAL | 鸥翼 | 260 | 1 | 1.27 mm | compliant | 8 | R-PDSO-G8 | 不合格 | 6 V | 3/5 V | COMMERCIAL | 2.5 V | SYNCHRONOUS | 0.0015 mA | 256X8 | 2.03 mm | 8 | 0.000001 A | 2048 bit | SERIAL | EEPROM | MICROWIRE | 1000000 Write/Erase Cycles | 6 ms | 200 | SOFTWARE | 5.28 mm | 5.2 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | IS64WV25616EDBLL-10BLA3 | ISSI, Integrated Silicon Solution Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Automotive grade | 表面贴装 | 48-TFBGA | YES | 48 | Volatile | -40°C~125°C TA | Tray | 活跃 | 3 (168 Hours) | 48 | 2.4V~3.6V | BOTTOM | 1 | 3V | 0.75mm | 48 | 3.6V | 2.5/3.3V | 2.4V | 4Mb 256K x 16 | 1 | SRAM | Parallel | 3-STATE | 16 | 10ns | 18b | 4 Mb | COMMON | 2V | 8mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AS6C62256A-70SIN | Alliance Memory, Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 28-SOIC (0.330, 8.38mm Width) | YES | 28 | Volatile | -40°C~85°C TA | Tube | 2009 | yes | 活跃 | 3 (168 Hours) | 28 | EAR99 | 4.5V~5.5V | DUAL | 260 | 1 | 5V | 40 | 28 | 不合格 | 5V | 5V | 256Kb 32K x 8 | 1 | 0.07mA | SRAM | Parallel | 32KX8 | 3-STATE | 8 | 70ns | 15b | 256 kb | 0.000006A | 14MHz | 70 ns | COMMON | 2V | YES | 3.048mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AS7C1024B-15TJCNTR | Alliance Memory, Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 32-TFSOP (0.724, 18.40mm Width) | YES | 32 | Volatile | 0°C~70°C TA | Tape & Reel (TR) | 2002 | e3/e6 | yes | 活跃 | 3 (168 Hours) | 32 | PURE MATTE TIN/TIN BISMUTH | 4.5V~5.5V | DUAL | 245 | 1 | 5V | 1.27mm | 40 | 32 | 5.5V | 4.5V | 1Mb 128K x 8 | SRAM | Parallel | 128KX8 | 8 | 15ns | 1048576 bit | 15 ns | 3.683mm | 20.995mm | 7.62mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CY15B016Q-SXET | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Automotive grade | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | Non-Volatile | -40°C~125°C TA | Tape & Reel (TR) | Automotive, AEC-Q100, F-RAM™ | 活跃 | 3 (168 Hours) | 8 | EAR99 | 8542.32.00.71 | 2.7V~3.65V | DUAL | 未说明 | 1 | 3.3V | 1.27mm | 未说明 | R-PDSO-G8 | 3.6V | 3V | 16Kb 2K x 8 | SYNCHRONOUS | 16MHz | FRAM | SPI | 2KX8 | 8 | 16384 bit | 1.727mm | 4.889mm | 3.8985mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CY7C1049B-20VC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 36-BSOJ (0.400, 10.16mm Width) | YES | 36 | Volatile | 0°C~70°C TA | Tube | 2000 | e0 | no | Obsolete | 3 (168 Hours) | 36 | 3A991.B.2.A | Tin/Lead (Sn/Pb) | 8542.32.00.41 | 4.5V~5.5V | DUAL | 225 | 1 | 5V | 1.27mm | not_compliant | 20GHz | 30 | CY7C1049 | 36 | 不合格 | 5.5V | 5V | 4.5V | 4Mb 512K x 8 | SRAM | Parallel | 512KX8 | 3-STATE | 8 | 20ns | 0.008A | 4194304 bit | 20 ns | COMMON | 4.5V | 3.683mm | 23.495mm | 10.16mm | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AT49F008AT-12TC | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 40-TFSOP (0.724, 18.40mm Width) | 40 | 40-TSOP | Non-Volatile | 0°C~70°C TC | Tray | 1997 | Obsolete | 3 (168 Hours) | 70°C | 0°C | 4.5V~5.5V | 120GHz | AT49F008 | Parallel | 5.5V | 4.5V | 8Mb 1M x 8 512K x 16 | 120ns | FLASH | Parallel | 8b | 50μs | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS84032CGB-150 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 150 MHz | Parallel | 2.3 V | 0 C | + 70 C | SMD/SMT | SDR | 有 | 84 | SyncBurst | 3.6 V | BGA, | 网格排列 | 128000 | PLASTIC/EPOXY | 未说明 | 70 °C | 有 | GS84032CGB-150 | 131072 words | 2.5 V | BGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.18 | BGA-119 | YES | 119 | Details | Tray | GS84032CGB | 3A991.B.2.B | Pipeline/Flow Through | IT ALSO OPERATES AT 3 V TO 3.6 V SUPPLY VOLTAGE | CMOS | BOTTOM | BALL | 未说明 | 1 | 1.27 mm | compliant | R-PBGA-B119 | 2.7 V | COMMERCIAL | 2.3 V | 4 Mbit | SYNCHRONOUS | 130 mA, 140 mA | 7.5 ns | 128 k x 32 | 1.99 mm | 32 | 4194304 bit | PARALLEL | 缓存SRAM | 22 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8672Q18BE-400I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Parallel | 1.7 V | - 40 C | + 85 C | SMD/SMT | QDR-II | 有 | 15 | SigmaQuad-II | 1.9 V | BGA-165 | 400 MHz | Tray | GS8672Q18BE | SigmaQuad-II | 72 Mbit | 1.38 A | 4 M x 18 | 72 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS816136DGT-250 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 250 MHz | + 70 C | 3.6 V | 0 C | 36 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | SRAM | TQFP-100 | 有 | Tray | GS816136DGT | Pipeline/Flow Through | Memory & Data Storage | 18 Mbit | 230 mA, 250 mA | 5.5 ns | 512 k x 36 | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8672D36BE-400I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 400 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II | QDR-II | SRAM | BGA-165 | 有 | Tray | GS8672D36BE | SigmaQuad-II | Memory & Data Storage | 72 Mbit | 1.88 A | 2 M x 36 | 72 | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8672D18BGE-333I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 333 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II | Details | QDR-II | SRAM | BGA-165 | 有 | Tray | GS8672D18BGE | SigmaQuad-II | Memory & Data Storage | 72 Mbit | 1.21 A | 4 M x 18 | 72 | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS880E18CGT-200I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | TQFP | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 512 kWords | 18 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 200 MHz | + 85 C | 3.6 V | - 40 C | 72 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | Industrial grade | SRAM | TQFP-100 | 153.8@Flow-Through/200@Pipelined MHz | -40 to 85 °C | Tray | GS880E18CGT | DCD | Memory & Data Storage | 100 | 9 Mbit | 2 | 150 mA, 175 mA | 6.5 ns | Flow-Through/Pipelined | 512 k x 18 | 18 Bit | 9 Mbit | Industrial | SRAM |