N/A

-

Production (Last Updated: 2 months ago)

Compliant

138

Tray

M2S025

活跃

-

166 MHz

27696 LE

SMD/SMT

-

64 kB

256-LBGA

256-FPBGA (17x17)

微芯片技术

1.2000 V

-40 to 100 °C

SmartFusion®2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

1

FPGA - 25K Logic Modules

1 Core

256KB

N/A

-

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP144,.87SQ,20

1.5 V

30

1.425 V

有

A2F060M3E-TQG144I

80 MHz

LFQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

8.63

YES

144

LFQFP, QFP144,.87SQ,20

e3

PURE MATTE TIN (394)

8542.39.00.01

现场可编程门阵列

CMOS

QUAD

鸥翼

250

0.5 mm

compliant

S-PQFP-G144

33

不合格

1.5,1.8,2.5,3.3 V

33

1536 CLBS, 60000 GATES

1.6 mm

现场可编程门阵列

1536

1536

60000

20 mm

20 mm

N/A

-

活跃

MCU - 136, FPGA - 276

784-BFBGA, FCBGA

784-FCBGA (23x23)

PEI-Genesis

Bulk

-40°C ~ 125°C (TJ)

*

-

857.6KB

RISC-V

DMA, PCI, PWM

CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 93K Logic Modules

128KB

N/A

-

Production (Last Updated: 2 months ago)

1.14 V

1.26 V

有

This product may require additional documentation to export from the United States.

-

166 MHz

56520 LE

60

4710 LAB

Microchip

Microchip Technology / Atmel

SmartFusion2

Details

-

64 kB

267

Tray

M2S060

活跃

SoC FPGA

484-BGA

484-FPBGA (23x23)

微芯片技术

1.2 V

0 to 85 °C

Tray

SmartFusion2

SOC - Systems on a Chip

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

STD

FPGA - 60K Logic Modules

1 Core

256KB

SoC FPGA

N/A

-

Tray

M2S005

活跃

-

166 MHz

6060 LE

-

64 kB

256-LBGA

256-FPBGA (17x17)

微芯片技术

161

0°C ~ 85°C (TJ)

SmartFusion®2

166MHz

64KB

ARM® Cortex®-M3

-

128 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

STD

FPGA - 5K Logic Modules

1 Core

128KB

N/A

-

Production (Last Updated: 2 months ago)

267

Tray

M2S060

活跃

-

166 MHz

56520 LE

-

64 kB

484-BGA

484-FPBGA (23x23)

微芯片技术

Non-Compliant

0°C ~ 85°C (TJ)

SmartFusion®2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 60K Logic Modules

1 Core

256KB

N/A

-

Tray

A2F200

活跃

256-LBGA

256-FPBGA (17x17)

微芯片技术

MCU - 25, FPGA - 66

-40°C ~ 100°C (TJ)

SmartFusion®

100MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

256KB

N/A

-

273

Tray

M2S150

活跃

-

166 MHz

146124 LE

-

64 kB

484-BFBGA

484-FBGA (19x19)

微芯片技术

1.2000 V

-40 to 100 °C

SmartFusion®2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

STD

FPGA - 150K Logic Modules

1 Core

512KB

N/A

-

207

Tray

M2S025

活跃

40

有

M2S025TS-1VFG400T2

Microsemi Corporation

活跃

MICROSEMI CORP

5.81

400-LFBGA

400-VFBGA (17x17)

微芯片技术

1.2000 V

0 to 85 °C

Automotive, AEC-Q100, SmartFusion®2

e1

有

Tin/Silver/Copper (Sn/Ag/Cu)

250

compliant

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

现场可编程门阵列

1

FPGA - 25K Logic Modules

256KB

N/A

-

1.425 V

500000

1.575 V

MCU - 31, FPGA - 78

Tray

A2F500

活跃

288-TFBGA, CSPBGA

288-CSP (11x11)

微芯片技术

1.5000 V

0 to 85 °C

SmartFusion®

80MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

STD

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

512KB

N/A

-

1.14 V

1.26 V

180

Tray

M2S090

活跃

TFBGA, BGA325,21X21,20

GRID ARRAY, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

40

1.14 V

有

M2S090T-FCSG325I

TFBGA

RECTANGULAR

Microsemi Corporation

活跃

MICROSEMI CORP

1.26 V

5.74

-

166 MHz

86316 LE

SMD/SMT

-

64 kB

325-TFBGA, FCBGA

YES

325-FCBGA (11x13.5)

325

微芯片技术

1.2000 V

-40 to 100 °C

SmartFusion®2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

LG-MIN, WD-MIN

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

250

0.5 mm

compliant

R-PBGA-B325

180

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

180

1.16 mm

现场可编程门阵列

STD

FPGA - 90K Logic Modules

86316

1 Core

512KB

13.5 mm

11 mm

N/A

-

1.14 V

1.26 V

267

Tray

M2S025

活跃

64 kB

-

SMD/SMT

27696 LE

166 MHz

-

484-BGA

484-FPBGA (23x23)

微芯片技术

1.2000 V

-40 to 100 °C

SmartFusion®2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

1

FPGA - 25K Logic Modules

1 Core

256KB

N/A

-

267

Tray

M2S090

活跃

FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

40

1.14 V

有

M2S090TS-FGG484I

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.26 V

5.8

-

166 MHz

86316 LE

SMD/SMT

-

64 kB

484-BGA

YES

484-FPBGA (23x23)

484

微芯片技术

1.2000 V

-40 to 100 °C

SmartFusion®2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

267

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

267

2.44 mm

现场可编程门阵列

STD

FPGA - 90K Logic Modules

86316

1 Core

512KB

23 mm

23 mm

N/A

-

Klockner-Moeller, Div of Eaton

MCU - 25, FPGA - 66

Tray

A2F200

活跃

256-LBGA

256-FPBGA (17x17)

微芯片技术

DIL2MKV-00(24V50/60HZ)

0°C ~ 85°C (TJ)

SmartFusion®

100MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

256KB

N/A

-

ACS8802XR8I+2XR8IIP42

ACS880-17-1110A-5+B4+C+H-ABBI

ABB

Panel

MCU - 22, FPGA - 66

A2F500

活跃

208-BFQFP

208-PQFP (28x28)

微芯片技术

2XR8I+2XR8I

0°C ~ 85°C (TJ)

SmartFusion®

80MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

Ethernet, I²C, SPI, UART/USART

MCU, FPGA

500 Hz

STD

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

512KB

IP42

N/A

-

1.425 V

500000

1.575 V

5.24

1.575 V

MICROSEMI CORP

活跃

Microsemi Corporation

SQUARE

TFBGA

100 MHz

A2F500M3G-1CS288I

无

100 °C

1.425 V

20

1.5 V

-40 °C

BGA288,21X21,20

PLASTIC/EPOXY

GRID ARRAY, THIN PROFILE, FINE PITCH

TFBGA, BGA288,21X21,20

活跃

A2F500

Tray

MCU - 31, FPGA - 78

288-TFBGA, CSPBGA

YES

288-CSP (11x11)

288

微芯片技术

1.5000 V

-40 to 100 °C

SmartFusion®

e0

锡铅银

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

235

0.5 mm

compliant

S-PBGA-B288

78

不合格

1.5,1.8,2.5,3.3 V

INDUSTRIAL

100MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

78

11520 CLBS, 500000 GATES

1.05 mm

现场可编程门阵列

1

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

11520

11520

500000

512KB

11 mm

11 mm

N/A

-

Tray

A2F500

活跃

11 X 11 MM, 1.05 MM HEIGHT, 0.50 MM PITCH, GREEN, BGA-288

GRID ARRAY, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA288,21X21,20

-40 °C

1.5 V

30

1.425 V

100 °C

有

A2F500M3G-1CSG288I

100 MHz

TFBGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

5.24

288-TFBGA, CSPBGA

YES

288-CSP (11x11)

288

微芯片技术

MCU - 31, FPGA - 78

-40°C ~ 100°C (TJ)

SmartFusion®

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

260

0.5 mm

compliant

S-PBGA-B288

78

不合格

1.5,1.8,2.5,3.3 V

INDUSTRIAL

100MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

78

11520 CLBS, 500000 GATES

1.05 mm

现场可编程门阵列

1

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

11520

11520

500000

512KB

11 mm

11 mm

N/A

-

N/A

-

48 MHz

72.2 Mbps

+ 85 C

4.2 V

- 40 C

490

2.7 V

SMD/SMT

268 mA

I2C, SPI, UART

61 mA

Microchip

Microchip Technology / Atmel

RAM

64 kB, 128 kB

Tray

ATWINC1500

活跃

VQFN-40

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

PLASTIC/EPOXY

LCC40,.2SQ,16

-40 °C

3.3 V

85 °C

ATWINC1500B-MU-Y042

48 MHz

HQCCN

SQUARE

活跃

MICROCHIP TECHNOLOGY INC

5.06

RF System on a Chip - SoC

表面贴装

QFN-40

YES

40-QFN (5x5)

40

微芯片技术

有

-40°C ~ 85°C

Tray

-

Wi-Fi

Wireless & RF Integrated Circuits

Si

2.7V ~ 3.6V

QUAD

无铅

0.4 mm

compliant

2.4GHz

S-PQCC-N40

2.4 GHz

INDUSTRIAL

4MB Flash, 128kB ROM, 224kB RAM

网络控制器

Flash

4 MB

18.5 dBm

32 bit

1 mm

802.11b/g/n

20.5dBm

WiFi

- 74 dBm

72.2Mbps

I²C, SDIO, SPI, UART

22mA ~ 58.5mA

22mA ~ 294mA

CCK, DSSS, OFDM

9

RF System on a Chip - SoC

0.85 mm

5 mm

5 mm

N/A

-

25.4 mm

Straight

CGB399

cUL, UL

Round

Crouse-Hinds Industrial Produc

Bushing Grip with Strain Relief

无

1.2000 V

84

Tray

M2S010

活跃

-

166 MHz

12084 LE

SMD/SMT

-

64 kB

144-LQFP

144-TQFP (20x20)

Steel

微芯片技术

30.18 mm

-40 to 100 °C

SmartFusion®2

Metallic

166MHz

64KB

ARM® Cortex®-M3

-

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

1

FPGA - 10K Logic Modules

1 Core

256KB

N/A

-

Production (Last Updated: 1 month ago)

10250T112-2

CE, CSA, UL

Cutler Hammer, Div of Eaton Co

1.2000 V

1.14 V

1.26 V

Compliant

138

Tray

M2S010

活跃

-

166 MHz

12084 LE

+ 85 C

0 C

SMD/SMT

-

64 kB

256-LBGA

256

256-FPBGA (17x17)

微芯片技术

Momentary

0 to 85 °C

SmartFusion®2

85 °C

0 °C

1.2 V

166MHz

50 kB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

Screw

STD

FPGA - 10K Logic Modules

1 Core

256KB

2NO

IP65

N/A

-

Production (Last Updated: 2 months ago)

Thomas & Betts

1.2000 V

1.14 V

1.26 V

Non-Compliant

200

Tray

M2S060

活跃

FBGA-325

GRID ARRAY, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

1.14 V

85 °C

有

TFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.82

-

166 MHz

56520 LE

-

64 kB

325-TFBGA, FCBGA

YES

325-FCBGA (11x11)

Nylon

325

微芯片技术

TY23M-4

0 to 85 °C

SmartFusion®2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

Yellow

LG-MIN, WD-MIN

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

250

0.5 mm

compliant

40

S-PBGA-B325

200

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

200

1.01 mm

现场可编程门阵列

STD

FPGA - 60K Logic Modules

56520

1 Core

256KB

11 mm

11 mm

0.093

N/A

-

Schneider

2.5, 3.3 V

1.14 V

1.26 V

200

Tray

M2S050

活跃

FBGA-325

GRID ARRAY, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

40

1.14 V

5.76

1.26 V

MICROSEMI CORP

活跃

SQUARE

TFBGA

有

-

166 MHz

56340 LE

SMD/SMT

-

64 kB

325-TFBGA, FCBGA

YES

325-FCBGA (11x11)

325

微芯片技术

136499

-40 to 100 °C

SmartFusion®2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

LG-MIN, WD-MIN

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

250

0.5 mm

compliant

S-PBGA-B325

200

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

200

1.01 mm

现场可编程门阵列

STD

FPGA - 50K Logic Modules

56340

1 Core

256KB

Threaded

11 mm

11 mm

N/A

-

Cutler Hammer, Div of Eaton Co

1.2000 V

1.14 V

1.26 V

有

-

400 kbit

166 MHz

12084 LE

84 I/O

+ 100 C

0.035380 oz

- 40 C

60

SMD/SMT

1007 LAB

Microchip Technology / Atmel

Details

-

64 kB

Tray

M2S010

活跃

LFQFP,

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.2 V

40

1.14 V

有

LFQFP

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.81

SoC FPGA

TQFP-144

YES

144-TQFP (20x20)

144

微芯片技术

DR1-40D8-05

-40 to 100 °C

Tray

SmartFusion2

有

Pure Matte Tin (Sn)

8542.39.00.01

SOC - Systems on a Chip

QUAD

鸥翼

250

0.5 mm

compliant

S-PQFP-G144

1.2 V

166MHz

64KB

ARM® Cortex®-M3

-

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

1.6 mm

现场可编程门阵列

STD

FPGA - 10K Logic Modules

1 Core

256KB

SoC FPGA

20 mm

20 mm

N/A

-

Non-Compliant