N/A

-

Production (Last Updated: 2 months ago)

N

有

27

IGLOO2

377

Tray

M2GL050

活跃

31 X 31 MM, 1 MM PITCH, FBGA-896

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

1.2 V

20

1.14 V

85 °C

无

M2GL050-1FG896

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.3

表面贴装

896-BGA

YES

896-FBGA (31x31)

896

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

M2GL050

85 °C

0 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B896

377

不合格

1.2 V

OTHER

228.3 kB

377

2.44 mm

现场可编程门阵列

56340

1869824

56340

31 mm

31 mm

N/A

-

N

有

84

IGLOO2

248

Tray

M2GL150

活跃

表面贴装

484-BFBGA

484-FBGA (19x19)

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

M2GL150

1.14V ~ 2.625V

146124

5120000

N/A

-

Production (Last Updated: 2 months ago)

Details

12084 LE

195 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

90

IGLOO2

1.2 V

Tray

M2GL010

活跃

LFBGA, BGA400,20X20,32

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

85 °C

有

M2GL010T-1VFG400

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.3

表面贴装

VFPBGA-400

YES

400

400-VFBGA (17x17)

400

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

M2GL010T

85 °C

0 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

compliant

30

S-PBGA-B400

195

不合格

1.2 V

1.2 V

OTHER

114 kB

195

1.51 mm

现场可编程门阵列

12084

933888

1

4 Transceiver

12084

17 mm

17 mm

N/A

-

Production (Last Updated: 2 months ago)

Details

有

84

IGLOO2

248

Tray

M2GL150

活跃

FBGA,

GRID ARRAY, FINE PITCH

4

PLASTIC/EPOXY

1.2 V

30

1.14 V

有

M2GL150TS-FCVG484I

FBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

表面贴装

484-BFBGA

YES

484-BGA

484

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

M2GL150TS

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B484

3.15 mm

现场可编程门阵列

146124

5120000

STD

19 mm

19 mm

N/A

-

Details

有

60

IGLOO2

267

Tray

M2GL050

活跃

表面贴装

484-BGA

484-FPBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

-55°C ~ 125°C (TJ)

Tray

M2GL050T

1.14V ~ 2.625V

56340

1869824

N/A

-

Production (Last Updated: 2 months ago)

Details

有

24

IGLOO2

574

Tray

M2GL150

活跃

35 X 35 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-1152

网格排列

4

PLASTIC/EPOXY

BGA1152,34X34,40

1.2 V

30

1.14 V

有

M2GL150TS-FCG1152I

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

表面贴装

1152-BBGA, FCBGA

YES

1152-FCBGA (35x35)

1152

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

M2GL150TS

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B1152

574

不合格

1.2 V

574

2.9 mm

现场可编程门阵列

146124

5120000

146124

35 mm

35 mm

N/A

-

Production (Last Updated: 2 months ago)

Details

27696 LE

207 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

90

IGLOO2

Tray

M2GL025

活跃

1.2 V

LFBGA, BGA400,20X20,32

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

有

M2GL025-1VFG400I

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.3

表面贴装

VFPBGA-400

YES

400

400-VFBGA (17x17)

400

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

M2GL025

100 °C

-40 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

compliant

30

S-PBGA-B400

207

不合格

1.2 V

1.2 V

138 kB

207

1.51 mm

现场可编程门阵列

27696

1130496

1

27696

17 mm

17 mm

N/A

-

Details

有

90

IGLOO2

293

Tray

M2GL150

活跃

表面贴装

536-LFBGA, CSPBGA

536-CSPBGA (16x16)

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

M2GL150T

1.14V ~ 2.625V

146124

5120000

N/A

-

Details

86184 LE

267 I/O

1.2 V

- 55 C

+ 125 C

SMD/SMT

有

60

IGLOO2

Tray

M2GL090

活跃

1.2 V

23 X 23 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-55 °C

1.2 V

125 °C

有

M2GL090TS-1FGG484M

BGA

SQUARE

活跃

FPGA - Field Programmable Gate Array IGLOO 2

MICROSEMI CORP

5.27

表面贴装

FPBGA-484

YES

484-FPBGA (23x23)

484

微芯片技术

This product may require additional documentation to export from the United States.

-55°C ~ 125°C (TJ)

Tray

M2GL090TS

3A001.A.2.C

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

260

1 mm

compliant

30

S-PBGA-B484

267

不合格

1.2 V

1.2 V

MILITARY

267

2.44 mm

现场可编程门阵列

86184

2648064

4 Transceiver

86316

23 mm

23 mm

N/A

-

12084 LE

138 I/O

1.14 V

0 C

+ 85 C

SMD/SMT

有

119

IGLOO2

0.707552 oz

1.26 V

Tray

M2GL010

活跃

14 X 14 MM, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-256

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.2 V

30

85 °C

有

M2GL010-VFG256

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.26

表面贴装

VFPBGA-256

YES

256-FPBGA (14x14)

256

微芯片技术

Details

0°C ~ 85°C (TJ)

Tray

M2GL010

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B256

1.2 V

OTHER

667 Mb/s

1.56 mm

现场可编程门阵列

12084

933888

STD

2 Transceiver

14 mm

14 mm

N/A

-

Production (Last Updated: 2 months ago)

N

有

90

IGLOO2

207

Tray

M2GL050

活跃

17 X 17 MM, 0.80 MM PITCH, VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

20

1.14 V

85 °C

无

M2GL050T-VF400

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.3

表面贴装

400-LFBGA

YES

400

400-VFBGA (17x17)

400

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

M2GL050T

85 °C

0 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B400

207

不合格

1.2 V

OTHER

228.3 kB

207

1.51 mm

现场可编程门阵列

56340

1869824

56340

17 mm

17 mm

N/A

-

Details

12084 LE

195 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

90

IGLOO2

1.2 V

Tray

M2GL010

活跃

表面贴装

VFPBGA-400

400-VFBGA (17x17)

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

M2GL010TS

1.14V ~ 2.625V

1.2 V

12084

933888

4 Transceiver

N/A

-

N

56520 LE

387 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

40

IGLOO2

1.2 V

Tray

M2GL060

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.2 V

20

85 °C

无

M2GL060TS-FG676

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

表面贴装

FPBGA-676

YES

676-FBGA (27x27)

676

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

M2GL060TS

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B676

1.2 V

OTHER

2.44 mm

现场可编程门阵列

56520

1869824

4 Transceiver

27 mm

27 mm

N/A

-

Details

1.14 V

有

60

IGLOO2

1.26 V

84

Tray

M2GL005

活跃

LFQFP,

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.2 V

30

85 °C

有

M2GL005S-1TQG144

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.57

表面贴装

144-LQFP

YES

144-TQFP (20x20)

144

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

M2GL005S

1.14V ~ 2.625V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G144

OTHER

1.6 mm

现场可编程门阵列

6060

719872

20 mm

20 mm

N/A

-

N

27696 LE

138 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

119

IGLOO2

1.2 V

Tray

M2GL025

活跃

LFBGA,

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

1.2 V

20

85 °C

无

M2GL025TS-VF256

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.27

表面贴装

VFPBGA-256

YES

256-FPBGA (14x14)

256

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

M2GL025TS

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B256

1.2 V

OTHER

1.56 mm

现场可编程门阵列

27696

1130496

2 Transceiver

14 mm

14 mm

N/A

-

Details

86184 LE

180 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

176

IGLOO2

1.2 V

Tray

M2GL090

活跃

, BGA325,21X21,20

3

PLASTIC

BGA325,21X21,20

1.2 V

有

M2GL090-1FCSG325

活跃

MICROSEMI CORP

5.82

表面贴装

FCBGA-325

YES

325-FCBGA (11x11)

325

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

M2GL090

8542.39.00.01

CMOS

1.14V ~ 2.625V

compliant

180

不合格

1.2 V

1.2 V

180

现场可编程门阵列

86184

2648064

86316

N/A

-

Production (Last Updated: 2 months ago)

N

12084 LE

195 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

90

IGLOO2

1.2 V

Tray

M2GL010

活跃

17 X 17 MM, 0.80 MM PITCH, VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

20

无

M2GL010-VF400I

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.27

表面贴装

VFPBGA-400

YES

400-VFBGA (17x17)

400

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

M2GL010

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B400

195

不合格

1.2 V

1.2 V

195

1.51 mm

现场可编程门阵列

12084

933888

STD

12084

17 mm

17 mm

N/A

-

Details

56340 LE

377 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

27

IGLOO2

1.2000 V

1.14 V

1.26 V

1.2 V

Tray

M2GL050

活跃

BGA, BGA896,30X30,40

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

1.2 V

30

85 °C

有

M2GL050T-FGG896

BGA

SQUARE

活跃

MICROSEMI CORP

5.29

表面贴装

FBGA-896

YES

896-FBGA (31x31)

896

微芯片技术

This product may require additional documentation to export from the United States.

0 to 85 °C

Tray

M2GL050T

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B896

377

不合格

1.2 V

1.2 V

OTHER

667 Mb/s

377

2.44 mm

现场可编程门阵列

56340

1869824

STD

8 Transceiver

56340

31 mm

31 mm

N/A

-

Details

12084 LE

138 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

119

IGLOO2

1.2 V

Tray

M2GL010

活跃

LFBGA,

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.2 V

30

85 °C

有

M2GL010T-VFG256

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.27

表面贴装

VFPBGA-256

YES

256-FPBGA (14x14)

256

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

M2GL010T

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B256

1.2 V

OTHER

1.56 mm

现场可编程门阵列

12084

933888

2 Transceiver

14 mm

14 mm

N/A

-

Details

86184 LE

267 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

60

IGLOO2

1.2 V

Tray

M2GL090

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

85 °C

有

M2GL090TS-1FGG484

BGA

SQUARE

活跃

MICROSEMI CORP

5.27

表面贴装

FPBGA-484

YES

484-FPBGA (23x23)

484

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

M2GL090TS

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

260

1 mm

compliant

30

S-PBGA-B484

267

不合格

1.2 V

1.2 V

OTHER

267

2.44 mm

现场可编程门阵列

86184

2648064

4 Transceiver

86316

23 mm

23 mm

N/A

-

Details

有

84

IGLOO2

248

Tray

M2GL150

活跃

表面贴装

484-BFBGA

484-BGA

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

M2GL150T

1.14V ~ 2.625V

146124

5120000

N/A

-

Details

27696 LE

267 I/O

1.2 V

- 55 C

+ 125 C

SMD/SMT

有

60

IGLOO2

1.2 V

Tray

M2GL025

活跃

表面贴装

FPBGA-484

484-FPBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

-55°C ~ 125°C (TJ)

Tray

M2GL025T

1.14V ~ 2.625V

1.2 V

27696

1130496

4 Transceiver

N/A

-

N

1.14 V

有

60

IGLOO2

1.26 V

209

Tray

M2GL005

活跃

23 X 23 MM, 1 MM PITCH, FBGA-484

网格排列

3

PLASTIC/EPOXY

1.2 V

20

无

M2GL005-FG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.28

表面贴装

484-BGA

YES

484-FPBGA (23x23)

484

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

M2GL005

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B484

2.44 mm

现场可编程门阵列

6060

719872

STD

23 mm

23 mm

N/A

-

Production (Last Updated: 2 months ago)

Details

有

60

IGLOO2

267

Tray

M2GL050

活跃

表面贴装

484-BGA

484

484-FPBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

M2GL050

100 °C

-40 °C

1.14V ~ 2.625V

1.2 V

228.3 kB

56340

1869824

1

N/A

-

N

有

84

IGLOO2

248

Tray

M2GL150

活跃

表面贴装

484-BFBGA

484-FBGA (19x19)

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

M2GL150T

1.14V ~ 2.625V

146124

5120000