
MCIMX6D4AVT08ACR
624-FBGA, FCBGA
Processors - Application Specialized i.MX6D AUTO
规格参数
- 类型参数全选
工厂交货时间
15 Weeks
包装/外壳
624-FBGA, FCBGA
操作温度
-40°C~125°C TJ
包装
Tape & Reel (TR)
系列
i.MX6D
已出版
2002
JESD-609代码
e1
零件状态
Not For New Designs
湿度敏感性等级(MSL)
3 (168 Hours)
ECCN 代码
5A992
端子表面处理
Tin/Silver/Copper (Sn/Ag/Cu)
HTS代码
8542.31.00.01
峰值回流焊温度(摄氏度)
260
时间@峰值回流温度-最大值(s)
40
基本部件号
MCIMX6
速度
852MHz
uPs/uCs/外围ICs类型
MICROPROCESSOR
核心处理器
ARM® Cortex®-A9
电压 - I/O
1.8V 2.5V 2.8V 3.3V
以太网
10/100/1000Mbps (1)
核数/总线宽度
2 Core 32-Bit
图形加速
Yes
内存控制器
LPDDR2, LVDDR3, DDR3
USB
USB 2.0 + PHY (4)
附加接口
CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
协处理器/DSP
Multimedia; NEON™ SIMD
保安功能
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
显示和界面控制器
Keypad, LCD
萨塔
SATA 3Gbps (1)
RoHS状态
ROHS3 Compliant
相关型号
- 图片产品型号品牌Package / CaseMoisture Sensitivity Level (MSL)Terminal FinishTechnologyPeak Reflow Temperature (Cel)RoHS StatusJESD-609 CodeCo-Processors/DSP
-
MCIMX6D4AVT08ACR
624-FBGA, FCBGA
3 (168 Hours)
Tin/Silver/Copper (Sn/Ag/Cu)
CMOS
260
ROHS3 Compliant
e1
Multimedia; NEON? SIMD
-
423-LFBGA, FCBGA
3 (168 Hours)
Tin/Silver/Copper (Sn/Ag/Cu)
CMOS
260
ROHS3 Compliant
e1
Multimedia; NEON? SIMD
-
624-FBGA, FCBGA
3 (168 Hours)
Tin/Silver/Copper (Sn/Ag/Cu)
CMOS
260
ROHS3 Compliant
e1
Multimedia; NEON? SIMD
-
624-FBGA, FCBGA
3 (168 Hours)
Tin/Silver/Copper (Sn/Ag/Cu)
CMOS
260
ROHS3 Compliant
e1
Multimedia; NEON? SIMD
-
624-FBGA, FCBGA
3 (168 Hours)
Tin/Silver/Copper (Sn/Ag/Cu)
CMOS
260
ROHS3 Compliant
e1
Multimedia; NEON? SIMD
MCIMX6D4AVT08ACR PDF数据手册
- 数据表 :
- 环境信息 :
- PCN 组装/原产地 :