表面安装

YES

终端数量

516

No

Transferred

MOTOROLA INC

BGA, BGA516,26X26,40

70 °C

PLASTIC/EPOXY

BGA

BGA516,26X26,40

SQUARE

GRID ARRAY

HTS代码

8542.31.00.01

端子位置

BOTTOM

终端形式

BALL

端子间距

1 mm

Reach合规守则

unknown

JESD-30代码

S-PBGA-B516

资历状况

Not Qualified

温度等级

COMMERCIAL