类别是'接口 - 电信'
接口 - 电信 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 安装类型 | 包装/外壳 | 表面安装 | 材料 | 质量 | 终端数量 | 端子材料 | Application area | Capacitors series | Case | Case - inch | Case - mm | Design Level | Diameter after shrink | Diameter before shrink | Gross Weight | Heatsink shape | Kind of capacitor | Kind of interface | Kind of memory | Material finishing | Maximum Charging Voltage | 厂商 | Operating conditions | Permissible load | Piece Count | Plate thickness | Protection | Purpose | Type of capacitor | Type of heatsink | Type of integrated circuit | Type of transistor | Wall thickness before shrink | Weight gross | 操作温度 | 包装 | 系列 | 尺寸/尺寸 | 容差 | JESD-609代码 | 无铅代码 | 零件状态 | ECCN 代码 | 类型 | 端子表面处理 | 组成 | 颜色 | 应用 | 功率(瓦特) | 附加功能 | HTS代码 | 电容量 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | 深度 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 引脚数量 | JESD-30代码 | 输出的数量 | 资历状况 | 审批机构 | 效率 | 电压-隔离度 | 电压 - 输入(最大值) | 电介质 | 电压 - 输入(最小值) | 电源 | 温度等级 | 最大输出电流 | 操作模式 | 电源电流-最大值 | 电压 - 输出 2 | 数据率 | 座位高度-最大 | 筛选水平 | 通信IC类型 | 收发器数量 | 电源 | 第二个连接器加载的位置数 | 过滤器 | 压缩法 | 饱和电流 | 特征 | 负电源电压 | 电池类型 | 增益公差-最大 | 线性编码 | 模块类型 | 直径 | 高度 | 长度 | 宽度 | |||||||||||||||||||||
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![]() | GS2984-INE3 | Gennum Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Transferred | GENNUM CORP | QCCN, LCC16,.16SQ,25 | 85 °C | -20 °C | PLASTIC/EPOXY | QCCN | LCC16,.16SQ,25 | SQUARE | CHIP CARRIER | 3.3 V | for back plate | YES | aluminium | 16 | grilled | anodized | 15mm | 有 | extruded | 8542.39.00.01 | QUAD | 无铅 | 0.635 mm | unknown | S-PQCC-N16 | 不合格 | OTHER | universal | 84mm | 0.15m | 300mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | UJA1169ATK/3 | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 有 | 活跃 | NXP SEMICONDUCTORS | HVSON-20 | PLASTIC/EPOXY | HVSON | SOLCC20,.14,20 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | 13 V | YES | aluminium | 20 | round | anodized | heat transfer glue, | extruded | DUAL | 无铅 | 1 | 0.5 mm | compliant | R-PDSO-N20 | 67 mA | 15000 Mbps | 1 mm | AEC-Q100 | CAN FD TRANSCEIVER | 1 | LED | 120mm | 5.5 mm | 3.5 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | KSZ8851SNLI | Micrel Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Transferred | MICREL INC | 5 X 5 MM, LEAD FREE, QFN-32 | 85 °C | -40 °C | PLASTIC/EPOXY | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 1.8 V | YES | 32 | 有 | e4 | 镍钯金 | QUAD | 无铅 | 260 | 1 | 0.5 mm | compliant | 40 | S-PQCC-N32 | 不合格 | INDUSTRIAL | 0.9 mm | 以太网收发器 | 2 | 5 mm | 5 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MGA-43003-TR1G | Avago Technologies | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Obsolete | AVAGO TECHNOLOGIES INC | HVQCCN, | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 5 V | Protection board for Li-Ion battery (4S 40A) with balancing and recovery function | YES | 28 | 13.80 | 16.8…18.1 V | from overloading/overcharging 4.095…4.195/4.28 ± 0.05 V; overdischarge 2.55 ± 0.08 V; SC | triggering on current overload - 500; on SC - 100 ms | 8542.39.00.01 | QUAD | 无铅 | 1 | 0.5 mm | unknown | S-XQCC-N28 | 1 mm | 电信电路 | 4 batteries (4S) Unom=3.7 V: 18650; 26650; Li-Po | Protection board for Li-Ion battery (4S 40A) with balancing and recovery function | 5 mm | 5 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TJA1050T | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 不推荐 | NXP SEMICONDUCTORS | SOIC | 3.90 MM, PLASTIC, MS-012, SOT96-1, SOP-8 | 125 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | 小概要 | 5 V | YES | 8 | 有 | IGBT | e4 | 有 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | 8542.39.00.01 | DUAL | 鸥翼 | 260 | 1 | 1.27 mm | compliant | 40 | 8 | R-PDSO-G8 | 不合格 | AUTOMOTIVE | 0.075 mA | 1000 Mbps | 1.75 mm | 电路接口 | 1 | 4.9 mm | 3.9 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GRF4005 | Guerrilla RF | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | GUERRILLA RF INC | HSON, | 105 °C | -40 °C | PLASTIC/EPOXY | HSON | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG | 5 V | YES | fiberglass rod in blue plastic cover | 6 | maximum bending radius - 30mm | static tensile forces - not more than 2 kN; crushing forces - not more than 0.5 kN/cm | for cable pulling in cable channels, boxes, pipes, etc. | 接触制造商 | in coil | Fiberglass rod | blue | 8542.39.00.01 | DUAL | 无铅 | 1 | unknown | S-PDSO-N6 | INDUSTRIAL | 电信电路 | 1 | external on the cover - 4mm | 5m | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | RF6545 | Qorvo | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 通孔 | Obsolete | QORVO INC | 3.50 X 3.50 MM, 0.50 MM HEIGHT, QFN-20 | 85 °C | -40 °C | UNSPECIFIED | HVQCCN | LCC20,.14SQ,20 | SQUARE | CHIP CARRIER | 3.3 V | M4 | 62368-1 | 8-SIP Module, 7 Leads | YES | Brass | 20 | 5V | Traco Power | 有 | -40°C ~ 90°C | Tube | TEC 3UI (3W) | 0.88" L x 0.39" W x 0.44" H (22.3mm x 10.0mm x 11.3mm) | 活跃 | 5A991.G | 隔离模块 | ITE (Commercial) | 3 W | 8542.39.00.01 | QUAD | 无铅 | 未说明 | 1 | 0.5 mm | compliant | 未说明 | S-XQCC-N20 | 2 | 不合格 | CB | 77% | 2 kV | 75V | 9V | INDUSTRIAL | 300mA, 300mA | -5V | 0.5 mm | 电信电路 | Remote On/Off | Dmax = 5.2 mm | L = 6 mm | 3.5 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | RF5722TR7 | RF Micro Devices Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Transferred | RF MICRO DEVICES INC | 2.20 X 2.20 MM, 0.45 MM HEIGHT, GREEN, QFN-8 | 85 °C | -30 °C | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 3.3 V | 12 mm | YES | polyolefin | 8 | 4 mm | 12 mm | 有 | 0.68 mm | 39.25 | supplied in 1.0 m lengths | e3 | 5A991.G | Heat shrink tubing with adhesive layer | 哑光锡 | green | 8517.70.00.00 | QUAD | 无铅 | 260 | 1 | 0.65 mm | unknown | 30 | S-XQCC-N8 | OTHER | 0.5 mm | 电信电路 | 2 | 1000 mm | 2.2 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AWT6621RM45Q7 | Coherent Thermal Solutions | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Obsolete | II-VI INC | 3 X 3 MM, 1 MM HEIGHT, ROHS COMPLIANT, PACKAGE-10 | PLASTIC/EPOXY | HTSON | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE | 3.4 V | YES | 10 | 有 | 8542.39.00.01 | DUAL | 无铅 | 1 | 0.6 mm | unknown | S-PDSO-N10 | 不合格 | 1.13 mm | 射频和基带电路 | 3 | 3 mm | 3 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AWT6621RM45Q7 | ANADIGICS Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Transferred | ANADIGICS INC | SOIC | 3 X 3 MM, 1 MM HEIGHT, ROHS COMPLIANT, PACKAGE-10 | PLASTIC/EPOXY | HTSON | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE | 3.4 V | 32GB FLASH | SMD | YES | 10 | FBGA153 | serial | eMMC | 有 | FLASH memory | 8542.39.00.01 | DUAL | 无铅 | 1 | 0.6 mm | unknown | 10 | S-PDSO-N10 | 不合格 | 1.13 mm | 射频和基带电路 | 3 | 3 mm | 3 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | DP83865BVH | National Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Obsolete | NATIONAL SEMICONDUCTOR CORP | 70 °C | 1.8 V | 有 | 1 | unknown | 不合格 | COMMERCIAL | 1000000 Mbps | 以太网收发器 | 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | LMV225SDX | National Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Transferred | NATIONAL SEMICONDUCTOR CORP | 2.20 X 2.50 MM, 0.80 MM HEIGHT, LLP-6 | 85 °C | -40 °C | UNSPECIFIED | HVSON | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | 2.7 V | YES | 6 | 无 | e0 | 锡铅 | 8542.39.00.01 | DUAL | 无铅 | 260 | 1 | 0.65 mm | not_compliant | 40 | R-XDSO-N6 | 不合格 | INDUSTRIAL | 0.8 mm | 射频和基带电路 | 1 | 2.5 mm | 2.2 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TJA1040T | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 有 | 不推荐 | NXP SEMICONDUCTORS | SOIC | 3.90 MM, PLASTIC, MS-012, SOT96-1, SOP-8 | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | 小概要 | 5 V | YES | 38 g | 8 | 5 (240 VAC; 28 VDC) A | e4 | REK78 series electromagnetic relay | Nickel/Palladium/Gold (Ni/Pd/Au) | 8542.39.00.01 | DUAL | 鸥翼 | 260 | 1 | 1.27 mm | 27.3 mm | compliant | 40 | 8 | R-PDSO-G8 | 不合格 | 0.07 mA | 1000 Mbps | 1.75 mm | 电路接口 | 1 | coil - 1.2 VA | 35.2 mm | 4.9 mm | 3.9 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TP3067WM | National Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Transferred | NATIONAL SEMICONDUCTOR CORP | PLASTIC, SO-16 | 70 °C | PLASTIC/EPOXY | SOP | SOP20,.4 | RECTANGULAR | 小概要 | 5 V | YES | 20 | 无 | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | DUAL | 鸥翼 | 220 | 1 | 1.27 mm | not_compliant | 30 | R-PDSO-G20 | 不合格 | COMMERCIAL | SYNCHRONOUS/ASYNCHRONOUS | 10 mA | 2.65 mm | PCM 编解码器 | YES | A-LAW | 4 | -5 V | 0.15 dB | 不提供 | 12.8 mm | 7.5 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TDA8060TS | Philips Semiconductors | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 有 | Transferred | 飞利浦半导体 | SSOP, SSOP24,.3 | 70 °C | PLASTIC/EPOXY | SSOP | SSOP24,.3 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | 5 V | YES | 24 | for cars | 0402 | 1005 | MLCC | SMD | ceramic | ±20% | Socket for car lighter with flange and cover | black | 8542.39.00.01 | 1µF | DUAL | 鸥翼 | 260 | 0.635 mm | 32 mm | unknown | R-PDSO-G24 | 不合格 | X7T | COMMERCIAL | 60 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS9074ACNE3 | Gennum Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 有 | Transferred | GENNUM CORP | 70 °C | PLASTIC/EPOXY | QCCN | LCC16,.16SQ,25 | SQUARE | CHIP CARRIER | 3.3 V | YES | 16 | KGM | 1206 | 3216 | MLCC | SMD | ceramic | ±5% | 8542.39.00.01 | 1.8nF | QUAD | 无铅 | 0.635 mm | unknown | S-PQCC-N16 | 不合格 | C0G (NP0) | COMMERCIAL | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TCM3105NL | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Obsolete | TEXAS INSTRUMENTS INC | DIP | 0.300 INCH, PLASTIC, DIP-16 | 70 °C | PLASTIC/EPOXY | DIP | DIP16,.3 | RECTANGULAR | IN-LINE | 5 V | NO | 16 | 无 | FULL DUPLEX | 8542.39.00.01 | DUAL | THROUGH-HOLE | 未说明 | 1 | 2.54 mm | not_compliant | 未说明 | 16 | R-PDIP-T16 | 不合格 | COMMERCIAL | 12 mA | 5.08 mm | MODEM | 19.304 mm | 7.62 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | KSZ9031RNXIC | Micrel Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 有 | Transferred | MICREL INC | 7 X 7 MM, LEAD FREE, QFN-48 | 85 °C | -40 °C | UNSPECIFIED | HVQCCN | LCC48,.27SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 1.2 V | YES | 48 | KGM | 1206 | 3216 | MLCC | SMD | ceramic | ±1% | 22pF | QUAD | 无铅 | 1 | 0.5 mm | compliant | S-XQCC-N48 | 不合格 | C0G (NP0) | INDUSTRIAL | 1000000 Mbps | 0.9 mm | 以太网收发器 | 1 | 7 mm | 7 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS1574ACNE3 | Gennum Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Transferred | GENNUM CORP | QCCN, LCC16,.16SQ,25 | 70 °C | PLASTIC/EPOXY | QCCN | LCC16,.16SQ,25 | SQUARE | CHIP CARRIER | 3.3 V | YES | 16 | Beginner Kit | 60 | 有 | 8542.39.00.01 | QUAD | 无铅 | 0.635 mm | unknown | S-PQCC-N16 | 不合格 | COMMERCIAL | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | USB2514B-AEZG-TR | SMSC | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Obsolete | STANDARD MICROSYSTEMS CORP | QCCN, LCC36,.25SQ,20 | 85 °C | PLASTIC/EPOXY | QCCN | LCC36,.25SQ,20 | SQUARE | CHIP CARRIER | 3.3 V | YES | 36 | 有 | QUAD | 无铅 | 0.5 mm | unknown | S-PQCC-N36 | 不合格 | OTHER | 105 mA | 3.3 V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | LMV228TLX | National Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Transferred | NATIONAL SEMICONDUCTOR CORP | 1 X 1 MM, 0.60 MM HEIGHT, LEAD FREE, MO-211BA, MICRO SMD-4 | 85 °C | -40 °C | PLASTIC/EPOXY | VFBGA | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | 2.7 V | YES | 4 | 无 | e0 | Tin/Lead (Sn63Pb37) | 8542.39.00.01 | BOTTOM | BALL | 260 | 1 | 0.5 mm | not_compliant | 40 | S-PBGA-B4 | 不合格 | INDUSTRIAL | 0.675 mm | 射频和基带电路 | 1 | 1.014 mm | 1.014 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | DS80PCI800SQ/NOPB | National Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NATIONAL SEMICONDUCTOR CORP | Transferred | unknown | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TJA1054T | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Obsolete | NXP SEMICONDUCTORS | SOIC | SOP, SOP14,.25 | 125 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP14,.25 | RECTANGULAR | 小概要 | 5 V | YES | 14 | 有 | e4 | 镍钯金 | 8542.39.00.01 | DUAL | 鸥翼 | 1 | 1.27 mm | unknown | 14 | R-PDSO-G14 | 不合格 | AUTOMOTIVE | 0.027 mA | 125 Mbps | 1.75 mm | 电路接口 | 1 | 8.65 mm | 3.9 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | RFSW6042TR7 | RF Micro Devices Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 有 | Transferred | RF MICRO DEVICES INC | QFN | HVQCCN, | 85 °C | -40 °C | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 5 V | YES | 12 | KGM | 0402 | 1005 | MLCC | SMD | ceramic | ±2% | 有 | 5A991.G | 8541.21.00.75 | 10pF | QUAD | 无铅 | 1 | 0.4 mm | unknown | 12 | S-XQCC-N12 | C0G (NP0) | INDUSTRIAL | 0.65 mm | 射频和基带电路 | 2 | 1.8 mm | 1.8 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TJA1054T | Philips Semiconductors | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Transferred | 飞利浦半导体 | SOP, SOP14,.25 | PLASTIC/EPOXY | SOP | SOP14,.25 | RECTANGULAR | 小概要 | 5 V | YES | 14 | 有 | e4 | Nickel/Palladium/Gold (Ni/Pd/Au) | 8542.39.00.01 | DUAL | 鸥翼 | 1.27 mm | unknown | R-PDSO-G14 | 不合格 | 27 mA | 125 Mbps | 可收发器 | 1 |