类别是'嵌入式 - 片上系统（SoC）'
嵌入式 - 片上系统（SoC） (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 包装/外壳 | 表面安装 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | JESD-30代码 | 输出的数量 | 资历状况 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 界面 | 速度 | 内存大小 | uPs/uCs/外围ICs类型 | 核心处理器 | 周边设备 | 时钟频率 | 连接方式 | 建筑学 | 输入数量 | 可编程逻辑类型 | 核心架构 | 边界扫描 | 内存(字) | 主要属性 | 逻辑单元数 | 总线兼容性 | 座位高度(最大) | 长度 | 宽度 | RoHS状态 | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | 10AS057N2F40I1SG | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1517-BBGA, FCBGA | YES | 588 | -40°C~100°C TJ | Tray | Arria 10 SX | Discontinued | 3 (168 Hours) | 8542.39.00.01 | BOTTOM | BALL | 0.9V | 1mm | unknown | S-PBGA-B1517 | 0.93V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 现场可编程门阵列 | FPGA - 570K Logic Elements | 3.5mm | 40mm | 40mm | 符合RoHS标准 | |||||||||||||||||||||||
 | 10AS066H4F34I3SGES | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1152-BBGA, FCBGA | YES | 492 | -40°C~100°C TJ | Tray | Arria 10 SX | Discontinued | 3 (168 Hours) | 8542.39.00.01 | BOTTOM | BALL | 0.9V | 1mm | S-PBGA-B1152 | 0.93V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 现场可编程门阵列 | FPGA - 660K Logic Elements | 3.65mm | 35mm | 35mm | 符合RoHS标准 | ||||||||||||||||||||||||
 | 5CSEBA6U19C8NES | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 484-FBGA | YES | MCU - 151, FPGA - 66 | 0°C~85°C TJ | Tray | Cyclone® V SE | Obsolete | 3 (168 Hours) | 484 | 8542.39.00.01 | BOTTOM | BALL | 1.1V | 0.8mm | compliant | 5CSEBA6 | S-PBGA-B484 | 1.13V | 1.07V | 600MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | 500MHz | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 现场可编程门阵列 | FPGA - 110K Logic Elements | 1.9mm | 19mm | 19mm | |||||||||||||||||||||
.png) | 5ASTFD5K3F40I5N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 1517-BBGA, FCBGA | YES | MCU - 208, FPGA - 540 | -40°C~100°C TJ | Tray | Arria V ST | e1 | 活跃 | 3 (168 Hours) | 锡银铜 | BOTTOM | BALL | 未说明 | 1.1V | 1mm | 未说明 | 5ASTFD5 | S-PBGA-B1517 | 528 | 不合格 | 1.13V | 1.11.2/3.32.5V | 1.07V | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | 622MHz | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 528 | 现场可编程门阵列 | FPGA - 462K Logic Elements | 503500 | 2.7mm | 40mm | 40mm | 符合RoHS标准 | |||||||||||||
 | 10AS016E3F27E1HG | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 672-BBGA, FCBGA | 240 | 0°C~100°C TJ | Tray | Arria 10 SX | 活跃 | 3 (168 Hours) | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 160K Logic Elements | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||
 | 5ASXFB3G4F35C4N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 1152-BBGA, FCBGA | YES | MCU - 208, FPGA - 385 | 0°C~85°C TJ | Tray | Arria V SX | e1 | 活跃 | 3 (168 Hours) | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.1V | 1mm | 未说明 | 5ASXFB3 | S-PBGA-B1152 | 350 | 不合格 | 1.13V | 1.11.2/3.32.5V | 1.07V | 925MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | 670MHz | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 350 | 现场可编程门阵列 | FPGA - 350K Logic Elements | 350000 | 2.7mm | 35mm | 35mm | 符合RoHS标准 | ||||||||||||
| 5ASXFB3G4F35I5N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 1152-BBGA, FCBGA | YES | MCU - 208, FPGA - 385 | -40°C~100°C TJ | Tray | Arria V SX | e1 | 活跃 | 3 (168 Hours) | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.1V | 1mm | 未说明 | 5ASXFB3 | S-PBGA-B1152 | 350 | 不合格 | 1.13V | 1.11.2/3.32.5V | 1.07V | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | 622MHz | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 350 | 现场可编程门阵列 | FPGA - 350K Logic Elements | 350000 | 2.7mm | 35mm | 35mm | 符合RoHS标准 | ||||||||||||
| 5ASXBB3D4F35I5N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 1152-BBGA, FCBGA | YES | MCU - 208, FPGA - 385 | -40°C~100°C TJ | Tray | Arria V SX | e1 | 活跃 | 3 (168 Hours) | 锡银铜 | BOTTOM | BALL | 未说明 | 1.1V | 1mm | 未说明 | 5ASXBB3 | S-PBGA-B1152 | 1.13V | 1.07V | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | 622MHz | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 现场可编程门阵列 | FPGA - 350K Logic Elements | 2.7mm | 35mm | 35mm | 符合RoHS标准 | ||||||||||||||||||
 | XC7Z045-1FBG676CES | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 676-BBGA, FCBGA | YES | 130 | 0°C~85°C TJ | Tray | 2010 | Zynq®-7000 | Obsolete | 4 (72 Hours) | 676 | BOTTOM | BALL | 1V | 1mm | 667MHz | XC7Z045 | S-PBGA-B676 | 1.05V | 0.95V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | ARM | YES | 256000 | Kintex™-7 FPGA, 350K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 2.54mm | 27mm | 27mm | 符合RoHS标准 | ||||||||||||||||||
| 10AS066H2F34I2SGES | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1152-BBGA, FCBGA | YES | 492 | -40°C~100°C TJ | Tray | Arria 10 SX | Discontinued | 3 (168 Hours) | 8542.39.00.01 | BOTTOM | BALL | 0.9V | 1mm | S-PBGA-B1152 | 0.93V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 现场可编程门阵列 | FPGA - 660K Logic Elements | 3.65mm | 35mm | 35mm | 符合RoHS标准 | ||||||||||||||||||||||||
| XC7Z030-1FF676I | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | 676-BBGA, FCBGA | YES | 4 | -40°C~100°C TJ | Tray | Zynq®-7000 | 活跃 | 4 (72 Hours) | 676 | GPIO WITH FOUR 32-BIT BANKS | 8542.39.00.01 | BOTTOM | BALL | S-PBGA-B676 | 667MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | 667MHz | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | YES | 256000 | Kintex™-7 FPGA, 125K Logic Cells | CAN, ETHERNET, I2C, PCI, SPI, UART, USB | Non-RoHS Compliant | |||||||||||||||||||||||||
 | 5CSEBA4U23A7N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 672-FBGA | YES | MCU - 181, FPGA - 145 | -40°C~125°C TJ | Tray | 2017 | Automotive, AEC-Q100, Cyclone® V SE | 活跃 | 3 (168 Hours) | 672 | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.1V | 0.8mm | 未说明 | S-PBGA-B672 | 145 | 不合格 | 1.13V | 1.11.2/3.32.5V | 1.07V | 700MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 145 | 现场可编程门阵列 | FPGA - 40K Logic Elements | 40000 | 1.85mm | 23mm | 23mm | 符合RoHS标准 | ||||||||||||||
 | 10AS022C3U19E2LG | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 484-BFBGA | YES | 192 | 0°C~100°C TJ | Tray | Arria 10 SX | 活跃 | 3 (168 Hours) | 484 | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 0.9V | 0.8mm | 未说明 | S-PBGA-B484 | 192 | 不合格 | 0.93V | 0.9V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 192 | 现场可编程门阵列 | FPGA - 220K Logic Elements | 220000 | 3.25mm | 19mm | 19mm | 符合RoHS标准 | |||||||||||||||
 | XCZU2EG-3SFVC784E | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 25 Weeks | 784-BFBGA, FCBGA | YES | 252 | 0°C~100°C TJ | Tray | 2013 | Zynq® UltraScale+™ MPSoC EG | Obsolete | 4 (72 Hours) | 784 | 8542.31.00.01 | BOTTOM | BALL | 0.9V | compliant | S-PBGA-B784 | 600MHz, 667MHz, 1.5GHz | 256KB | 微处理器电路 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | |||||||||||||||||||||||||||
| 10AS057K2F35E2LG | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1152-BBGA, FCBGA | YES | 396 | 0°C~100°C TJ | Tray | Arria 10 SX | 活跃 | 3 (168 Hours) | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 0.9V | 1mm | 未说明 | S-PBGA-B1152 | 396 | 不合格 | 0.93V | 0.9V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 396 | 现场可编程门阵列 | FPGA - 570K Logic Elements | 570000 | 3.5mm | 35mm | 35mm | 符合RoHS标准 | |||||||||||||||||
| 10AS027E4F27E3LG | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 672-BBGA, FCBGA | YES | 240 | 0°C~100°C TJ | Tray | Arria 10 SX | 活跃 | 3 (168 Hours) | 672 | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 0.9V | 1mm | 未说明 | S-PBGA-B672 | 240 | 不合格 | 0.93V | 0.9V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 240 | 现场可编程门阵列 | FPGA - 270K Logic Elements | 270000 | 3.25mm | 27mm | 27mm | 符合RoHS标准 | |||||||||||||||
| XCZU17EG-3FFVC1760E | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | 1760-BBGA, FCBGA | 512 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | 活跃 | 4 (72 Hours) | 8542.31.00.01 | 未说明 | 未说明 | 600MHz, 667MHz, 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells | ROHS3 Compliant | ||||||||||||||||||||||||||||||||
| 10AS057H1F34E1SG | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1152-BBGA, FCBGA | YES | 492 | 0°C~100°C TJ | Tray | Arria 10 SX | Discontinued | 3 (168 Hours) | 8542.39.00.01 | BOTTOM | BALL | 0.9V | 1mm | unknown | S-PBGA-B1152 | 0.93V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 现场可编程门阵列 | FPGA - 570K Logic Elements | 3.65mm | 35mm | 35mm | 符合RoHS标准 | |||||||||||||||||||||||
| 10AS057H2F34I1SG | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1152-BBGA, FCBGA | YES | 492 | -40°C~100°C TJ | Tray | Arria 10 SX | Discontinued | 3 (168 Hours) | 8542.39.00.01 | BOTTOM | BALL | 0.9V | 1mm | unknown | S-PBGA-B1152 | 0.93V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 现场可编程门阵列 | FPGA - 570K Logic Elements | 3.65mm | 35mm | 35mm | 符合RoHS标准 | |||||||||||||||||||||||
| 10AS057K2F35E1SG | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1152-BBGA, FCBGA | YES | 396 | 0°C~100°C TJ | Tray | Arria 10 SX | Discontinued | 3 (168 Hours) | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 0.9V | 1mm | 未说明 | S-PBGA-B1152 | 396 | 不合格 | 0.93V | 0.9V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 396 | 现场可编程门阵列 | FPGA - 570K Logic Elements | 570000 | 3.5mm | 35mm | 35mm | 符合RoHS标准 | |||||||||||||||||
| 10AS057K1F35E1SG | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1152-BBGA, FCBGA | YES | 396 | 0°C~100°C TJ | Tray | Arria 10 SX | Discontinued | 3 (168 Hours) | 8542.39.00.01 | BOTTOM | BALL | 0.9V | 1mm | S-PBGA-B1152 | 0.93V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 现场可编程门阵列 | FPGA - 570K Logic Elements | 3.5mm | 35mm | 35mm | 符合RoHS标准 | ||||||||||||||||||||||||
 | 5CSXFC6D6F31A7N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 896-BGA | YES | MCU - 181, FPGA - 288 | -40°C~125°C TJ | Tray | 2018 | Automotive, AEC-Q100, Cyclone® V SE | 活跃 | 3 (168 Hours) | 896 | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.1V | 1mm | 未说明 | S-PBGA-B896 | 288 | 不合格 | 1.13V | 1.11.2/3.32.5V | 1.07V | 700MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 288 | 现场可编程门阵列 | FPGA - 110K Logic Elements | 110000 | 2mm | 31mm | 31mm | 符合RoHS标准 | ||||||||||||||
| XC7Z045-3FFV676E | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 676-BBGA, FCBGA | 130 | 0°C~100°C TJ | Bulk | 2009 | Zynq®-7000 | 活跃 | 4 (72 Hours) | 1GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Kintex™-7 FPGA, 350K Logic Cells | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||
| 5ASTFD3K3F40I5N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 1517-BBGA, FCBGA | YES | MCU - 208, FPGA - 540 | -40°C~100°C TJ | Tray | Arria V ST | e1 | 活跃 | 3 (168 Hours) | 锡银铜 | BOTTOM | BALL | 未说明 | 1.1V | 1mm | 未说明 | 5ASTFD3 | S-PBGA-B1517 | 528 | 不合格 | 1.13V | 1.11.2/3.32.5V | 1.07V | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | 622MHz | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 528 | 现场可编程门阵列 | FPGA - 350K Logic Elements | 350000 | 2.7mm | 40mm | 40mm | 符合RoHS标准 | |||||||||||||
 | 5ASXMB3E4F31I3N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 896-BBGA, FCBGA | YES | MCU - 208, FPGA - 250 | -40°C~100°C TJ | Tray | Arria V SX | e1 | 活跃 | 3 (168 Hours) | 896 | 锡银铜 | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.15V | 1mm | 未说明 | 5ASXMB3 | S-PBGA-B896 | 1.18V | 1.12V | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | 670MHz | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 现场可编程门阵列 | FPGA - 350K Logic Elements | 2.7mm | 31mm | 31mm | 符合RoHS标准 |