类别是'嵌入式 - 微处理器'
嵌入式 - 微处理器 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 表面安装 | 终端数量 | JESD-609代码 | 无铅代码 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 引脚数量 | JESD-30代码 | 资历状况 | 温度等级 | 速度 | uPs/uCs/外围ICs类型 | 电源电流-最大值 | 位元大小 | 座位高度-最大 | 地址总线宽度 | 边界扫描 | 低功率模式 | 外部数据总线宽度 | 格式 | 集成缓存 | 内存(字) | 串行I/O数 | 外部中断数量 | DMA通道数 | 总剂量 | 长度 | 宽度 | |||||||||||||||||
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![]() | XC7455ARX1250PF | Motorola Semiconductor Products | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | MOTOROLA INC | , | Transferred | 8542.31.00.01 | unknown | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC7455ARX1250PF | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Obsolete | NXP SEMICONDUCTORS | , | 1 | 无 | e0 | 锡铅 | 8542.31.00.01 | 220 | not_compliant | 30 | MICROPROCESSOR, RISC | ||||||||||||||||||||||||||||||||||||||||||
![]() | TSC695F-25MA | Microchip Technology Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 活跃 | MICROCHIP TECHNOLOGY INC | MQFP-256 | 50 MHz | 125 °C | -55 °C | UNSPECIFIED | QFF | QFL256,1.5SQ,20 | SQUARE | FLATPACK | 5.5 V | 4.5 V | 5 V | 256 | 无 | e0 | 3A991.A.2 | 锡铅 | 8542.31.00.01 | QUAD | FLAT | 0.508 mm | compliant | S-XQFP-F256 | 不合格 | MILITARY | 25 MHz | MICROPROCESSOR, RISC | 230 mA | 32 | 3.18 mm | 32 | YES | YES | 32 | 浮点 | NO | 300k Rad(Si) V | 37.085 mm | 37.085 mm | ||||||||||||
![]() | TSPC603RMGU8LC | Teledyne e2v | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | TELEDYNE E2V (UK) LTD | BGA | BGA, | 200 MHz | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | BGA | SQUARE | 网格排列 | 2.625 V | 2.375 V | 2.5 V | 255 | Obsolete | 3A991.A.2 | 8542.31.00.01 | BOTTOM | BALL | 1.27 mm | unknown | 255 | S-CBGA-B255 | 不合格 | MILITARY | 200 MHz | MICROPROCESSOR, RISC | 32 | 3 mm | 32 | YES | YES | 64 | 浮点 | YES | 21 mm | 21 mm | ||||||||||||||||
![]() | TSPC603RMGU8LC | Atmel Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Transferred | ATMEL CORP | BGA | BGA, BGA255,16X16,50 | 66.7 MHz | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | BGA | BGA255,16X16,50 | SQUARE | 网格排列 | 2.625 V | 2.375 V | 2.5 V | 255 | 无 | e0 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 1.27 mm | unknown | 255 | S-CBGA-B255 | 不合格 | MILITARY | 200 MHz | MICROPROCESSOR, RISC | 32 | 3 mm | 32 | YES | YES | 64 | 浮点 | YES | 21 mm | 21 mm | ||||||||||||
![]() | TMPR3927F | Toshiba America Electronic Components | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | TOSHIBA CORP | QFP | 32 X 32 MM, 0.50 MM PITCH, PLASTIC, QFP-240 | 66.66 MHz | 70 °C | PLASTIC/EPOXY | FQFP | SQUARE | FLATPACK, FINE PITCH | 3.6 V | 3 V | 3.3 V | 240 | 无 | QUAD | 鸥翼 | 未说明 | 0.5 mm | unknown | 未说明 | 240 | S-PQFP-G240 | 不合格 | COMMERCIAL | 133 MHz | MICROPROCESSOR, RISC | 32 | 4.45 mm | 20 | NO | NO | 32 | 固定点 | YES | 32 mm | 32 mm | ||||||||||||||||
![]() | TNETV3010CGVC | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | STN8810BDS12HPBE | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | STMICROELECTRONICS | BGA | LFBGA, | 19.2 MHz | PLASTIC/EPOXY | LFBGA | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | 1.2 V | 26 | Obsolete | 8542.31.00.01 | BOTTOM | BALL | 0.5 mm | compliant | 26 | S-PBGA-B26 | 不合格 | 264 MHz | MICROPROCESSOR, RISC | 32 | 1.4 mm | YES | YES | 固定点 | YES | 14 mm | 14 mm | ||||||||||||||||||||||||
![]() | TS80C186EC25 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | INTEL CORP | QFP | QFP, | 50 MHz | 85 °C | -40 °C | PLASTIC/EPOXY | QFP | RECTANGULAR | FLATPACK | 5.5 V | 4.5 V | 5 V | 100 | Obsolete | 3A991.A.2 | DRAM REFRESH CONTROLLER; 3 PROGRAMMABLE TIMERS; EMULATION HARDWARE; NUMERIC COPROCESSOR INTERFACE | 8542.31.00.01 | QUAD | 鸥翼 | 0.65 mm | unknown | 100 | R-PQFP-G100 | 不合格 | INDUSTRIAL | 25 MHz | MICROPROCESSOR | 125 mA | 16 | 3.15 mm | 20 | NO | YES | 16 | 固定点 | NO | 0 | 2 | 9 | 4 | 20 mm | 14 mm | ||||||||||
![]() | TSC695F-25SASV | Microchip Technology Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | MICROCHIP TECHNOLOGY INC | MQFP-256 | 125 °C | -55 °C | PLASTIC/EPOXY | QFF | SQUARE | FLATPACK | 5.5 V | 4.5 V | 5 V | 256 | 活跃 | e4 | 3A001.A.2.C | GOLD | 8542.31.00.01 | QUAD | FLAT | 0.508 mm | compliant | S-PQFP-F256 | MILITARY | 25 MHz | MICROPROCESSOR, RISC | 32 | 3.18 mm | 32 | YES | YES | 32 | 浮点 | NO | 37.085 mm | 37.085 mm | ||||||||||||||||||
![]() | TMPM4KNFYFG | Toshiba America Electronic Components | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | TOSHIBA CORP | , | 不推荐 | 8542.31.00.01 | unknown | MICROPROCESSOR, RISC | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 212816 | EECO Switch | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | SAB8086-1-C | Infineon Technologies AG | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NO | Obsolete | INFINEON TECHNOLOGIES AG | 70 °C | CERAMIC | DIP | DIP40,.6 | RECTANGULAR | IN-LINE | 5 V | 40 | 无 | e0 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | not_compliant | R-XDIP-T40 | 不合格 | COMMERCIAL | 10 MHz | MICROPROCESSOR, RISC | 360 mA | 16 | ||||||||||||||||||||||||||||
![]() | LE80537LG0254M | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | INTEL CORP | BGA | HBGA, | PLASTIC/EPOXY | HBGA | SQUARE | GRID ARRAY, HEAT SINK/SLUG | 1.3 V | 0.75 V | 479 | 有 | 3A991.A.1 | 8542.31.00.01 | BOTTOM | BALL | 1.27 mm | compliant | 479 | S-PBGA-B479 | 不合格 | 1600 MHz | MICROPROCESSOR | 64 | 2.963 mm | 36 | NO | YES | 64 | YES | 35 mm | 35 mm | |||||||||||||||||||||
![]() | SDA3600IAA3CN | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NO | ADVANCED MICRO DEVICES INC | SPGA, PGA940,31X31,50 | CERAMIC | SPGA | PGA940,31X31,50 | SQUARE | GRID ARRAY, SHRINK PITCH | 940 | Obsolete | 3A991.A.2 | 8542.31.00.01 | PERPENDICULAR | PIN/PEG | 1.27 mm | unknown | S-XPGA-P940 | 不合格 | 2000 MHz | MICROPROCESSOR, RISC | 44800 mA | 64 | ||||||||||||||||||||||||||||||||
![]() | PPC440SPE-AGB533C | Applied Micro Circuits Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | APPLIED MICRO CIRCUITS CORP | BGA | BGA, BGA675,26X26,40 | 1 | PLASTIC/EPOXY | BGA | BGA675,26X26,40 | SQUARE | 网格排列 | 1.575 V | 1.425 V | 1.5 V | 66.66 MHz | 675 | 无 | 无 | 3A991.A.2 | 8542.31.00.01 | BOTTOM | BALL | 1 mm | compliant | 675 | S-PBGA-B675 | 不合格 | 533 MHz | MICROPROCESSOR, RISC | 5400 mA | 32 | 3.22 mm | 32 | YES | YES | 64 | 固定点 | YES | 27 mm | 27 mm | ||||||||||||||
![]() | XC7451ARX800RE | Freescale Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | FREESCALE SEMICONDUCTOR INC | , | Transferred | 8542.31.00.01 | unknown | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC7451ARX800RE | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 403GCX-3JC80C2 | IBM | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | IBM MICROELECTRONICS | QFP | PLASTIC/EPOXY | QFP | QFP160,1.2SQ | SQUARE | FLATPACK | 3.3 V | 160 | 接触制造商 | 8542.31.00.01 | QUAD | 鸥翼 | 0.635 mm | unknown | 160 | S-PQFP-G160 | 不合格 | 80 MHz | MICROPROCESSOR, RISC | 320 mA | 32 | |||||||||||||||||||||||||||||||
![]() | UPD70433GD-5BB | Renesas Electronics Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | RENESAS ELECTRONICS CORP | 85 °C | -40 °C | PLASTIC/EPOXY | QFP | QFP120,1.2SQ,32 | SQUARE | FLATPACK | 5 V | 120 | 无 | e0 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | QUAD | 鸥翼 | 0.8 mm | unknown | S-PQFP-G120 | 不合格 | INDUSTRIAL | 12.5 MHz | MICROPROCESSOR, RISC | 130 mA | 16 | |||||||||||||||||||||||||||
![]() | UPD70136AL-12 | Renesas Electronics Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | RENESAS ELECTRONICS CORP | 70 °C | -10 °C | PLASTIC/EPOXY | QCCJ | LDCC68,1.0SQ | SQUARE | CHIP CARRIER | 5 V | 68 | 无 | e0 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | QUAD | J BEND | 1.27 mm | unknown | S-PQCC-J68 | 不合格 | COMMERCIAL | 12.5 MHz | MICROPROCESSOR, RISC | 110 mA | 16 | |||||||||||||||||||||||||||
![]() | TMPR3927AF | Toshiba America Electronic Components | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | TOSHIBA CORP | QFP, QFP240,1.3SQ,20 | PLASTIC/EPOXY | QFP | QFP240,1.3SQ,20 | SQUARE | FLATPACK | 240 | 无 | 8542.31.00.01 | QUAD | 鸥翼 | 0.5 mm | unknown | S-PQFP-G240 | 不合格 | 133 MHz | MICROPROCESSOR, RISC | 32 | |||||||||||||||||||||||||||||||||
![]() | MC9328MXLDVH20 | Freescale Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | FREESCALE SEMICONDUCTOR INC | BGA | LFBGA, BGA256,16X16,32 | 16 MHz | 3 | 70 °C | -30 °C | PLASTIC/EPOXY | LFBGA | BGA256,16X16,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | 2 V | 1.8 V | 1.9 V | 256 | 无 | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.31.00.01 | BOTTOM | BALL | 220 | 0.8 mm | not_compliant | 30 | 256 | S-PBGA-B256 | 不合格 | OTHER | 200 MHz | MICROPROCESSOR, RISC | 32 | 1.6 mm | 25 | YES | YES | 32 | 固定点 | YES | 14 mm | 14 mm | ||||||||||
![]() | MC9328MXLDVH20 | Motorola Semiconductor Products | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Transferred | MOTOROLA INC | LFBGA, BGA256,16X16,32 | 16 MHz | 70 °C | -30 °C | PLASTIC/EPOXY | LFBGA | BGA256,16X16,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | 2 V | 1.8 V | 1.9 V | 256 | 无 | 8542.31.00.01 | BOTTOM | BALL | 0.8 mm | unknown | S-PBGA-B256 | 不合格 | OTHER | 200 MHz | MICROPROCESSOR, RISC | 32 | 1.6 mm | 25 | YES | YES | 32 | 固定点 | YES | 14 mm | 14 mm | |||||||||||||||||
![]() | P3041PSE1MZB | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 |