表面安装

YES

终端数量

150

Yes

Obsolete

INTEGRATED DEVICE TECHNOLOGY INC

70 °C

PLASTIC/EPOXY

FBGA

BGA150,11X19,25

RECTANGULAR

GRID ARRAY, FINE PITCH

1.8 V

HTS代码

8542.39.00.01

端子位置

BOTTOM

终端形式

BALL

端子间距

0.635 mm

Reach合规守则

unknown

JESD-30代码

R-PBGA-B150

资历状况

Not Qualified

温度等级

COMMERCIAL

逻辑IC类型

BUS DRIVER