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询价

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包装/外壳

表面安装

供应商器件包装

终端数量

厂商

操作温度

包装

系列

尺寸/尺寸

容差

JESD-609代码

零件状态

湿度敏感性等级(MSL)

终端

ECCN 代码

温度系数

端子表面处理

组成

应用

HTS代码

电容量

子类别

技术

端子位置

终端形式

峰值回流焊温度(摄氏度)

端子间距

Reach合规守则

额定电流

引脚数量

JESD-30代码

输出的数量

资历状况

输出电压

输出类型

工作电源电压

引线间距

电源

温度等级

电压

工作电源电流

速度

内存大小

引线样式

核心处理器

极数

周边设备

程序内存大小

连接方式

开关类型

建筑学

数据总线宽度

输入数量

座位高度-最大

可编程逻辑类型

工具类型

产品类别

最高频率

筛选水平

速度等级

主要属性

频带数量

寄存器数量

逻辑单元数

核数量

闪光大小

断开类型

连接类型

特征

输入电压(交流电)

输入电压

产品类别

轴承

知识产权评级

座位高度(最大)

长度

宽度

厚度(最大)

评级结果

XCZU9EG-3FFVC900E XCZU9EG-3FFVC900E

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

FCBGA

1.0000 V

0.97 V

1.03 V

204

Tray

XCZU9

活跃

900-BBGA, FCBGA

900-FCBGA (31x31)

AMD

599,550

0 to 100 °C

Zynq® UltraScale+™ MPSoC EG

900

600MHz, 1.5GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

扩展工业

3

Zynq®UltraScale+™ FPGA, 599K+ Logic Cells

548,160

-

XCZU15EG-L2FFVB1156E XCZU15EG-L2FFVB1156E

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

0.698, 0.808 V

0.742, 0.892 V

328

Tray

XCZU15

活跃

1156-BBGA, FCBGA

1156-FCBGA (35x35)

AMD

0.72, 0.85 V

0 to 110 °C

Zynq® UltraScale+™ MPSoC EG

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

2L

Zynq®UltraScale+™ FPGA, 747K+ Logic Cells

-

M2S090-1FGG484I M2S090-1FGG484I

Microchip 数据表

N/A

-

最小起订量: 1

倍率: 1

1.14 V

1.26 V

267

Tray

M2S090

活跃

484-BGA

484-FPBGA (23x23)

微芯片技术

1.2000 V

-40 to 100 °C

SmartFusion®2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

1

FPGA - 90K Logic Modules

512KB

AGFA008R16A2E3V AGFA008R16A2E3V

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

活跃

-

-

Intel

384

0°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 764K Logic Elements

-

AGFA027R24C2E1VR2 AGFA027R24C2E1VR2

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

活跃

-

-

Intel

744

0°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.7M Logic Elements

-

XCZU49DR-2FFVF1760I XCZU49DR-2FFVF1760I

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

活跃

1760-BBGA, FCBGA

1760-FCBGA (42.5x42.5)

AMD

622

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ RFSoC

533MHz, 1.333GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

AGFD019R25A2I3V AGFD019R25A2I3V

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

活跃

-

-

Intel

480

-40°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.9M Logic Elements

-

AGFC023R25A1E1V AGFC023R25A1E1V

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

活跃

-

-

Intel

480

0°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.3M Logic Elements

-

AGFA008R24C3E3V AGFA008R24C3E3V

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

活跃

-

-

Intel

576

0°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 764K Logic Elements

-

XCVC1502-2MSENSVG1369 XCVC1502-2MSENSVG1369

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

CE, CSA, UL

Cutler Hammer, Div of Eaton Corp

Panel

478

Tray

活跃

AMD

PDG23F0150P3YK

Versal™ AI Core

150 A

600MHz, 1.4GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 800k Logic Cells

-

XC7Z020-3CLG484E XC7Z020-3CLG484E

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

CE

Honeywell

130

Tray

XC7Z020

活跃

484-LFBGA, CSPBGA

484-CSPBGA (19x19)

AMD

VH3G7LEF2/M

0°C ~ 100°C (TJ)

Zynq®-7000

866MHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Artix™-7 FPGA, 85K Logic Cells

-

Lug

1SX065HH3F35I2LG 1SX065HH3F35I2LG

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

Hubbell

392

Tray

活跃

1152-BBGA, FCBGA

1152-FBGA (35x35)

Intel

IN430FS1

-40°C ~ 100°C (TJ)

Stratix® 10 SX

1.5GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

FPGA - 650K Logic Elements

-

XCZU4EV-1FBVB900E XCZU4EV-1FBVB900E

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

CE

Hollowshaft

Hollow

Dynapar

204

Tray

XCZU4

活跃

900-BBGA, FCBGA

900-FCBGA (31x31)

AMD

HS35R05009141

-40 to 85 Degrees C

Zynq® UltraScale+™ MPSoC EV

7 Pin Connector

5~26 VDC

Differential

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

1

Zynq®UltraScale+™ FPGA, 192K+ Logic Cells

-

5~26 VDC

IP67

XCZU6EG-L1FFVC900I XCZU6EG-L1FFVC900I

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

0.808 V

0.892 V

204

Tray

XCZU6

活跃

900-BBGA, FCBGA

900-FCBGA (31x31)

AMD

0.8500 V

-40 to 100 °C

Zynq® UltraScale+™ MPSoC EG

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

1L

Zynq®UltraScale+™ FPGA, 469K+ Logic Cells

-

XCZU9CG-2FFVB1156E XCZU9CG-2FFVB1156E

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

0.808 V

0.892 V

328

Tray

XCZU9

活跃

1156-BBGA, FCBGA

1156-FCBGA (35x35)

AMD

0.8500 V

0 to 100 °C

Zynq® UltraScale+™ MPSoC CG

533MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

2

Zynq®UltraScale+™ FPGA, 599K+ Logic Cells

-

XCZU3CG-1SFVA625I XCZU3CG-1SFVA625I

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

FCBGA

0.8500 V

0.808 V

180

0.892 V

180

Bulk

XCZU3

活跃

Industrial grade

625-BFBGA, FCBGA

625-FCBGA (21x21)

AMD

154,350

-40 to 100 °C

Zynq® UltraScale+™ MPSoC CG

625

500MHz, 1.2GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Industrial

1

Zynq®UltraScale+™ FPGA, 154K+ Logic Cells

141,120

-

XCZU2EG-1SFVA625I XCZU2EG-1SFVA625I

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

XCZU2

活跃

625-BFBGA, FCBGA

625-FCBGA (21x21)

AMD

180

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 103K+ Logic Cells

-

A2F500M3G-FG256I A2F500M3G-FG256I

Microchip 数据表

N/A

-

最小起订量: 1

倍率: 1

Continental Belt

265 Inches

MCU - 25, FPGA - 66

Tray

A2F500

活跃

256-LBGA

256-FPBGA (17x17)

微芯片技术

11/5V2650

-40°C ~ 100°C (TJ)

SmartFusion®

80MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

STD

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

11

512KB

M2S090TS-1FGG484M M2S090TS-1FGG484M

Microchip 数据表

N/A

-

最小起订量: 1

倍率: 1

CUL, UL

Cutler Hammer, Div of Eaton Co

267

Tray

活跃

M2S090

-

166 MHz

86316 LE

SMD/SMT

-

64 kB

FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-55 °C

1.2 V

40

1.14 V

125 °C

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.8

484-BGA

YES

484-FPBGA (23x23)

484

微芯片技术

DH361UGK

-55°C ~ 125°C (TJ)

SmartFusion®2

e1

3A001.A.2.C

Tin/Silver/Copper (Sn/Ag/Cu)

Metallic

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

250

1 mm

compliant

30 A

S-PBGA-B484

267

不合格

1.2 V

MILITARY

600 V

166MHz

64KB

ARM® Cortex®-M3

3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

重型

MCU, FPGA

267

2.44 mm

现场可编程门阵列

FPGA - 90K Logic Modules

86316

1 Core

512KB

23 mm

23 mm

M2S100S-1FCG1152I M2S100S-1FCG1152I

Microchip 数据表

N/A

-

最小起订量: 1

倍率: 1

ACH580-BCR-046A-2+B056

ABB

Panel

ACH580BX122

500 Hz

断路器

240 VAC

IP55

XC7Z030-L2FFG676I XC7Z030-L2FFG676I

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

Surface Mount, MLCC

25V

125,000

FCBGA

1.0000 V

0.95 V

250

1.05 V

表面贴装

130

Tray

XC7Z030

活跃

Industrial grade

0402 (1005 Metric)

676-FCBGA (27x27)

AMD

Contains lead / RoHS non-compliant

-55°C ~ 125°C

Tape & Reel (TR)

VJ HIFREQ

0.040 L x 0.020 W (1.02mm x 0.51mm)

±0.5pF

1 (Unlimited)

C0G, NP0

RF, Microwave, High Frequency

0.9pF

676

-

800MHz

256KB

-

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Industrial

2L

Kintex™-7 FPGA, 125K Logic Cells

157,200

-

High Q, Low Loss

-

0.024 (0.61mm)

-

EOS3FLF512-PDN64LV EOS3FLF512-PDN64LV

QUICK 数据表

N/A

-

最小起订量: 1

倍率: 1

2400 LE

46 I/O

512 kB

+ 85 C

0.000688 oz

- 20 C

810

SMD/SMT

QuickLogic

QuickLogic

EOS S3

Details

BGA-64

80 MHz

EOS

SOC - Systems on a Chip

1.1 V

147 uA

512 kB

SoC FPGA

R9A06G037GNP#AA0 R9A06G037GNP#AA0

Renesas 数据表

N/A

-

最小起订量: 1

倍率: 1

活跃

This product may require additional documentation to export from the United States.

128 kB

138 MHz, 276 MHz

+ 85 C

- 40 C

25

SMD/SMT

Renesas Electronics

Renesas Electronics

Details

128 kB

Microprocessors - MPU

64-VFQFN Exposed Pad

Renesas Electronics America Inc

Tray

-40°C ~ 85°C (TA)

Tray

-

Microprocessors - MPU

1.1 V

128KB

ARM® Cortex®-M3

PWM

32 bit

-

2 Core

-

Microprocessors - MPU

XC7Z0152CLG485I XC7Z0152CLG485I

Other 数据表

N/A

-

最小起订量: 1

倍率: 1

Reliant22

Obsolete

XC7Z0301FFG676I XC7Z0301FFG676I

Other 数据表

N/A

-

最小起订量: 1

倍率: 1

--

--

活跃

钢筋弯曲机