N/A

-

有

Obsolete

XILINX INC

QFP

PLASTIC, TQFP-100

5.65

3

81

85 °C

-40 °C

PLASTIC/EPOXY

LFQFP

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

2.6 V

2.5 V

40

2.4 V

YES

100

XC95144XV-5TQG100I

e3

哑光锡

8542.39.00.01

QUAD

鸥翼

260

0.5 mm

compliant

100

S-PQFP-G100

不合格

INDUSTRIAL

4 ns

0 DEDICATED INPUTS, 81 I/O

1.6 mm

闪存 PLD

REGISTERED

14 mm

14 mm

N/A

-

有

Obsolete

XILINX INC

BGA

PLASTIC, FBGA-256

5.6

125 MHz

3

192

70 °C

PLASTIC/EPOXY

BGA

BGA256,16X16,40

SQUARE

网格排列

2.62 V

2.5 V

30

2.37 V

YES

256

XC95288XV-7FGG256C

e1

EAR99

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

YES

8542.39.00.01

BOTTOM

BALL

260

1 mm

unknown

256

S-PBGA-B256

不合格

1.8/3.3,2.5 V

COMMERCIAL

7.5 ns

0 DEDICATED INPUTS, 192 I/O

2 mm

闪存 PLD

MACROCELL

288

YES

YES

17 mm

17 mm

N/A

-

有

Obsolete

XILINX INC

BGA

BGA, BGA1156,34X34,40

5.8

357 MHz

3

85 °C

PLASTIC/EPOXY

BGA

BGA1156,34X34,40

SQUARE

网格排列

1.89 V

1.8 V

40

1.71 V

YES

1156

XCV2000E-6FGG1156C

e1

有

EAR99

锡银铜

8542.39.00.01

BOTTOM

BALL

245

1 mm

compliant

1156

S-PBGA-B1156

804

不合格

1.2/3.6,1.8 V

OTHER

804

9600 CLBS, 518400 GATES

2.6 mm

现场可编程门阵列

0.47 ns

9600

43200

518400

35 mm

35 mm

N/A

-

有

Obsolete

XILINX INC

BGA

LBGA,

5.79

294 MHz

3

85 °C

PLASTIC/EPOXY

LBGA

SQUARE

GRID ARRAY, LOW PROFILE

3.6 V

3.3 V

30

3 V

YES

352

XC4028XLA-07BGG352C

e1

有

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

CAN ALSO USE 50000 GATES

8542.39.00.01

BOTTOM

BALL

245

1.27 mm

compliant

352

S-PBGA-B352

不合格

OTHER

1024 CLBS, 18000 GATES

1.7 mm

现场可编程门阵列

0.9 ns

1024

18000

35 mm

35 mm

N/A

-

有

Obsolete

XILINX INC

QFP

LFQFP, QFP144,.87SQ,20

5.65

125 MHz

3

117

85 °C

-40 °C

PLASTIC/EPOXY

LFQFP

QFP144,.87SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

2.62 V

2.5 V

40

2.37 V

YES

144

XC95144XV-7TQG144I

e3

Matte Tin (Sn)

YES

8542.39.00.01

QUAD

鸥翼

260

0.5 mm

compliant

144

S-PQFP-G144

不合格

1.8/3.3,2.5 V

INDUSTRIAL

7.5 ns

0 DEDICATED INPUTS, 117 I/O

1.6 mm

闪存 PLD

MACROCELL

144

YES

YES

20 mm

20 mm

N/A

-

XILINX INC

BGA

PLASTIC, FBGA-256

5.62

125 MHz

3

192

85 °C

-40 °C

PLASTIC/EPOXY

BGA

BGA256,16X16,40

SQUARE

网格排列

有

XC95288XV-7FGG256I

2.62 V

2.5 V

20

2.37 V

YES

256

Obsolete

e1

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

YES

8542.39.00.01

BOTTOM

BALL

260

1 mm

unknown

256

S-PBGA-B256

不合格

1.8/3.3,2.5 V

INDUSTRIAL

7.5 ns

0 DEDICATED INPUTS, 192 I/O

2 mm

闪存 PLD

MACROCELL

288

YES

YES

17 mm

17 mm

N/A

-

无

Obsolete

XILINX INC

BGA, BGA668,26X26,40

5.83

1205 MHz

4

PLASTIC/EPOXY

BGA

BGA668,26X26,40

SQUARE

网格排列

YES

668

XC4VLX25-11FF668CS2

e0

Tin/Lead (Sn63Pb37)

BOTTOM

BALL

1 mm

not_compliant

S-PBGA-B668

448

不合格

1.2,1.2/3.3,2.5 V

448

现场可编程门阵列

24192

N/A

-

有

Obsolete

XILINX INC

BGA

BGA, BGA1156,34X34,40

5.81

416 MHz

3

PLASTIC/EPOXY

BGA

BGA1156,34X34,40

SQUARE

网格排列

1.89 V

1.8 V

30

1.71 V

YES

1156

XCV2000E-8FGG1156I

e1

有

锡银铜

8542.39.00.01

BOTTOM

BALL

245

1 mm

compliant

1156

S-PBGA-B1156

804

不合格

1.2/3.6,1.8 V

804

9600 CLBS, 518400 GATES

2.6 mm

现场可编程门阵列

0.4 ns

9600

43200

518400

35 mm

35 mm

N/A

-

有

活跃

MICROSEMI CORP

35 X 35 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-1152

5.3

4

PLASTIC/EPOXY

BGA

BGA1152,34X34,40

SQUARE

网格排列

1.26 V

1.2 V

30

1.2000 V

574

Tray

M2GL150

活跃

1.14 V

表面贴装

1152-BBGA, FCBGA

YES

1152-FCBGA (35x35)

1152

微芯片技术

M2GL150T-1FCG1152I

-40 to 100 °C

IGLOO2

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B1152

574

不合格

1.2 V

574

2.9 mm

现场可编程门阵列

146124

5120000

1

146124

35 mm

35 mm

N/A

-

Production (Last Updated: 2 months ago)

有

活跃

MICROSEMI CORP

23 X 23 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-484

5.3

3

PLASTIC/EPOXY

BGA

BGA484,22X22,40

SQUARE

网格排列

1.26 V

1.2 V

30

233

Compliant

有

12084 LE

+ 100 C

0.892167 oz

- 40 C

60

SMD/SMT

Microchip Technology / Atmel

IGLOO2

Tray

M2GL010

活跃

1.14 V

FPGA - Field Programmable Gate Array

表面贴装

FBGA-484

YES

484-FPBGA (23x23)

484

微芯片技术

M2GL010T-1FGG484I

-40°C ~ 100°C (TJ)

Tray

M2GL010T

100 °C

-40 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B484

233

不合格

1.2 V

1.2 V

114 kB

667 Mb/s

233

2.44 mm

现场可编程门阵列

12084

933888

1

4 Transceiver

12084

FPGA - Field Programmable Gate Array

23 mm

23 mm

N/A

-

有

活跃

MICROSEMI CORP

BGA, BGA484,22X22,40

5.27

3

PLASTIC/EPOXY

BGA

BGA484,22X22,40

SQUARE

网格排列

1.26 V

1.2 V

30

267

Tray

M2GL050

活跃

1.14 V

表面贴装

484-BGA

YES

484-FPBGA (23x23)

484

微芯片技术

M2GL050TS-FGG484I

-40°C ~ 100°C (TJ)

IGLOO2

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B484

267

不合格

1.2 V

267

2.44 mm

现场可编程门阵列

56340

1869824

56340

23 mm

23 mm

N/A

-

有

活跃

MICROSEMI CORP

BGA, BGA1152,34X34,40

5.77

4

PLASTIC/EPOXY

BGA

BGA1152,34X34,40

SQUARE

网格排列

1.26 V

1.2 V

40

574

Tray

M2S150

活跃

-

166 MHz

146124 LE

SMD/SMT

-

64 kB

1.14 V

1152-BBGA, FCBGA

YES

1152-FCBGA (35x35)

1152

微芯片技术

M2S150T-1FCG1152I

-40°C ~ 100°C (TJ)

SmartFusion®2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B1152

574

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

574

2.9 mm

现场可编程门阵列

1

FPGA - 150K Logic Modules

146124

1 Core

512KB

35 mm

35 mm

N/A

-

有

活跃

MICROSEMI CORP

LFBGA,

5.27

3

85 °C

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.26 V

1.14 V

1.2 V

30

138

Tray

M2GL010

活跃

12084 LE

+ 85 C

0 C

SMD/SMT

表面贴装

256-LFBGA

YES

256-FPBGA (14x14)

256

微芯片技术

M2GL010T-1VFG256

0°C ~ 85°C (TJ)

IGLOO2

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B256

1.2 V

OTHER

1.56 mm

现场可编程门阵列

12084

933888

2 Transceiver

14 mm

14 mm

N/A

-

无

活跃

MICROSEMI CORP

BGA, BGA896,30X30,40

5.27

3

PLASTIC/EPOXY

BGA

BGA896,30X30,40

SQUARE

网格排列

1.26 V

1.2 V

20

377

Tray

M2GL050

活跃

1.14 V

表面贴装

896-BGA

YES

896-FBGA (31x31)

896

微芯片技术

M2GL050TS-FG896I

-40°C ~ 100°C (TJ)

IGLOO2

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B896

377

不合格

1.2 V

377

2.44 mm

现场可编程门阵列

56340

1869824

56340

31 mm

31 mm

N/A

-

Production (Last Updated: 2 months ago)

无

活跃

MICROSEMI CORP

FBGA-676

5.88

3

PLASTIC/EPOXY

BGA

BGA676,26X26,40

SQUARE

网格排列

1.26 V

1.2 V

30

Non-Compliant

387

Tray

M2S060

活跃

-

166 MHz

56520 LE

-

64 kB

1.14 V

676-BGA

YES

676-FBGA (27x27)

676

微芯片技术

M2S060T-1FG676I

-40°C ~ 100°C (TJ)

SmartFusion®2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

BOTTOM

BALL

240

1 mm

not_compliant

S-PBGA-B676

387

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

387

2.44 mm

现场可编程门阵列

FPGA - 60K Logic Modules

56520

1 Core

256KB

27 mm

27 mm

N/A

-

无

Obsolete

MICROSEMI CORP

BGA,

5.25

3

100 °C

-40 °C

PLASTIC/EPOXY

BGA

SQUARE

网格排列

1.575 V

1.5 V

30

1.425 V

YES

484

M1A3P400-FG484I

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

不合格

INDUSTRIAL

9216 CLBS, 400000 GATES

2.44 mm

现场可编程门阵列

9216

400000

23 mm

23 mm

N/A

-

无

活跃

MICROSEMI CORP

BGA, BGA325,21X21,20

5.27

85 °C

PLASTIC/EPOXY

BGA

BGA325,21X21,20

SQUARE

网格排列

1.26 V

1.2 V

20

180

Tray

M2GL025

活跃

1.14 V

27696 LE

+ 85 C

0 C

SMD/SMT

表面贴装

325-TFBGA, FCBGA

YES

325-FCBGA (11x11)

325

微芯片技术

M2GL025-1FCS325

0°C ~ 85°C (TJ)

IGLOO2

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

compliant

S-PBGA-B325

180

不合格

1.2 V

1.2 V

OTHER

180

现场可编程门阵列

27696

1130496

27696

N/A

-

无

Obsolete

MICROSEMI CORP

17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256

5.26

350 MHz

3

70 °C

PLASTIC/EPOXY

BGA

BGA256,16X16,40

SQUARE

网格排列

1.575 V

1.14 V

1.2 V

30

YES

256

M1A3P600L-FG256

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

177

不合格

1.5/3.3 V

COMMERCIAL

177

13824 CLBS, 600000 GATES

1.8 mm

现场可编程门阵列

13824

13824

600000

17 mm

17 mm

N/A

-

Production (Last Updated: 2 months ago)

20

1.2 V

GRID ARRAY, LOW PROFILE, FINE PITCH

SQUARE

BGA400,20X20,32

LFBGA

PLASTIC/EPOXY

5.3

17 X 17 MM, 0.80 MM PITCH, VFBGA-400

MICROSEMI CORP

活跃

无

M2GL010-1VF400I

195

Tray

M2GL010

活跃

Non-Compliant

12084 LE

+ 100 C

- 40 C

SMD/SMT

1.14 V

表面贴装

400-LFBGA

YES

400

400-VFBGA (17x17)

400

微芯片技术

1.26 V

-40°C ~ 100°C (TJ)

IGLOO2

100 °C

-40 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B400

195

不合格

1.2 V

1.2 V

1.26 V

1.14 V

114 kB

195

1.51 mm

现场可编程门阵列

12084

933888

1

12084

17 mm

17 mm

N/A

-

1.2 V

40

GRID ARRAY, LOW PROFILE, FINE PITCH

SQUARE

BGA400,20X20,32

LFBGA

PLASTIC/EPOXY

85 °C

3

5.25

VFBGA-400

MICROSEMI CORP

活跃

有

M2S010T-VFG400

195

Tray

M2S010

活跃

-

166 MHz

12084 LE

+ 85 C

0 C

SMD/SMT

-

64 kB

1.14 V

400-LFBGA

YES

400-VFBGA (17x17)

400

微芯片技术

1.26 V

0°C ~ 85°C (TJ)

SmartFusion®2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

BOTTOM

BALL

250

0.8 mm

compliant

S-PBGA-B400

195

不合格

1.2 V

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

195

1.51 mm

现场可编程门阵列

STD

FPGA - 10K Logic Modules

12084

1 Core

256KB

17 mm

17 mm

N/A

-

无

Obsolete

MICROSEMI CORP

BGA, BGA1152,34X34,40

5.88

PLASTIC

BGA

BGA1152,34X34,40

SQUARE

网格排列

1.2 V

YES

1152

M2GL100T-1FC1152I

BOTTOM

BALL

1 mm

unknown

S-PBGA-B1152

574

不合格

1.2 V

574

现场可编程门阵列

99512

N/A

-

有

活跃

MICROSEMI CORP

BGA, BGA1152,34X34,40

5.8

4

PLASTIC/EPOXY

BGA

BGA1152,34X34,40

SQUARE

网格排列

1.26 V

1.2 V

未说明

1.14 V

YES

1152

M2S100T-1FCG1152I

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B1152

574

不合格

1.2 V

574

2.9 mm

现场可编程门阵列

99512

35 mm

35 mm

N/A

-

有

活跃

MICROSEMI CORP

5.26

3

30

M2S050S-1FGG896I

e1

Tin/Silver/Copper (Sn/Ag/Cu)

245

compliant

现场可编程门阵列

N/A

-

无

活跃

MICROSEMI CORP

BGA, BGA484,22X22,40

5.88

PLASTIC/EPOXY

BGA

BGA484,22X22,40

SQUARE

网格排列

1.2 V

233

Non-Compliant

表面贴装

YES

484

M2GL010S-1FG484I

100 °C

-40 °C

BOTTOM

BALL

1 mm

unknown

S-PBGA-B484

233

不合格

1.2 V

114 kB

233

现场可编程门阵列

12084

12084

N/A

-

有

活跃

MICROSEMI CORP

5.78

3

30

M2S025S-1FGG484I

e1

Tin/Silver/Copper (Sn/Ag/Cu)

250

compliant

现场可编程门阵列