N/A

-

71 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

350 MHz

有

90

ProASIC3 nano

Tray

A3PN125

活跃

1.575 V

14 X 14 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, VQFP-100

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

85 °C

有

A3PN125-1VQG100I

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.26

表面贴装

VQFP

YES

100-VQFP (14x14)

100

微芯片技术

Details

-40°C ~ 100°C (TJ)

Tray

A3PN125

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

不合格

1.5 V

INDUSTRIAL

2 mA

3072 CLBS, 125000 GATES

1.2 mm

现场可编程门阵列

36864

125000

1

3072

125000

1 mm

14 mm

14 mm

N/A

-

N

11000 LE

97 I/O

1.425 V

- 55 C

+ 125 C

SMD/SMT

350 MHz

有

160

ProASIC3

0.014110 oz

Tray

A3P1000

活跃

1.575 V

LBGA, BGA144,12X12,40

GRID ARRAY, LOW PROFILE

5.22

MICROSEMI CORP

活跃

SQUARE

LBGA

350 MHz

A3P1000-1FG144M

无

125 °C

30

1.5 V

-55 °C

BGA144,12X12,40

PLASTIC/EPOXY

3

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

微芯片技术

This product may require additional documentation to export from the United States.

-55°C ~ 125°C (TJ)

Tray

A3P1000

e0

3A001.A.2.C

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

not_compliant

S-PBGA-B144

97

不合格

1.5 V

1.5,1.5/3.3 V

MILITARY

8 mA

97

24576 CLBS, 1000000 GATES

1.55 mm

现场可编程门阵列

147456

1000000

24576

24576

1000000

13 mm

13 mm

N/A

-

128 LE

41 I/O

2.3 V

0 C

+ 70 C

SMD/SMT

250 MHz

有

160

Actel

0.012720 oz

2.7 V

Tray

EX64

活跃

LFQFP,

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

2.5 V

40

70 °C

有

EX64-TQG64

250 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.3

表面贴装

TQFP-64

YES

64-TQFP (10x10)

64

微芯片技术

Details

0°C ~ 70°C (TA)

Tray

EX64

e3

Matte Tin (Sn)

LG-MIN; WD-MIN; TERM PITCH-MIN

8542.39.00.01

CMOS

2.3V ~ 2.7V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G64

2.5 V

COMMERCIAL

-

3000 GATES

1.6 mm

现场可编程门阵列

128

3000

-

1 ns

3000

1.4 mm

10 mm

10 mm

N/A

-

Details

6500 LE

177 I/O

1.14 V

0 C

+ 70 C

SMD/SMT

526.32 MHz, 892.86 MHz

有

-

90

110592 bit

IGLOOe

1.2, 1.5 V

1.14 V

1.575 V

Tray

AGL600

活跃

1.575 V

BGA,

网格排列

3

PLASTIC/EPOXY

1.2 V

40

85 °C

有

AGL600V2-FGG256

108 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.46

表面贴装

FBGA-256

YES

256-FPBGA (17x17)

256

微芯片技术

This product may require additional documentation to export from the United States.

0 to 70 °C

Tray

AGL600V2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

1.2 V to 1.5 V

OTHER

13824 CLBS, 600000 GATES

1.8 mm

现场可编程门阵列

13824

110592

600000

STD

13824

600000

1.2 mm

17 mm

17 mm

N/A

-

97 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

231 MHz

有

160

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3P125

活跃

13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

A3P125-FG144

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.22

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

微芯片技术

N

0 to 70 °C

Tray

A3P125

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

不合格

1.5 V

COMMERCIAL

3072 CLBS, 125000 GATES

1.55 mm

现场可编程门阵列

36864

125000

STD

3072

125000

1.05 mm

13 mm

13 mm

N/A

-

Details

608 LE

72 I/O

3 V

- 55 C

+ 125 C

SMD/SMT

172 MHz

有

-

16

Actel

0.239083 oz

5.5 V

Tray

A42MX16

活跃

ROHS COMPLIANT, PLASTIC, LCC-84

CHIP CARRIER

3

PLASTIC/EPOXY

-55 °C

3.3 V

40

125 °C

有

A42MX16-PLG84M

94 MHz

QCCJ

SQUARE

活跃

MICROSEMI CORP

5.28

表面贴装

PLCC-84

YES

84-PLCC (29.31x29.31)

84

微芯片技术

This product may require additional documentation to export from the United States.

-55°C ~ 125°C (TC)

Tube

A42MX16

e3

3A001.A.2.C

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J84

不合格

3.3 V, 5 V

MILITARY

1232 CLBS, 24000 GATES

4.572 mm

现场可编程门阵列

24000

2.8 ns

1232

24000

3.68 mm

29.31 mm

29.31 mm

N/A

-

Production (Last Updated: 2 months ago)

35000 LE

341 I/O

1.425 V

0 C

+ 85 C

SMD/SMT

350 MHz

有

60

1.575 V

FLASH

Tray

A3PE3000

活跃

23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.5 V

40

70 °C

有

A3PE3000-FGG484

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.58

516096 bit

ProASIC3

0.861390 oz

63 kB

表面贴装

表面贴装

FBGA-484

YES

484

484-FPBGA (23x23)

484

微芯片技术

Details

0°C ~ 85°C (TJ)

Tray

A3PE3000

e1

3A001.A.7.A

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

231 MHz

S-PBGA-B484

341

不合格

1.425 V to 1.575 V

1.5/3.3 V

COMMERCIAL

1.575 V

1.425 V

25 mA

128 B

-

341

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

35000

516096

3000000

231 MHz

STD

-

75264

75264

85 °C

75264

70 °C

3000000

1.73 mm

23 mm

23 mm

无

N/A

-

Production (Last Updated: 1 month ago)

3000 LE

68 I/O

1.425 V

0 C

+ 85 C

SMD/SMT

231 MHz

有

90

ProASIC3

0.017813 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3P250

活跃

14 X 14 MM, 1 MM HEIGHT, 0.50 MM PITCH, VQFP-100

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

A3P250-VQ100

350 MHz

TFQFP

SQUARE

活跃

FPGA - Field Programmable Gate Array ProASIC3

MICROSEMI CORP

5.22

表面贴装

表面贴装

VQFP-100

YES

100

100-VQFP (14x14)

100

微芯片技术

N

0 to 70 °C

Tray

A3P250

e0

锡铅

70 °C

0 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

231 MHz

S-PQFP-G100

不合格

1.5 V

COMMERCIAL

1.575 V

1.425 V

4.5 kB

-

6144 CLBS, 250000 GATES

1.2 mm

现场可编程门阵列

36864

250000

231 MHz

STD

-

6144

6144

250000

1 mm

14 mm

14 mm

无

N/A

-

57 I/O

3 V

0 C

+ 70 C

SMD/SMT

139 MHz

有

90

Actel

5.25 V

Tray

A40MX02

活跃

1 MM HEIGHT, ROHS COMPLIANT, PLASTIC, VQFP-80

FLATPACK, THIN PROFILE

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A40MX02-VQG80

80 MHz

TQFP

SQUARE

活跃

MICROSEMI CORP

5.29

表面贴装

VQFP

YES

80-VQFP (14x14)

80

微芯片技术

Details

0°C ~ 70°C (TA)

Tray

A40MX02

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

260

0.65 mm

compliant

S-PQFP-G80

不合格

3.3 V, 5 V

COMMERCIAL

295 CLBS, 3000 GATES

1.2 mm

现场可编程门阵列

3000

2.7 ns

295

3000

1 mm

14 mm

14 mm

N/A

-

295 LE

34 I/O

3 V

0 C

+ 70 C

SMD/SMT

139 MHz

有

295 LAB

27

Actel

0.084185 oz

3.3, 5 V

3 V

5.25 V

MSL 3 - 168 hours

5.25 V

Tray

A40MX02

活跃

QCCJ,

CHIP CARRIER

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A40MX02-PLG44

80 MHz

QCCJ

SQUARE

活跃

MICROSEMI CORP

1.52

表面贴装

PLCC-44

YES

44-PLCC (16.59x16.59)

44

微芯片技术

Details

0 to 70 °C

Tube

A40MX02

e3

Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J44

不合格

3.3 V, 5 V

COMMERCIAL

-

295 CLBS, 3000 GATES

4.572 mm

现场可编程门阵列

-

3000

STD

-

2.7 ns

295

3000

3.68 mm

16.59 mm

16.59 mm

N/A

-

N

177 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

272 MHz

有

90

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3P600

活跃

17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

100 °C

无

A3P600-1FG256I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.49

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

微芯片技术

This product may require additional documentation to export from the United States.

-40 to 85 °C

Tray

A3P600

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

1.5 V

INDUSTRIAL

13824 CLBS, 600000 GATES

1.8 mm

现场可编程门阵列

110592

600000

1

13824

600000

1.2 mm

17 mm

17 mm

N/A

-

N

11000 LE

177 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

310 MHz

有

90

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3P1000

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

A3P1000-2FG256

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.23

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

微芯片技术

This product may require additional documentation to export from the United States.

0 to 70 °C

Tray

A3P1000

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

1.5 V

COMMERCIAL

24576 CLBS, 1000000 GATES

1.8 mm

现场可编程门阵列

147456

1000000

2

24576

1000000

17 mm

17 mm

N/A

-

Production (Last Updated: 2 months ago)

7000 LE

158 I/O

2.3 V

0 C

+ 70 C

SMD/SMT

180 MHz

有

24

Actel

2.264236 oz

2.5000 V

2.3 V

2.7 V

2.7 V

Tray

APA600

活跃

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

2.5 V

30

70 °C

有

APA600-PQG208

180 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.3

表面贴装

表面贴装

PQFP-208

YES

208

208-PQFP (28x28)

208

微芯片技术

Details

0 to 70 °C

Tray

APA600

e3

Matte Tin (Sn)

70 °C

0 °C

8542.39.00.01

CMOS

2.3V ~ 2.7V

QUAD

鸥翼

245

0.5 mm

compliant

180 MHz

S-PQFP-G208

158

不合格

2.5 V

2.5,2.5/3.3 V

COMMERCIAL

2.7 V

2.3 V

15.8 kB

-

158

600000 GATES

4.1 mm

现场可编程门阵列

129024

600000

180 MHz

STD

-

21504

21504

600000

3.4 mm

28 mm

28 mm

无

N/A

-

Production (Last Updated: 1 month ago)

Details

344 I/O

2.3 V

0 C

+ 70 C

SMD/SMT

180 MHz

有

60

Actel

0.014110 oz

2.7 V

Tray

APA450

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

2.5 V

40

70 °C

有

APA450-FGG484

180 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 70°C (TA)

Tray

APA450

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

CMOS

2.3V ~ 2.7V

BOTTOM

BALL

250

1 mm

compliant

180 MHz

S-PBGA-B484

344

不合格

2.5 V

2.5,2.5/3.3 V

COMMERCIAL

2.7 V

2.3 V

13.5 kB

344

450000 GATES

2.44 mm

现场可编程门阵列

110592

450000

180 MHz

STD

12288

12288

450000

1.73 mm

23 mm

23 mm

无

N/A

-

Actel

60

有

238 MHz

SMD/SMT

+ 85 C

- 40 C

2.25 V

113 I/O

Details

2.5000 V

2.25 V

2.75 V

2.75 V

Tray

A54SX08

活跃

表面贴装

TQFP-144

144-TQFP (20x20)

微芯片技术

0.046530 oz

-40 to 85 °C

Tray

A54SX08A

2.25V ~ 5.25V

2.5 V

12000

768

STD

1.4 mm

20 mm

20 mm

N/A

-

Production (Last Updated: 2 months ago)

125 I/O

4.75 V

- 40 C

+ 125 C

SMD/SMT

135 MHz

有

24

Actel

0.196363 oz

5.25 V

Tray

A42MX24

活跃

QFP,

FLATPACK

3

PLASTIC/EPOXY

-40 °C

5 V

40

125 °C

有

A42MX24-PQG160A

124 MHz

QFP

SQUARE

活跃

MICROSEMI CORP

5.6

表面贴装

表面贴装

PQFP-160

YES

160

160-PQFP (28x28)

5.566797 g

160

微芯片技术

Details

-40°C ~ 125°C (TA)

Tray

A42MX24

e3

Matte Tin (Sn)

125 °C

-40 °C

CAN ALSO BE OPERATED AT 5.0V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

245

0.65 mm

compliant

S-PQFP-G160

不合格

5 V

AUTOMOTIVE

5.25 V

4.75 V

2 ns

1890 CLBS, 36000 GATES

4.1 mm

现场可编程门阵列

36000

135 MHz

STD

1410

2 ns

1890

36000

3.4 mm

28 mm

28 mm

无

N/A

-

157 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

892.86 MHz

有

119

IGLOO PLUS

1.575 V

Tray

AGLP060

Obsolete

TFBGA, BGA289,17X17,32

GRID ARRAY, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA289,17X17,32

-40 °C

1.5 V

未说明

85 °C

有

AGLP060V5-CSG289I

250 MHz

TFBGA

SQUARE

活跃

MICROSEMI CORP

1.43

表面贴装

CSP-289

YES

289-CSP (14x14)

289

微芯片技术

Details

-40°C ~ 100°C (TJ)

Tray

AGLP060V5

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

未说明

0.8 mm

compliant

S-PBGA-B289

157

不合格

1.5 V

1.5 V

INDUSTRIAL

157

1584 CLBS, 60000 GATES

1.2 mm

现场可编程门阵列

1584

18432

60000

1584

1584

60000

0.81 mm

14 mm

14 mm

N/A

-

81 I/O

2.25 V

0 C

+ 70 C

SMD/SMT

227 MHz

有

90

Actel

0.023175 oz

SX-A

70C

Commercial

TQFP

24000

0C to 70C

81

16000

1452

0.25um

2.75(V)

2.5(V)

无

2.25(V)

0C

有

924

990

表面贴装

2.75 V

Tray

A54SX16

活跃

表面贴装

TQFP-100

100-TQFP (14x14)

微芯片技术

Details

0°C ~ 70°C (TA)

Tray

A54SX16A

2.25V ~ 5.25V

227(MHz)

100

2.5 V

24000

1452

1.4 mm

14 mm

14 mm

N/A

-

Production (Last Updated: 2 months ago)

Details

341 I/O

1.14 V

0 C

+ 70 C

SMD/SMT

892.86 MHz

有

60

ProASIC3

0.014110 oz

1.2000 V

1.14 V

1.26 V

1.26 V

Tray

A3PE3000

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

40

70 °C

有

A3PE3000L-1FGG484

250 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

微芯片技术

This product may require additional documentation to export from the United States.

0 to 70 °C

Tray

A3PE3000L

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

341

不合格

1.5 V

1.2/1.5,1.2/3.3 V

COMMERCIAL

1.26 V

1.14 V

63 kB

341

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

892.86 MHz

1

75264

75264

75264

3000000

1.73 mm

23 mm

23 mm

无

N/A

-

N

11000 LE

97 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

272 MHz

有

160

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3P1000

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

100 °C

无

A3P1000-1FG144I

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.23

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

微芯片技术

This product may require additional documentation to export from the United States.

-40 to 85 °C

Tray

A3P1000

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

不合格

1.5 V

INDUSTRIAL

24576 CLBS, 1000000 GATES

1.55 mm

现场可编程门阵列

147456

1000000

1

24576

1000000

13 mm

13 mm

N/A

-

N

151 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

231 MHz

有

24

ProASIC3

0.183425 oz

1.575 V

Tray

A3P250

Obsolete

表面贴装

PQFP-208

208-PQFP (28x28)

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

A3P250

1.425V ~ 1.575V

1.5 V

36864

250000

3.4 mm

28 mm

28 mm

N/A

-

Production (Last Updated: 2 months ago)

Details

341 I/O

1.14 V

- 40 C

+ 85 C

SMD/SMT

781.25 MHz

有

60

ProASIC3

0.014110 oz

1.2000 V

1.14 V

1.26 V

1.26 V

Tray

A3PE3000

活跃

23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-40 °C

1.2 V

40

85 °C

有

A3PE3000L-FGG484I

250 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

微芯片技术

This product may require additional documentation to export from the United States.

-40 to 85 °C

Tray

A3PE3000L

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

341

不合格

1.5 V

1.2/1.5,1.2/3.3 V

INDUSTRIAL

1.26 V

1.14 V

63 kB

341

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

781.25 MHz

STD

75264

75264

75264

3000000

1.73 mm

23 mm

23 mm

无

无铅

N/A

-

Production (Last Updated: 2 months ago)

912 LE

150 I/O

3 V

- 40 C

+ 85 C

SMD/SMT

有

40

Actel

3.3, 5 V

3 V

5.5 V

42MX

85C

Industrial

TQFP

36000

-40C to 85C

150

36000

912

0.45UM

5.5(V)

3.3/5(V)

无

3(V)

-40C

有

912

1410

表面贴装

8542390000, 8542390000/8542390000, 8542390000/8542390000/8542390000, 8542390000/8542390000/8542390000/8542390000

5.5 V

Tray

A42MX24

活跃

LFQFP,

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

3.3 V

40

85 °C

有

A42MX24-TQG176I

91.8 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.29

表面贴装

表面贴装

TQFP-176

YES

176

176-TQFP (24x24)

176

微芯片技术

Details

-40 to 85 °C

Tray

A42MX24

e3

Matte Tin (Sn)

85 °C

-40 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

260

0.5 mm

compliant

176

S-PQFP-G176

不合格

3.3 V, 5 V

INDUSTRIAL

5.5 V

3 V

-

1890 CLBS, 36000 GATES

1.6 mm

现场可编程门阵列

912

36000

250 MHz

912

STD

-

1410

2.5 ns

1890

36000

1.4 mm

24 mm

24 mm

无

无铅

N/A

-

Details

4500 LE

151 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

272 MHz

有

-

24

55296 bit

ProASIC3

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3P400

活跃

28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, QFP-208

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

100 °C

有

A3P400-1PQG208I

350 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.24

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

微芯片技术

This product may require additional documentation to export from the United States.

-40 to 85 °C

Tray

A3P400

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

1.5 V

INDUSTRIAL

30 mA

9216 CLBS, 400000 GATES

4.1 mm

现场可编程门阵列

55296

400000

1

9216

400000

3.4 mm

28 mm

28 mm

N/A

-

N

186 I/O

2.3 V

- 40 C

+ 85 C

SMD/SMT

180 MHz

有

90

Actel

0.014110 oz

2.7 V

Tray

APA600

活跃

表面贴装

FBGA

256-FPBGA (17x17)

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 85°C (TA)

Tray

APA600

2.3V ~ 2.7V

2.5 V

129024

600000

STD

1.2 mm

17 mm

17 mm