类别是'专用'
专用 (1453)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 表面安装 | 终端数量 | JESD-609代码 | 无铅代码 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 引脚数量 | JESD-30代码 | 资历状况 | 电源电压-最大值(Vsup) | 温度等级 | 电源电压-最小值(Vsup) | 端口的数量 | 操作模式 | 电源电流-最大值 | 组织结构 | 输出特性 | 座位高度-最大 | 内存宽度 | 待机电流-最大值 | 记忆密度 | 并行/串行 | I/O类型 | 内存IC类型 | 待机电压-最小值 | 输出启用 | 混合内存类型 | 长度 | 宽度 | |||||||||||||||||
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![]() | XC17S30XLPDG8I | AMD Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NO | Obsolete | XILINX INC | DIP | DIP, | 1 | 249168 words | 249168 | 85 °C | -40 °C | PLASTIC/EPOXY | DIP | RECTANGULAR | IN-LINE | 3.3 V | 8 | 有 | e3 | 有 | EAR99 | Matte Tin (Sn) | 8542.32.00.71 | DUAL | THROUGH-HOLE | 250 | 1 | 2.54 mm | compliant | 30 | 8 | R-PDIP-T8 | 不合格 | 3.6 V | INDUSTRIAL | 3 V | SYNCHRONOUS | 249168X1 | 4.5974 mm | 1 | 249168 bit | 存储器电路 | 9.3599 mm | 7.62 mm | |||||||||||||
![]() | M4-4104S-Z2 | Moujen Switch | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MD2201-D72-V3 | M-Systems Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | SST32HF32A1-70-4E-LFS | Silicon Storage Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | SILICON STORAGE TECHNOLOGY INC | BGA | LFBGA, | 2097152 words | 2000000 | 85 °C | -20 °C | PLASTIC/EPOXY | LFBGA | RECTANGULAR | GRID ARRAY, LOW PROFILE, FINE PITCH | 3 V | 63 | 无 | 无 | EAR99 | PSRAM IS ORGANIZED AS 1024K X 16 | 8542.32.00.71 | BOTTOM | BALL | 240 | 1 | 0.8 mm | unknown | 10 | 63 | R-PBGA-B63 | 不合格 | 3.3 V | OTHER | 2.7 V | ASYNCHRONOUS | 2MX16 | 1.4 mm | 16 | 33554432 bit | 存储器电路 | 10 mm | 8 mm | |||||||||||||||
![]() | SL82S212W | Lansdale Semiconductor Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | LANSDALE SEMICONDUCTOR INC | , | 活跃 | EAR99 | 8542.32.00.71 | compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | SST32HF3281-70-4E-LSE | Silicon Storage Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | SILICON STORAGE TECHNOLOGY INC | BGA | LFBGA, | 2097152 words | 2000000 | 85 °C | -20 °C | PLASTIC/EPOXY | LFBGA | RECTANGULAR | GRID ARRAY, LOW PROFILE, FINE PITCH | 3 V | 62 | Obsolete | EAR99 | SRAM IS ORGANIZED AS 512K X 16 | 8542.32.00.71 | BOTTOM | BALL | 1 | 0.8 mm | unknown | 62 | R-PBGA-B62 | 不合格 | 3.3 V | 商业扩展 | 2.7 V | ASYNCHRONOUS | 2MX16 | 1.4 mm | 16 | 33554432 bit | 存储器电路 | 10 mm | 8 mm | |||||||||||||||||||
![]() | NAND98R3M0AZBB5E | Micron Technology Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | MICRON TECHNOLOGY INC | FBGA, BGA107,10X14,32 | 85 °C | -30 °C | PLASTIC/EPOXY | FBGA | BGA107,10X14,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | 1.8 V | 107 | 有 | EAR99 | 8542.32.00.71 | BOTTOM | BALL | 0.8 mm | compliant | R-PBGA-B107 | 不合格 | OTHER | 存储器电路 | FLASH+SDRAM | |||||||||||||||||||||||||||||||
![]() | S71WS256NC0BFWAM | Spansion | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | SPANSION INC | BGA | TFBGA, | 3 | 16777216 words | 16000000 | 85 °C | -25 °C | PLASTIC/EPOXY | TFBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | 1.8 V | 84 | 有 | e1 | EAR99 | 锡银铜 | PSRAM IS ALSO ORGANIZED AS 4M X 16 | 8542.32.00.71 | BOTTOM | BALL | 1 | 0.8 mm | compliant | 84 | R-PBGA-B84 | 不合格 | 1.95 V | OTHER | 1.7 V | SYNCHRONOUS | 16MX16 | 1.2 mm | 16 | 268435456 bit | 存储器电路 | 11.6 mm | 8 mm | |||||||||||||||
![]() | TC518129AFWL-80 | Toshiba America Electronic Components | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | TOSHIBA CORP | SOIC | 80 ns | 131072 words | 128000 | 70 °C | PLASTIC/EPOXY | SOP | RECTANGULAR | 小概要 | 5 V | 32 | 无 | e0 | 锡铅 | CE/AUTO/SELF REFRESH | DUAL | 鸥翼 | 240 | 1 | 1.27 mm | unknown | 未说明 | 32 | R-PDSO-G32 | 不合格 | 5.5 V | COMMERCIAL | 4.5 V | 1 | ASYNCHRONOUS | 128KX8 | 3-STATE | 2.8 mm | 8 | 1048576 bit | PARALLEL | PSEUDO STATIC RAM | YES | 20.6 mm | 10.7 mm | |||||||||||||
![]() | M6MGB64BM34CWG-P | Renesas Electronics Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | RENESAS TECHNOLOGY CORP | , | Obsolete | EAR99 | 8542.32.00.71 | unknown | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | RD28F1602C3T90 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | INTEL CORP | BGA | LFBGA, BGA68,8X12,32 | 90 ns | 1048576 words | 1000000 | 85 °C | -25 °C | PLASTIC/EPOXY | LFBGA | BGA68,8X12,32 | RECTANGULAR | GRID ARRAY, LOW PROFILE, FINE PITCH | 3 V | 66 | Obsolete | EAR99 | SRAM IS ORGANIZED AS 256K X 16 | 8542.32.00.71 | BOTTOM | BALL | 1 | 0.8 mm | unknown | 66 | R-PBGA-B66 | 不合格 | 3.3 V | 商业扩展 | 2.7 V | ASYNCHRONOUS | 0.055 mA | 1MX16 | 1.4 mm | 16 | 0.000035 A | 16777216 bit | 存储器电路 | FLASH+SRAM | 10 mm | 8 mm | ||||||||||||||
![]() | S71PL032J40BAW0K2 | Spansion | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | SPANSION INC | BGA | TFBGA, BGA56,8X8,32 | 65 ns | 3 | 2097152 words | 2000000 | 85 °C | -25 °C | PLASTIC/EPOXY | TFBGA | BGA56,8X8,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | 3 V | 56 | 有 | e1 | EAR99 | 锡银铜 | PSRAM IS ORGANIZED AS 256K X 16 | 8542.32.00.71 | BOTTOM | BALL | 1 | 0.8 mm | compliant | 56 | R-PBGA-B56 | 不合格 | 3.6 V | 商业扩展 | 2.7 V | ASYNCHRONOUS | 2MX16 | 1.2 mm | 16 | 33554432 bit | 存储器电路 | FLASH+PSRAM | 9 mm | 7 mm | ||||||||||||
![]() | XC17S40PDG8I | AMD Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NO | Obsolete | XILINX INC | DIP | DIP, | 1 | 329312 words | 329312 | 85 °C | -40 °C | PLASTIC/EPOXY | DIP | RECTANGULAR | IN-LINE | 5 V | 8 | 有 | e3 | 有 | EAR99 | Matte Tin (Sn) | 8542.32.00.71 | DUAL | THROUGH-HOLE | 250 | 1 | 2.54 mm | compliant | 30 | 8 | R-PDIP-T8 | 不合格 | 5.5 V | INDUSTRIAL | 4.5 V | SYNCHRONOUS | 329312X1 | 4.5974 mm | 1 | 329312 bit | 存储器电路 | 9.3599 mm | 7.62 mm | |||||||||||||
![]() | CT512VA-IS3 | Crown Connector Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M4-4103S-Z3 | Moujen Switch | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | RD38F3040L0YTQ0 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | INTEL CORP | BGA | TFBGA, BGA88,8X12,32 | 85 ns | 8388608 words | 8000000 | 85 °C | -25 °C | PLASTIC/EPOXY | TFBGA | BGA88,8X12,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | 1.8 V | 88 | 无 | e0 | EAR99 | 锡铅 | CONTAINS 32M BIT PSRAM | 8542.32.00.71 | BOTTOM | BALL | 1 | 0.8 mm | compliant | 88 | R-PBGA-B88 | 不合格 | 2 V | OTHER | 1.7 V | SYNCHRONOUS | 0.035 mA | 8MX16 | 1.2 mm | 16 | 0.0001 A | 134217728 bit | 存储器电路 | FLASH+PSRAM | 10 mm | 8 mm | |||||||||||
![]() | XC17S05XLVOG8I | AMD Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | XILINX INC | TSOP | TSOP2, | 3 | 54544 words | 54544 | 85 °C | -40 °C | PLASTIC/EPOXY | TSOP2 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | 3.3 V | 8 | 有 | e3 | 有 | EAR99 | Matte Tin (Sn) | 8542.32.00.71 | DUAL | 鸥翼 | 260 | 1 | 1.27 mm | compliant | 30 | 8 | R-PDSO-G8 | 不合格 | 3.6 V | INDUSTRIAL | 3 V | SYNCHRONOUS | 54544X1 | 1.2 mm | 1 | 54544 bit | 存储器电路 | 4.9 mm | 3.9 mm | |||||||||||||
![]() | S71VS256RD0AHKBL0 | Spansion | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Transferred | SPANSION INC | FBGA, BGA56,10X14,20 | 85 °C | -25 °C | PLASTIC/EPOXY | FBGA | BGA56,10X14,20 | RECTANGULAR | GRID ARRAY, FINE PITCH | 1.8 V | 56 | 有 | EAR99 | 8542.32.00.71 | BOTTOM | BALL | 260 | 0.5 mm | unknown | 40 | R-PBGA-B56 | 不合格 | OTHER | 存储器电路 | FLASH+PSRAM | |||||||||||||||||||||||||||||
![]() | S71GL512NC0BFWEZ2 | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 活跃 | ADVANCED MICRO DEVICES INC | FBGA, BGA84,10X12,32 | 110 ns | 85 °C | -25 °C | PLASTIC/EPOXY | FBGA | BGA84,10X12,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | 84 | 有 | EAR99 | 8542.32.00.71 | BOTTOM | BALL | 0.8 mm | compliant | R-PBGA-B84 | 不合格 | OTHER | 0.09 mA | 0.005 A | 存储器电路 | FLASH+PSRAM | |||||||||||||||||||||||||||||
![]() | M4-4102S-Z2 | Moujen Switch | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | SN74LS219AN | Rochester Electronics LLC | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NO | ROCHESTER ELECTRONICS LLC | , | 80 ns | 16 words | 16 | 70 °C | PLASTIC/EPOXY | DIP | DIP16,.3 | RECTANGULAR | IN-LINE | 5 V | 16 | 活跃 | EAR99 | LG_MAX | 8542.32.00.41 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | R-PDIP-T16 | 5.25 V | 4.75 V | 1 | ASYNCHRONOUS | 0.06 mA | 16X4 | 3-STATE | 5.08 mm | 4 | 64 bit | PARALLEL | SEPARATE | 标准SRAM | 4.75 V | NO | 19.8 mm | 7.62 mm | |||||||||||||||
![]() | SSDSC2KB240G8 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MT42L2DALG-DC | Micron Technology Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | MICRON TECHNOLOGY INC | , | 接触制造商 | EAR99 | 8542.32.00.71 | compliant | 存储器电路 | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | S71NS032JA0BJWRT0 | Spansion | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TMS4C1060-40N | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NO | Obsolete | TEXAS INSTRUMENTS INC | DIP, DIP16,.3 | 30 ns | 70 °C | PLASTIC/EPOXY | DIP | DIP16,.3 | RECTANGULAR | IN-LINE | 5 V | 16 | 无 | EAR99 | 8542.32.00.71 | DUAL | THROUGH-HOLE | 未说明 | 2.54 mm | not_compliant | 未说明 | R-PDIP-T16 | 不合格 | COMMERCIAL | 0.045 mA | 0.01 A | 存储器电路 |