null 产品销售 - PDF - null - 页 219 - 深圳市佳达源电子有限公司

类别是'嵌入式 - 片上系统（SoC）'

嵌入式 - 片上系统（SoC） (6000)

产品型号	品牌	数据表	有效性	单价(CNY)	询价	安装类型	包装/外壳	表面安装	越来越多的功能	触点形状	外壳材料	供应商器件包装	插入材料	终端数量	后壳材料，电镀																		厂商																														操作温度	包装	系列	尺寸/尺寸	容差	零件状态	终止次数	终端	温度系数	连接器类型	类型	电阻	定位的数量	组成	颜色	应用	功率(瓦特)	HTS代码	电容量	紧固类型	子类别	触点类型	额定电流	技术	端子位置	方向	终端形式	屏蔽/屏蔽	峰值回流焊温度（摄氏度）	入口保护	端子间距	Reach合规守则	频率	频率稳定性	外壳完成	外壳尺寸-插入	JESD-30代码	输出的数量	资历状况	房屋颜色	ESR（等效串联电阻）	失败率	引线间距	电源	温度等级	注意	电感,电感	界面	直流电阻（DCR）	负载电容	速度	内存大小	操作模式	外壳尺寸，MIL	引线样式	输出电流	核心处理器	频率容差	周边设备	电源线保护	程序内存大小	连接方式	电压 - 击穿	谐振@频率	电缆开口	功率 - 脉冲峰值	峰值脉冲电流（10/1000μs）	电压 - 输出	建筑学	电压 - 反向断态（典型值）	频率开关	输入数量	座位高度-最大	使用的 IC/零件	提供的内容	单向通道	可编程逻辑类型	产品类别	包括	电容@频率	显示类型	板型	主要目的	电压 - I/O	主要属性	以太网	核数/总线宽度	输出和类型	图形加速	内存控制器	USB	附加接口	调节器拓扑	逻辑单元数	协处理器/DSP	核数量	视区	显示模式	背光	触摸屏	点像素	背景颜色	屏幕对角线尺寸	图形颜色	点尺寸	显示和界面控制器	点距	闪光大小	萨塔	控制器类型	特征
10AS066H1F34E1SG	ALTERA	数据表	N/A	-	最小起订量: 1 倍率: 1	RJMG1	Obsolete	492	35 X 35 MM, ROHS COMPLIANT, FBGA-1152	网格排列	PLASTIC/EPOXY	0.9 V	0.87 V	100 °C	有	10AS066H1F34E1SG	BGA	SQUARE	Intel Corporation	Obsolete	INTEL CORP	0.93 V	5.66		1152-BBGA, FCBGA	YES				1152-FCBGA (35x35)		1152		Amphenol ICC (Commercial Products)	Tray	0°C ~ 100°C (TJ)	Tray	-			Discontinued at Digi-Key												8542.39.00.01							BOTTOM		BALL				1 mm	compliant					S-PBGA-B1152								OTHER						1.5GHz	256KB					Dual ARM® Cortex®-A9 MPCore™ with CoreSight™		DMA, POR, WDT			EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG								MCU, FPGA				3.65 mm				现场可编程门阵列								FPGA - 660K Logic Elements																							--						35 mm	35 mm
10AS057N3F40E2LG	ALTERA	数据表	N/A	-	最小起订量: 1 倍率: 1	表面贴装	Bulk	588	有	This product may require additional documentation to export from the United States.	2 x 32 kB	1.2 GHz	570000 LE	21	SMD/SMT	71250 LAB	965072	Intel	Intel / Altera	Arria 10 SoC	Details	2 x 32 kB	-	BGA, BGA1517,39X39,40	网格排列	PLASTIC/EPOXY	BGA1517,39X39,40	0.9 V	未说明	0.87 V	100 °C	有	10AS057N3F40E2LG	BGA	SQUARE	活跃	INTEL CORP	0.93 V	5.45	SoC FPGA	783-BBGA, FCBGA	YES				783-FCPBGA (29x29)		1517		飞思卡尔半导体	活跃	0°C ~ 90°C (TA)	Tray	MPC85xx			活跃												8542.39.00.01			SOC - Systems on a Chip			CMOS	BOTTOM		BALL		未说明		1 mm	compliant					S-PBGA-B1517	588	不合格					0.9 V	OTHER						1GHz	256KB					PowerPC e500		DMA, POR, WDT		-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG								MCU, FPGA			588	3.5 mm				现场可编程门阵列					1.8V, 2.5V, 3.3V	FPGA - 570K Logic Elements	10/100/1000Mbps (3)	1 Core, 32-Bit		无	DDR2, DDR3	USB 2.0 (3)	DUART, I²C, MMC/SD, PCI, SPI		570000	Security; SEC	2 Core			Cryptography								-		--	SATA 3Gbps (2)		SoC FPGA		40 mm	40 mm
10AS022E3F27E1SG	ALTERA	数据表	N/A	-	最小起订量: 1 倍率: 1	Surface Mount, MLCC	VJ0402	活跃	50V	240	Non-Compliant	27 X 27 MM, ROHS COMPLIANT, FBGA-672	网格排列	PLASTIC/EPOXY	BGA672,26X26,40	0.9 V	未说明	0.87 V	100 °C	有	10AS022E3F27E1SG	BGA	SQUARE	Intel Corporation	Obsolete	INTEL CORP	0.93 V	5.67	0402 (1005 Metric)	YES				672-FBGA (27x27)		672		Vishay Vitramon	Tape & Reel (TR)	-55°C ~ 125°C	Tray	VJ HIFREQ	0.040 L x 0.020 W (1.02mm x 0.51mm)	±0.5pF	Discontinued at Digi-Key			C0G, NP0							RF, Microwave, High Frequency		8542.39.00.01	3.3 pF		现场可编程门阵列			CMOS	BOTTOM		BALL		未说明		1 mm	compliant					S-PBGA-B672	240	不合格				-	0.9 V	OTHER						1.5GHz	256KB			-		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™		DMA, POR, WDT			EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG								MCU, FPGA			240	3.25 mm				现场可编程门阵列								FPGA - 220K Logic Elements								220000															--			High Q, Low Loss		-	27 mm	27 mm	0.024 (0.61mm)			-
10AS066H2F34E1SG	ALTERA	数据表	N/A	-	最小起订量: 1 倍率: 1	ERC50	活跃	492	35 X 35 MM, ROHS COMPLIANT, FBGA-1152	网格排列	PLASTIC/EPOXY	BGA1152,34X34,40	0.9 V	未说明	0.87 V	100 °C	有	10AS066H2F34E1SG	BGA	SQUARE	Intel Corporation	Obsolete	INTEL CORP	0.93 V	5.15		Axial	YES				Axial		1152		Vishay Dale	Tape & Reel (TR)	-65°C ~ 175°C	Tray	ERC	0.070 Dia x 0.150 L (1.78mm x 3.81mm)	±1%	Discontinued at Digi-Key	2		±50ppm/°C			19.1 Ohms		Metal Film			0.1W, 1/10W	8542.39.00.01			现场可编程门阵列			CMOS	BOTTOM		BALL		未说明		1 mm	compliant					S-PBGA-B1152	492	不合格			-		0.9 V	OTHER						1.5GHz	256KB					Dual ARM® Cortex®-A9 MPCore™ with CoreSight™		DMA, POR, WDT			EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG								MCU, FPGA			492	3.65 mm				现场可编程门阵列								FPGA - 660K Logic Elements								660000															--			Moisture Resistant		-	35 mm	35 mm
10AS066K4F40I3LG	ALTERA	数据表	N/A	-	最小起订量: 1 倍率: 1	Surface Mount, MLCC	0805D	活跃	250V	696	有	This product may require additional documentation to export from the United States.	2 x 32 kB	1.2 GHz	660000 LE	21	SMD/SMT	82500 LAB	978990	Intel	Intel / Altera	Arria 10 SoC	Details	2 x 32 kB	-	BGA,	网格排列	PLASTIC/EPOXY	-40 °C	0.9 V	0.87 V	100 °C	有	10AS066K4F40I3LG	BGA	SQUARE	活跃	INTEL CORP	0.93 V	5.46	SoC FPGA	0805 (2012 Metric)	YES				1517-FBGA (40x40)		1517		诺尔斯诺卡普	Tape & Reel (TR)	-55°C ~ 200°C	Tray	-	0.080 L x 0.050 W (2.03mm x 1.27mm)	±5%	活跃			C0G, NP0							通用型		8542.39.00.01	56 pF		SOC - Systems on a Chip				BOTTOM		BALL				1 mm	compliant					S-PBGA-B1517					-	-		INDUSTRIAL						1.5GHz	256KB			-		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™		DMA, POR, WDT		-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG								MCU, FPGA				3.5 mm				现场可编程门阵列						FPGA - 660K Logic Elements											2 Core													--		高温	SoC FPGA	-	40 mm	40 mm	0.054 (1.37mm)			-
10AS022E3F29E1SG	ALTERA	数据表	N/A	-	最小起订量: 1 倍率: 1	Obsolete	288	Non-Compliant	29 X 29 MM, ROHS COMPLIANT, FBGA-780	网格排列	PLASTIC/EPOXY	BGA780,28X28,40	0.9 V	未说明	0.87 V	100 °C	有	10AS022E3F29E1SG	BGA	SQUARE	Intel Corporation	Obsolete	INTEL CORP	0.93 V	5.67		780-BBGA, FCBGA	YES				780-FBGA (29x29)		780		Vishay Vitramon	Box	0°C ~ 100°C (TJ)	Tray	*			Discontinued at Digi-Key												8542.39.00.01			现场可编程门阵列			CMOS	BOTTOM		BALL		未说明		1 mm	compliant					S-PBGA-B780	288	不合格					0.9 V	OTHER						1.5GHz	256KB					Dual ARM® Cortex®-A9 MPCore™ with CoreSight™		DMA, POR, WDT			EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG								MCU, FPGA			288	3.35 mm				现场可编程门阵列								FPGA - 220K Logic Elements								220000															--						29 mm	29 mm
10AS032H2F35I1SG	ALTERA	数据表	N/A	-	最小起订量: 1 倍率: 1	RNC55	活跃	384	Non-Compliant	35 X 35 MM, ROHS COMPLIANT, FBGA-1152	网格排列	PLASTIC/EPOXY	-40 °C	0.9 V	0.87 V	100 °C	有	10AS032H2F35I1SG	BGA	SQUARE	Intel Corporation	Obsolete	INTEL CORP	0.93 V	5.66		Axial	YES				Axial		1152		Vishay Dale	Tape & Reel (TR)	-65°C ~ 175°C	Tray	Military, MIL-PRF-55182/01, RNC55	0.094 Dia x 0.250 L (2.39mm x 6.35mm)	±1%	Discontinued at Digi-Key	2		±50ppm/°C			10 Ohms		Metal Film			0.125W, 1/8W	8542.39.00.01							BOTTOM		BALL				1 mm	compliant					S-PBGA-B1152					R (0.01%)			INDUSTRIAL						1.5GHz	256KB					Dual ARM® Cortex®-A9 MPCore™ with CoreSight™		DMA, POR, WDT			EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG								MCU, FPGA				3.5 mm				现场可编程门阵列								FPGA - 320K Logic Elements																							--			Military, Moisture Resistant, Weldable		-	35 mm	35 mm
10AS032E4F27E3LG	ALTERA	数据表	N/A	-	最小起订量: 1 倍率: 1	090879	活跃	240	Non-Compliant	BGA, BGA672,26X26,40	网格排列	PLASTIC/EPOXY	BGA672,26X26,40	0.9 V	未说明	0.87 V	100 °C	有	10AS032E4F27E3LG	BGA	SQUARE	Intel Corporation	活跃	INTEL CORP	0.93 V	5.45			YES						672		Molex	Bulk	0°C ~ 100°C (TJ)	Tray	*			活跃												8542.39.00.01			现场可编程门阵列			CMOS	BOTTOM		BALL		未说明		1 mm	compliant					S-PBGA-B672	240	不合格					0.9 V	OTHER						1.5GHz	256KB					Dual ARM® Cortex®-A9 MPCore™ with CoreSight™		DMA, POR, WDT			EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG								MCU, FPGA			240	3.25 mm				现场可编程门阵列								FPGA - 320K Logic Elements								320000															--						27 mm	27 mm
10AS048E3F29I2LG	ALTERA	数据表	N/A	-	最小起订量: 1 倍率: 1	活跃	360	有	This product may require additional documentation to export from the United States.	2 x 32 kB	1.2 GHz	480000 LE	1	SMD/SMT	60000 LAB	965034	Intel	Intel / Altera	Arria 10 SoC	Details	2 x 32 kB	-	BGA, BGA780,28X28,40	网格排列	PLASTIC/EPOXY	BGA780,28X28,40	-40 °C	0.9 V	未说明	0.87 V	100 °C	有	10AS048E3F29I2LG	BGA	SQUARE	活跃	INTEL CORP	0.93 V	5.47	SoC FPGA		0805 (2012 Metric)	YES				0805		780		Stackpole Electronics Inc	Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;	-55°C ~ 155°C	Tray	CSR	0.079 L x 0.049 W (2.00mm x 1.25mm)	±1%	活跃	2		±200ppm/°C			620 mOhms		厚膜			0.25W, 1/4W	8542.39.00.01			SOC - Systems on a Chip			CMOS	BOTTOM		BALL		未说明		1 mm	compliant					S-PBGA-B780	360	不合格			-		0.9 V	INDUSTRIAL						1.5GHz	256KB					Dual ARM® Cortex®-A9 MPCore™ with CoreSight™		DMA, POR, WDT		-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG								MCU, FPGA			360	3.35 mm				现场可编程门阵列						FPGA - 480K Logic Elements									480000		2 Core													--		电流感应	SoC FPGA	0.026 (0.65mm)	29 mm	29 mm
10AS032E2F27E2LG	ALTERA	数据表	N/A	-	最小起订量: 1 倍率: 1	通孔	Bulk	1 kHz	活跃	-	-	240	有	This product may require additional documentation to export from the United States.	2 x 32 kB	1.2 GHz	320000 LE	1	SMD/SMT	40000 LAB	964832	Intel	Intel / Altera	Arria 10 SoC	Details	2 x 32 kB	-	BGA, BGA672,26X26,40	网格排列	PLASTIC/EPOXY	BGA672,26X26,40	0.9 V	未说明	0.87 V	100 °C	有	10AS032E2F27E2LG	BGA	SQUARE	活跃	INTEL CORP	0.93 V	5.45	SoC FPGA	Radial, Vertical Cylinder	YES				Radial		672		中央技术	-	-25°C ~ 85°C	Tray	CTDR2F	0.866 Dia (22.00mm)	±10%	活跃					Drum Core, Wirewound							8542.39.00.01			SOC - Systems on a Chip		4 A	CMOS	BOTTOM		BALL	Unshielded	未说明		1 mm	compliant					S-PBGA-B672	240	不合格					0.9 V	OTHER		150 µH		98mOhm Max		1.5GHz	256KB					Dual ARM® Cortex®-A9 MPCore™ with CoreSight™		DMA, POR, WDT		-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		-						MCU, FPGA			240	3.25 mm			现场可编程门阵列							FPGA - 320K Logic Elements									320000		2 Core												--			-	SoC FPGA	0.866 (22.00mm)	27 mm	27 mm				-
10AS057H3F34I2SG	ALTERA	数据表	N/A	-	最小起订量: 1 倍率: 1	表面贴装	活跃	492	有	This product may require additional documentation to export from the United States.	2 x 32 kB	1.2 GHz	570000 LE	24	SMD/SMT	71250 LAB	965307	Intel	Intel / Altera	Arria 10 SoC	Details	2 x 32 kB	-	BGA, BGA1152,34X34,40	网格排列	PLASTIC/EPOXY	BGA1152,34X34,40	-40 °C	0.9 V	未说明	0.87 V	100 °C	有	10AS057H3F34I2SG	BGA	SQUARE	活跃	INTEL CORP	0.93 V	5.45	SoC FPGA	2-SMD, No Lead	YES				1152-FCBGA (35x35)		1152		微芯片技术	Tape & Reel (TR)	-40°C ~ 85°C	Tray	VXM1	0.197 L x 0.126 W (5.00mm x 3.20mm)		活跃					兆赫晶体							8542.39.00.01			SOC - Systems on a Chip			CMOS	BOTTOM		BALL		未说明		1 mm	compliant	25 MHz	±25ppm			S-PBGA-B1152	492	不合格		50 Ohms			0.9 V	INDUSTRIAL					16pF	1.5GHz	256KB	Fundamental				Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	±10ppm	DMA, POR, WDT		-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG								MCU, FPGA			492	3.65 mm				现场可编程门阵列						FPGA - 570K Logic Elements									570000		2 Core													--			SoC FPGA	0.051 (1.30mm)	35 mm	35 mm				-
10AS057K2F35E2SG	ALTERA	数据表	N/A	-	最小起订量: 1 倍率: 1	活跃	396	有	This product may require additional documentation to export from the United States.	2 x 32 kB	1.2 GHz	570000 LE	24	SMD/SMT	71250 LAB	964919	Intel	Intel / Altera	Arria 10 SoC	Details	2 x 32 kB	-	BGA, BGA1152,34X34,40	网格排列	PLASTIC/EPOXY	BGA1152,34X34,40	0.9 V	未说明	0.87 V	100 °C	有	10AS057K2F35E2SG	BGA	SQUARE	活跃	INTEL CORP	0.93 V	5.45	SoC FPGA		1152-BBGA, FCBGA	YES				1152-FCBGA (35x35)		1152		Vishay Sfernice	Bag	0°C ~ 100°C (TJ)	Tray	*			活跃												8542.39.00.01			SOC - Systems on a Chip			CMOS	BOTTOM		BALL		未说明		1 mm	compliant					S-PBGA-B1152	396	不合格					0.9 V	OTHER						1.5GHz	256KB					Dual ARM® Cortex®-A9 MPCore™ with CoreSight™		DMA, POR, WDT		-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG								MCU, FPGA			396	3.5 mm				现场可编程门阵列						FPGA - 570K Logic Elements									570000		2 Core													--			SoC FPGA		35 mm	35 mm
10AS032E2F29E1SG	ALTERA	数据表	N/A	-	最小起订量: 1 倍率: 1	活跃	360	Non-Compliant	29 X 29 MM, ROHS COMPLIANT, FBGA-780	网格排列	PLASTIC/EPOXY	BGA780,28X28,40	0.9 V	未说明	0.87 V	100 °C	有	10AS032E2F29E1SG	BGA	SQUARE	Intel Corporation	Obsolete	INTEL CORP	0.93 V	5.66		0603 (1608 Metric)	YES				0603		780		Vishay Foil Resistors (Division of Vishay Precision Group)	Tray	-55°C ~ 150°C	Tray	VSMP	0.063 L x 0.032 W (1.60mm x 0.81mm)	±1%	Discontinued at Digi-Key	2		±0.2ppm/°C			4.02 kOhms		金属箔			0.1W, 1/10W	8542.39.00.01			现场可编程门阵列			CMOS	BOTTOM		BALL		未说明		1 mm	compliant					S-PBGA-B780	360	不合格			-		0.9 V	OTHER						1.5GHz	256KB					Dual ARM® Cortex®-A9 MPCore™ with CoreSight™		DMA, POR, WDT			EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG								MCU, FPGA			360	3.35 mm				现场可编程门阵列								FPGA - 320K Logic Elements								320000															--			Non-Inductive		0.025 (0.64mm)	29 mm	29 mm
10AS057K2F35I2LG	ALTERA	数据表	N/A	-	最小起订量: 1 倍率: 1	通孔	最后一次购买	396	BGA, BGA1152,34X34,40	网格排列	PLASTIC/EPOXY	BGA1152,34X34,40	-40 °C	0.9 V	未说明	0.87 V	100 °C	有	10AS057K2F35I2LG	BGA	SQUARE	Intel Corporation	活跃	INTEL CORP	0.93 V	5.45	P600, Axial	YES				P600		1152		Vishay General Semiconductor - Diodes Division	Bulk	-55°C ~ 175°C (TJ)	Tray	Automotive, AEC-Q101, TransZorb®			活跃					Zener					Automotive, Telecom		8542.39.00.01			现场可编程门阵列			CMOS	BOTTOM		BALL		未说明		1 mm	compliant					S-PBGA-B1152	396	不合格					0.9 V	INDUSTRIAL						1.5GHz	256KB					Dual ARM® Cortex®-A9 MPCore™ with CoreSight™		DMA, POR, WDT	无		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	14.4V			5000W (5kW)	233A		21.5V	MCU, FPGA	13V		396	3.5 mm			1	现场可编程门阵列			-					FPGA - 570K Logic Elements								570000															--						35 mm	35 mm
10AS022E4F27E3LG	ALTERA	数据表	N/A	-	最小起订量: 1 倍率: 1	RN731J	Obsolete	240	Non-Compliant	有	This product may require additional documentation to export from the United States.	2 x 32 kB	1.2 GHz	220000 LE	1	SMD/SMT	27500 LAB	964908	Intel	Intel / Altera	Arria 10 SoC	2 x 32 kB	-	BGA, BGA672,26X26,40	网格排列	PLASTIC/EPOXY	BGA672,26X26,40	0.9 V	未说明	0.87 V	100 °C	有	10AS022E4F27E3LG	BGA	SQUARE	活跃	INTEL CORP	0.93 V	1.95	SoC FPGA		0603 (1608 Metric)	YES				0603		672		KOA Speer Electronics, Inc.	Tape & Reel (TR)	-55°C ~ 155°C	Tray	RN73	0.063 L x 0.031 W (1.60mm x 0.80mm)	±0.5%	活跃	2		±10ppm/°C			2.1 kOhms		Thin Film			0.063W, 1/16W	8542.39.00.01			SOC - Systems on a Chip			CMOS	BOTTOM		BALL		未说明		1 mm	compliant					S-PBGA-B672	240	不合格					0.9 V	OTHER						1.5GHz	256KB					Dual ARM® Cortex®-A9 MPCore™ with CoreSight™		DMA, POR, WDT		-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG								MCU, FPGA			240	3.25 mm				现场可编程门阵列						FPGA - 220K Logic Elements									220000		2 Core													--		Moisture Resistant	SoC FPGA	0.022 (0.55mm)	27 mm	27 mm
10AS022C4U19I3LG	ALTERA	数据表	N/A	-	最小起订量: 1 倍率: 1	Obsolete	192	Non-Compliant	FBGA, BGA484,22X22,32	GRID ARRAY, FINE PITCH	PLASTIC/EPOXY	BGA484,22X22,32	-40 °C	0.9 V	未说明	0.87 V	100 °C	有	10AS022C4U19I3LG	FBGA	SQUARE	Intel Corporation	活跃	INTEL CORP	0.93 V	1.95			YES						484		Phoenix Contact	Bulk	-40°C ~ 100°C (TJ)	Tray	-			活跃												8542.39.00.01			现场可编程门阵列			CMOS	BOTTOM		BALL		未说明		0.8 mm	compliant					S-PBGA-B484	192	不合格					0.9 V	INDUSTRIAL			Display Port, RS-232, USB			1.5GHz	256KB					Dual ARM® Cortex®-A9 MPCore™ with CoreSight™		DMA, POR, WDT			EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG								MCU, FPGA			192	3.25 mm				现场可编程门阵列				-				FPGA - 220K Logic Elements								220000			-	-		无背光	Capacitive	800 x 480 (WVGA)	-	7 (177.80mm)	-	-		-	--		-				19 mm	19 mm
10AS048E2F29E2LG	ALTERA	数据表	N/A	-	最小起订量: 1 倍率: 1	面板安装	Bag	Metal	D38999/20KH	活跃	Copper Alloy	Gold	360	有	This product may require additional documentation to export from the United States.	2 x 32 kB	1.2 GHz	480000 LE	1	SMD/SMT	60000 LAB	964901	Intel	Intel / Altera	Arria 10 SoC	Details	2 x 32 kB	-	BGA, BGA780,28X28,40	网格排列	PLASTIC/EPOXY	BGA780,28X28,40	0.9 V	未说明	0.87 V	100 °C	有	10AS048E2F29E2LG	BGA	SQUARE	活跃	INTEL CORP	0.93 V	5.47	SoC FPGA	FBGA-780	YES	Flange		不锈钢		Thermoplastic	780	-	Corsair	-	-65°C ~ 200°C	Tray	Military, MIL-DTL-38999 Series III			活跃		Crimp		Receptacle, Male Pins			21		-	Aviation, Marine, Military		8542.39.00.01		Threaded	SOC - Systems on a Chip		13A	CMOS	BOTTOM	B	BALL	Shielded	未说明	IP67 - Dust Tight, Waterproof	1 mm	compliant			Passivated	23-21	S-PBGA-B780	360	不合格					0.9 V	OTHER						1.5GHz	256KB		H			Dual ARM® Cortex®-A9 MPCore™ with CoreSight™		DMA, POR, WDT		-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG			-					MCU, FPGA			360	3.35 mm			现场可编程门阵列							FPGA - 480K Logic Elements									480000		2 Core												--			-	SoC FPGA		29 mm	29 mm		50.0µin (1.27µm)	-
10AS032E2F29E2LG	ALTERA	数据表	N/A	-	最小起订量: 1 倍率: 1	Obsolete	360	有	This product may require additional documentation to export from the United States.	2 x 32 kB	1.2 GHz	320000 LE	1	SMD/SMT	40000 LAB	964837	Intel	Intel / Altera	Arria 10 SoC	Details	2 x 32 kB	-	BGA, BGA780,28X28,40	网格排列	PLASTIC/EPOXY	BGA780,28X28,40	0.9 V	未说明	0.87 V	100 °C	有	10AS032E2F29E2LG	BGA	SQUARE	活跃	INTEL CORP	0.93 V	5.45	SoC FPGA		FBGA-780	YES						780		Panduit Corp	Bulk	0°C ~ 100°C (TJ)	Tray	-			活跃												8542.39.00.01			SOC - Systems on a Chip			CMOS	BOTTOM		BALL		未说明		1 mm	compliant					S-PBGA-B780	360	不合格					0.9 V	OTHER						1.5GHz	256KB					Dual ARM® Cortex®-A9 MPCore™ with CoreSight™		DMA, POR, WDT		-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG								MCU, FPGA			360	3.35 mm				现场可编程门阵列						FPGA - 320K Logic Elements									320000		2 Core													--			SoC FPGA		29 mm	29 mm
10AS022E3F27I2SG	ALTERA	数据表	N/A	-	最小起订量: 1 倍率: 1	面板安装	D38999/20FJ	20 (2), 10 Power (9)	活跃	240	Non-Compliant	有	This product may require additional documentation to export from the United States.	2 x 32 kB	1.2 GHz	220000 LE	1	SMD/SMT	27500 LAB	964738	Intel	Intel / Altera	Arria 10 SoC	2 x 32 kB	-	BGA, BGA672,26X26,40	网格排列	PLASTIC/EPOXY	BGA672,26X26,40	-40 °C	0.9 V	未说明	0.87 V	100 °C	有	10AS022E3F27I2SG	BGA	SQUARE	活跃	INTEL CORP	0.93 V	5.46	SoC FPGA	FBGA-672	YES	Flange	Circular	铝合金		-	672		Conesys	Box	-65°C ~ 200°C	Tray	Military, MIL-DTL-38999 Series III, Tri-Start™ TV			活跃				插座外壳	用于内螺纹插座		11 (2 + 9 Power)					8542.39.00.01		Threaded	SOC - Systems on a Chip	Crimp		CMOS	BOTTOM	E	BALL	Shielded	未说明	抗环境干扰	1 mm	compliant			化学镍	25-11	S-PBGA-B672	240	不合格	Silver				0.9 V	INDUSTRIAL	不包括触点					1.5GHz	256KB		J			Dual ARM® Cortex®-A9 MPCore™ with CoreSight™		DMA, POR, WDT		-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG								MCU, FPGA			240	3.25 mm			现场可编程门阵列	-						FPGA - 220K Logic Elements									220000		2 Core												--			-	SoC FPGA		27 mm	27 mm			-
10AS032E2F27I2SG	ALTERA	数据表	N/A	-	最小起订量: 1 倍率: 1	最后一次购买	240	有	This product may require additional documentation to export from the United States.	2 x 32 kB	1.2 GHz	320000 LE	1	SMD/SMT	40000 LAB	964963	Intel	Intel / Altera	Arria 10 SoC	Details	2 x 32 kB	-	BGA, BGA672,26X26,40	网格排列	PLASTIC/EPOXY	BGA672,26X26,40	-40 °C	0.9 V	未说明	0.87 V	100 °C	有	10AS032E2F27I2SG	BGA	SQUARE	活跃	INTEL CORP	0.93 V	5.45	SoC FPGA		FBGA-672	YES						672		Vishay Sfernice	Tape & Reel (TR)	-40°C ~ 100°C (TJ)	Tray	*			活跃												8542.39.00.01			SOC - Systems on a Chip			CMOS	BOTTOM		BALL		未说明		1 mm	compliant					S-PBGA-B672	240	不合格					0.9 V	INDUSTRIAL						1.5GHz	256KB					Dual ARM® Cortex®-A9 MPCore™ with CoreSight™		DMA, POR, WDT		-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG								MCU, FPGA			240	3.25 mm				现场可编程门阵列						FPGA - 320K Logic Elements									320000		2 Core													--			SoC FPGA		27 mm	27 mm
10AS022E3F29E2LG	ALTERA	数据表	N/A	-	最小起订量: 1 倍率: 1	RN731J	Obsolete	288	Non-Compliant	有	This product may require additional documentation to export from the United States.	2 x 32 kB	1.2 GHz	220000 LE	1	SMD/SMT	27500 LAB	964739	Intel	Intel / Altera	Arria 10 SoC	2 x 32 kB	-	BGA, BGA780,28X28,40	网格排列	PLASTIC/EPOXY	BGA780,28X28,40	0.9 V	未说明	0.87 V	100 °C	有	10AS022E3F29E2LG	BGA	SQUARE	活跃	INTEL CORP	0.93 V	5.46	SoC FPGA		0603 (1608 Metric)	YES				0603		780		KOA Speer Electronics, Inc.	Tape & Reel (TR)	-55°C ~ 155°C	Tray	RN73	0.063 L x 0.031 W (1.60mm x 0.80mm)	±0.5%	活跃	2		±10ppm/°C			517 Ohms		Thin Film			0.063W, 1/16W	8542.39.00.01			SOC - Systems on a Chip			CMOS	BOTTOM		BALL		未说明		1 mm	compliant					S-PBGA-B780	288	不合格					0.9 V	OTHER						1.5GHz	256KB					Dual ARM® Cortex®-A9 MPCore™ with CoreSight™		DMA, POR, WDT		-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG								MCU, FPGA			288	3.35 mm				现场可编程门阵列						FPGA - 220K Logic Elements									220000		2 Core													--		Moisture Resistant	SoC FPGA	0.022 (0.55mm)	29 mm	29 mm
10AS057K3F35E2SG	ALTERA	数据表	N/A	-	最小起订量: 1 倍率: 1	面板安装	Bulk	Composite	ACT94	Discontinued at Digi-Key	Copper Alloy	Gold	396	BGA, BGA1152,34X34,40	网格排列	PLASTIC/EPOXY	BGA1152,34X34,40	0.9 V	未说明	0.87 V	100 °C	有	10AS057K3F35E2SG	BGA	SQUARE	Intel Corporation	活跃	INTEL CORP	0.93 V	5.45	1152-BBGA, FCBGA	YES	Bulkhead - Front Side Nut		Composite	1152-FCBGA (35x35)	Thermoplastic	1152	-	TE Connectivity Deutsch 连接器	-	-65°C ~ 175°C	Tray	MIL-DTL-38999 Series III, ACT			活跃		Crimp		Receptacle, Female Sockets			32		橄榄色	Aerospace, Military		8542.39.00.01		Threaded	现场可编程门阵列		7.5A	CMOS	BOTTOM	A	BALL	Shielded	未说明	抗环境干扰	1 mm	compliant			橄榄色镉	19-32	S-PBGA-B1152	396	不合格					0.9 V	OTHER						1.5GHz	256KB		F			Dual ARM® Cortex®-A9 MPCore™ with CoreSight™		DMA, POR, WDT			EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG			-					MCU, FPGA			396	3.5 mm				现场可编程门阵列								FPGA - 570K Logic Elements								570000															--			-			35 mm	35 mm		-	-
10AS066K4F40E3LG	ALTERA	数据表	N/A	-	最小起订量: 1 倍率: 1	MAX150	Obsolete	696	有	This product may require additional documentation to export from the United States.	2 x 32 kB	1.2 GHz	660000 LE	21	SMD/SMT	82500 LAB	978967	Intel	Intel / Altera	Arria 10 SoC	Details	2 x 32 kB	-	BGA,	网格排列	PLASTIC/EPOXY	0.9 V	0.87 V	100 °C	有	10AS066K4F40E3LG	BGA	SQUARE	活跃	INTEL CORP	0.93 V	5.46	SoC FPGA		1517-BBGA, FCBGA	YES				1517-FBGA (40x40)		1517		Analog Devices Inc./Maxim Integrated	Bulk	0°C ~ 100°C (TJ)	Tray	-			活跃												8542.39.00.01			SOC - Systems on a Chip				BOTTOM		BALL				1 mm	compliant					S-PBGA-B1517								OTHER						1.5GHz	256KB				1A, 50mA	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™		DMA, POR, WDT		-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG						3.3V, 5V		MCU, FPGA		500kHz		3.5 mm	MAX15015A	Board(s)		现场可编程门阵列			Fully Populated	DC/DC, Step Down with LDO		FPGA - 660K Logic Elements			2, Non-Isolated					巴克			2 Core													--			SoC FPGA		40 mm	40 mm
10AS048K3F35E2LG	ALTERA	数据表	N/A	-	最小起订量: 1 倍率: 1	面板安装	Bag	Metal	D38999/24ZD	活跃	Copper Alloy	Gold	396	有	This product may require additional documentation to export from the United States.	2 x 32 kB	1.2 GHz	480000 LE	1	SMD/SMT	60000 LAB	965009	Intel	Intel / Altera	Arria 10 SoC	Details	2 x 32 kB	-	BGA, BGA1152,34X34,40	网格排列	PLASTIC/EPOXY	BGA1152,34X34,40	0.9 V	未说明	0.87 V	100 °C	有	10AS048K3F35E2LG	BGA	SQUARE	活跃	INTEL CORP	0.93 V	5.47	SoC FPGA	FBGA-1152	YES	Bulkhead - Front Side Nut		Aluminum		Thermoplastic	1152	-	Corsair	-	-65°C ~ 200°C	Tray	Military, MIL-DTL-38999 Series III			活跃		Crimp		Receptacle, Female Sockets			19		Black	Aviation, Marine, Military		8542.39.00.01		Threaded	SOC - Systems on a Chip		7.5A	CMOS	BOTTOM	C	BALL	Shielded	未说明	IP67 - Dust Tight, Waterproof	1 mm	compliant			黑锌镍	15-19	S-PBGA-B1152	396	不合格					0.9 V	OTHER						1.5GHz	256KB		D			Dual ARM® Cortex®-A9 MPCore™ with CoreSight™		DMA, POR, WDT		-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG			-					MCU, FPGA			396	3.5 mm			现场可编程门阵列							FPGA - 480K Logic Elements									480000		2 Core												--			-	SoC FPGA		35 mm	35 mm		50.0µin (1.27µm)	-
10AS066K2F35I2LG	ALTERA	数据表	N/A	-	最小起订量: 1 倍率: 1	Obsolete	396	BGA, BGA1152,34X34,40	网格排列	PLASTIC/EPOXY	BGA1152,34X34,40	-40 °C	0.9 V	未说明	0.87 V	100 °C	有	10AS066K2F35I2LG	BGA	SQUARE	Intel Corporation	活跃	INTEL CORP	0.93 V	5.46		1152-BBGA, FCBGA	YES				1152-FBGA (35x35)		1152		Diodes Incorporated	Tape & Reel (TR)	-40°C ~ 100°C (TJ)	Tray	-			活跃												8542.39.00.01			现场可编程门阵列			CMOS	BOTTOM		BALL		未说明		1 mm	compliant					S-PBGA-B1152	396	不合格					0.9 V	INDUSTRIAL						1.5GHz	256KB					Dual ARM® Cortex®-A9 MPCore™ with CoreSight™		DMA, POR, WDT			EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG								MCU, FPGA			396	3.5 mm				现场可编程门阵列								FPGA - 660K Logic Elements								660000															--						35 mm	35 mm

嵌入式 - 片上系统（SoC） (6000)