Microchip - Embedded - System On Chip (SoC) - 产品分销商 - 目录 - Embedded - System On Chip (SoC) - 页 28

制造商是'Microchip'

Microchip 嵌入式 - 片上系统（SoC）
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产品型号	品牌	数据表	有效性	单价(CNY)	询价	生命周期状态	包装/外壳	表面安装	引脚数	供应商器件包装	终端数量														厂商																															操作温度	包装	系列	JESD-609代码	端子表面处理	最高工作温度	最小工作温度	附加功能	HTS代码	技术	端子位置	终端形式	峰值回流焊温度（摄氏度）	端子间距	Reach合规守则	时间@峰值回流温度-最大值(s)	引脚数量	JESD-30代码	输出的数量	资历状况	工作电源电压	电源	温度等级	界面	速度	内存大小	核心处理器	周边设备	程序内存大小	连接方式	建筑学	数据总线宽度	输入数量	座位高度-最大	可编程逻辑类型
M2S090-1FCS325	Microchip Technology	数据表	N/A	-	最小起订量: 1 倍率: 1	N	SMD/SMT	166 MHz	-	-	64 kB	86316 LE	有	7193 LAB	176	180	Tray	M2S090	活跃	FBGA-325	GRID ARRAY, THIN PROFILE, FINE PITCH	PLASTIC/EPOXY	BGA325,21X21,20	1.2 V	30	1.14 V	85 °C	无	M2S090-1FCS325	TFBGA	RECTANGULAR	活跃	MICROSEMI CORP	1.26 V	5.83		FCBGA-325	YES		325-FCBGA (11x13.5)	325	微芯片技术	This product may require additional documentation to export from the United States.	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e0	Tin/Lead (Sn/Pb)			LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	240	0.5 mm	not_compliant			R-PBGA-B325	180	不合格		1.2 V	OTHER		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		180	1.16 mm	现场可编程门阵列			FPGA - 90K Logic Modules	86316	1 Core	512KB		13.5 mm	11 mm
M2S050TS-VF400I	Microchip Technology	数据表	N/A	-	最小起订量: 1 倍率: 1	Production (Last Updated: 2 months ago)	N	SMD/SMT	166 MHz	-	-	64 kB	56340 LE	有	4695 LAB	90	207	Tray	M2S050	活跃	VFPBGA-400			400-VFBGA (17x17)		微芯片技术	This product may require additional documentation to export from the United States.	-40°C ~ 100°C (TJ)	Tray	SmartFusion2																						166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA							FPGA - 50K Logic Modules		1 Core	256KB
M2S025TS-1FG484I	Microchip Technology	数据表	N/A	-	最小起订量: 1 倍率: 1	N	SMD/SMT	166 MHz	-	-	64 kB	27696 LE	有	2308 LAB	60	1.2000 V	1.14 V	1.26 V	267	Tray	M2S025	活跃		FPBGA-484			484-FPBGA (23x23)		微芯片技术	This product may require additional documentation to export from the United States.	-40 to 100 °C	Tray	SmartFusion2																						166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA						1	FPGA - 25K Logic Modules		1 Core	256KB
M2S050TS-FG896	Microchip Technology	数据表	N/A	-	最小起订量: 1 倍率: 1	Production (Last Updated: 2 months ago)	N	166 MHz	-	-	64 kB	56340 LE	有	4695 LAB	27	377	Tray	M2S050	活跃	896-BGA			896-FBGA (31x31)		微芯片技术	This product may require additional documentation to export from the United States.	0°C ~ 85°C (TJ)	Tray	SmartFusion2																						166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA							FPGA - 50K Logic Modules		1 Core	256KB
M2S010TS-1VFG256	Microchip Technology	数据表	N/A	-	最小起订量: 1 倍率: 1	Production (Last Updated: 1 month ago)	Details	SMD/SMT	166 MHz	-	-	64 kB	12084 LE	有	1007 LAB	119	138	Tray	M2S010	活跃	VFBGA-256	GRID ARRAY, LOW PROFILE, FINE PITCH	3	PLASTIC/EPOXY	BGA256,16X16,32	1.2 V	40	1.14 V	85 °C	有	M2S010TS-1VFG256	LFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.81	VFPBGA-256	YES		256-FPBGA (17x17)	256	微芯片技术	This product may require additional documentation to export from the United States.	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e1	Tin/Silver/Copper (Sn/Ag/Cu)			LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	250	0.8 mm	compliant			S-PBGA-B256	138	不合格		1.2 V	OTHER		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		138	1.56 mm	现场可编程门阵列			FPGA - 10K Logic Modules	12084	1 Core	256KB		14 mm	14 mm
M2S050TS-1FCS325I	Microchip Technology	数据表	N/A	-	最小起订量: 1 倍率: 1	Production (Last Updated: 2 months ago)	N	SMD/SMT	166 MHz	-	-	64 kB	56340 LE	有	4695 LAB	176	200	Tray	M2S050	活跃	FBGA-325	GRID ARRAY, THIN PROFILE, FINE PITCH	PLASTIC/EPOXY	BGA325,21X21,20	1.2 V	30	1.14 V	无	M2S050TS-1FCS325I	TFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.88	FCBGA-325	YES		325-FCBGA (11x11)	325	微芯片技术	This product may require additional documentation to export from the United States.	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e0	Tin/Lead (Sn/Pb)			LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	240	0.5 mm	not_compliant			S-PBGA-B325	200	不合格		1.2 V			166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		200	1.01 mm	现场可编程门阵列			FPGA - 50K Logic Modules	56340	1 Core	256KB		11 mm	11 mm
M2S025-1FCS325	Microchip Technology	数据表	N/A	-	最小起订量: 1 倍率: 1	Production (Last Updated: 2 months ago)	N	SMD/SMT	166 MHz	-	-	64 kB	27696 LE	有	2308 LAB	176	180	Tray	M2S025	活跃	FCBGA-325			325-FCBGA (11x11)		微芯片技术	This product may require additional documentation to export from the United States.	0°C ~ 85°C (TJ)	Tray	SmartFusion2																						166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA							FPGA - 25K Logic Modules		1 Core	256KB
M2S060TS-1VF400I	Microchip Technology	数据表	N/A	-	最小起订量: 1 倍率: 1	N	166 MHz	-	-	64 kB	56520 LE	有	4710 LAB	90	SmartFusion2	207	Tray	M2S060	活跃	VFBGA-400	GRID ARRAY, LOW PROFILE, FINE PITCH	PLASTIC/EPOXY	BGA400,20X20,32	1.2 V	30	1.14 V	无	M2S060TS-1VF400I	LFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.87		400-LFBGA	YES		400-VFBGA (17x17)	400	微芯片技术	This product may require additional documentation to export from the United States.	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e0	Tin/Lead (Sn/Pb)				8542.39.00.01	CMOS	BOTTOM	BALL	240	0.8 mm	not_compliant			S-PBGA-B400	207	不合格		1.2 V			166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		207	1.51 mm	现场可编程门阵列			FPGA - 60K Logic Modules	56520	1 Core	256KB		17 mm	17 mm
M2S050T-1FCSG325	Microchip Technology	数据表	N/A	-	最小起订量: 1 倍率: 1	Production (Last Updated: 2 months ago)	Details	SMD/SMT	166 MHz	-	-	64 kB	56340 LE	有	4695 LAB	176	200	Tray	M2S050	活跃	FCBGA-325			325-FCBGA (11x11)		微芯片技术	This product may require additional documentation to export from the United States.	0°C ~ 85°C (TJ)	Tray	SmartFusion2																						166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA							FPGA - 50K Logic Modules		1 Core	256KB
M2S150-FCG1152I	Microchip Technology	数据表	N/A	-	最小起订量: 1 倍率: 1	Details	SMD/SMT	166 MHz	-	-	64 kB	146124 LE	有	12177 LAB	24	1.2000 V	574	Tray	M2S150	活跃	BGA, BGA1152,34X34,40	网格排列	4	PLASTIC/EPOXY	BGA1152,34X34,40	1.2 V	40	1.14 V	有	M2S150-FCG1152I	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.77		FCBGA-1152	YES		1152-FCBGA (35x35)	1152	微芯片技术	This product may require additional documentation to export from the United States.	-40 to 100 °C	Tray	SmartFusion2	e1	Tin/Silver/Copper (Sn/Ag/Cu)				8542.39.00.01	CMOS	BOTTOM	BALL	250	1 mm	compliant			S-PBGA-B1152	574	不合格		1.2 V			166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		574	2.9 mm	现场可编程门阵列		STD	FPGA - 150K Logic Modules	146124	1 Core	512KB		35 mm	35 mm
M2S090-FCS325	Microchip Technology	数据表	N/A	-	最小起订量: 1 倍率: 1	N	166 MHz	-	-	64 kB	86316 LE	有	7193 LAB	176	RISC	1.2, 1.5, 1.8, 2.5, 3.3 V	1	CAN/Ethernet/Serial I2C/SPI/UART/USB	有	表面贴装	180	Tray	M2S090	活跃	Commercial grade		325-TFBGA, FCBGA			325-FCBGA (11x13.5)		微芯片技术	This product may require additional documentation to export from the United States.	0 to 85 °C	Tray	SmartFusion2														325				0.95, 1.05 V			CAN/Ethernet/Serial	166MHz	64 KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	32 Bit				Commercial		FPGA - 90K Logic Modules		1 Core	512KB	ARM Cortex-M3
M2S150-FC1152I	Microchip Technology	数据表	N/A	-	最小起订量: 1 倍率: 1	N	SMD/SMT	166 MHz	-	-	64 kB	146124 LE	有	12177 LAB	24	574	Tray	M2S150	活跃	BGA, BGA1152,34X34,40	网格排列	PLASTIC/EPOXY	BGA1152,34X34,40	1.2 V	30	1.14 V	无	M2S150-FC1152I	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.81		FCBGA-1152	YES		1152-FCBGA (35x35)	1152	微芯片技术	This product may require additional documentation to export from the United States.	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e0	Tin/Lead (Sn/Pb)				8542.39.00.01	CMOS	BOTTOM	BALL	240	1 mm	not_compliant			S-PBGA-B1152	574	不合格		1.2 V			166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		574	2.9 mm	现场可编程门阵列			FPGA - 150K Logic Modules	146124	1 Core	512KB		35 mm	35 mm
M2S150T-1FCSG536	Microchip Technology	数据表	N/A	-	最小起订量: 1 倍率: 1	Details	166 MHz	-	-	64 kB	146124 LE	有	12177 LAB	90	293	Tray	M2S150	活跃		536-LFBGA, CSPBGA			536-CSPBGA (16x16)		微芯片技术	This product may require additional documentation to export from the United States.	0°C ~ 85°C (TJ)	Tray	SmartFusion2																						166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA							FPGA - 150K Logic Modules		1 Core	512KB
M2S090T-1FGG676	Microchip Technology	数据表	N/A	-	最小起订量: 1 倍率: 1	Details	SMD/SMT	166 MHz	-	-	64 kB	86316 LE	有	7193 LAB	40	425	Tray	M2S090	活跃	BGA, BGA676,26X26,40	网格排列	3	PLASTIC/EPOXY	BGA676,26X26,40	1.2 V	40	1.14 V	85 °C	有	M2S090T-1FGG676	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.27		BGA-676	YES		676-FBGA (27x27)	676	微芯片技术	This product may require additional documentation to export from the United States.	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e1	Tin/Silver/Copper (Sn/Ag/Cu)				8542.39.00.01	CMOS	BOTTOM	BALL	250	1 mm	compliant			S-PBGA-B676	425	不合格		1.2 V	OTHER		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		425	2.44 mm	现场可编程门阵列			FPGA - 90K Logic Modules	86316	1 Core	512KB		27 mm	27 mm
M2S050TS-1FCSG325I	Microchip Technology	数据表	N/A	-	最小起订量: 1 倍率: 1	Production (Last Updated: 2 months ago)	Details	SMD/SMT	166 MHz	-	-	64 kB	56340 LE	有	4695 LAB	176	200	Tray	M2S050	活跃	FBGA-325	GRID ARRAY, THIN PROFILE, FINE PITCH	3	PLASTIC/EPOXY	BGA325,21X21,20	1.2 V	1.14 V	有	M2S050TS-1FCSG325I	TFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.82	FCBGA-325	YES		325-FCBGA (11x11)	325	微芯片技术	This product may require additional documentation to export from the United States.	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e1	Tin/Silver/Copper (Sn/Ag/Cu)			LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	250	0.5 mm	compliant	40		S-PBGA-B325	200	不合格		1.2 V			166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		200	1.01 mm	现场可编程门阵列			FPGA - 50K Logic Modules	56340	1 Core	256KB		11 mm	11 mm
M2S025T-1FG484M	Microchip Technology	数据表	N/A	-	最小起订量: 1 倍率: 1	Production (Last Updated: 2 months ago)	N	SMD/SMT	166 MHz	-	-	64 kB	27696 LE	有	2308 LAB	60	267	Tray	M2S025	活跃	FPBGA-484			484-FPBGA (23x23)		微芯片技术	This product may require additional documentation to export from the United States.	-55°C ~ 125°C (TJ)	Tray	SmartFusion2																						166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA							FPGA - 25K Logic Modules		1 Core	256KB				含铅
M2S025-1VF256I	Microchip Technology	数据表	N/A	-	最小起订量: 1 倍率: 1	Production (Last Updated: 2 months ago)	N	166 MHz	-	-	64 kB	27696 LE	有	2308 LAB	119	138	Tray	M2S025	活跃	256-LFBGA			256-FPBGA (14x14)		微芯片技术	This product may require additional documentation to export from the United States.	-40°C ~ 100°C (TJ)	Tray	SmartFusion2																						166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA							FPGA - 25K Logic Modules		1 Core	256KB
M2S010TS-FG484I	Microchip Technology	数据表	N/A	-	最小起订量: 1 倍率: 1	Production (Last Updated: 1 month ago)	N	SMD/SMT	166 MHz	-	-	64 kB	12084 LE	有	1007 LAB	60	233	Tray	M2S010	活跃	BGA, BGA484,22X22,40	网格排列	3	PLASTIC/EPOXY	BGA484,22X22,40	1.2 V	30	1.14 V	无	M2S010TS-FG484I	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.88	FPBGA-484	YES		484-FPBGA (23x23)	484	微芯片技术	This product may require additional documentation to export from the United States.	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e0	Tin/Lead (Sn/Pb)				8542.39.00.01	CMOS	BOTTOM	BALL	240	1 mm	not_compliant			S-PBGA-B484	233	不合格		1.2 V			166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		233	2.44 mm	现场可编程门阵列			FPGA - 10K Logic Modules	12084	1 Core	256KB		23 mm	23 mm
M2S010-1VF400	Microchip Technology	数据表	N/A	-	最小起订量: 1 倍率: 1	N	SMD/SMT	166 MHz	-	-	64 kB	12084 LE	有	1007 LAB	90	1.2000 V	1.14 V	1.26 V	195	Tray	M2S010	活跃	LFBGA, BGA400,20X20,32	GRID ARRAY, LOW PROFILE, FINE PITCH	PLASTIC/EPOXY	BGA400,20X20,32	1.2 V	30	1.14 V	85 °C	无	M2S010-1VF400	LFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.84		VFPBGA-400	YES		400-VFBGA (17x17)	400	微芯片技术	This product may require additional documentation to export from the United States.	0 to 85 °C	Tray	SmartFusion2	e0	Tin/Lead (Sn/Pb)				8542.39.00.01	CMOS	BOTTOM	BALL	240	0.8 mm	not_compliant			S-PBGA-B400	160	不合格		1.2 V	OTHER		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		160	1.51 mm	现场可编程门阵列		1	FPGA - 10K Logic Modules	9744	1 Core	256KB		17 mm	17 mm
M2S050TS-1VF400	Microchip Technology	数据表	N/A	-	最小起订量: 1 倍率: 1	Production (Last Updated: 2 months ago)	N	SMD/SMT	166 MHz	-	-	64 kB	56340 LE	有	4695 LAB	90	207	Tray	M2S050	活跃	VFPBGA-400			400-VFBGA (17x17)		微芯片技术	This product may require additional documentation to export from the United States.	0°C ~ 85°C (TJ)	Tray	SmartFusion2																						166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA							FPGA - 50K Logic Modules		1 Core	256KB
M2S090T-FGG676	Microchip Technology	数据表	N/A	-	最小起订量: 1 倍率: 1	Details	166 MHz	-	-	64 kB	86316 LE	有	7193 LAB	40	1.2000 V	1.14 V	1.26 V	425	Tray	M2S090	活跃		676-BGA			676-FBGA (27x27)		微芯片技术	This product may require additional documentation to export from the United States.	0 to 85 °C	Tray	SmartFusion2																						166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA						STD	FPGA - 90K Logic Modules		1 Core	512KB
M2S090T-1FGG484	Microchip Technology	数据表	N/A	-	最小起订量: 1 倍率: 1	Details	SMD/SMT	166 MHz	-	-	64 kB	86316 LE	有	7193 LAB	60	1.2000 V	267	Tray	M2S090	活跃		FPBGA-484			484-FPBGA (23x23)		微芯片技术	This product may require additional documentation to export from the United States.	0 to 85 °C	Tray	SmartFusion2																						166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA						1	FPGA - 90K Logic Modules		1 Core	512KB
M2S090T-1FCSG325	Microchip Technology	数据表	N/A	-	最小起订量: 1 倍率: 1	Details	SMD/SMT	166 MHz	-	-	64 kB	86316 LE	有	7193 LAB	176	180	Tray	M2S090	活跃		FCBGA-325			325-FCBGA (11x13.5)		微芯片技术	This product may require additional documentation to export from the United States.	0°C ~ 85°C (TJ)	Tray	SmartFusion2																						166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA							FPGA - 90K Logic Modules		1 Core	512KB
M2S050-1FCSG325	Microchip Technology	数据表	N/A	-	最小起订量: 1 倍率: 1	Production (Last Updated: 2 months ago)	Details	SMD/SMT	166 MHz	-	-	64 kB	56340 LE	有	4695 LAB	176	1.2000 V	1.14 V	1.26 V	200	Tray	M2S050	活跃	FBGA-325	GRID ARRAY, THIN PROFILE, FINE PITCH	3	PLASTIC/EPOXY	BGA325,21X21,20	1.2 V	1.14 V	85 °C	有	M2S050-1FCSG325	TFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.76	FCBGA-325	YES	325	325-FCBGA (11x11)	325	微芯片技术	This product may require additional documentation to export from the United States.	0 to 85 °C	Tray	SmartFusion2	e1	Tin/Silver/Copper (Sn/Ag/Cu)	85 °C	0 °C	LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	250	0.5 mm	compliant	40		S-PBGA-B325	200	不合格	1.2 V	1.2 V	OTHER		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		200	1.01 mm	现场可编程门阵列		1	FPGA - 50K Logic Modules	56340	1 Core	256KB		11 mm	11 mm
M2S025T-1VF256	Microchip Technology	数据表	N/A	-	最小起订量: 1 倍率: 1	Production (Last Updated: 2 months ago)	N	SMD/SMT	166 MHz	-	-	64 kB	27696 LE	有	2308 LAB	119	138	Tray	M2S025	活跃	VFPBGA-256			256-FPBGA (14x14)		微芯片技术	This product may require additional documentation to export from the United States.	0°C ~ 85°C (TJ)	Tray	SmartFusion2																						166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA							FPGA - 25K Logic Modules		1 Core	256KB

Microchip 嵌入式 - 片上系统（SoC）