N/A

-

NO

Obsolete

TEXAS INSTRUMENTS INC

DIP, DIP16,.3

70 °C

PLASTIC/EPOXY

DIP

DIP16,.3

RECTANGULAR

IN-LINE

5.25 V

4.25 V

5 V

16

无

EAR99

8542.39.00.01

DUAL

THROUGH-HOLE

未说明

2.54 mm

not_compliant

未说明

R-PDIP-T16

不合格

COMMERCIAL

CLOCK GENERATOR, PROCESSOR SPECIFIC

115 mA

27 MHz

27 MHz

N/A

-

YES

活跃

ADVANCED MICRO DEVICES INC

BGA-484

4

100 °C

-40 °C

PLASTIC/EPOXY

FBGA

BGA484,22X22,32

SQUARE

GRID ARRAY, FINE PITCH

0.876 V

0.825 V

0.85 V

484

有

e1

锡银铜

BOTTOM

BALL

250

0.8 mm

compliant

30

S-PBGA-B484

INDUSTRIAL

PROGRAMMABLE SoC

2.61 mm

I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)

19 mm

19 mm

N/A

-

NO

Obsolete

MOTOROLA SEMICONDUCTOR PRODUCTS

PGA, PGA132,13X13

70 °C

CERAMIC

PGA

PGA132,13X13

SQUARE

网格排列

5 V

132

无

e0

Tin/Lead (Sn/Pb)

8542.31.00.01

PERPENDICULAR

PIN/PEG

2.54 mm

unknown

S-XPGA-P132

不合格

COMMERCIAL

64 mA

N/A

-

YES

WAFERSCALE INTEGRATION INC

CERAMIC, LDCC-68

20.41 MHz

40

70 °C

CERAMIC, METAL-SEALED COFIRED

QCCJ

SQUARE

CHIP CARRIER, WINDOW

5.5 V

4.5 V

5 V

68

Obsolete

QUAD

J BEND

unknown

S-CQCC-J68

不合格

COMMERCIAL

5

PARALLEL IO PORT, GENERAL PURPOSE

4.57 mm

16

24.13 mm

24.13 mm

N/A

-

YES

Obsolete

INTEGRATED DEVICE TECHNOLOGY INC

BGA

31 X 31 MM, LOW PROFILE, THERMALLY ENHANCED, SBGA-304

70 °C

PLASTIC/EPOXY

LBGA

SQUARE

GRID ARRAY, LOW PROFILE

2.625 V

2.375 V

2.5 V

304

无

e0

锡铅

8542.31.00.01

BOTTOM

BALL

1.27 mm

not_compliant

304

S-PBGA-B304

不合格

COMMERCIAL

微处理器电路

1.7 mm

31 mm

31 mm

N/A

-

NO

活跃

HOLT INTEGRATED CIRCUITS INC

DIP

DIP,

CERAMIC, METAL-SEALED COFIRED

DIP

RECTANGULAR

IN-LINE

5.25 V

4.75 V

5 V

28

无

e0

无

Tin/Lead (Sn/Pb)

DUAL

THROUGH-HOLE

245

2.54 mm

compliant

30

28

R-CDIP-T28

不合格

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

5.08 mm

NO

NO

8

0

1

SYNC, BYTE

NRZ

35.56 mm

15.24 mm

N/A

-

YES

Transferred

XILINX INC

FBGA, BGA484,22X22,32

100 °C

PLASTIC/EPOXY

FBGA

BGA484,22X22,32

SQUARE

GRID ARRAY, FINE PITCH

0.876 V

0.825 V

0.85 V

484

有

8542.31.00.01

BOTTOM

BALL

0.8 mm

unknown

S-PBGA-B484

OTHER

PROGRAMMABLE SoC

2.61 mm

I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)

19 mm

19 mm

N/A

-

N/A

-

N/A

-

N/A

-

NO

PERICOM SEMICONDUCTOR CORP

DIP

DIP,

70 °C

PLASTIC/EPOXY

DIP

RECTANGULAR

IN-LINE

5.5 V

4.5 V

5 V

14

Obsolete

e0

EAR99

锡铅

8542.39.00.01

DUAL

THROUGH-HOLE

2.54 mm

unknown

14

R-PDIP-T14

不合格

COMMERCIAL

CLOCK GENERATOR, PROCESSOR SPECIFIC

20 mA

4.19 mm

14.318 MHz

100.23 MHz

16.83 mm

7.62 mm

N/A

-

YES

Obsolete

STMICROELECTRONICS

QFN

WINDOWED, CERAMIC, LCC-68

20.41 MHz

40

70 °C

CERAMIC, METAL-SEALED COFIRED

WQCCJ

LDCC68,1.0SQ

SQUARE

CHIP CARRIER, WINDOW

5.5 V

4.5 V

5 V

68

无

e0

EAR99

锡铅

8542.39.00.01

QUAD

J BEND

1.27 mm

not_compliant

68

S-CQCC-J68

不合格

COMMERCIAL

5

PARALLEL IO PORT, GENERAL PURPOSE

4.57 mm

16

24.13 mm

24.13 mm

N/A

-

CAVIUM NETWORKS

,

Transferred

8542.31.00.01

unknown

N/A

-

QLOGIC CORP

,

Transferred

8542.31.00.01

unknown

N/A

-

N/A

-

YES

Transferred

MOTOROLA INC

BGA, BGA516,26X26,40

70 °C

PLASTIC/EPOXY

BGA

BGA516,26X26,40

SQUARE

网格排列

516

无

8542.31.00.01

BOTTOM

BALL

1 mm

unknown

S-PBGA-B516

不合格

COMMERCIAL

N/A

-

YES

Obsolete

FREESCALE SEMICONDUCTOR INC

3

70 °C

PLASTIC/EPOXY

BGA

BGA516,26X26,40

SQUARE

网格排列

516

无

e0

锡铅银

8542.31.00.01

BOTTOM

BALL

245

1 mm

not_compliant

30

S-PBGA-B516

不合格

COMMERCIAL

N/A

-

YES

活跃

ADVANCED MICRO DEVICES INC

FCBGA-1924

4

100 °C

-40 °C

PLASTIC/EPOXY

BGA

BGA1924,44X44,40

SQUARE

网格排列

0.85 V

1924

有

e1

锡银铜

BOTTOM

BALL

1 mm

compliant

S-PBGA-B1924

INDUSTRIAL

PROGRAMMABLE SoC

3.71 mm

CAN, I2C, SPI, UART

45 mm

45 mm

N/A

-

YES

活跃

ADVANCED MICRO DEVICES INC

FCBGA-625

4

110 °C

PLASTIC/EPOXY

FBGA

BGA625,25X25,32

SQUARE

GRID ARRAY, FINE PITCH

0.85 V

625

有

e1

锡银铜

BOTTOM

BALL

0.8 mm

compliant

S-PBGA-B625

OTHER

PROGRAMMABLE SoC

3.43 mm

CAN, I2C, SPI, UART

21 mm

21 mm

N/A

-

NO

Obsolete

ZILOG INC

DIP, DIP40,.6

100 °C

-40 °C

PLASTIC/EPOXY

DIP

DIP40,.6

RECTANGULAR

IN-LINE

5 V

40

无

e0

锡铅

8542.31.00.01

DUAL

THROUGH-HOLE

240

2.54 mm

unknown

R-PDIP-T40

不合格

INDUSTRIAL

5 mA

N/A

-

N/A

-

YES

活跃

ADVANCED MICRO DEVICES INC

FCBGA-484

4

100 °C

-40 °C

PLASTIC/EPOXY

FBGA

BGA484,22X22,32

SQUARE

GRID ARRAY, FINE PITCH

0.85 V

484

有

e1

锡银铜

BOTTOM

BALL

0.8 mm

compliant

S-PBGA-B484

INDUSTRIAL

PROGRAMMABLE SoC

2.61 mm

CAN, I2C, SPI, UART

19 mm

19 mm

N/A

-

YES

Transferred

INTEGRATED DEVICE TECHNOLOGY INC

TSSOP

TSSOP-8

1

70 °C

PLASTIC/EPOXY

TSSOP

TSSOP8,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

3.63 V

2.97 V

3.3 V

8

无

e0

无

EAR99

锡铅

8542.39.00.01

DUAL

鸥翼

0.65 mm

not_compliant

8

R-PDSO-G8

不合格

COMMERCIAL

CLOCK GENERATOR, OTHER

85 mA

1.2 mm

40 MHz

140 MHz

4.4 mm

3 mm

N/A

-

N/A

-

YES

活跃

ADVANCED MICRO DEVICES INC

FCBGA-1156

4

100 °C

-40 °C

PLASTIC/EPOXY

BGA

SQUARE

网格排列

0.9 V

1156

有

e1

锡银铜

BOTTOM

BALL

245

1 mm

compliant

30

S-PBGA-B1156

INDUSTRIAL

PROGRAMMABLE SoC

3.51 mm

35 mm

35 mm