类别是'嵌入式 - CPLD（复杂可编程逻辑器件）'
嵌入式 - CPLD（复杂可编程逻辑器件） (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 终端数量 | 厂商 | 操作温度 | 包装 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 子类别 | 技术 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 端子间距 | Reach合规守则 | 频率 | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源 | 温度等级 | 可编程类型 | 最大电源电压 | 最小电源电压 | 工作电源电流 | 电源电流 | 传播延迟 | 接通延迟时间 | 组织结构 | 座位高度-最大 | 可编程逻辑类型 | 逻辑元件/单元数 | 产品类别 | 阀门数量 | 最高频率 | 可编程I/O数 | 逻辑块数(LABs) | 速度等级 | 输出功能 | 宏细胞数 | JTAG BST | 内部供电电压 | 延迟时间 tpd(1)最大 | 逻辑元素/块的数量 | 系统内可编程 | 产品类别 | 高度 | 长度 | 宽度 | 辐射硬化 | 达到SVHC | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
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.png) | EPM7032STC44-7 | ALTERA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 32 | Bag | EPM7032 | Obsolete | 表面贴装 | 44-TQFP | 44-TQFP (10x10) | Altera | 36 | 0°C ~ 70°C (TA) | Tray | MAX® 7000S | Obsolete | EPM7032 | 系统内可编程 | 600 | 4.75 V ~ 5.25 V | 7.5ns | 2 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EPM7128AETC100-10 | ALTERA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 128 | LFQFP, TQFP100,.63SQ | FLATPACK, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | TQFP100,.63SQ | 3.3 V | 30 | 3 V | 70 °C | 无 | EPM7128AETC100-10 | 98 MHz | LFQFP | SQUARE | Intel Corporation | 活跃 | 84 | INTEL CORP | 3.6 V | 1.59 | 表面贴装 | 100-TQFP | YES | 100-TQFP (14x14) | 100 | 84 | 0°C ~ 70°C (TA) | Tray | MAX® 7000A | e0 | 活跃 | EAR99 | Tin/Lead (Sn85Pb15) | YES | 8542.39.00.01 | 可编程逻辑器件 | CMOS | QUAD | 鸥翼 | 235 | 0.5 mm | not_compliant | EPM7128 | S-PQFP-G100 | 不合格 | 2.5/3.3,3.3 V | COMMERCIAL | 系统内可编程 | 10 ns | 0 DEDICATED INPUTS, 84 I/O | 1.27 mm | EE PLD | 2500 | MACROCELL | 128 | YES | 3 V ~ 3.6 V | 10.0ns | 8 | YES | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EPM1270T144C3N | ALTERA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 980 | MSL 3 - 168 hours | 22 X 22 MM, 0.50 MM PITCH, LEAD FREE, TQFP-144 | FLATPACK, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | QFP144,.87SQ,20 | 2.5 V | 40 | 2.375 V | 85 °C | 有 | 2.625 V | 3.35 | QFP | ALTERA CORP | CPLD, MAX II | 116 | Transferred | Altera Corporation | SQUARE | LFQFP | EPM1270T144C3N | 表面贴装 | 144-LQFP | YES | 144-TQFP (20x20) | 144 | 116 | 0°C ~ 85°C (TJ) | Tray | MAX® II | e3 | 有 | 活跃 | 3A991 | Matte Tin (Sn) - annealed | IT CAN ALSO OPERATE AT 3.3V | 8542.39.00.01 | 可编程逻辑器件 | CMOS | QUAD | 鸥翼 | 260 | 0.5 mm | unknown | 304MHz | EPM1270 | 144 | S-PQFP-G144 | 不合格 | 1.5/3.3,2.5/3.3 V | OTHER | 系统内可编程 | 3.7ns | 0 DEDICATED INPUTS, 116 I/O | 1.6 mm | 闪存 PLD | MACROCELL | 980 | YES | 2.5V, 3.3V | 6.2ns | 1270 | YES | 20 mm | 20 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| EPM570GF100I5N | ALTERA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 440 | 表面贴装 | 100-LBGA | 100-FBGA (11x11) | 76 | -40°C ~ 100°C (TJ) | Tray | MAX® II | 活跃 | EPM570 | 系统内可编程 | 1.71 V ~ 1.89 V | 5.4ns | 570 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EPM7192EGI160-20 | ALTERA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 192 | PGA, PGA160M,15X15 | 网格排列 | 1 | CERAMIC, METAL-SEALED COFIRED | PGA160M,15X15 | -40 °C | 5 V | 30 | 4.5 V | 85 °C | 无 | EPM7192EGI160-20 | 83.3 MHz | PGA | SQUARE | Intel Corporation | Obsolete | 124 | INTEL CORP | 5.5 V | 5.18 | 表面贴装 | 160-BPGA | NO | 160-PGA (39.6x39.6) | 160 | 124 | -40°C ~ 85°C (TA) | Tray | MAX® 7000 | e0 | Obsolete | EAR99 | Tin/Lead (Sn/Pb) | CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V | 8542.39.00.01 | 可编程逻辑器件 | CMOS | PERPENDICULAR | PIN/PEG | 220 | 2.54 mm | compliant | EPM7192 | S-CPGA-P160 | 不合格 | 3.3/5,5 V | INDUSTRIAL | EE PLD | 20 ns | 0 DEDICATED INPUTS, 124 I/O | 5.34 mm | EE PLD | 3750 | MACROCELL | 192 | NO | 4.5 V ~ 5.5 V | 20.0ns | 12 | NO | 39.624 mm | 39.624 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EPM570F100I5 | ALTERA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 440 | LBGA, BGA100,10X10,40 | GRID ARRAY, LOW PROFILE | PLASTIC/EPOXY | BGA100,10X10,40 | 2.5 V | 未说明 | 2.375 V | 无 | EPM570F100I5 | LBGA | SQUARE | Intel Corporation | 活跃 | 76 | INTEL CORP | 2.625 V | 1.97 | 表面贴装 | 100-LBGA | YES | 100-FBGA (11x11) | 100 | 76 | -40°C ~ 100°C (TJ) | Tray | MAX® II | e0 | 活跃 | 锡铅 | IT CAN ALSO OPERATE AT 3.3V | 8542.39.00.01 | 可编程逻辑器件 | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | EPM570 | S-PBGA-B100 | 不合格 | 1.5/3.3,2.5/3.3 V | 系统内可编程 | 7.5 ns | 0 DEDICATED INPUTS, 76 I/O | 1.7 mm | 闪存 PLD | MACROCELL | 440 | YES | 2.5V, 3.3V | 5.4ns | 570 | YES | 11 mm | 11 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EPM7064STC100-10N | ALTERA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 64 | 8542390000, 8542390000/8542390000/8542390000/8542390000/8542390000 | Compliant | EEPROM | 表面贴装 | 100-TQFP | 100 | 100-TQFP (14x14) | 68 | 0°C ~ 70°C (TA) | Tray | MAX® 7000S | Obsolete | 70 °C | 0 °C | 125 MHz | EPM7064 | 5 V | 系统内可编程 | 5.25 V | 4.75 V | 10 ns | 10 ns | 4 | 1250 | 175.4 MHz | 68 | 4 | 10 | 4.75 V ~ 5.25 V | 10.0ns | 4 | 1 mm | 14 mm | 14 mm | 无 | Unknown | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EPM7064LC84-15 | ALTERA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 64 | 8542390000, 8542390000/8542390000, 8542390000/8542390000/8542390000, 8542390000/8542390000/8542390000/8542390000 | Compliant | EEPROM | 表面贴装 | 84-LCC (J-Lead) | 84 | 84-PLCC (29.31x29.31) | 68 | 0°C ~ 70°C (TA) | Tube | MAX® 7000 | Obsolete | 70 °C | 0 °C | 100 MHz | EPM7064 | 5 V | EE PLD | 5.25 V | 4.75 V | 15 ns | 15 ns | 4 | 1250 | 151.5 MHz | 68 | 4 | 15 | 4.75 V ~ 5.25 V | 15.0ns | 4 | 3.81 mm | 29.31 mm | 29.31 mm | 无 | 含铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EPM570T100C3N | ALTERA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 440 | Lead free / RoHS Compliant | 544-1315 EPM570T100C3N-ND | TFQFP, TQFP100,.63SQ | FLATPACK, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | TQFP100,.63SQ | 2.5 V | 40 | 2.375 V | 85 °C | 有 | EPM570T100C3N | TFQFP | SQUARE | Intel Corporation | 活跃 | 76 | CPLD, MAX II | INTEL CORP | 2.625 V | 1.18 | 表面贴装 | 100-TQFP | YES | 100-TQFP (14x14) | 100 | 76 | 0°C ~ 85°C (TJ) | Tray | MAX® II | e3 | 活跃 | 3 (168 Hours) | MATTE TIN (472) OVER COPPER | IT CAN ALSO OPERATE AT 3.3V | 8542.39.00.01 | 可编程逻辑器件 | CMOS | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | EPM570 | S-PQFP-G100 | 不合格 | 1.5/3.3,2.5/3.3 V | OTHER | 系统内可编程 | 5.4 ns | 0 DEDICATED INPUTS, 76 I/O | 1.2 mm | 闪存 PLD | MACROCELL | 440 | YES | 2.5V, 3.3V | 5.4ns | 570 | YES | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EPM7160SLC84-10 | ALTERA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 160 | QCCJ, LDCC84,1.2SQ | CHIP CARRIER | 2 | PLASTIC/EPOXY | LDCC84,1.2SQ | 5 V | 30 | 4.75 V | 70 °C | 无 | EPM7160SLC84-10 | 125 MHz | QCCJ | SQUARE | Intel Corporation | Obsolete | 64 | INTEL CORP | 5.25 V | 7.33 | 表面贴装 | 84-LCC (J-Lead) | YES | 84-PLCC (29.31x29.31) | 84 | 64 | 0°C ~ 70°C (TA) | Tray | MAX® 7000S | e0 | Obsolete | Tin/Lead (Sn/Pb) | CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V | 8542.39.00.01 | 可编程逻辑器件 | CMOS | QUAD | J BEND | 220 | 1.27 mm | compliant | EPM7160 | S-PQCC-J84 | 不合格 | 3.3/5,5 V | COMMERCIAL | 系统内可编程 | 10 ns | 0 DEDICATED INPUTS, 64 I/O | 5.08 mm | EE PLD | 3200 | MACROCELL | 160 | YES | 4.75 V ~ 5.25 V | 10.0ns | 10 | YES | 29.3116 mm | 29.3116 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EPM9560RC240-15 | ALTERA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 560 | 8542390000, 8542390000/8542390000/8542390000/8542390000/8542390000 | Compliant | EEPROM | FQFP, HQFP240,1.37SQ,20 | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | HQFP240,1.37SQ,20 | 5 V | 30 | 4.75 V | 70 °C | 无 | EPM9560RC240-15 | 117.6 MHz | FQFP | SQUARE | Intel Corporation | Obsolete | 191 | INTEL CORP | 5.25 V | 8.25 | 表面贴装 | 240-BFQFP Exposed Pad | YES | 240 | 240-RQFP (32x32) | 240 | 191 | 0°C ~ 70°C (TA) | Tray | MAX® 9000 | e0 | Obsolete | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | 772 FLIP FLOPS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V | 8542.39.00.01 | 可编程逻辑器件 | CMOS | QUAD | 鸥翼 | 220 | 0.5 mm | compliant | 117.6 MHz | EPM9560 | S-PQFP-G240 | 不合格 | 5 V | 3.3/5,5 V | COMMERCIAL | 系统内可编程 | 5.25 V | 4.75 V | 146 mA | 146 mA | 15 ns | 0 DEDICATED INPUTS, 191 I/O | 4.1 mm | EE PLD | 35 | 12000 | 144 MHz | 191 | 35 | 15 | MACROCELL | 560 | YES | 4.75 V ~ 5.25 V | 15.0ns | 35 | YES | 32 mm | 32 mm | 含铅 | |||||||||||||||||||||||||||||||||||||||
| EPM7064BFC100-3 | ALTERA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 64 | 8542390000, 8542390000/8542390000/8542390000/8542390000/8542390000 | Compliant | EEPROM | 表面贴装 | 100-LBGA | 100 | 100-FBGA (11x11) | 68 | 0°C ~ 70°C (TA) | Tray | MAX® 7000B | Obsolete | 70 °C | 0 °C | 333.33 MHz | EPM7064 | 2.5 V | 系统内可编程 | 2.625 V | 2.375 V | 3.5 ns | 3.5 ns | 4 | 1250 | 303 MHz | 68 | 4 | 2.375 V ~ 2.625 V | 3.5ns | 4 | 无 | 含铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EPM7064STC44-5F | ALTERA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 64 | Compliant | 表面贴装 | 44-TQFP | 44-TQFP (10x10) | 36 | 0°C ~ 70°C (TA) | Tray | MAX® 7000S | Obsolete | 70 °C | 0 °C | EPM7064 | 系统内可编程 | 1250 | 4 | 4.75 V ~ 5.25 V | 5.0ns | 4 | 含铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EPM570F100C4N | ALTERA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 440 | 表面贴装 | 100-LBGA | 100-FBGA (11x11) | 76 | 0°C ~ 85°C (TJ) | Tray | MAX® II | 活跃 | EPM570 | 系统内可编程 | 2.5V, 3.3V | 5.4ns | 570 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EPM7032AELC44-4N | ALTERA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 32 | PLASTIC, LCC-44 | CHIP CARRIER | 3 | PLASTIC/EPOXY | LDCC44,.7SQ | 3.3 V | 40 | 3 V | 70 °C | 有 | EPM7032AELC44-4N | 227.3 MHz | QCCJ | SQUARE | Altera Corporation | Transferred | 36 | ALTERA CORP | 3.6 V | 5.19 | LCC | 表面贴装 | 44-LCC (J-Lead) | YES | 44-PLCC (16.59x16.59) | 44 | 36 | 0°C ~ 70°C (TA) | Tray | MAX® 7000A | e3 | 有 | 活跃 | EAR99 | Matte Tin (Sn) - annealed | 32 MACROCELLS; 2 LABS; CONFIGURABLE I/O OPERATION WITH 2.5 OR 3.3 | 8542.39.00.01 | 可编程逻辑器件 | CMOS | QUAD | J BEND | 245 | 1.27 mm | unknown | EPM7032 | 44 | S-PQCC-J44 | 不合格 | 2.5/3.3,3.3 V | COMMERCIAL | 系统内可编程 | 4.5 ns | 0 DEDICATED INPUTS, 36 I/O | 4.57 mm | EE PLD | 600 | MACROCELL | 32 | YES | 3 V ~ 3.6 V | 4.5ns | 2 | YES | 16.5862 mm | 16.5862 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EPM240GT100C5 | ALTERA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 192 | Bulk | 活跃 | TFQFP, TQFP100,.63SQ | FLATPACK, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | TQFP100,.63SQ | 1.8 V | 30 | 1.71 V | 85 °C | 无 | EPM240GT100C5 | TFQFP | SQUARE | Intel Corporation | 活跃 | 80 | INTEL CORP | 1.89 V | 1.41 | 表面贴装 | 100-TQFP | YES | 100-TQFP (14x14) | 100 | Altera | 80 | 0°C ~ 85°C (TJ) | Tray | MAX® II | e0 | 活跃 | EAR99 | 锡铅 | YES | 8542.39.00.01 | 可编程逻辑器件 | CMOS | QUAD | 鸥翼 | 235 | 0.5 mm | compliant | EPM240 | S-PQFP-G100 | 不合格 | 1.5/3.3,1.8 V | 商业扩展 | 系统内可编程 | 7.5 ns | 0 DEDICATED INPUTS, 80 I/O | 1.2 mm | 闪存 PLD | MACROCELL | 192 | YES | 1.71 V ~ 1.89 V | 4.7ns | 240 | YES | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EPM7064AELC44-4 | ALTERA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 64 | Compliant | EEPROM | QCCJ, LDCC44,.7SQ | CHIP CARRIER | 1 | PLASTIC/EPOXY | LDCC44,.7SQ | 3.3 V | 30 | 3 V | 70 °C | 无 | EPM7064AELC44-4 | 222.2 MHz | QCCJ | SQUARE | Intel Corporation | 活跃 | 36 | INTEL CORP | 3.6 V | 5.11 | 表面贴装 | 44-LCC (J-Lead) | YES | 44 | 44-PLCC (16.59x16.59) | 44 | 36 | 0°C ~ 70°C (TA) | Tube | MAX® 7000A | e0 | 活跃 | EAR99 | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | 64 MICROCELLS; 4 LABS; CONFIGURABLE I/O OPERATION WITH 2.5 OR 3.3 | 8542.39.00.01 | 可编程逻辑器件 | CMOS | QUAD | J BEND | 220 | 1.27 mm | compliant | 250 MHz | EPM7064 | S-PQCC-J44 | 不合格 | 3.3 V | 2.5/3.3,3.3 V | COMMERCIAL | 系统内可编程 | 3.6 V | 3 V | 4.5 ns | 4.5 ns | 0 DEDICATED INPUTS, 36 I/O | 4.57 mm | EE PLD | 4 | 1250 | 222.2 MHz | 36 | 4 | 4 | MACROCELL | 64 | YES | 3 V ~ 3.6 V | 4.5ns | 4 | YES | 16.5862 mm | 16.5862 mm | 无 | 含铅 | |||||||||||||||||||||||||||||||||||||||
| EPM240F100I5 | ALTERA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 192 | BGA, BGA100,10X10,40 | 网格排列 | PLASTIC/EPOXY | BGA100,10X10,40 | 无 | EPM240F100I5 | BGA | SQUARE | Intel Corporation | 活跃 | INTEL CORP | 2.03 | 表面贴装 | 100-LBGA | YES | 100-FBGA (11x11) | 100 | 80 | -40°C ~ 100°C (TJ) | Tray | MAX® II | 活跃 | YES | 可编程逻辑器件 | CMOS | BOTTOM | BALL | 1 mm | compliant | EPM240 | S-PBGA-B100 | 不合格 | 1.5/3.3,2.5/3.3 V | 系统内可编程 | 7.5 ns | 闪存 PLD | 192 | YES | 2.5V, 3.3V | 4.7ns | 240 | YES | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EPM7032STC44-10FN | ALTERA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 36 | Compliant | 表面贴装 | 44-TQFP | 44-TQFP (10x10) | 32 | 0°C ~ 70°C (TA) | Tray | MAX® 7000S | Obsolete | 70 °C | 0 °C | EPM7032 | 系统内可编程 | 600 | 2 | 4.75 V ~ 5.25 V | 10.0ns | 2 | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EPM1270M256C5N | ALTERA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 980 | MAX II | 11 x 11 x 1.05mm | 3 V | MBGA | +85 °C | 0 °C | 1270 | 3.6 V | Flash | 有 | BGA, BGA256,20X20,20 | 网格排列 | 3 | PLASTIC/EPOXY | BGA256,20X20,20 | 2.5 V | 40 | 2.375 V | 85 °C | 有 | EPM1270M256C5N | BGA | RECTANGULAR | Intel Corporation | 活跃 | 212 | INTEL CORP | 2.625 V | 1.35 | 表面贴装 | 256-TFBGA | YES | 256-MBGA (11x11) | 256 | 212 | 0°C ~ 85°C (TJ) | Tray | MAX® II | e1 | 活跃 | 3A991 | 锡银铜 | IT CAN ALSO OPERATE AT 3.3V | 8542.39.00.01 | 可编程逻辑器件 | CMOS | BOTTOM | BALL | 260 | 0.5 mm | compliant | EPM1270 | 256 | R-PBGA-B256 | 不合格 | 1.5/3.3,2.5/3.3 V | OTHER | 系统内可编程 | 6.2ns | 0 DEDICATED INPUTS, 212 I/O | 闪存 PLD | MACROCELL | 980 | YES | 2.5V, 3.3V | 6.2ns | 1270 | YES | 1.05mm | 11mm | 11mm | ||||||||||||||||||||||||||||||||||||||||||||||||
| EPM7128AEFC100-10N | ALTERA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 128 | 8542390000, 8542390000/8542390000/8542390000/8542390000/8542390000 | Compliant | EEPROM | FINE LINE, BGA-100 | GRID ARRAY, LOW PROFILE | 3 | PLASTIC/EPOXY | BGA100,10X10,40 | 3.3 V | 40 | 3 V | 70 °C | 有 | EPM7128AEFC100-10N | 98 MHz | LBGA | SQUARE | Altera Corporation | Transferred | 84 | ALTERA CORP | 3.6 V | 5.08 | BGA | 表面贴装 | 100-LBGA | YES | 100 | 100-FBGA (11x11) | 100 | 84 | 0°C ~ 70°C (TA) | Tray | MAX® 7000A | e1 | 有 | 活跃 | 3A991 | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | YES | 8542.39.00.01 | 可编程逻辑器件 | CMOS | BOTTOM | BALL | 260 | 1 mm | unknown | 125 MHz | EPM7128 | 100 | S-PBGA-B100 | 不合格 | 3.3 V | 2.5/3.3,3.3 V | COMMERCIAL | 系统内可编程 | 3.6 V | 3 V | 10 ns | 10 ns | 0 DEDICATED INPUTS, 84 I/O | 1.7 mm | EE PLD | 8 | 2500 | 192.3 MHz | 8 | 10 | MACROCELL | 128 | YES | 3 V ~ 3.6 V | 10.0ns | 8 | YES | 11 mm | 11 mm | 无 | 无铅 | ||||||||||||||||||||||||||||||||||||
| EPM7256AEFC100-10 | ALTERA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 256 | 有 | 5.5 ns | + 70 C | 3.6 V | 0 C | 176 | 3 V | SMD/SMT | 16 | 972545 | Intel | Intel / Altera | 172.4 MHz | MAX 7000 | N | EEPROM | LBGA, BGA100,10X10,40 | GRID ARRAY, LOW PROFILE | 3 | PLASTIC/EPOXY | BGA100,10X10,40 | 3.3 V | 30 | 70 °C | 无 | EPM7256AEFC100-10 | 95.2 MHz | LBGA | SQUARE | 活跃 | 84 | INTEL CORP | 1.65 | CPLD - Complex Programmable Logic Devices | 表面贴装 | 100-LBGA | YES | 100 | 100-FBGA (11x11) | 100 | 84 | 0°C ~ 70°C (TA) | Tray | MAX® 7000A | e0 | 活跃 | 3A991 | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | YES | 8542.39.00.01 | 可编程逻辑集成电路 | CMOS | BOTTOM | BALL | 235 | 1 mm | compliant | 125 MHz | EPM7256 | S-PBGA-B100 | 不合格 | 3.3 V | 2.5/3.3,3.3 V | COMMERCIAL | 系统内可编程 | 3.6 V | 3 V | 10 ns | 10 ns | 0 DEDICATED INPUTS, 84 I/O | 1.7 mm | EE PLD | 16 | 5000 | 172.4 MHz | 84 | 16 | 10 | MACROCELL | 256 | YES | 3 V ~ 3.6 V | 10.0ns | 16 | YES | CPLD - Complex Programmable Logic Devices | 11 mm | 11 mm | 无 | 含铅 | ||||||||||||||||||||||||||
| EPM7256AEFC100-10N | ALTERA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 256 | Compliant | EEPROM | LBGA, BGA100,10X10,40 | GRID ARRAY, LOW PROFILE | 3 | PLASTIC/EPOXY | BGA100,10X10,40 | 3.3 V | 40 | 3 V | 70 °C | 有 | EPM7256AEFC100-10N | 95.2 MHz | LBGA | SQUARE | Intel Corporation | 活跃 | 84 | INTEL CORP | 3.6 V | 1.49 | 表面贴装 | 100-LBGA | YES | 100 | 100-FBGA (11x11) | 100 | 84 | 0°C ~ 70°C (TA) | Tray | MAX® 7000A | e1 | 活跃 | 3A991 | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | YES | 8542.39.00.01 | 可编程逻辑器件 | CMOS | BOTTOM | BALL | 260 | 1 mm | compliant | 125 MHz | EPM7256 | S-PBGA-B100 | 不合格 | 3.3 V | 2.5/3.3,3.3 V | COMMERCIAL | 系统内可编程 | 3.6 V | 3 V | 10 ns | 10 ns | 0 DEDICATED INPUTS, 84 I/O | 1.7 mm | EE PLD | 16 | 5000 | 172.4 MHz | 84 | 16 | 10 | MACROCELL | 256 | YES | 3 V ~ 3.6 V | 10.0ns | 16 | YES | 11 mm | 11 mm | 无铅 | ||||||||||||||||||||||||||||||||||||||||
| EPM1270GF256C5 | ALTERA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 980 | BGA, BGA256,16X16,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA256,16X16,40 | 1.8 V | 30 | 1.71 V | 85 °C | 无 | EPM1270GF256C5 | BGA | SQUARE | Intel Corporation | 活跃 | 212 | INTEL CORP | 1.89 V | 5 | 表面贴装 | 256-BGA | YES | 256-FBGA (17x17) | 256 | 212 | 0°C ~ 85°C (TJ) | Tray | MAX® II | e0 | 活跃 | 3A991 | 锡铅 | YES | 8542.39.00.01 | 可编程逻辑器件 | CMOS | BOTTOM | BALL | 220 | 1 mm | compliant | EPM1270 | S-PBGA-B256 | 不合格 | 1.5/3.3,1.8 V | 商业扩展 | 系统内可编程 | 10 ns | 0 DEDICATED INPUTS, 212 I/O | 2.2 mm | 闪存 PLD | MACROCELL | 980 | YES | 1.71 V ~ 1.89 V | 6.2ns | 1270 | YES | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EPM570T144A5N | ALTERA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 440 | LFQFP, QFP144,.87SQ,20 | FLATPACK, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | QFP144,.87SQ,20 | -40 °C | 2.5 V | 40 | 2.375 V | 125 °C | 有 | EPM570T144A5N | LFQFP | SQUARE | Intel Corporation | 活跃 | 116 | INTEL CORP | 2.625 V | 5 | 表面贴装 | 144-LQFP | YES | 144-TQFP (20x20) | 144 | 116 | -40°C ~ 125°C (TJ) | Tray | MAX® II | e3 | 活跃 | EAR99 | MATTE TIN (472) OVER COPPER | IT CAN ALSO OPERATE AT 3.3V | 8542.39.00.01 | 可编程逻辑器件 | CMOS | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | EPM570 | S-PQFP-G144 | 不合格 | 1.5/3.3,2.5/3.3 V | AUTOMOTIVE | 系统内可编程 | 8.7 ns | 0 DEDICATED INPUTS, 116 I/O | 1.6 mm | 闪存 PLD | MACROCELL | 440 | YES | 2.5V, 3.3V | 5.4ns | 570 | YES | 20 mm | 20 mm |