![TDOTG242-00BC](https://res.utmel.com/Images/category/Integrated Circuits (ICs).png)
规格参数
- 类型参数全选
表面安装
YES
终端数量
64
No
Transferred
PLX TECHNOLOGY INC
FBGA, BGA64,8X8,20
PLASTIC/EPOXY
FBGA
BGA64,8X8,20
SQUARE
GRID ARRAY, FINE PITCH
3.3 V
HTS代码
8542.31.00.01
端子位置
BOTTOM
终端形式
BALL
端子间距
0.5 mm
Reach合规守则
unknown
JESD-30代码
S-PBGA-B64
资历状况
Not Qualified