规格参数
- 类型参数全选
触点镀层
Gold
底架
Surface Mount
安装类型
Surface Mount
引脚数
32
房屋材料
Polyamide (PA46), Nylon 4/6, Glass Filled
触点材料 - 配套
Beryllium Copper
触点材料 - 柱子
Brass
Gold
系列
Correct-A-Chip® 354000
已出版
2006
零件状态
Active
湿度敏感性等级(MSL)
1 (Unlimited)
终端
Solder
定位的数量
32
额定电流
3A
额定电流
3A
触点表面处理 - 柱子
Gold
间距--柱子
0.100 2.54mm
转换自(适配器端)
DIP, 0.3 (7.62mm) Row Spacing
转换（适配器端）
SOIC
触点表面处理厚度 - 配套
10.0μin 0.25μm
触点表面处理厚度 - 柱子
10.0μin 0.25μm
材料可燃性等级
UL94 V-0
RoHS状态
ROHS3 Compliant
可燃性等级
UL94 V-0
相关型号
- 图片产品型号品牌Number of PositionsMountTerminationContact PlatingHousing MaterialPart StatusMoisture Sensitivity Level (MSL)Contact Material - Mating
32-354000-10
32
Surface Mount
Solder
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
Active
1 (Unlimited)
Beryllium Copper
-
Surface Mount, Through Hole
Solder
-
Polyamide (PA46), Nylon 4/6, Glass Filled
Active
1 (Unlimited)
Beryllium Copper
-
Surface Mount, Through Hole
Solder
-
Polyamide (PA46), Nylon 4/6, Glass Filled
Active
1 (Unlimited)
Beryllium Copper
32
Surface Mount
Solder
Tin
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Active
1 (Unlimited)
Beryllium Copper
32
Surface Mount
Solder
Tin
Polybutylene Terephthalate (PBT), Glass Filled
Active
1 (Unlimited)
Copper Alloy
32-354000-10 PDF数据手册
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