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我的订单 我的询价 0755-82520436 3307104213

图片

产品型号

品牌

数据表

有效性

单价(CNY)

询价

认证

表面安装

终端数量

JESD-609代码

无铅代码

ECCN 代码

端子表面处理

附加功能

HTS代码

端子位置

终端形式

峰值回流焊温度(摄氏度)

功能数量

端子间距

Reach合规守则

时间@峰值回流温度-最大值(s)

引脚数量

JESD-30代码

资历状况

电源电压-最大值(Vsup)

温度等级

电源电压-最小值(Vsup)

端口的数量

操作模式

电源电流-最大值

组织结构

输出特性

座位高度-最大

内存宽度

待机电流-最大值

记忆密度

并行/串行

I/O类型

内存IC类型

输出启用

刷新周期

访问模式

混合内存类型

长度

宽度

SST34HF1622S-70-4E-L1P SST34HF1622S-70-4E-L1P

Silicon Storage Technology 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

SILICON STORAGE TECHNOLOGY INC

BGA

LFBGA,

1048576 words

1000000

85 °C

-20 °C

PLASTIC/EPOXY

LFBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

3 V

56

Obsolete

EAR99

SRAM IS ORGANIZED AS 128K X 16 / 256K X 8; FLASH CAN ALSO BE ORGANIZED AS 2M X 8

8542.32.00.71

BOTTOM

BALL

1

0.8 mm

unknown

56

R-PBGA-B56

不合格

3.3 V

OTHER

2.7 V

ASYNCHRONOUS

1MX16

1.4 mm

16

16777216 bit

存储器电路

10 mm

8 mm

XC17S20XLPDG8I XC17S20XLPDG8I

AMD Xilinx 数据表

N/A

-

最小起订量: 1

倍率: 1

NO

Obsolete

XILINX INC

DIP

DIP,

1

179160 words

179160

85 °C

-40 °C

PLASTIC/EPOXY

DIP

RECTANGULAR

IN-LINE

3.3 V

8

e3

EAR99

Matte Tin (Sn)

8542.32.00.71

DUAL

THROUGH-HOLE

250

1

2.54 mm

compliant

30

8

R-PDIP-T8

不合格

3.6 V

INDUSTRIAL

3 V

SYNCHRONOUS

179160X1

4.5974 mm

1

179160 bit

存储器电路

9.3599 mm

7.62 mm

DS1235YW DS1235YW

Dallas Semiconductor 数据表

N/A

-

最小起订量: 1

倍率: 1

DALLAS SEMICONDUCTOR

Obsolete

EAR99

8542.32.00.71

unknown

S63256 S63256

Asahi Kasei Microsystems Corporation 数据表

N/A

-

最小起订量: 1

倍率: 1

ASAHI KASEI MICRODEVICES CORP

,

活跃

EAR99

8542.32.00.71

unknown

HYG0UEG0AF1P-6SS0E HYG0UEG0AF1P-6SS0E

SK Hynix Inc 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

SK HYNIX INC

FBGA-149

33554432 words

32000000

85 °C

-30 °C

PLASTIC/EPOXY

LFBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

1.8 V

149

活跃

EAR99

IT ALSO CONTAINS 512MBIT(64MBIT X 8) MOBILE DDR SDRAM OPERATES AT 2.7V NOM SUPPLY

8542.32.00.71

BOTTOM

BALL

1

0.8 mm

compliant

R-PBGA-B149

1.95 V

OTHER

1.7 V

SYNCHRONOUS

32MX16

1.4 mm

16

536870912 bit

存储器电路

14 mm

10 mm

AM2764A AM2764A

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

ADVANCED MICRO DEVICES INC

,

Obsolete

EAR99

8542.32.00.71

unknown

TMS4C1060-30N TMS4C1060-30N

NA 数据表

N/A

-

最小起订量: 1

倍率: 1

NO

Obsolete

TEXAS INSTRUMENTS INC

DIP, DIP16,.3

25 ns

70 °C

PLASTIC/EPOXY

DIP

DIP16,.3

RECTANGULAR

IN-LINE

5 V

16

EAR99

8542.32.00.71

DUAL

THROUGH-HOLE

未说明

2.54 mm

not_compliant

未说明

R-PDIP-T16

不合格

COMMERCIAL

0.05 mA

0.01 A

存储器电路

TH50VSF0302BAXB TH50VSF0302BAXB

Toshiba America Electronic Components 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

Obsolete

TOSHIBA CORP

BGA

LBGA, BGA48,6X8,40

100 ns

85 °C

-20 °C

PLASTIC/EPOXY

LBGA

BGA48,6X8,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

3 V

1000000

1048576 words

48

e0

EAR99

Tin/Lead (Sn/Pb)

SRAM IS ORGANISED AS 128K X 8

8542.32.00.71

BOTTOM

BALL

1

1 mm

unknown

48

R-PBGA-B48

不合格

3.6 V

OTHER

2.7 V

ASYNCHRONOUS

0.04 mA

1MX8

1.6 mm

8

0.00003 A

8388608 bit

存储器电路

FLASH+SRAM

12 mm

10 mm

S71WS256NC0BFWAP2 S71WS256NC0BFWAP2

Spansion 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

Obsolete

SPANSION INC

BGA

8 X 11.60 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-84

80 ns

3

16777216 words

16000000

85 °C

-25 °C

PLASTIC/EPOXY

TFBGA

BGA84,10X12,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

1.8 V

84

e1

EAR99

锡银铜

PSRAM IS ORGANIZED AS 4M X 16; SYNCHRONOUS BURST MODE ALSO POSSIBLE

8542.32.00.71

BOTTOM

BALL

260

1

0.8 mm

unknown

40

84

R-PBGA-B84

不合格

1.95 V

OTHER

1.7 V

ASYNCHRONOUS

0.054 mA

16MX16

1.2 mm

16

0.00007 A

268435456 bit

存储器电路

FLASH+PSRAM

11.6 mm

8 mm

TC518128AFL-10 TC518128AFL-10

Toshiba America Electronic Components 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

Obsolete

TOSHIBA CORP

SOIC

100 ns

131072 words

128000

70 °C

PLASTIC/EPOXY

SOP

RECTANGULAR

小概要

5 V

32

CE/AUTO/SELF REFRESH

DUAL

鸥翼

1

1.27 mm

unknown

32

R-PDSO-G32

不合格

5.5 V

COMMERCIAL

4.5 V

1

ASYNCHRONOUS

128KX8

3-STATE

2.8 mm

8

1048576 bit

PARALLEL

PSEUDO STATIC RAM

YES

20.6 mm

8.8 mm

MCM6605AL MCM6605AL

Freescale Semiconductor 数据表

N/A

-

最小起订量: 1

倍率: 1

NO

Obsolete

MOTOROLA SEMICONDUCTOR PRODUCTS

DIP, DIP22,.4

300 ns

4096 words

4000

70 °C

CERAMIC

DIP

DIP22,.4

RECTANGULAR

IN-LINE

22

e0

EAR99

Tin/Lead (Sn/Pb)

8542.32.00.71

DUAL

THROUGH-HOLE

2.54 mm

unknown

R-XDIP-T22

不合格

COMMERCIAL

4KX1

3-STATE

1

4096 bit

SEPARATE

32

MCM6605AL MCM6605AL

Motorola Semiconductor Products 数据表

N/A

-

最小起订量: 1

倍率: 1

NO

Obsolete

MOTOROLA INC

DIP, DIP22,.4

300 ns

4096 words

4000

70 °C

CERAMIC

DIP

DIP22,.4

RECTANGULAR

IN-LINE

22

e0

EAR99

Tin/Lead (Sn/Pb)

8542.32.00.71

DUAL

THROUGH-HOLE

2.54 mm

unknown

R-XDIP-T22

不合格

COMMERCIAL

4KX1

3-STATE

1

4096 bit

SEPARATE

32

S71VS064RB0AHT0L0 S71VS064RB0AHT0L0

Spansion 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

Obsolete

SPANSION INC

, BGA52,6X10,20

85 °C

-25 °C

PLASTIC/EPOXY

BGA52,6X10,20

1.8 V

52

EAR99

8542.32.00.71

260

unknown

40

不合格

OTHER

存储器电路

FLASH+PSRAM

TC528267J-70 TC528267J-70

Toshiba America Electronic Components 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

TOSHIBA CORP

SOJ

70 ns

262144 words

256000

70 °C

PLASTIC/EPOXY

SOJ

RECTANGULAR

小概要

5 V

40

Obsolete

RAS ONLY/CAS BEFORE RAS/HIDDEN/AUTO REFRESH

DUAL

J BEND

1

1.27 mm

unknown

40

R-PDSO-J40

不合格

5.5 V

COMMERCIAL

4.5 V

2

ASYNCHRONOUS

256KX8

3-STATE

3.7 mm

8

2097152 bit

视频DRAM

512

FAST EDO AND PIPELINED PAGE

26.04 mm

10.16 mm

S71VS256RD0ZHE400 S71VS256RD0ZHE400

Spansion 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

Obsolete

SPANSION INC

BGA

TFBGA,

16777216 words

16000000

85 °C

-25 °C

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

1.8 V

56

EAR99

PSRAM IS ORGANIZED AS 8M X 16

8542.32.00.71

BOTTOM

BALL

260

1

0.5 mm

unknown

40

56

R-PBGA-B56

不合格

1.95 V

OTHER

1.7 V

SYNCHRONOUS

16MX16

1.2 mm

16

268435456 bit

存储器电路

9.2 mm

8 mm

SST32HF324C-70-4C-LBKE SST32HF324C-70-4C-LBKE

Silicon Storage Technology 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

Obsolete

SILICON STORAGE TECHNOLOGY INC

BGA

LBGA,

2097152 words

2000000

70 °C

PLASTIC/EPOXY

LBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE

48

e1

EAR99

锡银铜

STATIC RAM IS ORGANIZED AS 256K X 16

8542.32.00.71

BOTTOM

BALL

260

1

1 mm

unknown

48

R-PBGA-B48

不合格

3.3 V

COMMERCIAL

2.7 V

ASYNCHRONOUS

2MX16

1.4 mm

16

33554432 bit

存储器电路

12 mm

10 mm

S72WS256NEEBFWUB0 S72WS256NEEBFWUB0

Spansion 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

Obsolete

SPANSION INC

BGA

LFBGA,

3

16777216 words

16000000

85 °C

-25 °C

PLASTIC/EPOXY

LFBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

1.8 V

137

e1

EAR99

锡银铜

MOBILE SDRAM IS ORGANIZED AS 4M X 16BIT X 4 BANKS; SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

8542.32.00.71

BOTTOM

BALL

260

1

0.8 mm

compliant

40

137

R-PBGA-B137

不合格

1.95 V

OTHER

1.7 V

ASYNCHRONOUS

16MX16

1.4 mm

16

268435456 bit

存储器电路

12 mm

9 mm

AM27C020-70PC AM27C020-70PC

Cypress Semiconductor 数据表

N/A

-

最小起订量: 1

倍率: 1

CYPRESS SEMICONDUCTOR CORP

活跃

compliant

S71GL064NA0BHW0F0 S71GL064NA0BHW0F0

Spansion 数据表

N/A

-

最小起订量: 1

倍率: 1

Obsolete

SPANSION INC

EAR99

8542.32.00.71

260

unknown

40

S71WS256NC0BFWAP0 S71WS256NC0BFWAP0

Spansion 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

Obsolete

SPANSION INC

BGA

8 X 11.60 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-84

80 ns

3

16777216 words

16000000

TFBGA

BGA84,10X12,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

1.8 V

PLASTIC/EPOXY

-25 °C

85 °C

84

e1

EAR99

锡银铜

PSRAM IS ORGANIZED AS 4M X 16; SYNCHRONOUS BURST MODE ALSO POSSIBLE

8542.32.00.71

BOTTOM

BALL

260

1

0.8 mm

unknown

40

84

R-PBGA-B84

不合格

1.95 V

OTHER

1.7 V

ASYNCHRONOUS

0.054 mA

16MX16

1.2 mm

16

0.00007 A

268435456 bit

存储器电路

FLASH+PSRAM

11.6 mm

8 mm

S71WS256NC0BFWAP0 S71WS256NC0BFWAP0

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

活跃

ADVANCED MICRO DEVICES INC

FBGA, BGA84,10X12,32

80 ns

85 °C

-25 °C

PLASTIC/EPOXY

FBGA

BGA84,10X12,32

RECTANGULAR

GRID ARRAY, FINE PITCH

1.8 V

84

EAR99

8542.32.00.71

BOTTOM

BALL

0.8 mm

compliant

R-PBGA-B84

不合格

OTHER

0.066 mA

0.00004 A

存储器电路

FLASH+PSRAM

SAA4955TJ SAA4955TJ

NXP Semiconductors 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

NXP SEMICONDUCTORS

SOJ

SOJ, SOJ40,.44

21 ns

245772 words

245772

70 °C

PLASTIC/EPOXY

SOJ

SOJ40,.44

RECTANGULAR

小概要

3.3 V

40

Obsolete

e3

EAR99

TIN

IT ALSO REQUIRES 3 TO 5.5V SUPPLY

8542.32.00.71

DUAL

J BEND

1

1.27 mm

compliant

40

R-PDSO-J40

不合格

3.6 V

COMMERCIAL

3 V

SYNCHRONOUS

0.07 mA

245772X12

12

0.01 A

2949264 bit

存储器电路

XC17S05PDG8I XC17S05PDG8I

AMD Xilinx 数据表

N/A

-

最小起订量: 1

倍率: 1

NO

Obsolete

XILINX INC

DIP

DIP,

1

53984 words

53984

85 °C

-40 °C

PLASTIC/EPOXY

DIP

RECTANGULAR

IN-LINE

5 V

8

e3

EAR99

Matte Tin (Sn)

8542.32.00.71

DUAL

THROUGH-HOLE

250

1

2.54 mm

compliant

30

8

R-PDIP-T8

不合格

5.5 V

INDUSTRIAL

4.5 V

SYNCHRONOUS

53984X1

4.5974 mm

1

53984 bit

存储器电路

9.3599 mm

7.62 mm

PF38F4050M0Y1Q0 PF38F4050M0Y1Q0

Numonyx Memory Solutions 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

NUMONYX

BGA

TFBGA,

67108864 words

64000000

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

1.8 V

88

Obsolete

EAR99

FLASH IS ALSO ORGANIZED AS 32M X 16 AND 64M X 16, PSEUDO SRAM IS ORGANIZED AS 4M X 16 OR 8M X 16

8542.32.00.71

BOTTOM

BALL

未说明

1

0.8 mm

unknown

未说明

88

R-PBGA-B88

不合格

1.95 V

1.7 V

SYNCHRONOUS

64MX16

1.2 mm

16

1073741824 bit

存储器电路

10 mm

8 mm

PF38F4050M0Y1Q0 PF38F4050M0Y1Q0

Intel Corporation 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

Transferred

INTEL CORP

BGA

TFBGA, BGA107,9X12,32

70 ns

3

67108864 words

64000000

PLASTIC/EPOXY

TFBGA

BGA107,9X12,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

1.8 V

88

e1

EAR99

锡银铜

FLASH IS ALSO ORGANIZED AS 32M X 16 AND 64M X 16, PSEUDO SRAM IS ORGANIZED AS 4M X 16 OR 8M X 16

8542.32.00.71

BOTTOM

BALL

1

0.8 mm

compliant

88

R-PBGA-B88

不合格

1.95 V

1.7 V

SYNCHRONOUS

64MX16

1.2 mm

16

0.00025 A

1073741824 bit

存储器电路

FLASH+PSRAM

10 mm

8 mm