规格参数
- 类型参数全选
工厂交货时间
11 Weeks
触点镀层
Gold
底架
Through Hole
安装类型
Through Hole
引脚数
164
材料 - 绝缘
Polyamide (PA), Nylon, Glass Filled
Copper Alloy
操作温度
-55°C~85°C
包装
Tray
零件状态
Active
湿度敏感性等级(MSL)
1 (Unlimited)
终端
Solder, Staggered
连接器类型
Cantilever
定位的数量
164
最高工作温度
85°C
最小工作温度
-55°C
颜色
Black
行数
2
性别
Female
触点类型
Cantilever
螺距
0.039 1.00mm
触点表面处理
Gold
磁卡种类
PCI Express™
读出
Dual
特征
Board Lock, Locking Ramp
触点表面处理厚度
30.0μin 0.76μm
磁卡厚度
0.062 1.57mm
RoHS状态
RoHS Compliant
相关型号
- 图片产品型号品牌GenderPitchNumber of PositionsNumber of RowsMountContact PlatingMax Operating TemperatureMoisture Sensitivity Level (MSL)
10018783-11023TLF
Female
0.039 (1.00mm)
164
2
Through Hole
Gold
85 °C
1 (Unlimited)
Female
0.050 (1.27mm)
120
2
Through Hole
-
85 °C
1 (Unlimited)
Female
0.050 (1.27mm)
120
2
Through Hole
-
85 °C
1 (Unlimited)
Female
0.050 (1.27mm)
120
2
Through Hole
-
85 °C
1 (Unlimited)
Female
0.050 (1.27mm)
120
2
Through Hole
-
85 °C
1 (Unlimited)
10018783-11023TLF PDF数据手册
- PCN 设计/规格 :