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我的订单 我的询价 0755-82520436 3307104213

图片

产品型号

品牌

数据表

有效性

单价(CNY)

询价

认证

安装类型

包装/外壳

表面安装

材料

质量

终端数量

端子材料

Application area

Capacitors series

Case

Case - inch

Case - mm

Design Level

Diameter after shrink

Diameter before shrink

Gross Weight

Heatsink shape

Kind of capacitor

Kind of interface

Kind of memory

Material finishing

Maximum Charging Voltage

厂商

Operating conditions

Permissible load

Piece Count

Plate thickness

Protection

Purpose

Type of capacitor

Type of heatsink

Type of integrated circuit

Type of transistor

Wall thickness before shrink

Weight gross

操作温度

包装

系列

尺寸/尺寸

容差

JESD-609代码

无铅代码

零件状态

ECCN 代码

类型

端子表面处理

组成

颜色

应用

功率(瓦特)

附加功能

HTS代码

电容量

端子位置

终端形式

峰值回流焊温度(摄氏度)

功能数量

端子间距

深度

Reach合规守则

时间@峰值回流温度-最大值(s)

引脚数量

JESD-30代码

输出的数量

资历状况

审批机构

效率

电压-隔离度

电压 - 输入(最大值)

电介质

电压 - 输入(最小值)

电源

温度等级

最大输出电流

操作模式

电源电流-最大值

电压 - 输出 2

数据率

座位高度-最大

筛选水平

通信IC类型

收发器数量

电源

第二个连接器加载的位置数

过滤器

压缩法

饱和电流

特征

负电源电压

电池类型

增益公差-最大

线性编码

模块类型

直径

高度

长度

宽度

GS2984-INE3 GS2984-INE3

Gennum Corporation 数据表

N/A

-

最小起订量: 1

倍率: 1

Transferred

GENNUM CORP

QCCN, LCC16,.16SQ,25

85 °C

-20 °C

PLASTIC/EPOXY

QCCN

LCC16,.16SQ,25

SQUARE

CHIP CARRIER

3.3 V

for back plate

YES

aluminium

16

grilled

anodized

15mm

extruded

8542.39.00.01

QUAD

无铅

0.635 mm

unknown

S-PQCC-N16

不合格

OTHER

universal

84mm

0.15m

300mm

UJA1169ATK/3 UJA1169ATK/3

NXP Semiconductors 数据表

N/A

-

最小起订量: 1

倍率: 1

活跃

NXP SEMICONDUCTORS

HVSON-20

PLASTIC/EPOXY

HVSON

SOLCC20,.14,20

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

13 V

YES

aluminium

20

round

anodized

heat transfer glue,

extruded

DUAL

无铅

1

0.5 mm

compliant

R-PDSO-N20

67 mA

15000 Mbps

1 mm

AEC-Q100

CAN FD TRANSCEIVER

1

LED

120mm

5.5 mm

3.5 mm

KSZ8851SNLI KSZ8851SNLI

Micrel Inc 数据表

N/A

-

最小起订量: 1

倍率: 1

Transferred

MICREL INC

5 X 5 MM, LEAD FREE, QFN-32

85 °C

-40 °C

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.8 V

YES

32

e4

镍钯金

QUAD

无铅

260

1

0.5 mm

compliant

40

S-PQCC-N32

不合格

INDUSTRIAL

0.9 mm

以太网收发器

2

5 mm

5 mm

MGA-43003-TR1G MGA-43003-TR1G

Avago Technologies 数据表

N/A

-

最小起订量: 1

倍率: 1

Obsolete

AVAGO TECHNOLOGIES INC

HVQCCN,

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

5 V

Protection board for Li-Ion battery (4S 40A) with balancing and recovery function

YES

28

13.80

16.8…18.1 V

from overloading/overcharging 4.095…4.195/4.28 ± 0.05 V; overdischarge 2.55 ± 0.08 V; SC

triggering on current overload - 500; on SC - 100 ms

8542.39.00.01

QUAD

无铅

1

0.5 mm

unknown

S-XQCC-N28

1 mm

电信电路

4 batteries (4S) Unom=3.7 V: 18650; 26650; Li-Po

Protection board for Li-Ion battery (4S 40A) with balancing and recovery function

5 mm

5 mm

TJA1050T TJA1050T

NXP Semiconductors 数据表

N/A

-

最小起订量: 1

倍率: 1

不推荐

NXP SEMICONDUCTORS

SOIC

3.90 MM, PLASTIC, MS-012, SOT96-1, SOP-8

125 °C

-40 °C

PLASTIC/EPOXY

SOP

SOP8,.25

RECTANGULAR

小概要

5 V

YES

8

IGBT

e4

EAR99

Nickel/Palladium/Gold (Ni/Pd/Au)

8542.39.00.01

DUAL

鸥翼

260

1

1.27 mm

compliant

40

8

R-PDSO-G8

不合格

AUTOMOTIVE

0.075 mA

1000 Mbps

1.75 mm

电路接口

1

4.9 mm

3.9 mm

GRF4005 GRF4005

Guerrilla RF 数据表

N/A

-

最小起订量: 1

倍率: 1

GUERRILLA RF INC

HSON,

105 °C

-40 °C

PLASTIC/EPOXY

HSON

SQUARE

SMALL OUTLINE, HEAT SINK/SLUG

5 V

YES

fiberglass rod in blue plastic cover

6

maximum bending radius - 30mm

static tensile forces - not more than 2 kN; crushing forces - not more than 0.5 kN/cm

for cable pulling in cable channels, boxes, pipes, etc.

接触制造商

in coil

Fiberglass rod

blue

8542.39.00.01

DUAL

无铅

1

unknown

S-PDSO-N6

INDUSTRIAL

电信电路

1

external on the cover - 4mm

5m

RF6545 RF6545

Qorvo 数据表

N/A

-

最小起订量: 1

倍率: 1

通孔

Obsolete

QORVO INC

3.50 X 3.50 MM, 0.50 MM HEIGHT, QFN-20

85 °C

-40 °C

UNSPECIFIED

HVQCCN

LCC20,.14SQ,20

SQUARE

CHIP CARRIER

3.3 V

M4

62368-1

8-SIP Module, 7 Leads

YES

Brass

20

5V

Traco Power

-40°C ~ 90°C

Tube

TEC 3UI (3W)

0.88" L x 0.39" W x 0.44" H (22.3mm x 10.0mm x 11.3mm)

活跃

5A991.G

隔离模块

ITE (Commercial)

3 W

8542.39.00.01

QUAD

无铅

未说明

1

0.5 mm

compliant

未说明

S-XQCC-N20

2

不合格

CB

77%

2 kV

75V

9V

INDUSTRIAL

300mA, 300mA

-5V

0.5 mm

电信电路

Remote On/Off

Dmax = 5.2 mm

L = 6 mm

3.5 mm

RF5722TR7 RF5722TR7

RF Micro Devices Inc 数据表

N/A

-

最小起订量: 1

倍率: 1

Transferred

RF MICRO DEVICES INC

2.20 X 2.20 MM, 0.45 MM HEIGHT, GREEN, QFN-8

85 °C

-30 °C

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3.3 V

12 mm

YES

polyolefin

8

4 mm

12 mm

0.68 mm

39.25

supplied in 1.0 m lengths

e3

5A991.G

Heat shrink tubing with adhesive layer

哑光锡

green

8517.70.00.00

QUAD

无铅

260

1

0.65 mm

unknown

30

S-XQCC-N8

OTHER

0.5 mm

电信电路

2

1000 mm

2.2 mm

AWT6621RM45Q7 AWT6621RM45Q7

Coherent Thermal Solutions 数据表

N/A

-

最小起订量: 1

倍率: 1

Obsolete

II-VI INC

3 X 3 MM, 1 MM HEIGHT, ROHS COMPLIANT, PACKAGE-10

PLASTIC/EPOXY

HTSON

SQUARE

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE

3.4 V

YES

10

8542.39.00.01

DUAL

无铅

1

0.6 mm

unknown

S-PDSO-N10

不合格

1.13 mm

射频和基带电路

3

3 mm

3 mm

AWT6621RM45Q7 AWT6621RM45Q7

ANADIGICS Inc 数据表

N/A

-

最小起订量: 1

倍率: 1

Transferred

ANADIGICS INC

SOIC

3 X 3 MM, 1 MM HEIGHT, ROHS COMPLIANT, PACKAGE-10

PLASTIC/EPOXY

HTSON

SQUARE

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE

3.4 V

32GB FLASH

SMD

YES

10

FBGA153

serial

eMMC

FLASH memory

8542.39.00.01

DUAL

无铅

1

0.6 mm

unknown

10

S-PDSO-N10

不合格

1.13 mm

射频和基带电路

3

3 mm

3 mm

DP83865BVH DP83865BVH

National Semiconductor Corporation 数据表

N/A

-

最小起订量: 1

倍率: 1

Obsolete

NATIONAL SEMICONDUCTOR CORP

70 °C

1.8 V

1

unknown

不合格

COMMERCIAL

1000000 Mbps

以太网收发器

1

LMV225SDX LMV225SDX

National Semiconductor Corporation 数据表

N/A

-

最小起订量: 1

倍率: 1

Transferred

NATIONAL SEMICONDUCTOR CORP

2.20 X 2.50 MM, 0.80 MM HEIGHT, LLP-6

85 °C

-40 °C

UNSPECIFIED

HVSON

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

2.7 V

YES

6

e0

锡铅

8542.39.00.01

DUAL

无铅

260

1

0.65 mm

not_compliant

40

R-XDSO-N6

不合格

INDUSTRIAL

0.8 mm

射频和基带电路

1

2.5 mm

2.2 mm

TJA1040T TJA1040T

NXP Semiconductors 数据表

N/A

-

最小起订量: 1

倍率: 1

不推荐

NXP SEMICONDUCTORS

SOIC

3.90 MM, PLASTIC, MS-012, SOT96-1, SOP-8

PLASTIC/EPOXY

SOP

SOP8,.25

RECTANGULAR

小概要

5 V

YES

38 g

8

5 (240 VAC; 28 VDC) A

e4

REK78 series electromagnetic relay

Nickel/Palladium/Gold (Ni/Pd/Au)

8542.39.00.01

DUAL

鸥翼

260

1

1.27 mm

27.3 mm

compliant

40

8

R-PDSO-G8

不合格

0.07 mA

1000 Mbps

1.75 mm

电路接口

1

coil - 1.2 VA

35.2 mm

4.9 mm

3.9 mm

TP3067WM TP3067WM

National Semiconductor Corporation 数据表

N/A

-

最小起订量: 1

倍率: 1

Transferred

NATIONAL SEMICONDUCTOR CORP

PLASTIC, SO-16

70 °C

PLASTIC/EPOXY

SOP

SOP20,.4

RECTANGULAR

小概要

5 V

YES

20

e0

EAR99

Tin/Lead (Sn/Pb)

8542.39.00.01

DUAL

鸥翼

220

1

1.27 mm

not_compliant

30

R-PDSO-G20

不合格

COMMERCIAL

SYNCHRONOUS/ASYNCHRONOUS

10 mA

2.65 mm

PCM 编解码器

YES

A-LAW

4

-5 V

0.15 dB

不提供

12.8 mm

7.5 mm

TDA8060TS TDA8060TS

Philips Semiconductors 数据表

N/A

-

最小起订量: 1

倍率: 1

Transferred

飞利浦半导体

SSOP, SSOP24,.3

70 °C

PLASTIC/EPOXY

SSOP

SSOP24,.3

RECTANGULAR

SMALL OUTLINE, SHRINK PITCH

5 V

YES

24

for cars

0402

1005

MLCC

SMD

ceramic

±20%

Socket for car lighter with flange and cover

black

8542.39.00.01

1µF

DUAL

鸥翼

260

0.635 mm

32 mm

unknown

R-PDSO-G24

不合格

X7T

COMMERCIAL

60 mm

GS9074ACNE3 GS9074ACNE3

Gennum Corporation 数据表

N/A

-

最小起订量: 1

倍率: 1

Transferred

GENNUM CORP

70 °C

PLASTIC/EPOXY

QCCN

LCC16,.16SQ,25

SQUARE

CHIP CARRIER

3.3 V

YES

16

KGM

1206

3216

MLCC

SMD

ceramic

±5%

8542.39.00.01

1.8nF

QUAD

无铅

0.635 mm

unknown

S-PQCC-N16

不合格

C0G (NP0)

COMMERCIAL

TCM3105NL TCM3105NL

NA 数据表

N/A

-

最小起订量: 1

倍率: 1

Obsolete

TEXAS INSTRUMENTS INC

DIP

0.300 INCH, PLASTIC, DIP-16

70 °C

PLASTIC/EPOXY

DIP

DIP16,.3

RECTANGULAR

IN-LINE

5 V

NO

16

FULL DUPLEX

8542.39.00.01

DUAL

THROUGH-HOLE

未说明

1

2.54 mm

not_compliant

未说明

16

R-PDIP-T16

不合格

COMMERCIAL

12 mA

5.08 mm

MODEM

19.304 mm

7.62 mm

KSZ9031RNXIC KSZ9031RNXIC

Micrel Inc 数据表

N/A

-

最小起订量: 1

倍率: 1

Transferred

MICREL INC

7 X 7 MM, LEAD FREE, QFN-48

85 °C

-40 °C

UNSPECIFIED

HVQCCN

LCC48,.27SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.2 V

YES

48

KGM

1206

3216

MLCC

SMD

ceramic

±1%

22pF

QUAD

无铅

1

0.5 mm

compliant

S-XQCC-N48

不合格

C0G (NP0)

INDUSTRIAL

1000000 Mbps

0.9 mm

以太网收发器

1

7 mm

7 mm

GS1574ACNE3 GS1574ACNE3

Gennum Corporation 数据表

N/A

-

最小起订量: 1

倍率: 1

Transferred

GENNUM CORP

QCCN, LCC16,.16SQ,25

70 °C

PLASTIC/EPOXY

QCCN

LCC16,.16SQ,25

SQUARE

CHIP CARRIER

3.3 V

YES

16

Beginner Kit

60

8542.39.00.01

QUAD

无铅

0.635 mm

unknown

S-PQCC-N16

不合格

COMMERCIAL

USB2514B-AEZG-TR USB2514B-AEZG-TR

SMSC 数据表

N/A

-

最小起订量: 1

倍率: 1

Obsolete

STANDARD MICROSYSTEMS CORP

QCCN, LCC36,.25SQ,20

85 °C

PLASTIC/EPOXY

QCCN

LCC36,.25SQ,20

SQUARE

CHIP CARRIER

3.3 V

YES

36

QUAD

无铅

0.5 mm

unknown

S-PQCC-N36

不合格

OTHER

105 mA

3.3 V

LMV228TLX LMV228TLX

National Semiconductor Corporation 数据表

N/A

-

最小起订量: 1

倍率: 1

Transferred

NATIONAL SEMICONDUCTOR CORP

1 X 1 MM, 0.60 MM HEIGHT, LEAD FREE, MO-211BA, MICRO SMD-4

85 °C

-40 °C

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

2.7 V

YES

4

e0

Tin/Lead (Sn63Pb37)

8542.39.00.01

BOTTOM

BALL

260

1

0.5 mm

not_compliant

40

S-PBGA-B4

不合格

INDUSTRIAL

0.675 mm

射频和基带电路

1

1.014 mm

1.014 mm

DS80PCI800SQ/NOPB DS80PCI800SQ/NOPB

National Semiconductor Corporation 数据表

N/A

-

最小起订量: 1

倍率: 1

NATIONAL SEMICONDUCTOR CORP

Transferred

unknown

TJA1054T TJA1054T

NXP Semiconductors 数据表

N/A

-

最小起订量: 1

倍率: 1

Obsolete

NXP SEMICONDUCTORS

SOIC

SOP, SOP14,.25

125 °C

-40 °C

PLASTIC/EPOXY

SOP

SOP14,.25

RECTANGULAR

小概要

5 V

YES

14

e4

镍钯金

8542.39.00.01

DUAL

鸥翼

1

1.27 mm

unknown

14

R-PDSO-G14

不合格

AUTOMOTIVE

0.027 mA

125 Mbps

1.75 mm

电路接口

1

8.65 mm

3.9 mm

RFSW6042TR7 RFSW6042TR7

RF Micro Devices Inc 数据表

N/A

-

最小起订量: 1

倍率: 1

Transferred

RF MICRO DEVICES INC

QFN

HVQCCN,

85 °C

-40 °C

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

5 V

YES

12

KGM

0402

1005

MLCC

SMD

ceramic

±2%

5A991.G

8541.21.00.75

10pF

QUAD

无铅

1

0.4 mm

unknown

12

S-XQCC-N12

C0G (NP0)

INDUSTRIAL

0.65 mm

射频和基带电路

2

1.8 mm

1.8 mm

TJA1054T TJA1054T

Philips Semiconductors 数据表

N/A

-

最小起订量: 1

倍率: 1

Transferred

飞利浦半导体

SOP, SOP14,.25

PLASTIC/EPOXY

SOP

SOP14,.25

RECTANGULAR

小概要

5 V

YES

14

e4

Nickel/Palladium/Gold (Ni/Pd/Au)

8542.39.00.01

DUAL

鸥翼

1.27 mm

unknown

R-PDSO-G14

不合格

27 mA

125 Mbps

可收发器

1