AMD - Embedded - Microcontrollers - Application Specific - 产品分销商 - 目录 - Embedded - Microcontrollers - Application Specific - 页 3

制造商是'AMD'

AMD 嵌入式 - 微控制器 - 应用特定
(158)

产品型号	品牌	数据表	有效性	单价(CNY)	询价	表面安装	终端数量																		JESD-609代码	端子表面处理	附加功能	HTS代码	端子位置	终端形式	峰值回流焊温度（摄氏度）	端子间距	Reach合规守则	时间@峰值回流温度-最大值(s)	引脚数量	JESD-30代码	资历状况	温度等级	uPs/uCs/外围ICs类型	座位高度-最大	地址总线宽度	边界扫描	低功率模式	外部数据总线宽度	内存(字)	串行I/O数	总线兼容性	最大数据传输率	DMA通道数	通信协议	数据编码/解码方式	饱和电流
XCZU5CG-2LFBVB900E	AMD	数据表	N/A	-	最小起订量: 1 倍率: 1	YES	活跃	ADVANCED MICRO DEVICES INC	FCBGA-900	4	110 °C	PLASTIC/EPOXY	BGA	BGA900,30X30,40	SQUARE	网格排列	0.85 V	900	有	e1	锡银铜			BOTTOM	BALL	245	1 mm	compliant	30		S-PBGA-B900		OTHER	PROGRAMMABLE SoC	2.88 mm							CAN, I2C, SPI, UART						31 mm	31 mm
XCZU3EG-2LSFVA625I	AMD	数据表	N/A	-	最小起订量: 1 倍率: 1	YES	活跃	ADVANCED MICRO DEVICES INC	FCBGA-625	100 °C	-40 °C	PLASTIC/EPOXY	FBGA	BGA625,25X25,32	SQUARE	GRID ARRAY, FINE PITCH	0.85 V	625	有					BOTTOM	BALL		0.8 mm	compliant			S-PBGA-B625		INDUSTRIAL	PROGRAMMABLE SoC	3.43 mm							CAN, I2C, SPI, UART						21 mm	21 mm
XCZU6CG-L1SFVA625I	AMD	数据表	N/A	-	最小起订量: 1 倍率: 1	YES	活跃	ADVANCED MICRO DEVICES INC	BGA-625	4	100 °C	-40 °C	PLASTIC/EPOXY	FBGA	BGA625,25X25,32	SQUARE	GRID ARRAY, FINE PITCH	0.742 V	0.698 V	0.72 V	625	有	e1	锡银铜	ALSO OPERATES AT 0.85V NOMINAL SUPPLY		BOTTOM	BALL	250	0.8 mm	compliant	30		S-PBGA-B625		INDUSTRIAL	PROGRAMMABLE SoC	3.43 mm							I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)						21 mm	21 mm
XQ7Z030-2RF900I	AMD	数据表	N/A	-	最小起订量: 1 倍率: 1	YES	活跃	ADVANCED MICRO DEVICES INC	31 X 31 MM, 1 MM PITCH, BGA-900	PLASTIC/EPOXY	BGA	BGA900,30X30,40	SQUARE	网格排列	900	无	e0	Tin/Lead (Sn/Pb)			BOTTOM	BALL		1 mm	compliant			S-PBGA-B900	不合格		PROGRAMMABLE SoC	3.44 mm													31 mm	31 mm
XCZU7CG-2LFFVF1517E	AMD	数据表	N/A	-	最小起订量: 1 倍率: 1	YES	活跃	ADVANCED MICRO DEVICES INC	FCBGA-1517	4	110 °C	PLASTIC/EPOXY	BGA	BGA1517,39X39,40	SQUARE	网格排列	0.85 V	1517	有	e1	锡银铜			BOTTOM	BALL		1 mm	compliant			S-PBGA-B1517		OTHER	PROGRAMMABLE SoC	3.51 mm							CAN, I2C, SPI, UART						40 mm	40 mm
XCZU5EV-1LSFVC784I	AMD	数据表	N/A	-	最小起订量: 1 倍率: 1	YES	活跃	ADVANCED MICRO DEVICES INC	FCBGA-784	4	100 °C	-40 °C	PLASTIC/EPOXY	FBGA	BGA784,28X28,32	SQUARE	GRID ARRAY, FINE PITCH	0.85 V	784	有	e1	锡银铜			BOTTOM	BALL	250	0.8 mm	compliant	30		S-PBGA-B784		INDUSTRIAL	PROGRAMMABLE SoC	3.32 mm							CAN, I2C, SPI, UART						23 mm	23 mm
XCZU11EG-3FFVF1517I	AMD	数据表	N/A	-	最小起订量: 1 倍率: 1	YES	活跃	ADVANCED MICRO DEVICES INC	FCBGA-1517	4	100 °C	-40 °C	PLASTIC/EPOXY	BGA	SQUARE	网格排列	0.9 V	1517	有	e1	锡银铜			BOTTOM	BALL	245	1 mm	compliant	30		S-PBGA-B1517		INDUSTRIAL	PROGRAMMABLE SoC	3.51 mm													40 mm	40 mm
XCZU6CG-1FBVB900E	AMD	数据表	N/A	-	最小起订量: 1 倍率: 1	YES	活跃	ADVANCED MICRO DEVICES INC	BGA-900	4	100 °C	PLASTIC/EPOXY	BGA	BGA900,30X30,40	SQUARE	网格排列	0.876 V	0.825 V	0.85 V	900	有	e1	锡银铜			BOTTOM	BALL	245	1 mm	compliant	30		S-PBGA-B900		OTHER	PROGRAMMABLE SoC	2.88 mm							I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)						31 mm	31 mm
XCZU6CG-2SFVA625E	AMD	数据表	N/A	-	最小起订量: 1 倍率: 1	YES	活跃	ADVANCED MICRO DEVICES INC	BGA-625	4	100 °C	PLASTIC/EPOXY	FBGA	BGA625,25X25,32	SQUARE	GRID ARRAY, FINE PITCH	0.876 V	0.825 V	0.85 V	625	有	e1	锡银铜			BOTTOM	BALL	250	0.8 mm	compliant	30		S-PBGA-B625		OTHER	PROGRAMMABLE SoC	3.43 mm							I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)						21 mm	21 mm
XCZU2CG-2LSFVA625E	AMD	数据表	N/A	-	最小起订量: 1 倍率: 1	YES	活跃	ADVANCED MICRO DEVICES INC	FCBGA-625	4	110 °C	PLASTIC/EPOXY	FBGA	BGA625,25X25,32	SQUARE	GRID ARRAY, FINE PITCH	0.85 V	625	有	e1	锡银铜			BOTTOM	BALL		0.8 mm	compliant			S-PBGA-B625		OTHER	PROGRAMMABLE SoC	3.43 mm							CAN, I2C, SPI, UART						21 mm	21 mm
XCZU2CG-2LSFVC784E	AMD	数据表	N/A	-	最小起订量: 1 倍率: 1	YES	活跃	ADVANCED MICRO DEVICES INC	FCBGA-784	4	110 °C	PLASTIC/EPOXY	FBGA	BGA784,28X28,32	SQUARE	GRID ARRAY, FINE PITCH	0.85 V	784	有	e1	锡银铜			BOTTOM	BALL	250	0.8 mm	compliant	30		S-PBGA-B784		OTHER	PROGRAMMABLE SoC	3.32 mm							CAN, I2C, SPI, UART						23 mm	23 mm
XCZU17EG-2LFFVB1517E	AMD	数据表	N/A	-	最小起订量: 1 倍率: 1	YES	活跃	ADVANCED MICRO DEVICES INC	FCBGA-1517	4	110 °C	PLASTIC/EPOXY	BGA	BGA1517,39X39,40	SQUARE	网格排列	0.85 V	1517	有	e1	锡银铜			BOTTOM	BALL		1 mm	compliant			S-PBGA-B1517		OTHER	PROGRAMMABLE SoC	3.51 mm							CAN, I2C, SPI, UART						40 mm	40 mm
XCZU9CG-L1SFVA625I	AMD	数据表	N/A	-	最小起订量: 1 倍率: 1	YES	活跃	ADVANCED MICRO DEVICES INC	BGA-625	4	100 °C	-40 °C	PLASTIC/EPOXY	FBGA	BGA625,25X25,32	SQUARE	GRID ARRAY, FINE PITCH	0.742 V	0.698 V	0.72 V	625	有	e1	锡银铜	ALSO OPERATES AT 0.85V NOMINAL SUPPLY		BOTTOM	BALL	250	0.8 mm	compliant	30		S-PBGA-B625		INDUSTRIAL	PROGRAMMABLE SoC	3.43 mm							I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)						21 mm	21 mm
XCZU2EG-1LSFVA625I	AMD	数据表	N/A	-	最小起订量: 1 倍率: 1	YES	活跃	ADVANCED MICRO DEVICES INC	FCBGA-625	4	100 °C	-40 °C	PLASTIC/EPOXY	FBGA	BGA625,25X25,32	SQUARE	GRID ARRAY, FINE PITCH	0.85 V	625	有	e1	锡银铜			BOTTOM	BALL		0.8 mm	compliant			S-PBGA-B625		INDUSTRIAL	PROGRAMMABLE SoC	3.43 mm							CAN, I2C, SPI, UART						21 mm	21 mm
XCZU4EG-1LSFVC784I	AMD	数据表	N/A	-	最小起订量: 1 倍率: 1	YES	活跃	ADVANCED MICRO DEVICES INC	FCBGA-784	4	100 °C	-40 °C	PLASTIC/EPOXY	FBGA	BGA784,28X28,32	SQUARE	GRID ARRAY, FINE PITCH	0.85 V	784	有	e1	锡银铜			BOTTOM	BALL	250	0.8 mm	compliant	30		S-PBGA-B784		INDUSTRIAL	PROGRAMMABLE SoC	3.32 mm							CAN, I2C, SPI, UART						23 mm	23 mm
XCZU7EV-1LFFVC1156I	AMD	数据表	N/A	-	最小起订量: 1 倍率: 1	YES	活跃	ADVANCED MICRO DEVICES INC	FCBGA-1156	4	100 °C	-40 °C	PLASTIC/EPOXY	BGA	BGA1156,34X34,40	SQUARE	网格排列	0.85 V	1156	有	e1	锡银铜			BOTTOM	BALL		1 mm	compliant			S-PBGA-B1156		INDUSTRIAL	PROGRAMMABLE SoC	3.51 mm							CAN, I2C, SPI, UART						35 mm	35 mm
XCZU27DR-2FFVE1156I	AMD	数据表	N/A	-	最小起订量: 1 倍率: 1	YES	活跃	ADVANCED MICRO DEVICES INC	100 °C	-40 °C	PLASTIC/EPOXY	BGA	RECTANGULAR	网格排列	0.876 V	0.825 V	0.85 V	1156	有	e1	锡银铜			BOTTOM	BALL	245		compliant	30		R-PBGA-B1156		INDUSTRIAL	RFSOC													4
XCZU4EG-3SFVC784I	AMD	数据表	N/A	-	最小起订量: 1 倍率: 1	YES	活跃	ADVANCED MICRO DEVICES INC	FCBGA-784	4	100 °C	-40 °C	PLASTIC/EPOXY	FBGA	SQUARE	GRID ARRAY, FINE PITCH	0.9 V	784	有	e1	锡银铜			BOTTOM	BALL	250	0.8 mm	compliant	30		S-PBGA-B784		INDUSTRIAL	PROGRAMMABLE SoC	3.32 mm													23 mm	23 mm
XCZU17EG-2LFFVE1924E	AMD	数据表	N/A	-	最小起订量: 1 倍率: 1	YES	活跃	ADVANCED MICRO DEVICES INC	FCBGA-1924	4	110 °C	PLASTIC/EPOXY	BGA	BGA1924,44X44,40	SQUARE	网格排列	0.85 V	1924	有	e1	锡银铜			BOTTOM	BALL		1 mm	compliant			S-PBGA-B1924		OTHER	PROGRAMMABLE SoC	3.71 mm							CAN, I2C, SPI, UART						45 mm	45 mm
XCZU5CG-1LFBVB900I	AMD	数据表	N/A	-	最小起订量: 1 倍率: 1	YES	活跃	ADVANCED MICRO DEVICES INC	FCBGA-900	4	100 °C	-40 °C	PLASTIC/EPOXY	BGA	BGA900,30X30,40	SQUARE	网格排列	0.85 V	900	有	e1	锡银铜			BOTTOM	BALL	245	1 mm	compliant	30		S-PBGA-B900		INDUSTRIAL	PROGRAMMABLE SoC	2.88 mm							CAN, I2C, SPI, UART						31 mm	31 mm
XCZU7CG-1LFBVB900I	AMD	数据表	N/A	-	最小起订量: 1 倍率: 1	YES	活跃	ADVANCED MICRO DEVICES INC	FCBGA-900	4	100 °C	-40 °C	PLASTIC/EPOXY	BGA	BGA900,30X30,40	SQUARE	网格排列	0.85 V	900	有	e1	锡银铜			BOTTOM	BALL	245	1 mm	compliant	30		S-PBGA-B900		INDUSTRIAL	PROGRAMMABLE SoC	2.88 mm							CAN, I2C, SPI, UART						31 mm	31 mm
XCZU4EV-1LFBVB900I	AMD	数据表	N/A	-	最小起订量: 1 倍率: 1	YES	活跃	ADVANCED MICRO DEVICES INC	FCBGA-900	4	100 °C	-40 °C	PLASTIC/EPOXY	BGA	BGA900,30X30,40	SQUARE	网格排列	0.85 V	900	有	e1	锡银铜			BOTTOM	BALL	245	1 mm	compliant	30		S-PBGA-B900		INDUSTRIAL	PROGRAMMABLE SoC	2.88 mm							CAN, I2C, SPI, UART						31 mm	31 mm
XCZU6EG-1LFFVC900I	AMD	数据表	N/A	-	最小起订量: 1 倍率: 1	YES	活跃	ADVANCED MICRO DEVICES INC	FCBGA-900	4	100 °C	-40 °C	PLASTIC/EPOXY	BGA	BGA900,30X30,40	SQUARE	网格排列	0.85 V	900	有	e1	锡银铜			BOTTOM	BALL		1 mm	compliant			S-PBGA-B900		INDUSTRIAL	PROGRAMMABLE SoC	3.42 mm							CAN, I2C, SPI, UART						31 mm	31 mm
AM7990JC	AMD	数据表	N/A	-	最小起订量: 1 倍率: 1	YES	Obsolete	ADVANCED MICRO DEVICES INC	LCC	QCCJ, LDCC68,1.0SQ	1.67 MHz	70 °C	PLASTIC/EPOXY	QCCJ	LDCC68,1.0SQ	SQUARE	CHIP CARRIER	5.25 V	4.75 V	5 V	68	无	e0	锡铅		8542.31.00.01	QUAD	J BEND		1.27 mm	unknown		68	S-PQCC-J68	不合格	COMMERCIAL	SERIAL IO/COMMUNICATION CONTROLLER, LAN	5.08 mm	24	NO	NO	16	0	1	8086; 68000; Z8000; LSI-11	1.25 MBps	1	ASYNC, BIT; SYNC, BYTE; ETHERNET	NRZ		24.2062 mm	24.2062 mm
XCZU2EG-2LSBVA484E	AMD	数据表	N/A	-	最小起订量: 1 倍率: 1	YES	活跃	ADVANCED MICRO DEVICES INC	FCBGA-484	4	110 °C	PLASTIC/EPOXY	FBGA	BGA484,22X22,32	SQUARE	GRID ARRAY, FINE PITCH	0.85 V	484	有	e1	锡银铜			BOTTOM	BALL		0.8 mm	compliant			S-PBGA-B484		OTHER	PROGRAMMABLE SoC	2.61 mm							CAN, I2C, SPI, UART						19 mm	19 mm

AMD 嵌入式 - 微控制器 - 应用特定