制造商是'IDT'
IDT 逻辑 - 专用逻辑
(160)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 触点镀层 | 底架 | 包装/外壳 | 表面安装 | 引脚数 | 终端数量 | 包装 | 已出版 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 引脚数量 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 极性 | 电源电压-最大值(Vsup) | 电源 | 温度等级 | 电源电压-最小值(Vsup) | 最大电源电压 | 最小电源电压 | 端口的数量 | 比特数 | 传播延迟 | 接通延迟时间 | 家人 | 逻辑功能 | 输入数量 | 输出特性 | 座位高度-最大 | 输出极性 | 逻辑IC类型 | 筛选水平 | 触发器类型 | 高电平输出电流 | 传播延迟(tpd) | 低水平输出电流 | 控制类型 | 电源电流-最大值(ICC) | fmax-Min | 计数方向 | 座位高度(最大) | 长度 | 宽度 | 器件厚度 | 辐射硬化 | RoHS状态 | 无铅 | ||||||||||||||||||
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![]() | 74FCT521CTSO | Integrated Device Technology Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Obsolete | INTEGRATED DEVICE TECHNOLOGY INC | SOP, SOP20,.4 | 1 | 70 °C | PLASTIC/EPOXY | SOP | SOP20,.4 | RECTANGULAR | 小概要 | 5 V | YES | 20 | 无 | e0 | 无 | Tin/Lead (Sn85Pb15) | 8542.39.00.01 | DUAL | 鸥翼 | 225 | 1.27 mm | not_compliant | 20 | R-PDSO-G20 | 不合格 | COMMERCIAL | IDENTITY COMPARATOR | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 54FCT521ATLB | Integrated Device Technology Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Obsolete | INTEGRATED DEVICE TECHNOLOGY INC | QCCN, LCC20,.35SQ | 125 °C | -55 °C | CERAMIC | QCCN | LCC20,.35SQ | SQUARE | CHIP CARRIER | 5 V | YES | 20 | 无 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | QUAD | 无铅 | 1.27 mm | unknown | S-XQCC-N20 | 不合格 | MILITARY | IDENTITY COMPARATOR | 38535Q/M;38534H;883B | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | QS3VH257PA | Integrated Device Technology Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Obsolete | INTEGRATED DEVICE TECHNOLOGY INC | TSSOP | TSSOP, TSSOP16,.25 | 50 pF | 1 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP16,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 3.3 V | YES | 16 | 无 | e0 | 无 | 锡铅 | 8542.39.00.01 | DUAL | 鸥翼 | 240 | 4 | 0.635 mm | not_compliant | 20 | 16 | R-PDSO-G16 | 不合格 | 3.6 V | INDUSTRIAL | 3 V | 3 | 2 | CB3Q/3VH/3C/2B | 3-STATE | TRUE | 总线交换机 | 0.25 ns | 高电平 | 3 mA | BIDIRECTIONAL | |||||||||||||||||||||||||||||||||||||||||||
![]() | QS3ST253Q | Integrated Device Technology Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Obsolete | INTEGRATED DEVICE TECHNOLOGY INC | 50 pF | 85 °C | -40 °C | PLASTIC/EPOXY | SSOP | SSOP20,.25 | RECTANGULAR | 小概要 | 5 V | YES | 20 | 无 | e0 | 锡铅 | 8542.39.00.01 | DUAL | 鸥翼 | 2 | 0.635 mm | not_compliant | R-PDSO-G20 | 1 | 不合格 | 5.5 V | INDUSTRIAL | 4.5 V | 4 | TRUE | MULTIPLEXER AND DEMUX/DECODER | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | IDT54FCT521TDB | Integrated Device Technology Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Obsolete | INTEGRATED DEVICE TECHNOLOGY INC | DIP | DIP, DIP20,.3 | 50 pF | 125 °C | -55 °C | CERAMIC, GLASS-SEALED | DIP | DIP20,.3 | RECTANGULAR | IN-LINE | 5 V | NO | 20 | 无 | e0 | 锡铅 | CASCADABLE | 8542.39.00.01 | DUAL | THROUGH-HOLE | 240 | 1 | 2.54 mm | not_compliant | 20 | R-GDIP-T20 | 不合格 | 5.5 V | MILITARY | 4.5 V | 8 | FCT | 5.08 mm | INVERTED | IDENTITY COMPARATOR | MIL-STD-883 Class B | 15 ns | 25.3365 mm | 7.62 mm | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | QS316213PA | Integrated Device Technology Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Obsolete | INTEGRATED DEVICE TECHNOLOGY INC | TSSOP, TSSOP56,.3,20 | 1 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP56,.3,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 5 V | YES | 56 | 无 | e0 | 无 | 锡铅 | 8542.39.00.01 | DUAL | 鸥翼 | 240 | 0.5 mm | not_compliant | 20 | R-PDSO-G56 | 不合格 | INDUSTRIAL | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | IDT74SSTU32D869BKG8 | Integrated Device Technology Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Obsolete | INTEGRATED DEVICE TECHNOLOGY INC | 70 °C | PLASTIC/EPOXY | FBGA | BGA150,11X19,25 | RECTANGULAR | GRID ARRAY, FINE PITCH | 1.8 V | YES | 150 | 有 | 8542.39.00.01 | BOTTOM | BALL | 0.635 mm | unknown | R-PBGA-B150 | 不合格 | COMMERCIAL | 总线驱动器 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 74FCT521CTP | Integrated Device Technology Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Obsolete | INTEGRATED DEVICE TECHNOLOGY INC | DIP, DIP20,.3 | 70 °C | PLASTIC/EPOXY | DIP | DIP20,.3 | RECTANGULAR | IN-LINE | 5 V | NO | 20 | 无 | e0 | Tin/Lead (Sn85Pb15) | 8542.39.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-PDIP-T20 | 不合格 | COMMERCIAL | IDENTITY COMPARATOR | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | ICSSSTUAF32868AHLF | Integrated Device Technology Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Obsolete | INTEGRATED DEVICE TECHNOLOGY INC | FBGA, BGA176,8X22,25 | 3 | 70 °C | PLASTIC/EPOXY | FBGA | BGA176,8X22,25 | RECTANGULAR | GRID ARRAY, FINE PITCH | 1.8 V | YES | 176 | 有 | e1 | 锡银铜 | 8542.39.00.01 | BOTTOM | BALL | 260 | 0.635 mm | unknown | 30 | R-PBGA-B176 | 不合格 | COMMERCIAL | 总线驱动器 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | IDT74FCT521BTP | Integrated Device Technology Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | QS74FCT2521ATSO | Integrated Device Technology Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Obsolete | INTEGRATED DEVICE TECHNOLOGY INC | SOP, SOP20,.4 | 1 | 70 °C | PLASTIC/EPOXY | SOP | SOP20,.4 | RECTANGULAR | 小概要 | 5 V | YES | 20 | 无 | e0 | 锡铅 | 8542.39.00.01 | DUAL | 鸥翼 | 225 | 1.27 mm | not_compliant | 20 | R-PDSO-G20 | 不合格 | COMMERCIAL | IDENTITY COMPARATOR | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | QS3162233PV | Integrated Device Technology Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Obsolete | INTEGRATED DEVICE TECHNOLOGY INC | SSOP, SSOP56,.4 | 1 | 85 °C | -40 °C | PLASTIC/EPOXY | SSOP | SSOP56,.4 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | 5 V | YES | 56 | 无 | e0 | 锡铅 | 8542.39.00.01 | DUAL | 鸥翼 | 225 | 0.635 mm | not_compliant | 20 | R-PDSO-G56 | 不合格 | INDUSTRIAL | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | QS3257S1X | Integrated Device Technology Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Obsolete | INTEGRATED DEVICE TECHNOLOGY INC | SOP, SOP16,.25 | 1 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP16,.25 | RECTANGULAR | 小概要 | 5 V | YES | 16 | 无 | e0 | 无 | 锡铅 | 8542.39.00.01 | DUAL | 鸥翼 | 240 | 1.27 mm | not_compliant | 30 | R-PDSO-G16 | 不合格 | INDUSTRIAL | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | QS32X383Q1X | Integrated Device Technology Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Obsolete | INTEGRATED DEVICE TECHNOLOGY INC | 1 | 85 °C | -40 °C | PLASTIC/EPOXY | SSOP | SSOP48,.24,16 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | 5 V | YES | 48 | 无 | e0 | 锡铅 | 8542.39.00.01 | DUAL | 鸥翼 | 240 | 0.4 mm | not_compliant | 30 | R-PDSO-G48 | 不合格 | INDUSTRIAL | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 74SSTUBF32866BBFG8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 9 Weeks | 410MHz | 1 | Copper, Silver, Tin | 表面贴装 | 96 | Positive Edge | 2006 | e1 | yes | 活跃 | 3 (168 Hours) | 96 | EAR99 | 锡银铜 | 70°C | 0°C | BOTTOM | BALL | 260 | 1 | 1.8V | 0.8mm | 410MHz | 30 | 96 | 25 | 1.8V | Non-Inverting | COMMERCIAL | 1.9V | 1.7V | 25 | 3 ns | 3 ns | 32866 | Buffer | OPEN-DRAIN | D FLIP-FLOP | -8mA | 8mA | 13.5mm | 5.5mm | 1.4mm | 无 | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||||||||||||||||
![]() | 74SSTUBF32869ABKG | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | Copper, Silver, Tin | 表面贴装 | TFBGA | 150 | 340MHz | 2006 | e1 | yes | 活跃 | 3 (168 Hours) | 150 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 70°C | 0°C | 8542.39.00.01 | BOTTOM | BALL | 260 | 1 | 1.8V | 0.65mm | 30 | 150 | 不合格 | 1.9V | Non-Inverting | 1.8V | COMMERCIAL | 1.7V | 14 | SSTU | Buffer | D FLIP-FLOP | 积极优势 | 1.5 ns | 13mm | 8mm | 1.2mm | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||
![]() | SSTUF32864CHLF | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1 | 表面贴装 | BGA | 96 | Positive Edge | 2004 | Discontinued | 70°C | 0°C | 25 | Non-Inverting | 1.9V | 1.7V | 25 | 3 ns | Buffer | 25 | -8mA | 8mA | 13.5mm | 5.5mm | 1.4mm | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | SSTVA32852AHT | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 114 | Tape & Reel (TR) | 2011 | Discontinued | 114 | 70°C | 0°C | BOTTOM | BALL | 2.5V | 0.8mm | 不合格 | 2.7V | 2.5V | COMMERCIAL | Buffer | 总线驱动器 | 16mm | 5.5mm | 1.4mm | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 74SSTUBF32866BBFG | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 9 Weeks | 410MHz | 1 | Copper, Silver, Tin | 表面贴装 | BGA | 96 | Positive Edge | 2006 | e1 | yes | 活跃 | 3 (168 Hours) | 96 | EAR99 | 锡银铜 | 70°C | 0°C | BOTTOM | BALL | 260 | 1 | 1.8V | 0.8mm | 410MHz | 30 | 96 | 25 | 不合格 | 1.8V | Non-Inverting | COMMERCIAL | 1.9V | 1.7V | 25 | 3 ns | SSTU | Buffer | D FLIP-FLOP | -8mA | 8mA | 13.5mm | 5.5mm | 1.4mm | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||||||||||||||||
![]() | SSTUAF32866BHLF | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1 | 表面贴装 | BGA | 96 | Positive Edge | 2006 | e1 | yes | Discontinued | 3 (168 Hours) | 96 | Tin/Silver/Copper (Sn/Ag/Cu) | 70°C | 0°C | BOTTOM | BALL | 260 | 1 | 1.8V | 0.8mm | unknown | 410MHz | 未说明 | 96 | 25 | Non-Inverting | COMMERCIAL | 1.9V | 1.7V | 25 | 3 ns | SSSTU | Buffer | D FLIP-FLOP | -8mA | 8mA | 13.5mm | 5.5mm | 1.4mm | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | SSTVF16859BKLF | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 210MHz | 1 | 表面贴装 | 56 | Positive Edge | 2012 | yes | 活跃 | 70°C | 0°C | 210MHz | 56 | 26 | 2.6V | Non-Inverting | 2.7V | 2.5V | 13 | 3.5 ns | Buffer | -16mA | 16mA | 8mm | 8mm | 850μm | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | SSTVA16859CGLFT | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 表面贴装 | TSSOP | 64 | Tape & Reel (TR) | 2013 | e3 | yes | 活跃 | 1 (Unlimited) | 64 | Matte Tin (Sn) - annealed | 70°C | 0°C | 8542.39.00.01 | DUAL | 鸥翼 | 260 | 1 | 2.5V | 0.5mm | 30 | 64 | 不合格 | 2.7V | COMMERCIAL | 2.3V | 13 | SSTV | Buffer | TRUE | D FLIP-FLOP | 积极优势 | 2.6 ns | 210 MHz | 1.2mm | 17mm | 6.1mm | 1mm | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | IDT74SSTVN16859NLG | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 56 | 2007 | e3 | 3 (168 Hours) | 56 | Matte Tin (Sn) - annealed | 70°C | 0°C | 220 MHZ FOR PC3200 OPERATION | 8542.39.00.01 | QUAD | 无铅 | 260 | 1 | 2.5V | 0.5mm | 30 | 56 | 不合格 | 2.7V | 2.5V | COMMERCIAL | 2.3V | 13 | SSTV | Buffer | TRUE | D FLIP-FLOP | 积极优势 | 2.5 ns | 200 MHz | 1mm | 8mm | 8mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 74SSTU32864CBFG8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 340MHz | 1 | Copper, Silver, Tin | 表面贴装 | 96 | Positive Edge | Tape & Reel (TR) | 2007 | e1 | yes | Discontinued | 3 (168 Hours) | 96 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 70°C | 0°C | BOTTOM | BALL | 260 | 1 | 1.8V | 0.8mm | 340MHz | 30 | 96 | 25 | 不合格 | Non-Inverting | COMMERCIAL | 1.9V | 1.7V | 25 | 2.35 ns | SSTU | Buffer | D FLIP-FLOP | -8mA | 8mA | 13.5mm | 5.5mm | 1.4mm | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||||||||||||||||||
![]() | SSTUA32864BHLF | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 410MHz | 1 | 表面贴装 | 96 | Positive Edge | 2005 | e1 | yes | 活跃 | 3 (168 Hours) | Tin/Silver/Copper (Sn/Ag/Cu) | 70°C | 0°C | 260 | unknown | 410MHz | 未说明 | 96 | 25 | 1.8V | Non-Inverting | 1.9V | 1.7V | 3 ns | Buffer | D FLIP-FLOP | -8mA | 8mA | 13.5mm | 5.5mm | 1.4mm | 符合RoHS标准 | 无铅 |