制造商是'Microchip'
Microchip 嵌入式 - FPGA(现场可编程门阵列)
(5152)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 终端数量 | 厂商 | 操作温度 | 包装 | 系列 | JESD-609代码 | 无铅代码 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 子类别 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | Reach合规守则 | 频率 | 引脚数量 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源 | 温度等级 | 最大电源电压 | 最小电源电压 | 传播延迟 | 数据率 | 输入数量 | 组织结构 | 座位高度-最大 | 可编程逻辑类型 | 逻辑元件/单元数 | 产品类别 | 总 RAM 位数 | 阀门数量 | LABs数量/ CLBs数量 | 筛选水平 | 逻辑块数(LABs) | 速度等级 | 收发器数量 | 寄存器数量 | CLB-Max的组合延时 | 逻辑块数量 | 逻辑单元数 | 等效门数 | 产品类别 | 长度 | 宽度 | 辐射硬化 | ||||||||||||||||||||||||||||||||||||||||
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![]() | AGLN020V5-CSG81 | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 52 | Tray | AGLN020 | 活跃 | 表面贴装 | 81-WFBGA, CSBGA | 81-CSP (5x5) | 微芯片技术 | 1.5000 V | -20 to 70 °C | IGLOO nano | 1.425V ~ 1.575V | 520 | 20000 | STD | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX32-2TQG144I | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 2.97, 4.5 V | 3.63, 5.5 V | 113 | Tray | A54SX32 | 活跃 | LFQFP, QFP144,.87SQ,20 | FLATPACK, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | QFP144,.87SQ,20 | -40 °C | 3.3 V | 40 | 3 V | 85 °C | 有 | A54SX32-2TQG144I | 320 MHz | LFQFP | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 3.6 V | 5.24 | 表面贴装 | 144-LQFP | YES | 144-TQFP (20x20) | 144 | 微芯片技术 | 3.3, 5 V | -40 to 85 °C | SX | e3 | Matte Tin (Sn) | CAN ALSO BE OPERATED AT 5V; 48000 SYSTEM GATES ALSO AVAILABLE | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | S-PQFP-G144 | 113 | 不合格 | 3.3,5 V | INDUSTRIAL | 113 | 2880 CLBS, 32000 GATES | 1.6 mm | 现场可编程门阵列 | 48000 | 2880 | 2 | 0.7 ns | 2880 | 2880 | 32000 | 20 mm | 20 mm | |||||||||||||||||||||||||||||||||||||
![]() | A54SX32A-2FG484 | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 2.25 V | 2.75 V | 249 | Tray | A54SX32 | 活跃 | BGA, BGA484,26X26,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,26X26,40 | 2.5 V | 30 | 2.25 V | 70 °C | 无 | A54SX32A-2FG484 | 313 MHz | BGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 2.75 V | 5.29 | 表面贴装 | 484-BGA | YES | 484-FPBGA (27X27) | 484 | 微芯片技术 | 2.5000 V | 0 to 70 °C | SX-A | e0 | 锡铅 | 32000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 2.25V ~ 5.25V | BOTTOM | BALL | 225 | 1 mm | unknown | S-PBGA-B484 | 249 | 不合格 | 2.5,2.5/5 V | COMMERCIAL | 249 | 2880 CLBS, 48000 GATES | 2.44 mm | 现场可编程门阵列 | 48000 | 2880 | 2 | 0.9 ns | 2880 | 2880 | 48000 | 27 mm | 27 mm | ||||||||||||||||||||||||||||||||||||||
![]() | M2GL050T-FG896I | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tray | M2GL050 | 活跃 | 31 X 31 MM, 1 MM PITCH, FBGA-896 | 网格排列 | 3 | PLASTIC/EPOXY | BGA896,30X30,40 | 1.2 V | 20 | 1.14 V | 无 | M2GL050T-FG896I | BGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.26 V | 5.27 | 表面贴装 | 896-BGA | YES | 896-FBGA (31x31) | 896 | 微芯片技术 | 377 | -40°C ~ 100°C (TJ) | IGLOO2 | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | compliant | S-PBGA-B896 | 377 | 不合格 | 1.2 V | 377 | 2.44 mm | 现场可编程门阵列 | 56340 | 1869824 | 56340 | 31 mm | 31 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A42MX16-FPQG208 | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 3 V | 5.25 V | 140 | Tray | A42MX16 | 活跃 | ROHS COMPLIANT, PLASTIC, QFP-208 | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | 3.3 V | 40 | 3 V | 70 °C | 有 | A42MX16-FPQG208 | 56 MHz | FQFP | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 3.6 V | 1.42 | 表面贴装 | 208-BFQFP | YES | 208-PQFP (28x28) | 208 | 微芯片技术 | 3.3, 5 V | 0 to 70 °C | MX | e3 | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | 鸥翼 | 245 | 0.5 mm | compliant | S-PQFP-G208 | 不合格 | COMMERCIAL | 1232 CLBS, 24000 GATES | 4.1 mm | 现场可编程门阵列 | 24000 | F | 4 ns | 1232 | 24000 | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL060TS-1FGG676T2 | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 387 | Tray | M2GL060 | 活跃 | , | 未说明 | 有 | M2GL060TS-1FGG676T2 | Microsemi Corporation | 活跃 | MICROSEMI CORP | 5.8 | 表面贴装 | 676-BGA | 676-FBGA (27x27) | 微芯片技术 | 1.2000 V | -40 to 125 °C | Automotive, AEC-Q100, IGLOO2 | 有 | 1.14V ~ 2.625V | 未说明 | compliant | 现场可编程门阵列 | 56520 | 1869824 | 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGL125V2-FG144 | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1.14 V | 1.575 V | 97 | Tray | AGL125 | 活跃 | LBGA, | GRID ARRAY, LOW PROFILE | 3 | PLASTIC/EPOXY | 1.2 V | 30 | 1.14 V | 85 °C | 无 | AGL125V2-FG144 | 108 MHz | LBGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.575 V | 5.28 | 表面贴装 | 144-LBGA | YES | 144-FPBGA (13x13) | 144 | 微芯片技术 | 1.2, 1.5 V | 0 to 70 °C | IGLOO | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 230 | 1 mm | unknown | S-PBGA-B144 | 不合格 | OTHER | 3072 CLBS, 125000 GATES | 1.55 mm | 现场可编程门阵列 | 3072 | 36864 | 125000 | STD | 3072 | 125000 | 13 mm | 13 mm | |||||||||||||||||||||||||||||||||||||||||||||
![]() | MPF300T-FCG784E | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tray | MPF300 | 活跃 | 有 | This product may require additional documentation to export from the United States. | 300000 LE | 20.6 Mbit | + 100 C | 1.08 V | 0 C | 1 | 0.97 V | SMD/SMT | Microchip | Microchip Technology / Atmel | PolarFire | Details | FPGA - Field Programmable Gate Array | 表面贴装 | 784-BBGA, FCBGA | 784-FCBGA (29x29) | 微芯片技术 | 388 | 0°C ~ 100°C (TJ) | Tray | PolarFire™ | 可编程逻辑集成电路 | 0.97V ~ 1.08V | 1 V, 1.05 V | 12.5 Gb/s | 300000 | 21094400 | 16 Transceiver | FPGA - Field Programmable Gate Array | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPF500T-FCG784IPP | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPF500TS-FCG784IPP | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3PN125-Z2VQG100 | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tray | A3PN125 | 活跃 | TFQFP, TQFP100,.63SQ | FLATPACK, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | TQFP100,.63SQ | -20 °C | 1.5 V | 未说明 | 1.425 V | 70 °C | 有 | A3PN125-Z2VQG100 | TFQFP | SQUARE | Microsemi Corporation | 不推荐 | MICROSEMI CORP | 1.575 V | 5.32 | 表面贴装 | 100-TQFP | YES | 100-VQFP (14x14) | 100 | 微芯片技术 | 71 | -20°C ~ 85°C (TJ) | ProASIC3 nano | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.425V ~ 1.575V | QUAD | 鸥翼 | 未说明 | 0.5 mm | compliant | S-PQFP-G100 | 71 | 不合格 | 1.5,1.5/3.3 V | OTHER | 71 | 3072 CLBS, 125000 GATES | 1.2 mm | 现场可编程门阵列 | 36864 | 125000 | 3072 | 3072 | 125000 | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGLN250V2-ZVQG100I | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tray | AGLN250 | Obsolete | 14 X 14 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, VQFP-100 | FLATPACK, THIN PROFILE, FINE PITCH | PLASTIC/EPOXY | -40 °C | 1.2 V | 未说明 | 1.14 V | 85 °C | 有 | AGLN250V2-ZVQG100I | TFQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 5.82 | 表面贴装 | 100-TQFP | YES | 100-VQFP (14x14) | 100 | 微芯片技术 | 68 | -40°C ~ 100°C (TJ) | IGLOO nano | e3 | TIN | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | QUAD | 鸥翼 | 未说明 | 0.5 mm | compliant | S-PQFP-G100 | 不合格 | INDUSTRIAL | 6144 CLBS, 250000 GATES | 1.2 mm | 现场可编程门阵列 | 6144 | 36864 | 250000 | 6144 | 250000 | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGLN125V2-ZVQ100I | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tray | AGLN125 | Obsolete | 14 X 14 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, VQFP-100 | FLATPACK, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | -40 °C | 1.2 V | 30 | 1.14 V | 85 °C | 无 | AGLN125V2-ZVQ100I | TFQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 5.84 | 表面贴装 | 100-TQFP | YES | 100-VQFP (14x14) | 100 | 微芯片技术 | 71 | -40°C ~ 100°C (TJ) | IGLOO nano | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | QUAD | 鸥翼 | 230 | 0.5 mm | unknown | S-PQFP-G100 | 不合格 | INDUSTRIAL | 3072 CLBS, 125000 GATES | 1.2 mm | 现场可编程门阵列 | 3072 | 36864 | 125000 | 3072 | 125000 | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGLN030V2-ZVQ100I | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | FLATPACK, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | -40 °C | 1.2 V | 30 | 1.14 V | 85 °C | 无 | AGLN030V2-ZVQ100I | TFQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 5.88 | YES | 100 | 14 X 14 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, VQFP-100 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | QUAD | 鸥翼 | 230 | 0.5 mm | unknown | S-PQFP-G100 | 不合格 | INDUSTRIAL | 768 CLBS, 30000 GATES | 1.2 mm | 现场可编程门阵列 | 768 | 30000 | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGLN250V5-ZVQ100I | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tray | AGLN250 | Obsolete | 14 X 14 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, VQFP-100 | FLATPACK, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | -40 °C | 1.5 V | 30 | 1.425 V | 85 °C | 无 | AGLN250V5-ZVQ100I | TFQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 5.89 | 表面贴装 | 100-TQFP | YES | 100-VQFP (14x14) | 100 | 微芯片技术 | 68 | -40°C ~ 100°C (TJ) | IGLOO nano | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | 鸥翼 | 230 | 0.5 mm | unknown | S-PQFP-G100 | 不合格 | INDUSTRIAL | 6144 CLBS, 250000 GATES | 1.2 mm | 现场可编程门阵列 | 6144 | 36864 | 250000 | 6144 | 250000 | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGLN250V2-ZVQ100I | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tray | AGLN250 | Obsolete | 14 X 14 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, VQFP-100 | FLATPACK, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | -40 °C | 1.2 V | 30 | 1.14 V | 85 °C | 无 | AGLN250V2-ZVQ100I | TFQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 5.87 | 表面贴装 | 100-TQFP | YES | 100-VQFP (14x14) | 100 | 微芯片技术 | 68 | -40°C ~ 100°C (TJ) | IGLOO nano | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | QUAD | 鸥翼 | 230 | 0.5 mm | unknown | S-PQFP-G100 | 不合格 | INDUSTRIAL | 6144 CLBS, 250000 GATES | 1.2 mm | 现场可编程门阵列 | 6144 | 36864 | 250000 | 6144 | 250000 | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGLN125V5-ZVQ100I | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tray | AGLN125 | Obsolete | 14 X 14 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, VQFP-100 | FLATPACK, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | -40 °C | 1.5 V | 30 | 1.425 V | 85 °C | 无 | AGLN125V5-ZVQ100I | TFQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 5.89 | 表面贴装 | 100-TQFP | YES | 100-VQFP (14x14) | 100 | 微芯片技术 | 71 | -40°C ~ 100°C (TJ) | IGLOO nano | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | 鸥翼 | 230 | 0.5 mm | unknown | S-PQFP-G100 | 不合格 | INDUSTRIAL | 3072 CLBS, 125000 GATES | 1.2 mm | 现场可编程门阵列 | 3072 | 36864 | 125000 | 3072 | 125000 | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A1010B-2PQ100C | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | Non-Compliant | QFP, QFP100,.7X.9 | FLATPACK | PLASTIC/EPOXY | QFP100,.7X.9 | 5 V | 4.75 V | 70 °C | 无 | A1010B-2PQ100C | 60 MHz | QFP | RECTANGULAR | Microsemi Corporation | Obsolete | MICROSEMI CORP | 5.25 V | 5.84 | QFP | YES | 100 | 100 | 57 | 70 °C | 0 °C | 现场可编程门阵列 | CMOS | QUAD | 鸥翼 | 0.65 mm | unknown | 65 MHz | 100 | R-PQFP-G100 | 57 | 不合格 | 5 V | 5 V | COMMERCIAL | 5.25 V | 4.75 V | 3.4 ns | 57 | 547 CLBS, 2000 GATES | 3.4 mm | 现场可编程门阵列 | 295 | 1200 | 295 | 2 | 147 | 3.4 ns | 547 | 295 | 2000 | 20 mm | 14 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||
![]() | A1425A-PLG84I | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | CHIP CARRIER | 3 | PLASTIC/EPOXY | -40 °C | 5 V | 40 | 4.5 V | 85 °C | 有 | A1425A-PLG84I | 125 MHz | QCCJ | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 5.5 V | 5.82 | YES | 84 | ROHS COMPLIANT, PLASTIC, LCC-84 | e3 | 哑光锡 | MAX 70 I/OS | CMOS | QUAD | J BEND | 245 | 1.27 mm | compliant | S-PQCC-J84 | 不合格 | INDUSTRIAL | 310 CLBS, 2500 GATES | 4.572 mm | 现场可编程门阵列 | 3 ns | 310 | 2500 | 29.3116 mm | 29.3116 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A1225A-1PL84I | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | Non-Compliant | PLASTIC, LCC-84 | CHIP CARRIER | 3 | PLASTIC/EPOXY | LDCC84,1.2SQ | -40 °C | 5 V | 30 | 4.5 V | 85 °C | 无 | A1225A-1PL84I | 90 MHz | QCCJ | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 5.5 V | 5.84 | YES | 84 | 84 | 72 | e0 | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | PLD EQUIVALENT GATES=6250 | 8542.39.00.01 | 现场可编程门阵列 | CMOS | QUAD | J BEND | 225 | 1.27 mm | compliant | 120 MHz | S-PQCC-J84 | 83 | 不合格 | 5 V | 5 V | INDUSTRIAL | 5.5 V | 4.5 V | 4.3 ns | 83 | 451 CLBS, 2500 GATES | 4.572 mm | 现场可编程门阵列 | 451 | 2500 | 451 | 4.3 ns | 451 | 451 | 2500 | 29.3116 mm | 29.3116 mm | ||||||||||||||||||||||||||||||||||||||||
![]() | A1460A-CQ196B | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | FLATPACK, GUARD RING | CERAMIC, METAL-SEALED COFIRED | TPAK196,2.5SQ,25 | -55 °C | 5 V | 未说明 | 4.5 V | 125 °C | 无 | A1460A-CQ196B | 100 MHz | GQFF | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 5.5 V | 5.85 | Military grade | YES | 196 | HERMETIC SEALED, CERAMIC, QFP-196 | e0 | 3A001.A.2.C | 锡铅 | MAX 168 I/OS | 8542.39.00.01 | 现场可编程门阵列 | CMOS | QUAD | FLAT | 未说明 | 0.635 mm | compliant | S-CQFP-F196 | 168 | 不合格 | 5 V | MILITARY | 168 | 848 CLBS, 6000 GATES | 2.9464 mm | 现场可编程门阵列 | MIL-STD-883 | 3 ns | 848 | 848 | 6000 | 34.29 mm | 34.29 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A1010B-1PG84M | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 通孔 | Compliant | PGA, PGA84M,11X11 | 网格排列 | CERAMIC | PGA84M,11X11 | -55 °C | 5 V | 125 °C | 无 | A1010B-1PG84M | 43.1 MHz | PGA | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 5.88 | NO | 84 | 84 | 57 | e0 | Tin/Lead (Sn/Pb) | 125 °C | -55 °C | 现场可编程门阵列 | CMOS | PERPENDICULAR | PIN/PEG | 2.54 mm | unknown | 57 MHz | S-XPGA-P84 | 57 | 不合格 | 5 V | 5 V | MILITARY | 5.5 V | 4.5 V | 3.8 ns | 57 | 现场可编程门阵列 | 295 | 1200 | 295 | 1 | 147 | 295 | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A1225A-PLG84C | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | Compliant | PLASTIC, LCC-84 | CHIP CARRIER | 3 | PLASTIC/EPOXY | LDCC84,1.2SQ | 5 V | 40 | 4.75 V | 70 °C | 有 | A1225A-PLG84C | 75 MHz | QCCJ | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 5.25 V | 5.8 | YES | 84 | 84 | 72 | e3 | 哑光锡 | 70 °C | 0 °C | MAX 72 I/OS | 现场可编程门阵列 | CMOS | QUAD | J BEND | 245 | 1.27 mm | compliant | 110 MHz | S-PQCC-J84 | 83 | 不合格 | 5 V | 5 V | COMMERCIAL | 5.25 V | 4.75 V | 5 ns | 83 | 451 CLBS, 2500 GATES | 4.57 mm | 现场可编程门阵列 | 451 | 2500 | 451 | 5 ns | 451 | 451 | 2500 | 29.3116 mm | 29.3116 mm | ||||||||||||||||||||||||||||||||||||||||||
![]() | A14V60A-TQ176C | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | FLATPACK, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | 3.3 V | 30 | 3 V | 70 °C | 无 | A14V60A-TQ176C | 75 MHz | LFQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 3.6 V | 5.88 | YES | 176 | 1.40 MM HEIGHT, PLASTIC, TQFP-176 | e0 | 锡铅 | MAX 151 I/OS | 8542.39.00.01 | CMOS | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | S-PQFP-G176 | 不合格 | COMMERCIAL | 848 CLBS, 6000 GATES | 1.6 mm | 现场可编程门阵列 | 3.9 ns | 848 | 6000 | 24 mm | 24 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A1010B-PQ100I | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | FLATPACK | PLASTIC/EPOXY | QFP100,.7X.9 | -40 °C | 5 V | 4.5 V | 85 °C | 无 | A1010B-PQ100I | 40.5 MHz | QFP | RECTANGULAR | Microsemi Corporation | Obsolete | MICROSEMI CORP | 5.5 V | 5.84 | QFP | YES | 100 | QFP, QFP100,.7X.9 | 现场可编程门阵列 | CMOS | QUAD | 鸥翼 | 0.65 mm | unknown | 100 | R-PQFP-G100 | 57 | 不合格 | 5 V | INDUSTRIAL | 57 | 547 CLBS, 2000 GATES | 3.4 mm | 现场可编程门阵列 | 547 | 295 | 2000 | 20 mm | 14 mm |