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我的订单 我的询价 0755-82520436 3307104213

图片

产品型号

品牌

数据表

有效性

单价(CNY)

询价

认证

表面安装

终端数量

JESD-609代码

无铅代码

ECCN 代码

端子表面处理

附加功能

HTS代码

端子位置

终端形式

峰值回流焊温度(摄氏度)

功能数量

端子间距

Reach合规守则

时间@峰值回流温度-最大值(s)

引脚数量

JESD-30代码

资历状况

电源电压-最大值(Vsup)

温度等级

电源电压-最小值(Vsup)

端口的数量

操作模式

电源电流-最大值

组织结构

输出特性

座位高度-最大

内存宽度

待机电流-最大值

记忆密度

并行/串行

I/O类型

内存IC类型

待机电压-最小值

输出启用

混合内存类型

长度

宽度

XC17S30XLPDG8I XC17S30XLPDG8I

AMD Xilinx 数据表

N/A

-

最小起订量: 1

倍率: 1

NO

Obsolete

XILINX INC

DIP

DIP,

1

249168 words

249168

85 °C

-40 °C

PLASTIC/EPOXY

DIP

RECTANGULAR

IN-LINE

3.3 V

8

e3

EAR99

Matte Tin (Sn)

8542.32.00.71

DUAL

THROUGH-HOLE

250

1

2.54 mm

compliant

30

8

R-PDIP-T8

不合格

3.6 V

INDUSTRIAL

3 V

SYNCHRONOUS

249168X1

4.5974 mm

1

249168 bit

存储器电路

9.3599 mm

7.62 mm

M4-4104S-Z2 M4-4104S-Z2

Moujen Switch 数据表

N/A

-

最小起订量: 1

倍率: 1

MD2201-D72-V3 MD2201-D72-V3

M-Systems Corp 数据表

N/A

-

最小起订量: 1

倍率: 1

SST32HF32A1-70-4E-LFS SST32HF32A1-70-4E-LFS

Silicon Storage Technology 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

Obsolete

SILICON STORAGE TECHNOLOGY INC

BGA

LFBGA,

2097152 words

2000000

85 °C

-20 °C

PLASTIC/EPOXY

LFBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

3 V

63

EAR99

PSRAM IS ORGANIZED AS 1024K X 16

8542.32.00.71

BOTTOM

BALL

240

1

0.8 mm

unknown

10

63

R-PBGA-B63

不合格

3.3 V

OTHER

2.7 V

ASYNCHRONOUS

2MX16

1.4 mm

16

33554432 bit

存储器电路

10 mm

8 mm

SL82S212W SL82S212W

Lansdale Semiconductor Inc 数据表

N/A

-

最小起订量: 1

倍率: 1

LANSDALE SEMICONDUCTOR INC

,

活跃

EAR99

8542.32.00.71

compliant

SST32HF3281-70-4E-LSE SST32HF3281-70-4E-LSE

Silicon Storage Technology 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

SILICON STORAGE TECHNOLOGY INC

BGA

LFBGA,

2097152 words

2000000

85 °C

-20 °C

PLASTIC/EPOXY

LFBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

3 V

62

Obsolete

EAR99

SRAM IS ORGANIZED AS 512K X 16

8542.32.00.71

BOTTOM

BALL

1

0.8 mm

unknown

62

R-PBGA-B62

不合格

3.3 V

商业扩展

2.7 V

ASYNCHRONOUS

2MX16

1.4 mm

16

33554432 bit

存储器电路

10 mm

8 mm

NAND98R3M0AZBB5E NAND98R3M0AZBB5E

Micron Technology Inc 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

Obsolete

MICRON TECHNOLOGY INC

FBGA, BGA107,10X14,32

85 °C

-30 °C

PLASTIC/EPOXY

FBGA

BGA107,10X14,32

RECTANGULAR

GRID ARRAY, FINE PITCH

1.8 V

107

EAR99

8542.32.00.71

BOTTOM

BALL

0.8 mm

compliant

R-PBGA-B107

不合格

OTHER

存储器电路

FLASH+SDRAM

S71WS256NC0BFWAM S71WS256NC0BFWAM

Spansion 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

Obsolete

SPANSION INC

BGA

TFBGA,

3

16777216 words

16000000

85 °C

-25 °C

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

1.8 V

84

e1

EAR99

锡银铜

PSRAM IS ALSO ORGANIZED AS 4M X 16

8542.32.00.71

BOTTOM

BALL

1

0.8 mm

compliant

84

R-PBGA-B84

不合格

1.95 V

OTHER

1.7 V

SYNCHRONOUS

16MX16

1.2 mm

16

268435456 bit

存储器电路

11.6 mm

8 mm

TC518129AFWL-80 TC518129AFWL-80

Toshiba America Electronic Components 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

Obsolete

TOSHIBA CORP

SOIC

80 ns

131072 words

128000

70 °C

PLASTIC/EPOXY

SOP

RECTANGULAR

小概要

5 V

32

e0

锡铅

CE/AUTO/SELF REFRESH

DUAL

鸥翼

240

1

1.27 mm

unknown

未说明

32

R-PDSO-G32

不合格

5.5 V

COMMERCIAL

4.5 V

1

ASYNCHRONOUS

128KX8

3-STATE

2.8 mm

8

1048576 bit

PARALLEL

PSEUDO STATIC RAM

YES

20.6 mm

10.7 mm

M6MGB64BM34CWG-P M6MGB64BM34CWG-P

Renesas Electronics Corporation 数据表

N/A

-

最小起订量: 1

倍率: 1

RENESAS TECHNOLOGY CORP

,

Obsolete

EAR99

8542.32.00.71

unknown

RD28F1602C3T90 RD28F1602C3T90

Intel Corporation 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

INTEL CORP

BGA

LFBGA, BGA68,8X12,32

90 ns

1048576 words

1000000

85 °C

-25 °C

PLASTIC/EPOXY

LFBGA

BGA68,8X12,32

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

3 V

66

Obsolete

EAR99

SRAM IS ORGANIZED AS 256K X 16

8542.32.00.71

BOTTOM

BALL

1

0.8 mm

unknown

66

R-PBGA-B66

不合格

3.3 V

商业扩展

2.7 V

ASYNCHRONOUS

0.055 mA

1MX16

1.4 mm

16

0.000035 A

16777216 bit

存储器电路

FLASH+SRAM

10 mm

8 mm

S71PL032J40BAW0K2 S71PL032J40BAW0K2

Spansion 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

Obsolete

SPANSION INC

BGA

TFBGA, BGA56,8X8,32

65 ns

3

2097152 words

2000000

85 °C

-25 °C

PLASTIC/EPOXY

TFBGA

BGA56,8X8,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

3 V

56

e1

EAR99

锡银铜

PSRAM IS ORGANIZED AS 256K X 16

8542.32.00.71

BOTTOM

BALL

1

0.8 mm

compliant

56

R-PBGA-B56

不合格

3.6 V

商业扩展

2.7 V

ASYNCHRONOUS

2MX16

1.2 mm

16

33554432 bit

存储器电路

FLASH+PSRAM

9 mm

7 mm

XC17S40PDG8I XC17S40PDG8I

AMD Xilinx 数据表

N/A

-

最小起订量: 1

倍率: 1

NO

Obsolete

XILINX INC

DIP

DIP,

1

329312 words

329312

85 °C

-40 °C

PLASTIC/EPOXY

DIP

RECTANGULAR

IN-LINE

5 V

8

e3

EAR99

Matte Tin (Sn)

8542.32.00.71

DUAL

THROUGH-HOLE

250

1

2.54 mm

compliant

30

8

R-PDIP-T8

不合格

5.5 V

INDUSTRIAL

4.5 V

SYNCHRONOUS

329312X1

4.5974 mm

1

329312 bit

存储器电路

9.3599 mm

7.62 mm

CT512VA-IS3 CT512VA-IS3

Crown Connector Inc 数据表

N/A

-

最小起订量: 1

倍率: 1

M4-4103S-Z3 M4-4103S-Z3

Moujen Switch 数据表

N/A

-

最小起订量: 1

倍率: 1

RD38F3040L0YTQ0 RD38F3040L0YTQ0

Intel Corporation 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

Obsolete

INTEL CORP

BGA

TFBGA, BGA88,8X12,32

85 ns

8388608 words

8000000

85 °C

-25 °C

PLASTIC/EPOXY

TFBGA

BGA88,8X12,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

1.8 V

88

e0

EAR99

锡铅

CONTAINS 32M BIT PSRAM

8542.32.00.71

BOTTOM

BALL

1

0.8 mm

compliant

88

R-PBGA-B88

不合格

2 V

OTHER

1.7 V

SYNCHRONOUS

0.035 mA

8MX16

1.2 mm

16

0.0001 A

134217728 bit

存储器电路

FLASH+PSRAM

10 mm

8 mm

XC17S05XLVOG8I XC17S05XLVOG8I

AMD Xilinx 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

Obsolete

XILINX INC

TSOP

TSOP2,

3

54544 words

54544

85 °C

-40 °C

PLASTIC/EPOXY

TSOP2

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

3.3 V

8

e3

EAR99

Matte Tin (Sn)

8542.32.00.71

DUAL

鸥翼

260

1

1.27 mm

compliant

30

8

R-PDSO-G8

不合格

3.6 V

INDUSTRIAL

3 V

SYNCHRONOUS

54544X1

1.2 mm

1

54544 bit

存储器电路

4.9 mm

3.9 mm

S71VS256RD0AHKBL0 S71VS256RD0AHKBL0

Spansion 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

Transferred

SPANSION INC

FBGA, BGA56,10X14,20

85 °C

-25 °C

PLASTIC/EPOXY

FBGA

BGA56,10X14,20

RECTANGULAR

GRID ARRAY, FINE PITCH

1.8 V

56

EAR99

8542.32.00.71

BOTTOM

BALL

260

0.5 mm

unknown

40

R-PBGA-B56

不合格

OTHER

存储器电路

FLASH+PSRAM

S71GL512NC0BFWEZ2 S71GL512NC0BFWEZ2

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

活跃

ADVANCED MICRO DEVICES INC

FBGA, BGA84,10X12,32

110 ns

85 °C

-25 °C

PLASTIC/EPOXY

FBGA

BGA84,10X12,32

RECTANGULAR

GRID ARRAY, FINE PITCH

84

EAR99

8542.32.00.71

BOTTOM

BALL

0.8 mm

compliant

R-PBGA-B84

不合格

OTHER

0.09 mA

0.005 A

存储器电路

FLASH+PSRAM

M4-4102S-Z2 M4-4102S-Z2

Moujen Switch 数据表

N/A

-

最小起订量: 1

倍率: 1

SN74LS219AN SN74LS219AN

Rochester Electronics LLC 数据表

N/A

-

最小起订量: 1

倍率: 1

NO

ROCHESTER ELECTRONICS LLC

,

80 ns

16 words

16

70 °C

PLASTIC/EPOXY

DIP

DIP16,.3

RECTANGULAR

IN-LINE

5 V

16

活跃

EAR99

LG_MAX

8542.32.00.41

DUAL

THROUGH-HOLE

1

2.54 mm

unknown

R-PDIP-T16

5.25 V

4.75 V

1

ASYNCHRONOUS

0.06 mA

16X4

3-STATE

5.08 mm

4

64 bit

PARALLEL

SEPARATE

标准SRAM

4.75 V

NO

19.8 mm

7.62 mm

SSDSC2KB240G8 SSDSC2KB240G8

Intel Corporation 数据表

N/A

-

最小起订量: 1

倍率: 1

MT42L2DALG-DC MT42L2DALG-DC

Micron Technology Inc 数据表

N/A

-

最小起订量: 1

倍率: 1

MICRON TECHNOLOGY INC

,

接触制造商

EAR99

8542.32.00.71

compliant

存储器电路

S71NS032JA0BJWRT0 S71NS032JA0BJWRT0

Spansion 数据表

N/A

-

最小起订量: 1

倍率: 1

TMS4C1060-40N TMS4C1060-40N

NA 数据表

N/A

-

最小起订量: 1

倍率: 1

NO

Obsolete

TEXAS INSTRUMENTS INC

DIP, DIP16,.3

30 ns

70 °C

PLASTIC/EPOXY

DIP

DIP16,.3

RECTANGULAR

IN-LINE

5 V

16

EAR99

8542.32.00.71

DUAL

THROUGH-HOLE

未说明

2.54 mm

not_compliant

未说明

R-PDIP-T16

不合格

COMMERCIAL

0.045 mA

0.01 A

存储器电路