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专用 (1453)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 表面安装 | 终端数量 | JESD-609代码 | 无铅代码 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 引脚数量 | JESD-30代码 | 资历状况 | 电源电压-最大值(Vsup) | 温度等级 | 电源电压-最小值(Vsup) | 端口的数量 | 操作模式 | 电源电流-最大值 | 组织结构 | 输出特性 | 座位高度-最大 | 内存宽度 | 待机电流-最大值 | 记忆密度 | 并行/串行 | 内存IC类型 | 输出启用 | 混合内存类型 | 长度 | 宽度 | |||||||||||||||||
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![]() | HCF40108BF | SGS-Ates Componenti Electronici SPA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NO | Obsolete | SGS-ATES COMPONENTI ELECTRONICI S P A | DIP, DIP24,.6 | 85 °C | -40 °C | CERAMIC | DIP | DIP24,.6 | RECTANGULAR | IN-LINE | 24 | 无 | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.71 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-XDIP-T24 | 不合格 | INDUSTRIAL | ||||||||||||||||||||||||||||||
![]() | CY15V108QN-50BKXQ | Infineon Technologies AG | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | PF38F4470LLYBB0 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MD3331-D64-V3-X-P | M-Systems Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | M-SYSTEMS CORP | FBGA, BGA107,10X12,32 | 70 ns | 85 °C | -40 °C | PLASTIC/EPOXY | FBGA | BGA107,10X12,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | 3.3 V | 107 | 有 | EAR99 | 8542.32.00.71 | BOTTOM | BALL | 260 | 0.8 mm | unknown | R-PBGA-B107 | 不合格 | INDUSTRIAL | 0.09 mA | 0.00008 A | 存储器电路 | FLASH+PSRAM | |||||||||||||||||||||||||
![]() | M36L0R8060T1ZAQE | Numonyx Memory Solutions | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | NUMONYX | BGA | TFBGA, | 16777216 words | 16000000 | 85 °C | -25 °C | PLASTIC/EPOXY | TFBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | 1.8 V | 88 | Transferred | e1 | EAR99 | 锡银铜 | PSEUDO SRAM IS ORGANIZED AS 4M X 16; SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE | 8542.32.00.71 | BOTTOM | BALL | 260 | 1 | 0.8 mm | unknown | 未说明 | 88 | R-PBGA-B88 | 不合格 | 1.95 V | OTHER | 1.7 V | ASYNCHRONOUS | 16MX16 | 1.2 mm | 16 | 268435456 bit | 存储器电路 | 10 mm | 8 mm | |||||||||||||
![]() | M36L0R8060T1ZAQE | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Transferred | STMICROELECTRONICS | BGA | 8 X 10 MM, 0.80 MM PITCH, ROHS COMPLIANT, TFBGA-88 | 16777216 words | 16000000 | 85 °C | -25 °C | PLASTIC/EPOXY | TFBGA | BGA88,8X12,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | 1.8 V | 88 | 有 | e1 | EAR99 | 锡银铜 | PSEUDO SRAM IS ORGANIZED AS 4M X 16; SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE | 8542.32.00.71 | BOTTOM | BALL | 1 | 0.8 mm | unknown | 88 | R-PBGA-B88 | 不合格 | 1.95 V | OTHER | 1.7 V | ASYNCHRONOUS | 0.052 mA | 16MX16 | 1.2 mm | 16 | 0.00011 A | 268435456 bit | 存储器电路 | FLASH+PSRAM | 10 mm | 8 mm | ||||||||||
![]() | M5M4C500AVP-5 | Mitsubishi Electric | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | MITSUBISHI ELECTRIC CORP | TSSOP, TSSOP28,.53,22 | 40 ns | 70 °C | PLASTIC/EPOXY | TSSOP | TSSOP28,.53,22 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 5 V | 28 | 无 | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.71 | DUAL | 鸥翼 | 0.55 mm | unknown | R-PDSO-G28 | 不合格 | COMMERCIAL | 0.05 mA | 0.004 A | |||||||||||||||||||||||||||
![]() | M36L0R8060T1ZAQE | Micron Technology Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | MICRON TECHNOLOGY INC | BGA | TFBGA, | 16777216 words | 16000000 | 85 °C | -25 °C | PLASTIC/EPOXY | TFBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | 1.8 V | 88 | 有 | e1 | 有 | EAR99 | 锡银铜 | PSEUDO SRAM IS ORGANIZED AS 4M X 16; SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE | 8542.32.00.71 | BOTTOM | BALL | 1 | 0.8 mm | compliant | 88 | R-PBGA-B88 | 不合格 | 1.95 V | OTHER | 1.7 V | ASYNCHRONOUS | 16MX16 | 1.2 mm | 16 | 268435456 bit | 存储器电路 | 10 mm | 8 mm | |||||||||||||
![]() | TH50VSF1320AAXB | Toshiba America Electronic Components | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | TOSHIBA CORP | BGA | LBGA, | 1048576 words | 1000000 | 85 °C | -20 °C | PLASTIC/EPOXY | LBGA | RECTANGULAR | GRID ARRAY, LOW PROFILE | 3 V | 48 | Obsolete | EAR99 | SRAM IS CONFIGURED AS 256 K X 8 | 8542.32.00.71 | BOTTOM | BALL | 1 | 1 mm | unknown | 48 | R-PBGA-B48 | 不合格 | 3.6 V | OTHER | 2.7 V | ASYNCHRONOUS | 1MX8 | 1.6 mm | 8 | 8388608 bit | 存储器电路 | 12 mm | 10 mm | |||||||||||||||||
![]() | XC17S150XLSOG20C | AMD Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | XILINX INC | SOIC | SOP, | 3 | 1040128 words | 1040128 | 70 °C | PLASTIC/EPOXY | SOP | RECTANGULAR | 小概要 | 3.3 V | 20 | 有 | e3 | 有 | EAR99 | Matte Tin (Sn) | 8542.32.00.71 | DUAL | 鸥翼 | 260 | 1 | 1.27 mm | compliant | 30 | 20 | R-PDSO-G20 | 不合格 | 3.6 V | COMMERCIAL | 3 V | SYNCHRONOUS | 1040128X1 | 2.65 mm | 1 | 1040128 bit | 存储器电路 | 12.8 mm | 7.5 mm | ||||||||||||
![]() | S71WS256NC0BFWAP | Spansion | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | SPANSION INC | BGA | TFBGA, | 3 | 16777216 words | 16000000 | 85 °C | -25 °C | PLASTIC/EPOXY | TFBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | 1.8 V | 84 | 有 | e1 | EAR99 | 锡银铜 | PSRAM IS ALSO ORGANIZED AS 4M X 16 | 8542.32.00.71 | BOTTOM | BALL | 1 | 0.8 mm | compliant | 84 | R-PBGA-B84 | 不合格 | 1.95 V | OTHER | 1.7 V | SYNCHRONOUS | 16MX16 | 1.2 mm | 16 | 268435456 bit | 存储器电路 | 11.6 mm | 8 mm | |||||||||||||
![]() | PF38F2040W0YTQ0 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Transferred | INTEL CORP | BGA | TFBGA, BGA88,8X12,32 | 70 ns | 3 | 4194304 words | 4000000 | 85 °C | -25 °C | PLASTIC/EPOXY | TFBGA | BGA88,8X12,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | 1.8 V | 88 | 有 | e1 | EAR99 | 锡银铜 | CONTAINS 32 MBIT SRAM, ALSO CONTAINS 64 MBIT FLASH | 8542.32.00.71 | BOTTOM | BALL | 1 | 0.8 mm | compliant | 88 | R-PBGA-B88 | 不合格 | 1.95 V | OTHER | 1.7 V | SYNCHRONOUS | 0.055 mA | 4MX16 | 1.2 mm | 16 | 0.000045 A | 67108864 bit | 存储器电路 | FLASH+PSRAM+SRAM | 10 mm | 8 mm | ||||||||
![]() | PF38F2040W0YTQ0 | Micron Technology Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | MICRON TECHNOLOGY INC | FBGA, BGA88,8X12,32 | 70 ns | PLASTIC/EPOXY | FBGA | BGA88,8X12,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | 1.8 V | 88 | 有 | EAR99 | 8542.32.00.71 | BOTTOM | BALL | 0.8 mm | compliant | R-PBGA-B88 | 不合格 | 0.035 mA | 0.00011 A | 存储器电路 | FLASH+PSRAM | |||||||||||||||||||||||||||||
![]() | PF38F2040W0YTQ0 | Numonyx Memory Solutions | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | NUMONYX | BGA | TFBGA, BGA88,8X12,32 | 70 ns | 4194304 words | 4000000 | 85 °C | -25 °C | PLASTIC/EPOXY | TFBGA | BGA88,8X12,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | 1.8 V | 88 | 有 | 有 | EAR99 | CONTAINS 32 MBIT SRAM, ALSO CONTAINS 64 MBIT FLASH | 8542.32.00.71 | BOTTOM | BALL | 未说明 | 1 | 0.8 mm | unknown | 未说明 | 88 | R-PBGA-B88 | 不合格 | 1.95 V | OTHER | 1.7 V | SYNCHRONOUS | 0.035 mA | 4MX16 | 1.2 mm | 16 | 0.00011 A | 67108864 bit | 存储器电路 | FLASH+PSRAM | 10 mm | 8 mm | ||||||||
![]() | MM5240AA/J | National Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NO | Obsolete | NATIONAL SEMICONDUCTOR CORP | 70 °C | -25 °C | CERAMIC | DIP | DIP24,.6 | RECTANGULAR | IN-LINE | 24 | 无 | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.71 | DUAL | THROUGH-HOLE | 2.54 mm | compliant | R-XDIP-T24 | 不合格 | OTHER | |||||||||||||||||||||||||||||||
![]() | MM5240AA/J | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NO | Obsolete | NATIONAL SEMICONDUCTOR CORP | DIP, DIP24,.6 | 70 °C | -25 °C | CERAMIC | DIP | DIP24,.6 | RECTANGULAR | IN-LINE | 24 | 无 | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.71 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-XDIP-T24 | 不合格 | OTHER | ||||||||||||||||||||||||||||||
![]() | TC518512FL-10 | Toshiba America Electronic Components | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | TOSHIBA CORP | SOIC | 100 ns | 524288 words | 512000 | 70 °C | PLASTIC/EPOXY | SOP | RECTANGULAR | 小概要 | 5 V | 32 | 无 | e0 | 锡铅 | CE/AUTO/SELF REFRESH | DUAL | 鸥翼 | 240 | 1 | 1.27 mm | unknown | 未说明 | 32 | R-PDSO-G32 | 不合格 | 5.5 V | COMMERCIAL | 4.5 V | 1 | ASYNCHRONOUS | 512KX8 | 3-STATE | 2.8 mm | 8 | 4194304 bit | PARALLEL | PSEUDO STATIC RAM | YES | 20.6 mm | 10.7 mm | |||||||||||
![]() | RD38F2040W0YTQ0 | Micron Technology Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | MICRON TECHNOLOGY INC | FBGA, BGA88,8X12,32 | 70 ns | PLASTIC/EPOXY | FBGA | BGA88,8X12,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | 1.8 V | 88 | 无 | EAR99 | 8542.32.00.71 | BOTTOM | BALL | 0.8 mm | unknown | R-PBGA-B88 | 不合格 | 0.035 mA | 0.00011 A | 存储器电路 | FLASH+PSRAM | |||||||||||||||||||||||||||||
![]() | RD38F2040W0YTQ0 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | INTEL CORP | BGA | TFBGA, BGA88,8X12,32 | 65 ns | 4194304 words | 4000000 | 85 °C | -25 °C | PLASTIC/EPOXY | TFBGA | BGA88,8X12,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | 1.8 V | 88 | 无 | e0 | 无 | EAR99 | 锡铅 | CONTAINS 32 MBIT SRAM, ALSO CONTAINS 64 MBIT FLASH | 8542.32.00.71 | BOTTOM | BALL | 1 | 0.8 mm | compliant | 88 | R-PBGA-B88 | 不合格 | 1.95 V | OTHER | 1.7 V | SYNCHRONOUS | 0.035 mA | 4MX16 | 1.2 mm | 16 | 0.0001 A | 67108864 bit | 存储器电路 | FLASH+PSRAM | 10 mm | 8 mm | ||||||||
![]() | RD38F2040W0YTQ0 | Numonyx Memory Solutions | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Transferred | NUMONYX | FBGA, BGA88,8X12,32 | 70 ns | PLASTIC/EPOXY | FBGA | BGA88,8X12,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | 1.8 V | 88 | 无 | EAR99 | 8542.32.00.71 | BOTTOM | BALL | 0.8 mm | unknown | R-PBGA-B88 | 不合格 | 0.035 mA | 0.00011 A | 存储器电路 | FLASH+PSRAM | |||||||||||||||||||||||||||||
![]() | M36W0R6050B1ZAQF | Numonyx Memory Solutions | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Transferred | NUMONYX | BGA | TFBGA, BGA88,8X12,32 | 70 ns | 4194304 words | 4000000 | 85 °C | -30 °C | PLASTIC/EPOXY | TFBGA | BGA88,8X12,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | 1.8 V | 88 | 有 | EAR99 | PSRAM IS ORGANIZED AS 2M X 16; SYNCHRONOUS BURST MODE ALSO POSSIBLE | 8542.32.00.71 | BOTTOM | BALL | 未说明 | 1 | 0.8 mm | unknown | 未说明 | 88 | R-PBGA-B88 | 不合格 | 1.95 V | OTHER | 1.7 V | ASYNCHRONOUS | 4MX16 | 1.2 mm | 16 | 67108864 bit | 存储器电路 | FLASH+PSRAM | 10 mm | 8 mm | |||||||||||
![]() | S71PL256ND0HFW5B0 | Spansion | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | SPANSION INC | BGA | 8 X 11.60 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FBGA-84 | 70 ns | 3 | 16777216 words | 16000000 | 85 °C | -25 °C | PLASTIC/EPOXY | TFBGA | BGA84,10X12,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | 3 V | 84 | 有 | e1 | EAR99 | 锡银铜 | 8542.32.00.71 | BOTTOM | BALL | 260 | 1 | 0.8 mm | unknown | 40 | 84 | R-PBGA-B84 | 不合格 | 3.1 V | OTHER | 2.7 V | ASYNCHRONOUS | 16MX16 | 1.2 mm | 16 | 268435456 bit | 存储器电路 | FLASH+PSRAM | 11.6 mm | 8 mm | |||||||||
![]() | SST34HF3282-70-4E-L1P | Silicon Storage Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | SILICON STORAGE TECHNOLOGY INC | BGA | LFBGA, | 2097152 words | 2000000 | 85 °C | -20 °C | PLASTIC/EPOXY | LFBGA | RECTANGULAR | GRID ARRAY, LOW PROFILE, FINE PITCH | 3 V | 56 | 无 | EAR99 | ALSO CONTAINS 512K X 16 SRAM | 8542.32.00.71 | BOTTOM | BALL | 未说明 | 1 | 0.8 mm | unknown | 未说明 | 56 | R-PBGA-B56 | 不合格 | 3.3 V | OTHER | 2.7 V | ASYNCHRONOUS | 2MX16 | 1.4 mm | 16 | 33554432 bit | 存储器电路 | 10 mm | 8 mm | ||||||||||||||
![]() | M4-4114S-Z3 | Moujen Switch | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | S71GL064AB0BFW0Z0 | Spansion | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | SPANSION INC | BGA | TFBGA, | 3 | 4194304 words | 4000000 | 85 °C | -25 °C | PLASTIC/EPOXY | TFBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | 3 V | 56 | 有 | e1 | EAR99 | 锡银铜 | PSRAM IS ORGANIZED AS 512K X 16 | 8542.32.00.71 | BOTTOM | BALL | 1 | 0.8 mm | compliant | 56 | R-PBGA-B56 | 不合格 | 3.1 V | 商业扩展 | 2.7 V | ASYNCHRONOUS | 4MX16 | 1.2 mm | 16 | 67108864 bit | 存储器电路 | 9 mm | 7 mm |