制造商是'Everspin Technologies'
Everspin Technologies 存储器
(203)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 终端数量 | 厂商 | 操作温度 | 包装 | 系列 | 无铅代码 | 零件状态 | ECCN 代码 | 最高工作温度 | 最小工作温度 | HTS代码 | 子类别 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 功能数量 | 端子间距 | Reach合规守则 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 温度等级 | 电源电压-最小值(Vsup) | 界面 | 最大电源电压 | 最小电源电压 | 内存大小 | 工作电源电流 | 电源电流 | 操作模式 | 时钟频率 | 电源电流-最大值 | 访问时间 | 内存格式 | 内存接口 | 数据总线宽度 | 组织结构 | 座位高度-最大 | 内存宽度 | 写入周期时间 - 字符、页面 | 产品类别 | 密度 | 待机电流-最大值 | 记忆密度 | 筛选水平 | 字长 | 内存IC类型 | 混合内存类型 | 产品类别 | 组织的记忆 | 长度 | 宽度 | |||||||||||||||||||||||||||||||||||||||||||||||||
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.png) | MR2A16ATS35C | Everspin Technologies, Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | EAR99 | 8542.32.00.71 | Unknown | 表面贴装 | 1.05(Max) | 10.29(Max) | 18.54(Max) | 44 | SOP | TSOP-II | Gull-wing | Compliant | Obsolete | 44 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MR25H40MDC | Everspin Technologies, Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 0.95(Max) | 6.1(Max) | 5.1(Max) | 8 | DFN | DFN EP | No Lead | Compliant | 8 | Compliant | Tray | Unconfirmed | 125 °C | -40 °C | 8 | 3.3 V | SPI, Serial | 3.6 V | 3 V | 42 mA | 10 ns | 4 Mb | 8 b | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MR4A08BMYS35 | Everspin Technologies, Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8542.32.00.71 | 表面贴装 | 1.05(Max) | 10.29(Max) | 18.54(Max) | 44 | SOP | TSOP | TSOP2, TSOP44,.46,32 | SMALL OUTLINE, THIN PROFILE | 2000000 | PLASTIC/EPOXY | TSOP44,.46,32 | -40 °C | 未说明 | 35 ns | 125 °C | 有 | MR4A08BMYS35 | 2097152 words | 3.3 V | TSOP2 | RECTANGULAR | Everspin Technologies | Obsolete | EVERSPIN TECHNOLOGIES INC | 5.64 | TSOP2 | YES | 44 | Compliant | 有 | Unconfirmed | EAR99 | 8542.32.00.71 | SRAMs | CMOS | DUAL | 鸥翼 | 未说明 | 1 | 0.8 mm | compliant | 44 | R-PDSO-G44 | 不合格 | 3.6 V | 3.3 V | AUTOMOTIVE | 3 V | ASYNCHRONOUS | 0.17 mA | 2MX8 | 1.2 mm | 8 | 0.014 A | 16777216 bit | 存储器电路 | N/A | 18.41 mm | 10.16 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 | EM004LXQBDH13CS1T | Everspin Technologies Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | EM004LXQ | 表面贴装 | 8-VDFN Exposed Pad | 8-DFN (5x6) | Everspin Technologies Inc. | Non-Volatile | 0°C ~ 70°C (TA) | Tray | EMxxLX | 活跃 | 1.65V ~ 2V | 4Mbit | 133 MHz | RAM | SPI - Quad I/O | 512K x 8 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | EM004LXQBB313IS1T | Everspin Technologies Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | EM004LXQ | 表面贴装 | 24-TBGA | 24-TBGA (6x8) | Everspin Technologies Inc. | Non-Volatile | -40°C ~ 85°C (TA) | Tray | EMxxLX | 活跃 | 1.65V ~ 2V | 4Mbit | 133 MHz | RAM | SPI - Quad I/O | 512K x 8 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EM004LXOBB320IS1T | Everspin Technologies Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | EM004LXO | 表面贴装 | 24-TBGA | 24-TBGA (6x8) | Everspin Technologies Inc. | Non-Volatile | -40°C ~ 85°C (TA) | Tray | EMxxLX | 活跃 | 1.65V ~ 2V | 4Mbit | 200 MHz | RAM | SPI - Octal I/O | 512K x 8 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MR10Q010VMBR | Everspin Technologies Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 活跃 | Non-Volatile | MR10Q010 | + 105 C | 3.6 V | - 40 C | 3 V | SMD/SMT | SPI | 表面贴装 | 24-LBGA | 24-BGA (6x8) | Everspin Technologies Inc. | Tape & Reel (TR) | -40°C ~ 105°C (TA) | - | 3V ~ 3.6V | 1Mbit | 100 mA | 40 MHz | 7 ns | RAM | SPI - Quad I/O, QPI | 8 bit | 128 k x 8 | - | 128K x 8 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MR25H256APDFR | Everspin Technologies Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 活跃 | Non-Volatile | MR25H256 | + 85 C | 3.6 V | - 40 C | 4000 | 2.7 V | SMD/SMT | Everspin Technologies | Everspin Technologies | Details | HVSON, | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | 3 | 32000 | PLASTIC/EPOXY | -40 °C | 未说明 | 85 °C | 有 | MR25H256APDFR | 32768 words | 3 V | HVSON | RECTANGULAR | 活跃 | EVERSPIN TECHNOLOGIES INC | 5.6 | Automotive grade | MRAM | 表面贴装 | 8-VDFN Exposed Pad | YES | 8-DFN-EP, Small Flag (5x6) | 8 | Everspin Technologies Inc. | Tape & Reel (TR) | -40°C ~ 85°C (TA) | Reel | - | Memory & Data Storage | 2.7V ~ 3.6V | DUAL | 无铅 | 未说明 | 1 | 1.27 mm | compliant | R-PDSO-N8 | 3.6 V | INDUSTRIAL | 2.7 V | 256Kbit | SYNCHRONOUS | 40 MHz | 9 ns | RAM | SPI | 8 bit | 32 k x 8 | 0.9 mm | 8 | - | 262144 bit | AEC-Q100 | SPI BUS SERIAL EEPROM | MRAM | 32K x 8 | 6 mm | 5 mm | ||||||||||||||||||||||||||||||||||||||||||
| MR10Q010VMB | Everspin Technologies Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 活跃 | Non-Volatile | MR10Q010 | + 105 C | 3.6 V | - 40 C | 480 | 3 V | SMD/SMT | SPI | Everspin Technologies | Everspin Technologies | Details | MRAM | 表面贴装 | 24-LBGA | 24-BGA (6x8) | Everspin Technologies Inc. | Tray | -40°C ~ 105°C (TA) | Tray | - | Memory & Data Storage | 3V ~ 3.6V | 1Mbit | 100 mA | 40 MHz | 7 ns | RAM | SPI - Quad I/O, QPI | 8 bit | 128 k x 8 | - | MRAM | 128K x 8 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MR10Q010CSCR | Everspin Technologies Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 活跃 | Non-Volatile | MR10Q010 | 有 | + 85 C | 3.6 V | - 40 C | 1000 | 3 V | SMD/SMT | SPI | Everspin Technologies | Everspin Technologies | Details | SOP, SOP16,.4 | 小概要 | 128000 | PLASTIC/EPOXY | SOP16,.4 | -40 °C | 未说明 | 85 °C | 有 | MR10Q010CSCR | 131072 words | 3.3 V | SOP | RECTANGULAR | 活跃 | EVERSPIN TECHNOLOGIES INC | 5.6 | SOIC | MRAM | 表面贴装 | 16-SOIC (0.295", 7.50mm Width) | YES | 16-SOIC | 16 | Everspin Technologies Inc. | Tape & Reel (TR) | 0°C ~ 70°C (TA) | Reel | - | EAR99 | 8542.32.00.71 | Memory & Data Storage | 3V ~ 3.6V | DUAL | 鸥翼 | 未说明 | 1 | 1.27 mm | compliant | 16 | R-PDSO-G16 | 不合格 | 3.6 V | 1.8,3.3 V | INDUSTRIAL | 3 V | 1Mbit | 100 mA | SYNCHRONOUS | 40 MHz | 0.22 mA | 7 ns | RAM | SPI - Quad I/O, QPI | 8 bit | 128 k x 8 | 2.64 mm | 8 | - | 0.005 A | 1048576 bit | 存储器电路 | N/A | MRAM | 128K x 8 | 10.34 mm | 7.52 mm | ||||||||||||||||||||||||||||||||
| MR25H40VDFR | Everspin Technologies Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 活跃 | Non-Volatile | MR25H40 | 有 | 0.6 W | + 105 C | 3.6 V | - 40 C | 4000 | 3 V | SMD/SMT | SPI | Everspin Technologies | Everspin Technologies | Details | DFN-8 | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | 3 | 512000 | PLASTIC/EPOXY | SOLCC8,.25 | -40 °C | 40 | 105 °C | 有 | MR25H40VDFR | 524288 words | 3.3 V | HVSON | RECTANGULAR | 活跃 | EVERSPIN TECHNOLOGIES INC | 5.61 | MRAM | 表面贴装 | 8-VDFN Exposed Pad | YES | 8-DFN-EP, Small Flag (5x6) | 8 | Everspin Technologies Inc. | Tape & Reel (TR) | -40°C ~ 105°C (TA) | Reel | Automotive, AEC-Q100 | EAR99 | Memory & Data Storage | 3V ~ 3.6V | DUAL | 无铅 | 260 | 1 | 1.27 mm | compliant | R-PDSO-N8 | 不合格 | 3.6 V | 3.3 V | INDUSTRIAL | 3 V | 4Mbit | 46.5 mA | SYNCHRONOUS | 40 MHz | 0.0465 mA | 9 ns | RAM | SPI | 8 bit | 512 k x 8 | 0.9 mm | 8 | - | 0.00018 A | 4194304 bit | 存储器电路 | N/A | MRAM | 512K x 8 | 6 mm | 5 mm | |||||||||||||||||||||||||||||||||
| MR25H256ACDFR | Everspin Technologies Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 活跃 | Non-Volatile | MR25H256 | 有 | + 85 C | 3.6 V | - 40 C | 4000 | 2.7 V | SMD/SMT | Everspin Technologies | Everspin Technologies | Details | HVSON, | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | 3 | 32000 | PLASTIC/EPOXY | -40 °C | 未说明 | 85 °C | 有 | MR25H256ACDFR | 32768 words | 3 V | HVSON | RECTANGULAR | 活跃 | EVERSPIN TECHNOLOGIES INC | 5.58 | MRAM | 表面贴装 | 8-VDFN Exposed Pad | YES | 8-DFN-EP, Small Flag (5x6) | 8 | Everspin Technologies Inc. | Tape & Reel (TR) | -40°C ~ 85°C (TA) | 切割胶带 | - | Memory & Data Storage | 2.7V ~ 3.6V | DUAL | 无铅 | 未说明 | 1 | 1.27 mm | compliant | R-PDSO-N8 | 3.6 V | INDUSTRIAL | 2.7 V | 256Kbit | SYNCHRONOUS | 40 MHz | 9 ns | RAM | SPI | 8 bit | 32 k x 8 | 0.9 mm | 8 | - | 262144 bit | SPI BUS SERIAL EEPROM | MRAM | 32K x 8 | 6 mm | 5 mm | |||||||||||||||||||||||||||||||||||||||||||
| MR4A16BUYS45R | Everspin Technologies Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 活跃 | Non-Volatile | MR4A16 | 有 | 0.6 W | + 125 C | 3.6 V | - 40 C | 1000 | 3 V | SMD/SMT | Parallel | Everspin Technologies | Everspin Technologies | Details | TSOP2, | SMALL OUTLINE, THIN PROFILE | 3 | 1000000 | PLASTIC/EPOXY | -40 °C | 未说明 | 125 °C | 有 | MR4A16BUYS45R | 1048576 words | 3.3 V | TSOP2 | RECTANGULAR | 活跃 | EVERSPIN TECHNOLOGIES INC | 5.67 | MRAM | 表面贴装 | 54-TSOP (0.400", 10.16mm Width) | YES | 54-TSOP2 | 54 | Everspin Technologies Inc. | Tape & Reel (TR) | -40°C ~ 125°C (TA) | MouseReel | - | 8542.32.00.71 | Memory & Data Storage | 3V ~ 3.6V | DUAL | 鸥翼 | 未说明 | 1 | 0.8 mm | compliant | R-PDSO-G54 | 3.6 V | AUTOMOTIVE | 3 V | 16Mbit | 180 mA | ASYNCHRONOUS | 45 ns | RAM | Parallel | 16 bit | 1 M x 16 | 1.2 mm | 16 | 45ns | 16777216 bit | 存储器电路 | MRAM | 1M x 16 | 22.22 mm | 10.16 mm | ||||||||||||||||||||||||||||||||||||||||
| MR10Q010CMBR | Everspin Technologies Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 活跃 | Non-Volatile | MR10Q010 | 有 | + 85 C | 3.6 V | - 40 C | 1000 | 3 V | SMD/SMT | SPI | Everspin Technologies | Everspin Technologies | Details | LBGA, | GRID ARRAY, LOW PROFILE | 3 | 128000 | PLASTIC/EPOXY | -40 °C | 未说明 | 85 °C | 有 | MR10Q010CMBR | 131072 words | 3.3 V | LBGA | RECTANGULAR | 活跃 | EVERSPIN TECHNOLOGIES INC | 5.6 | MRAM | 表面贴装 | 24-LBGA | YES | 24-BGA (6x8) | 24 | Everspin Technologies Inc. | Tape & Reel (TR) | 0°C ~ 70°C (TA) | Reel | - | EAR99 | 8542.32.00.71 | Memory & Data Storage | 3V ~ 3.6V | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B24 | 3.6 V | INDUSTRIAL | 3 V | 1Mbit | 100 mA | SYNCHRONOUS | 40 MHz | 7 ns | RAM | SPI - Quad I/O, QPI | 8 bit | 128 k x 8 | 1.35 mm | 8 | - | 1048576 bit | 存储器电路 | MRAM | 128K x 8 | 8 mm | 6 mm | |||||||||||||||||||||||||||||||||||||||
| EM016LXQADG13IS1R | Everspin Technologies, Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | SMD/SMT | 1.65 V | - 40 C | + 85 C | 2000 | Tape & Reel (TR) | 活跃 | Non-Volatile | 2 V | 表面贴装 | DFN-8 | 8-DFN (6x8) | Everspin Technologies Inc. | DSPI, QSPI, SPI | -40°C ~ 85°C | Reel | EMxxLX | MRAM (Magnetoresistive RAM) | 1.65V ~ 2V | 16 Mbit | 200 MHz | RAM | SPI - Octal I/O | - | 2M x 8 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EM064LXOAB320IS1T | Everspin Technologies, Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | SMD/SMT | 1.65 V | - 40 C | + 85 C | 有 | 960 | Tray | 活跃 | Non-Volatile | 2 V | 表面贴装 | BGA-24 | 24-TBGA (6x8) | Everspin Technologies Inc. | DSPI, OSPI, QSPI, SPI | -40°C ~ 85°C | Tray | EMxxLX | MRAM (Magnetoresistive RAM) | 1.65V ~ 2V | 64 Mbit | 200 MHz | RAM | SPI - Octal I/O | - | 8M x 8 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EM032LXQADG13CS1R | Everspin Technologies, Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | SMD/SMT | 1.65 V | 0 C | + 70 C | 2000 | Tape & Reel (TR) | 活跃 | Non-Volatile | 2 V | 表面贴装 | DFN-8 | 8-DFN (6x8) | Everspin Technologies Inc. | DSPI, QSPI, SPI | 0°C ~ 70°C | Reel | EMxxLX | MRAM (Magnetoresistive RAM) | 1.65V ~ 2V | 32 Mbit | 200 MHz | RAM | SPI - Octal I/O | - | 4M x 8 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EM008LXQADG13IS1R | Everspin Technologies, Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | SMD/SMT | 1.65 V | - 40 C | + 85 C | 2000 | Tape & Reel (TR) | 活跃 | Non-Volatile | 2 V | 表面贴装 | DFN-8 | 8-DFN (6x8) | Everspin Technologies Inc. | DSPI, QSPI, SPI | -40°C ~ 85°C | Reel | EMxxLX | MRAM (Magnetoresistive RAM) | 1.65V ~ 2V | 8 Mbit | 200 MHz | RAM | SPI - Octal I/O | - | 1M x 8 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EM032LXQADG13IS1T | Everspin Technologies, Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | SMD/SMT | 1.65 V | - 40 C | + 85 C | 580 | Tray | 活跃 | Non-Volatile | 2 V | 表面贴装 | DFN-8 | 8-DFN (6x8) | Everspin Technologies Inc. | DSPI, QSPI, SPI | -40°C ~ 85°C | Tray | EMxxLX | MRAM (Magnetoresistive RAM) | 1.65V ~ 2V | 32 Mbit | 200 MHz | RAM | SPI - Octal I/O | - | 4M x 8 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EM008LXQADG13CS1R | Everspin Technologies, Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | SMD/SMT | 1.65 V | 0 C | + 70 C | 2000 | Tape & Reel (TR) | 活跃 | Non-Volatile | 2 V | 表面贴装 | DFN-8 | 8-DFN (6x8) | Everspin Technologies Inc. | DSPI, QSPI, SPI | 0°C ~ 70°C | Reel | EMxxLX | MRAM (Magnetoresistive RAM) | 1.65V ~ 2V | 8 Mbit | 200 MHz | RAM | SPI - Octal I/O | - | 1M x 8 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EM032LXQAB313IS1R | Everspin Technologies, Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | SMD/SMT | 1.65 V | - 40 C | + 85 C | 4000 | Tape & Reel (TR) | 活跃 | Non-Volatile | 2 V | 表面贴装 | BGA-24 | 24-TBGA (6x8) | Everspin Technologies Inc. | DSPI, OSPI, QSPI, SPI | -40°C ~ 85°C | Reel | EMxxLX | MRAM (Magnetoresistive RAM) | 1.65V ~ 2V | 32 Mbit | 200 MHz | RAM | SPI - Octal I/O | - | 4M x 8 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EM008LXQAB313CS1T | Everspin Technologies, Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | SMD/SMT | 1.65 V | 0 C | + 70 C | 960 | Tray | 活跃 | Non-Volatile | 2 V | 表面贴装 | BGA-24 | 24-TBGA (6x8) | Everspin Technologies Inc. | DSPI, OSPI, QSPI, SPI | 0°C ~ 70°C | Tray | EMxxLX | MRAM (Magnetoresistive RAM) | 1.65V ~ 2V | 8 Mbit | 200 MHz | RAM | SPI - Octal I/O | - | 1M x 8 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EM032LXOAB320CS1T | Everspin Technologies, Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | SMD/SMT | 1.65 V | 0 C | + 70 C | 960 | Tray | 活跃 | Non-Volatile | 2 V | 表面贴装 | BGA-24 | 24-TBGA (6x8) | Everspin Technologies Inc. | DSPI, OSPI, QSPI, SPI | 0°C ~ 70°C | Tray | EMxxLX | MRAM (Magnetoresistive RAM) | 1.65V ~ 2V | 32 Mbit | 200 MHz | RAM | SPI - Octal I/O | - | 4M x 8 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EM032LXQADG13IS1R | Everspin Technologies, Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | SMD/SMT | 1.65 V | - 40 C | + 85 C | 2000 | Tape & Reel (TR) | 活跃 | Non-Volatile | 2 V | 表面贴装 | DFN-8 | 8-DFN (6x8) | Everspin Technologies Inc. | DSPI, QSPI, SPI | -40°C ~ 85°C | Reel | EMxxLX | MRAM (Magnetoresistive RAM) | 1.65V ~ 2V | 32 Mbit | 200 MHz | RAM | SPI - Octal I/O | - | 4M x 8 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EM016LXQAB313CS1T | Everspin Technologies, Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | SMD/SMT | 1.65 V | 0 C | + 70 C | 960 | Tray | 活跃 | Non-Volatile | 2 V | 表面贴装 | BGA-24 | 24-TBGA (6x8) | Everspin Technologies Inc. | DSPI, OSPI, QSPI, SPI | 0°C ~ 70°C | Tray | EMxxLX | MRAM (Magnetoresistive RAM) | 1.65V ~ 2V | 16 Mbit | 200 MHz | RAM | SPI - Octal I/O | - | 2M x 8 |