N/A

-

QL3P41

Obsolete

396

35 X 35 MM, ROHS COMPLIANT, FBGA-1152

网格排列

PLASTIC/EPOXY

0.9 V

0.87 V

100 °C

有

10AS066K1F35E1SG

BGA

SQUARE

Intel Corporation

Obsolete

INTEL CORP

0.93 V

5.66

1152-BBGA, FCBGA

YES

1152-FBGA (35x35)

1152

Broadcom Limited

Bulk

0°C ~ 100°C (TJ)

Tray

-

Discontinued at Digi-Key

8542.39.00.01

BOTTOM

BALL

1 mm

compliant

S-PBGA-B1152

OTHER

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

3.5 mm

现场可编程门阵列

FPGA - 660K Logic Elements

--

35 mm

35 mm

N/A

-

表面贴装

Bulk

ML620Q156

A/D 12x10b SAR

最后一次购买

52-TQFP

52-TQFP (10x10)

Rohm Semiconductor

34

-40°C ~ 105°C (TA)

Tray

-

活跃

External, Internal

8.4MHz

2K x 8

1.8V ~ 5.5V

nX-U16/100

POR, PWM, WDT

FLASH

16-Bit

64KB (32K x 16)

I²C, SSP, UART/USART

MCU, FPGA

2K x 8

FPGA - 2500K Logic Elements

--

N/A

-

SG731J

活跃

492

有

This product may require additional documentation to export from the United States.

2 x 32 kB

1.2 GHz

480000 LE

1

SMD/SMT

60000 LAB

965303

Intel

Intel / Altera

Arria 10 SoC

Details

2 x 32 kB

-

BGA, BGA1152,34X34,40

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

-40 °C

0.9 V

未说明

0.87 V

100 °C

有

10AS048H3F34I2LG

BGA

SQUARE

活跃

INTEL CORP

0.93 V

5.47

SoC FPGA

0603 (1608 Metric)

YES

0603

1152

KOA Speer Electronics, Inc.

Tape & Reel (TR)

-55°C ~ 155°C

Tray

SG73

0.063 L x 0.031 W (1.60mm x 0.80mm)

±20%

活跃

2

±200ppm/°C

18 Ohms

厚膜

0.1W, 1/10W

8542.39.00.01

SOC - Systems on a Chip

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B1152

492

不合格

-

0.9 V

INDUSTRIAL

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

492

3.65 mm

现场可编程门阵列

FPGA - 480K Logic Elements

480000

2 Core

--

Automotive AEC-Q200, Moisture Resistant, Pulse Withstanding

SoC FPGA

0.022 (0.55mm)

35 mm

35 mm

AEC-Q200

N/A

-

Obsolete

204

XCZU7

900-BBGA, FCBGA

900-FCBGA (31x31)

KEMET

Bulk

-40°C ~ 100°C (TJ)

-

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 504K+ Logic Cells

-

N/A

-

DIV40E15

活跃

130

900-BBGA, FCBGA

900-FCBGA (31x31)

TE Connectivity Deutsch 连接器

Bag

0°C ~ 85°C (TJ)

*

667MHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Kintex™-7 FPGA, 350K Logic Cells

-

N/A

-

通孔

Obsolete

25 V

5000 Hrs @ 105°C

130

XC7Z015

Radial, Can

485-CSPBGA (19x19)

-

EPCOS - TDK Electronics

Bulk

-55°C ~ 105°C

B41858

0.492 Dia (12.50mm)

±20%

汽车

2200 µF

30mOhm @ 10kHz

0.197 (5.00mm)

Polar

25 mOhms

667MHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

2.858 A @ 100 kHz

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Artix™-7 FPGA, 74K Logic Cells

-

1.654 (42.00mm)

-

N/A

-

093338

活跃

130

484-LFBGA, CSPBGA

484-CSPBGA (19x19)

Molex

Bulk

-40°C ~ 100°C (TJ)

*

766MHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Artix™-7 FPGA, 85K Logic Cells

-

N/A

-

120122

活跃

480

-

-

Molex

Bulk

-40°C ~ 100°C (TJ)

*

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.3M Logic Elements

-

N/A

-

通孔

活跃

440VAC

480

Radial, Disc

-

Vishay Beyschlag/Draloric/BC Components

Bulk

-40°C ~ 125°C

WYO

0.256 Dia (6.50mm)

±20%

Y5U (E)

Safety

1000 pF

-

0.197 (5.00mm)

1.4GHz

256KB

Straight

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.9M Logic Elements

-

-

0.374 (9.50mm)

-

X1, Y2

N/A

-

RN732B

Obsolete

720

1206 (3216 Metric)

1206

KOA Speer Electronics, Inc.

Tape & Reel (TR)

-55°C ~ 155°C

RN73

0.126 L x 0.063 W (3.20mm x 1.60mm)

±1%

2

±50ppm/°C

111 Ohms

Thin Film

0.125W, 1/8W

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.7M Logic Elements

-

Moisture Resistant

0.028 (0.70mm)

N/A

-

DL66G12

活跃

720

-

-

TE Connectivity Deutsch 连接器

Bag

0°C ~ 100°C (TJ)

*

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.7M Logic Elements

-

N/A

-

173114

活跃

384

-

-

Molex

Bulk

-40°C ~ 100°C (TJ)

*

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 764K Logic Elements

-

N/A

-

121064

活跃

MCU - 181, FPGA - 145

Compliant

FBGA, BGA672,28X28,32

GRID ARRAY, FINE PITCH

PLASTIC/EPOXY

BGA672,28X28,32

1.1 V

未说明

1.07 V

85 °C

有

5CSEBA6U23C7N

FBGA

SQUARE

Intel Corporation

活跃

FPGA - Field Programmable Gate Array Cyclone V SE dual -core ARM Cortex-A9

INTEL CORP

1.13 V

2.01

64KB

672-FBGA

YES

672

672-UBGA (23x23)

672

Molex

Bulk

0°C ~ 85°C (TJ)

Tray

*

活跃

85 °C

0 °C

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

未说明

0.8 mm

compliant

5CSEBA6

S-PBGA-B672

145

不合格

1.13 V

1.1,1.2/3.3,2.5 V

OTHER

800MHz

773.9 kB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

145

1.85 mm

现场可编程门阵列

110000

800 MHz

41509

7

FPGA - 110K Logic Elements

110000

--

23 mm

23 mm

无铅

N/A

-

表面贴装

500SAB

Obsolete

492

BGA,

网格排列

PLASTIC/EPOXY

-40 °C

0.9 V

0.87 V

100 °C

10AS066H2F34I2SGES

BGA

SQUARE

Intel Corporation

Obsolete

INTEL CORP

0.93 V

5.66

4-SMD, No Lead

YES

1152-FCBGA (35x35)

1152

Skyworks Solutions Inc.

Tape & Reel (TR)

0°C ~ 85°C

Tray

Si500S

0.157 L x 0.126 W (4.00mm x 3.20mm)

Discontinued at Digi-Key

XO (Standard)

8542.39.00.01

3.3V

BOTTOM

BALL

1 mm

compliant

70.3125 MHz

±20ppm

CMOS

S-PBGA-B1152

Enable/Disable

Crystal

24mA

INDUSTRIAL

10.7mA

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

3.65 mm

现场可编程门阵列

-

FPGA - 660K Logic Elements

--

0.035 (0.90mm)

35 mm

35 mm

-

N/A

-

Obsolete

396

BGA, BGA1152,34X34,40

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

-40 °C

0.9 V

未说明

0.87 V

100 °C

有

10AS048K4F35I3SG

BGA

SQUARE

Intel Corporation

活跃

INTEL CORP

0.93 V

5.47

YES

1152

Panduit Corp

Bulk

-40°C ~ 100°C (TJ)

Tray

*

活跃

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B1152

396

不合格

0.9 V

INDUSTRIAL

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

396

3.5 mm

现场可编程门阵列

FPGA - 480K Logic Elements

480000

--

35 mm

35 mm

N/A

-

Surface Mount, MLCC

活跃

100V

384

有

This product may require additional documentation to export from the United States.

2 x 32 kB

1.2 GHz

320000 LE

1

SMD/SMT

40000 LAB

965298

Intel

Intel / Altera

Arria 10 SoC

Details

2 x 32 kB

-

BGA, BGA1152,34X34,40

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

0.9 V

未说明

0.87 V

100 °C

有

10AS032H4F35E3SG

BGA

SQUARE

活跃

INTEL CORP

0.93 V

5.45

SoC FPGA

1812 (4532 Metric)

YES

1152

Vishay Vitramon

Tape & Reel (TR)

-55°C ~ 150°C

Tray

GA

0.177 L x 0.126 W (4.50mm x 3.20mm)

±5%

活跃

C0G, NP0

汽车

8542.39.00.01

150 pF

SOC - Systems on a Chip

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B1152

384

不合格

-

-

0.9 V

OTHER

1.5GHz

256KB

-

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

384

3.5 mm

现场可编程门阵列

FPGA - 320K Logic Elements

320000

2 Core

--

-

SoC FPGA

-

35 mm

35 mm

0.086 (2.18mm)

AEC-Q200

N/A

-

MS27497T14F

活跃

492

BGA, BGA1152,34X34,40

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

0.9 V

未说明

0.87 V

100 °C

有

10AS048H2F34E2LG

BGA

SQUARE

Intel Corporation

活跃

INTEL CORP

0.93 V

5.47

YES

1152

Corsair

Bag

0°C ~ 100°C (TJ)

Tray

*

活跃

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B1152

492

不合格

0.9 V

OTHER

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

492

3.65 mm

现场可编程门阵列

FPGA - 480K Logic Elements

480000

--

35 mm

35 mm

N/A

-

Surface Mount, MLCC

活跃

50V

384

Non-Compliant

35 X 35 MM, ROHS COMPLIANT, FBGA-1152

网格排列

PLASTIC/EPOXY

-40 °C

0.9 V

0.87 V

100 °C

有

10AS032H1F34I1SG

BGA

SQUARE

Intel Corporation

Obsolete

INTEL CORP

0.93 V

5.66

1206 (3216 Metric)

YES

1152-FBGA (35x35)

1152

Vishay Vitramon

Tape & Reel (TR)

-55°C ~ 150°C

Tray

GA

0.126 L x 0.063 W (3.20mm x 1.60mm)

±20%

Discontinued at Digi-Key

X8R

汽车

8542.39.00.01

1200 pF

BOTTOM

BALL

1 mm

compliant

S-PBGA-B1152

-

-

INDUSTRIAL

1.5GHz

256KB

-

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

3.65 mm

现场可编程门阵列

FPGA - 320K Logic Elements

--

-

-

35 mm

35 mm

0.067 (1.70mm)

AEC-Q200

N/A

-

Free Hanging (In-Line)

Bulk

Composite

D38999/26JH

Discontinued at Digi-Key

Copper Alloy

Gold

288

Non-Compliant

有

This product may require additional documentation to export from the United States.

2 x 32 kB

1.2 GHz

220000 LE

1

SMD/SMT

27500 LAB

973473

Intel

Intel / Altera

Arria 10 SoC

2 x 32 kB

-

BGA, BGA780,28X28,40

网格排列

PLASTIC/EPOXY

BGA780,28X28,40

0.9 V

未说明

0.87 V

100 °C

有

10AS022E3F29E2SG

BGA

SQUARE

活跃

INTEL CORP

0.93 V

5.46

SoC FPGA

FBGA-780

YES

-

Composite

Thermoplastic

780

-

TE Connectivity Deutsch 连接器

-

-65°C ~ 175°C

Tray

Military, MIL-DTL-38999 Series III, ACT

活跃

Crimp

Plug, Female Sockets

55

橄榄色

Aerospace, Military

8542.39.00.01

Threaded

SOC - Systems on a Chip

7.5A

CMOS

BOTTOM

B

BALL

Shielded

未说明

抗环境干扰

1 mm

compliant

橄榄色镉

23-55

S-PBGA-B780

288

不合格

0.9 V

OTHER

1.5GHz

256KB

H

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

-

MCU, FPGA

288

3.35 mm

现场可编程门阵列

FPGA - 220K Logic Elements

220000

2 Core

--

-

SoC FPGA

29 mm

29 mm

50.0µin (1.27µm)

-

N/A

-

DL66R

活跃

396

有

This product may require additional documentation to export from the United States.

2 x 32 kB

1.2 GHz

480000 LE

1

SMD/SMT

60000 LAB

964910

Intel

Intel / Altera

Arria 10 SoC

Details

2 x 32 kB

-

BGA, BGA1152,34X34,40

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

0.9 V

未说明

0.87 V

100 °C

有

10AS048K3F35E2SG

BGA

SQUARE

活跃

INTEL CORP

0.93 V

5.47

SoC FPGA

FBGA-1152

YES

1152

TE Connectivity Deutsch 连接器

Bag

0°C ~ 100°C (TJ)

Tray

*

活跃

8542.39.00.01

SOC - Systems on a Chip

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B1152

396

不合格

0.9 V

OTHER

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

396

3.5 mm

现场可编程门阵列

FPGA - 480K Logic Elements

480000

2 Core

--

SoC FPGA

35 mm

35 mm

N/A

-

RLR05

活跃

492

有

This product may require additional documentation to export from the United States.

2 x 32 kB

1.2 GHz

660000 LE

1

SMD/SMT

82500 LAB

965379

Intel

Intel / Altera

Arria 10 SoC

Details

2 x 32 kB

-

BGA, BGA1152,34X34,40

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

-40 °C

0.9 V

未说明

0.87 V

100 °C

有

10AS066H3F34I2SG

BGA

SQUARE

活跃

INTEL CORP

0.93 V

5.45

SoC FPGA

Axial

YES

Axial

1152

Vishay Dale

Tape & Reel (TR)

-65°C ~ 150°C

Tray

Military, MIL-PRF-39017/05, RLR05

0.066 Dia x 0.150 L (1.68mm x 3.81mm)

±2%

活跃

2

±100ppm/°C

30 Ohms

Metal Film

0.125W, 1/8W

8542.39.00.01

SOC - Systems on a Chip

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B1152

492

不合格

M (1%)

0.9 V

INDUSTRIAL

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

492

3.65 mm

现场可编程门阵列

FPGA - 660K Logic Elements

660000

2 Core

--

Military, Moisture Resistant, Weldable

SoC FPGA

-

35 mm

35 mm

N/A

-

YAFD54

活跃

384

35 X 35 MM, ROHS COMPLIANT, FBGA-1152

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

0.9 V

未说明

0.87 V

100 °C

有

10AS032H2F34E1SG

BGA

SQUARE

Intel Corporation

Obsolete

INTEL CORP

0.93 V

5.66

1152-BBGA, FCBGA

YES

1152-FBGA (35x35)

1152

TE Connectivity Deutsch 连接器

Bulk

0°C ~ 100°C (TJ)

Tray

*

Discontinued at Digi-Key

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B1152

384

不合格

0.9 V

OTHER

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

384

3.65 mm

现场可编程门阵列

FPGA - 320K Logic Elements

320000

--

35 mm

35 mm

N/A

-

RNCF0603B

活跃

360

BGA, BGA780,28X28,40

网格排列

PLASTIC/EPOXY

BGA780,28X28,40

-40 °C

0.9 V

未说明

0.87 V

100 °C

有

10AS048E4F29I3SG

BGA

SQUARE

Intel Corporation

活跃

INTEL CORP

0.93 V

5.47

0603 (1608 Metric)

YES

0603

780

Stackpole Electronics Inc

Tape & Reel (TR)

-55°C ~ 155°C

Tray

RNCF

0.061 L x 0.031 W (1.55mm x 0.80mm)

±0.1%

活跃

2

±25ppm/°C

23.2 Ohms

Thin Film

0.167W, 1/6W

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B780

360

不合格

-

0.9 V

INDUSTRIAL

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

360

3.35 mm

现场可编程门阵列

FPGA - 480K Logic Elements

480000

--

Automotive AEC-Q200

0.022 (0.55mm)

29 mm

29 mm

AEC-Q200

N/A

-

DJT16E25

活跃

360

有

This product may require additional documentation to export from the United States.

2 x 32 kB

1.2 GHz

480000 LE

1

SMD/SMT

60000 LAB

965352

Intel

Intel / Altera

Arria 10 SoC

Details

2 x 32 kB

-

BGA, BGA780,28X28,40

网格排列

PLASTIC/EPOXY

BGA780,28X28,40

-40 °C

0.9 V

未说明

0.87 V

100 °C

有

10AS048E4F29I3LG

BGA

SQUARE

活跃

INTEL CORP

0.93 V

5.47

SoC FPGA

FBGA-780

YES

780

TE Connectivity Deutsch 连接器

Bag

-40°C ~ 100°C (TJ)

Tray

*

活跃

8542.39.00.01

SOC - Systems on a Chip

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B780

360

不合格

0.9 V

INDUSTRIAL

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

360

3.35 mm

现场可编程门阵列

FPGA - 480K Logic Elements

480000

2 Core

--

SoC FPGA

29 mm

29 mm

N/A

-

RN732B

Obsolete

384

有

This product may require additional documentation to export from the United States.

2 x 32 kB

1.2 GHz

270000 LE

1

SMD/SMT

33750 LAB

964944

Intel

Intel / Altera

Arria 10 SoC

Details

2 x 32 kB

-

BGA, BGA1152,34X34,40

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

-40 °C

0.9 V

未说明

0.87 V

100 °C

有

10AS027H4F34I3SG

BGA

SQUARE

活跃

INTEL CORP

0.93 V

5.43

SoC FPGA

1206 (3216 Metric)

YES

1206

1152

KOA Speer Electronics, Inc.

Tape & Reel (TR)

-55°C ~ 155°C

Tray

RN73

0.126 L x 0.063 W (3.20mm x 1.60mm)

±1%

活跃

2

±50ppm/°C

25.5 kOhms

Thin Film

0.125W, 1/8W

8542.39.00.01

SOC - Systems on a Chip

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B1152

384

不合格

0.9 V

INDUSTRIAL

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

384

3.65 mm

现场可编程门阵列

FPGA - 270K Logic Elements

270000

2 Core

--

Moisture Resistant

SoC FPGA

0.028 (0.70mm)

35 mm

35 mm