表面安装

NO

终端数量

28

No

Obsolete

MOTOROLA SEMICONDUCTOR PRODUCTS

DIP, DIP28,.6

70 °C

CERAMIC

DIP

DIP28,.6

RECTANGULAR

IN-LINE

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-XDIP-T28

资历状况

Not Qualified

温度等级

COMMERCIAL

uPs/uCs/外围ICs类型

SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL