N/A

-

无

活跃

MICROSEMI CORP

LFBGA, BGA400,20X20,32

5.27

85 °C

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.26 V

1.2 V

20

207

Tray

M2GL025

活跃

27696 LE

+ 85 C

0 C

SMD/SMT

1.14 V

表面贴装

400-LFBGA

YES

400-VFBGA (17x17)

400

微芯片技术

M2GL025TS-VF400

0°C ~ 85°C (TJ)

IGLOO2

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B400

207

不合格

1.2 V

1.2 V

OTHER

207

1.51 mm

现场可编程门阵列

27696

1130496

4 Transceiver

27696

17 mm

17 mm

N/A

-

BGA484,22X22,40

SQUARE

网格排列

1.26 V

1.2 V

30

PLASTIC/EPOXY

85 °C

3

5.84

FBGA-484

MICROSEMI CORP

活跃

无

M2S050-1FG484

1.2000 V

267

Tray

M2S050

活跃

-

166 MHz

56340 LE

SMD/SMT

-

64 kB

1.14 V

484-BGA

YES

484-FPBGA (23x23)

484

微芯片技术

BGA

0 to 85 °C

SmartFusion®2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

BOTTOM

BALL

240

1 mm

not_compliant

S-PBGA-B484

267

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

267

2.44 mm

现场可编程门阵列

1

FPGA - 50K Logic Modules

48672

1 Core

256KB

23 mm

23 mm

N/A

-

无

活跃

MICROSEMI CORP

BGA, BGA896,30X30,40

5.3

3

85 °C

PLASTIC/EPOXY

BGA

BGA896,30X30,40

SQUARE

网格排列

1.26 V

1.2 V

30

1.2000 V

1.14 V

1.26 V

377

Tray

M2S050

活跃

-

166 MHz

56340 LE

SMD/SMT

-

64 kB

1.14 V

896-BGA

YES

896-FBGA (31x31)

896

微芯片技术

M2S050-FG896

0 to 85 °C

SmartFusion®2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

BOTTOM

BALL

240

1 mm

not_compliant

896

S-PBGA-B896

377

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

377

2.44 mm

现场可编程门阵列

STD

FPGA - 50K Logic Modules

48672

1 Core

256KB

31 mm

31 mm

N/A

-

无

活跃

MICROSEMI CORP

5.3

PLASTIC/EPOXY

BGA

BGA484,22X22,40

SQUARE

网格排列

1.2 V

267

Non-Compliant

表面贴装

YES

484

M2GL090S-1FG484I

100 °C

-40 °C

BOTTOM

BALL

1 mm

unknown

S-PBGA-B484

267

不合格

1.2 V

323.3 kB

267

现场可编程门阵列

86316

86316

N/A

-

无

Obsolete

MICROSEMI CORP

,

5.85

3

20

M2S010S-1FG484I

e0

Tin/Lead (Sn/Pb)

225

compliant

现场可编程门阵列

N/A

-

Production (Last Updated: 2 months ago)

有

活跃

MICROSEMI CORP

27 X 27 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-676

5.3

3

85 °C

-40 °C

PLASTIC/EPOXY

BGA

SQUARE

网格排列

1.575 V

1.5 V

40

1.5000 V

1.425 V

1.575 V

444

Compliant

有

This product may require additional documentation to export from the United States.

16000 LE

+ 100 C

0.014110 oz

- 40 C

40

SMD/SMT

Microchip Technology / Atmel

310 MHz

ProASIC3

Tray

A3PE1500

活跃

1.425 V

FPGA - Field Programmable Gate Array

表面贴装

表面贴装

FBGA

YES

676

676-FBGA (27x27)

400.011771 mg

676

微芯片技术

A3PE1500-2FGG676I

-40 to 85 °C

Tray

A3PE1500

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

8542.39.00.01

可编程逻辑集成电路

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B676

不合格

1.5 V

INDUSTRIAL

1.575 V

1.425 V

33.8 kB

-

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1.5e+06

310 MHz

2

-

38400

38400

1500000

FPGA - Field Programmable Gate Array

1.73 mm

27 mm

27 mm

无

N/A

-

有

Obsolete

MICROSEMI CORP

BGA, BGA256,16X16,40

5.31

294 MHz

3

85 °C

-40 °C

PLASTIC/EPOXY

BGA

BGA256,16X16,40

SQUARE

网格排列

2.75 V

2.5 V

40

2.25 V

YES

256

A54SX16A-2FGG256I

e1

锡银铜

16000 TYPICAL GATES AVAILABLE

8542.39.00.01

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

180

不合格

2.5,3.3/5 V

INDUSTRIAL

180

1452 CLBS, 24000 GATES

1.97 mm

现场可编程门阵列

1 ns

1452

1452

24000

17 mm

17 mm

N/A

-

有

Obsolete

-40 °C

PLASTIC/EPOXY

LBGA

BGA144,12X12,40

SQUARE

GRID ARRAY, LOW PROFILE

2.75 V

2.5 V

40

85 °C

3

278 MHz

5.32

LBGA, BGA144,12X12,40

MICROSEMI CORP

2.25 V

YES

144

A54SX32A-1FGG144I

e1

锡银铜

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

111

不合格

2.5,2.5/5 V

INDUSTRIAL

111

2880 CLBS, 48000 GATES

1.55 mm

现场可编程门阵列

1.1 ns

2880

2880

48000

13 mm

13 mm

N/A

-

有

Obsolete

MICROSEMI CORP

VFBGA,

8.05

85 °C

-40 °C

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.575 V

1.2 V

未说明

1.14 V

YES

81

AGLN020V2-UCG81I

8542.39.00.01

BOTTOM

BALL

未说明

0.4 mm

compliant

S-PBGA-B81

不合格

INDUSTRIAL

520 CLBS, 20000 GATES

0.8 mm

现场可编程门阵列

520

20000

4 mm

4 mm

N/A

-

无

Obsolete

MICROSEMI CORP

5.85

Non-Compliant

256

A2F060M3E-FG256M

125 °C

-55 °C

8542.39.00.01

unknown

80 MHz

EBI/EMI, I2C, SPI, UART, USART

DMA, POR, WDT

ARM

N/A

-

Production (Last Updated: 2 months ago)

有

活跃

MICROSEMI CORP

31 X 31 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-896

5.3

250 MHz

3

70 °C

PLASTIC/EPOXY

BGA

BGA896,30X30,40

SQUARE

网格排列

1.575 V

1.2 V

40

1.2000 V

1.14 V

1.26 V

620

Compliant

Tray

A3PE3000

活跃

1.14 V

表面贴装

表面贴装

896-BGA

YES

896

896-FBGA (31x31)

400.011771 mg

896

微芯片技术

A3PE3000L-FGG896

0 to 70 °C

ProASIC3L

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

1.14V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

896

S-PBGA-B896

620

不合格

1.2 V

1.2/1.5,1.2/3.3 V

COMMERCIAL

1.26 V

1.14 V

63 kB

620

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3e+06

781.25 MHz

STD

75264

75264

75264

3000000

1.73 mm

31 mm

31 mm

无

N/A

-

Production (Last Updated: 2 months ago)

无

活跃

MICROSEMI CORP

19 X 19 MM, 1.63 MM HEIGHT, 1 MM PITCH, FBGA-324

5.3

250 MHz

3

70 °C

PLASTIC/EPOXY

BGA

BGA324,18X18,40

SQUARE

网格排列

1.575 V

1.2 V

30

221

Tray

A3PE3000

活跃

Compliant

1.14 V

表面贴装

表面贴装

324-BGA

YES

324

324-FBGA (19x19)

400.011771 mg

324

微芯片技术

A3PE3000L-FG324

0°C ~ 85°C (TJ)

ProASIC3L

e0

Tin/Lead/Silver (Sn/Pb/Ag)

70 °C

0 °C

8542.39.00.01

1.14V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B324

221

不合格

1.2 V

1.2/1.5,1.2/3.3 V

COMMERCIAL

1.26 V

1.14 V

63 kB

221

75264 CLBS, 3000000 GATES

1.78 mm

现场可编程门阵列

516096

3000000

781.25 MHz

STD

75264

75264

75264

3000000

1.25 mm

19 mm

19 mm

无

N/A

-

无

活跃

MICROSEMI CORP

LBGA, BGA144,12X12,40

5.24

280 MHz

3

85 °C

-40 °C

PLASTIC/EPOXY

LBGA

BGA144,12X12,40

SQUARE

GRID ARRAY, LOW PROFILE

3.6 V

3.3 V

30

3.3, 5 V

2.97, 4.5 V

3.63, 5.5 V

111

Tray

A54SX08

活跃

Compliant

3 V

表面贴装

表面贴装

144-LBGA

YES

144

144-FPBGA (13x13)

400.011771 mg

144

微芯片技术

A54SX08-1FG144I

-40 to 85 °C

SX

e0

锡铅银

85 °C

-40 °C

CAN ALSO BE OPERATED AT 5V; 12000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

3V ~ 3.6V, 4.75V ~ 5.25V

BOTTOM

BALL

225

1 mm

compliant

280 MHz

S-PBGA-B144

111

不合格

5 V

3.3,5 V

INDUSTRIAL

5.5 V

4.5 V

800 ps

800 ps

111

768 CLBS, 8000 GATES

1.55 mm

现场可编程门阵列

768

12000

280 MHz

768

768

1

256

0.8 ns

768

768

8000

1.05 mm

13 mm

13 mm

无

N/A

-

有

活跃

MICROSEMI CORP

LBGA, BGA144,12X12,40

5.24

320 MHz

3

70 °C

PLASTIC/EPOXY

LBGA

BGA144,12X12,40

SQUARE

GRID ARRAY, LOW PROFILE

3.6 V

3.3 V

40

3.3, 5 V

2.97, 4.75 V

3.63, 5.25 V

111

Compliant

Tray

A54SX08

活跃

3 V

表面贴装

表面贴装

144-LBGA

YES

144

144-FPBGA (13x13)

400.011771 mg

144

微芯片技术

A54SX08-2FGG144

0 to 70 °C

SX

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

CAN ALSO BE OPERATED AT 5V; 12000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

3V ~ 3.6V, 4.75V ~ 5.25V

BOTTOM

BALL

260

1 mm

compliant

320 MHz

S-PBGA-B144

111

不合格

5 V

3.3,5 V

COMMERCIAL

5.25 V

4.75 V

700 ps

700 ps

111

768 CLBS, 8000 GATES

1.55 mm

现场可编程门阵列

768

12000

320 MHz

768

768

2

256

0.7 ns

768

768

8000

1.05 mm

13 mm

13 mm

无

N/A

-

无

活跃

MICROSEMI CORP

BGA,

5.23

350 MHz

3

100 °C

-40 °C

PLASTIC/EPOXY

BGA

SQUARE

网格排列

1.575 V

1.5 V

30

1.5000 V

1.425 V

1.575 V

有

This product may require additional documentation to export from the United States.

11000 LE

177 I/O

+ 100 C

0.014110 oz

- 40 C

90

SMD/SMT

Microchip Technology / Atmel

350 MHz

ProASIC3

N

Tray

A3P1000

活跃

1.425 V

FPGA - Field Programmable Gate Array

表面贴装

FBGA-256

YES

256-FPBGA (17x17)

256

微芯片技术

A3P1000-2FG256I

-40 to 85 °C

Tray

A3P1000

e0

3A001.A.7.A

Tin/Lead (Sn/Pb)

8542.39.00.01

可编程逻辑集成电路

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

1.5 V

INDUSTRIAL

-

24576 CLBS, 1000000 GATES

1.8 mm

现场可编程门阵列

147456

1000000

2

-

24576

1000000

FPGA - Field Programmable Gate Array

17 mm

17 mm

N/A

-

有

Obsolete

MICROSEMI CORP

BGA,

8.6

3

85 °C

PLASTIC/EPOXY

BGA

SQUARE

网格排列

1.575 V

40

1.5 V

1.425 V

YES

484

AGL400V5-FGG484

e1

锡银铜

8542.39.00.01

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B484

不合格

OTHER

9216 CLBS, 400000 GATES

2.44 mm

现场可编程门阵列

9216

400000

23 mm

23 mm

N/A

-

Production (Last Updated: 2 months ago)

有

活跃

MICROSEMI CORP

BGA, BGA1152,34X34,40

5.29

649 MHz

3

85 °C

-40 °C

PLASTIC/EPOXY

BGA

BGA1152,34X34,40

SQUARE

网格排列

1.575 V

1.5 V

40

684

Compliant

1.425 V

表面贴装

YES

1152

400.011771 mg

1152

AX2000-FGG1152I

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

2000000 SYSTEM GATES AVAILABLE

8542.39.00.01

BOTTOM

BALL

245

1 mm

compliant

649 MHz

S-PBGA-B1152

684

不合格

1.5 V

1.5,1.5/3.3,2.5/3.3 V

INDUSTRIAL

1.575 V

1.425 V

36 kB

990 ps

990 ps

684

21504 CLBS, 2000000 GATES

2.44 mm

现场可编程门阵列

21504

2e+06

649 MHz

21504

21504

0.99 ns

21504

32256

2000000

1.73 mm

35 mm

35 mm

无

N/A

-

无

活跃

MICROSEMI CORP

BGA,

1.5

350 MHz

3

100 °C

-40 °C

PLASTIC/EPOXY

BGA

SQUARE

网格排列

1.575 V

1.5 V

30

1.5000 V

1.425 V

1.575 V

有

11000 LE

177 I/O

+ 100 C

0.014110 oz

- 40 C

90

SMD/SMT

Microchip Technology / Atmel

350 MHz

ProASIC3

N

Tray

A3P1000

活跃

1.425 V

FPGA - Field Programmable Gate Array

表面贴装

FBGA-256

YES

256-FPBGA (17x17)

256

微芯片技术

A3P1000-FG256I

-40 to 85 °C

Tray

A3P1000

e0

3A001.A.7.A

Tin/Lead (Sn/Pb)

8542.39.00.01

可编程逻辑集成电路

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

not_compliant

S-PBGA-B256

不合格

1.5 V

INDUSTRIAL

-

24576 CLBS, 1000000 GATES

1.8 mm

现场可编程门阵列

147456

1000000

STD

-

24576

1000000

FPGA - Field Programmable Gate Array

17 mm

17 mm

N/A

-

无

活跃

MICROSEMI CORP

1 MM PITCH, FBGA-484

5.23

350 MHz

125 °C

-40 °C

PLASTIC/EPOXY

BGA

BGA484,22X22,40

SQUARE

网格排列

1.575 V

1.5 V

1.5000 V

1.425 V

1.575 V

300

Tray

A3P1000

活跃

1.425 V

Automotive grade

表面贴装

484-BGA

YES

484-FPBGA (23x23)

484

微芯片技术

A3P1000-FG484T

-40°C ~ 125°C (TA)

Automotive, AEC-Q100, ProASIC3

3A001.A.7.A

8542.39.00.01

1.425V ~ 1.575V

BOTTOM

BALL

1 mm

compliant

S-PBGA-B484

300

不合格

1.5/3.3 V

AUTOMOTIVE

300

24576 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

147456

1000000

AEC-Q100

STD

24576

24576

1000000

23 mm

23 mm

N/A

-

无

Obsolete

MICROSEMI CORP

6 X 6 MM, 0.99 MM HEIGHT, 0.50 MM PITCH, CSP-121

5.88

108 MHz

85 °C

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.575 V

1.425 V

1.5 V

未说明

YES

121

AGL060V5-CS121

8542.39.00.01

BOTTOM

BALL

未说明

0.5 mm

unknown

S-PBGA-B121

不合格

OTHER

1536 CLBS, 60000 GATES

0.99 mm

现场可编程门阵列

1536

60000

6 mm

6 mm

N/A

-

无

Obsolete

MICROSEMI CORP

13 X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144

5.31

3

85 °C

PLASTIC/EPOXY

LBGA

SQUARE

GRID ARRAY, LOW PROFILE

1.575 V

1.425 V

1.5 V

30

YES

144

AGL400V5-FG144

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

BOTTOM

BALL

230

1 mm

unknown

S-PBGA-B144

不合格

OTHER

9216 CLBS, 400000 GATES

1.55 mm

现场可编程门阵列

9216

400000

13 mm

13 mm

N/A

-

Production (Last Updated: 2 months ago)

无

活跃

MICROSEMI CORP

BGA,

5.3

3

85 °C

PLASTIC/EPOXY

BGA

SQUARE

网格排列

1.575 V

1.5 V

30

252

Compliant

Tray

AFS1500

活跃

1.425 V

表面贴装

表面贴装

676-BGA

YES

676

676-FBGA (27x27)

400.011771 mg

676

微芯片技术

AFS1500-1FG676

0°C ~ 85°C (TJ)

Fusion®

e0

Tin/Lead (Sn/Pb)

70 °C

0 °C

8542.39.00.01

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B676

不合格

1.5 V

OTHER

1.575 V

1.425 V

33.8 kB

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1.5e+06

1.28205 GHz

1

38400

38400

1500000

1.73 mm

25 mm

25 mm

无

N/A

-

Obsolete (Last Updated: 2 months ago)

有

Obsolete

MICROSEMI CORP

LBGA, BGA256,16X16,40

5.82

649 MHz

3

85 °C

-40 °C

PLASTIC/EPOXY

LBGA

BGA256,16X16,40

SQUARE

GRID ARRAY, LOW PROFILE

1.575 V

1.5 V

30

138

Compliant

1.425 V

表面贴装

YES

256

400.011771 mg

256

AX125-FGG256I

e1

锡银铜

85 °C

-40 °C

125000 SYSTEM GATES AVAILABLE

8542.39.00.01

BOTTOM

BALL

250

1 mm

compliant

649 MHz

S-PBGA-B256

168

不合格

1.5 V

1.5,1.5/3.3,2.5/3.3 V

INDUSTRIAL

1.575 V

1.425 V

2.3 kB

990 ps

990 ps

168

1344 CLBS, 125000 GATES

1.7 mm

现场可编程门阵列

1344

125000

649 MHz

1344

1344

0.99 ns

1344

2016

125000

1.2 mm

17 mm

17 mm

无

N/A

-

无

活跃

MICROSEMI CORP

1 MM PITCH, FBGA-256

5.23

350 MHz

3

125 °C

-40 °C

PLASTIC/EPOXY

BGA

BGA256,16X16,40

SQUARE

网格排列

1.575 V

1.5 V

20

157

Tray

A3P250

活跃

1.425 V

Automotive grade

表面贴装

256-LBGA

YES

256-FPBGA (17x17)

256

微芯片技术

A3P250-FG256T

-40°C ~ 125°C (TA)

Automotive, AEC-Q100, ProASIC3

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

157

不合格

1.5/3.3 V

AUTOMOTIVE

157

6144 CLBS, 250000 GATES

1.8 mm

现场可编程门阵列

36864

250000

AEC-Q100

STD

6144

6144

250000

17 mm

17 mm

N/A

-

Obsolete (Last Updated: 2 months ago)

无

Obsolete

MICROSEMI CORP

17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256

5.28

350 MHz

3

70 °C

PLASTIC/EPOXY

BGA

BGA256,16X16,40

SQUARE

网格排列

1.575 V

1.2 V

30

177

Compliant

1.14 V

表面贴装

YES

256

400.011771 mg

256

A3P600L-FG256

TIN LEAD/TIN LEAD SILVER

70 °C

0 °C

8542.39.00.01

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

177

不合格

1.2 V

1.5/3.3 V

COMMERCIAL

1.26 V

1.14 V

5 mA

13.5 kB

177

13824 CLBS, 600000 GATES

1.8 mm

现场可编程门阵列

600000

781.25 MHz

13824

13824

13824

600000

1.2 mm

17 mm

17 mm

无