N/A

-

YES

Transferred

XILINX INC

FBGA, BGA484,22X22,32

100 °C

-40 °C

PLASTIC/EPOXY

FBGA

BGA484,22X22,32

SQUARE

GRID ARRAY, FINE PITCH

0.742 V

0.698 V

0.72 V

484

有

ALSO OPERATES AT 0.85V NOMINAL SUPPLY

8542.31.00.01

BOTTOM

BALL

0.8 mm

unknown

S-PBGA-B484

INDUSTRIAL

PROGRAMMABLE SoC

2.61 mm

I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)

19 mm

19 mm

N/A

-

NO

Obsolete

GENERAL ELECTRIC SOLID STATE

DIP, DIP40,.6

85 °C

-40 °C

CERAMIC

DIP

DIP40,.6

RECTANGULAR

IN-LINE

40

无

e0

Tin/Lead (Sn/Pb)

8542.31.00.01

DUAL

THROUGH-HOLE

2.54 mm

unknown

R-XDIP-T40

不合格

INDUSTRIAL

N/A

-

YES

Transferred

INTEGRATED CIRCUIT SYSTEMS INC

SOIC-8

70 °C

PLASTIC/EPOXY

SOP

RECTANGULAR

小概要

5.25 V

4.75 V

5 V

8

有

e3

哑光锡

DUAL

鸥翼

1.27 mm

unknown

R-PDSO-G8

不合格

COMMERCIAL

CLOCK GENERATOR, VIDEO

1 MHz

37.5 MHz

4.9 mm

3.9 mm

N/A

-

N/A

-

NO

活跃

ON SEMICONDUCTOR

70 °C

-30 °C

PLASTIC/EPOXY

SDIP

SDIP30,.4

RECTANGULAR

IN-LINE, SHRINK PITCH

5 V

30

无

8542.31.00.01

DUAL

THROUGH-HOLE

1.78 mm

unknown

R-PDIP-T30

不合格

OTHER

GRAPHICS PROCESSOR

N/A

-

YES

活跃

ADVANCED MICRO DEVICES INC

BGA-484

4

100 °C

-40 °C

PLASTIC/EPOXY

FBGA

BGA484,22X22,32

SQUARE

GRID ARRAY, FINE PITCH

0.876 V

0.825 V

0.85 V

484

有

e1

锡银铜

BOTTOM

BALL

250

0.8 mm

compliant

30

S-PBGA-B484

INDUSTRIAL

PROGRAMMABLE SoC

2.61 mm

I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)

19 mm

19 mm

N/A

-

YES

Obsolete

TEXAS INSTRUMENTS INC

QFP

HFQFP,

140 MHz

70 °C

PLASTIC/EPOXY

HFQFP

SQUARE

FLATPACK, HEAT SINK/SLUG, FINE PITCH

5.25 V

4.75 V

5 V

208

无

无

3A001.A.3

8542.31.00.01

QUAD

鸥翼

未说明

0.5 mm

not_compliant

未说明

208

S-PQFP-G208

不合格

COMMERCIAL

DISPLAY CONTROLLER, PALETTE DAC

4.1 mm

4

8

1600 X 1280 PIXELS

28 mm

28 mm

N/A

-

YES

活跃

ROCHESTER ELECTRONICS LLC

QFP

PLASTIC, HQFP-208

140 MHz

70 °C

PLASTIC/EPOXY

HFQFP

SQUARE

FLATPACK, HEAT SINK/SLUG, FINE PITCH

5.25 V

4.75 V

5 V

208

无

e0

无

锡铅

QUAD

鸥翼

未说明

0.5 mm

unknown

未说明

208

S-PQFP-G208

COMMERCIAL

COMMERCIAL

DISPLAY CONTROLLER, PALETTE DAC

4.1 mm

4

8

1600 X 1280 PIXELS

28 mm

28 mm

N/A

-

YES

接触制造商

INTEL CORP

PLASTIC, LCC-44

19.3 MHz

85 °C

-40 °C

PLASTIC/EPOXY

QCCJ

SQUARE

CHIP CARRIER

5.25 V

4.75 V

5 V

44

无

e0

锡铅

8542.31.00.01

QUAD

J BEND

1.27 mm

compliant

S-PQCC-J44

不合格

INDUSTRIAL

SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL

4.57 mm

7

NO

YES

8

2

8051; 80188; 80186

0.5 MBps

SYNC, HDLC; SYNC, SDLC; X.25

NRZ; NRZI

16.6 mm

16.6 mm

N/A

-

YES

Transferred

INFINEON TECHNOLOGIES AG

LCC

PLASTIC, LCC-44

19.3 MHz

85 °C

-40 °C

PLASTIC/EPOXY

QCCJ

LDCC44,.7SQ

SQUARE

CHIP CARRIER

5.25 V

4.75 V

5 V

44

无

e0

锡铅

8542.31.00.01

QUAD

J BEND

1.27 mm

compliant

44

S-PQCC-J44

不合格

INDUSTRIAL

SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL

8.2 mA

4.57 mm

7

NO

YES

8

2

8051; 80188; 80186

0.5 MBps

SYNC, HDLC; SYNC, SDLC; X.25

NRZ; NRZI

16.6 mm

16.6 mm

N/A

-

YES

Obsolete

NATIONAL SEMICONDUCTOR CORP

QCCJ, LDCC52,.8SQ

70 °C

PLASTIC/EPOXY

QCCJ

LDCC52,.8SQ

SQUARE

CHIP CARRIER

5 V

52

无

e0

Tin/Lead (Sn/Pb)

8542.31.00.01

QUAD

J BEND

1.27 mm

unknown

S-PQCC-J52

不合格

COMMERCIAL

N/A

-

YES

Obsolete

FAIRCHILD SEMICONDUCTOR CORP

70 °C

PLASTIC/EPOXY

QCCJ

LDCC52,.8SQ

SQUARE

CHIP CARRIER

5 V

52

无

e0

Tin/Lead (Sn/Pb)

8542.31.00.01

QUAD

J BEND

1.27 mm

compliant

S-PQCC-J52

不合格

COMMERCIAL

N/A

-

N/A

-

N/A

-

SEAWARD ELECTRONICS INC

,

接触制造商

8542.31.00.01

unknown

N/A

-

INTEL CORP

,

2017-10-29

Obsolete

8542.31.00.01

compliant

RFSoC

N/A

-

YES

活跃

ADVANCED MICRO DEVICES INC

BGA-784

4

100 °C

PLASTIC/EPOXY

FBGA

BGA78428X28,32

SQUARE

GRID ARRAY, FINE PITCH

0.876 V

0.825 V

0.85 V

784

有

e1

锡银铜

BOTTOM

BALL

250

0.8 mm

compliant

30

S-PBGA-B784

OTHER

PROGRAMMABLE SoC

3.32 mm

I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)

23 mm

23 mm

N/A

-

YES

Transferred

XILINX INC

FBGA, BGA78428X28,32

4

100 °C

PLASTIC/EPOXY

FBGA

BGA78428X28,32

SQUARE

GRID ARRAY, FINE PITCH

0.876 V

0.825 V

0.85 V

784

有

锡银铜

8542.31.00.01

BOTTOM

BALL

250

0.8 mm

unknown

30

S-PBGA-B784

OTHER

PROGRAMMABLE SoC

3.32 mm

I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)

23 mm

23 mm

N/A

-

NO

Obsolete

TOSHIBA CORP

DIP

DIP,

6.144 MHz

85 °C

-40 °C

PLASTIC/EPOXY

DIP

RECTANGULAR

IN-LINE

5.5 V

4.5 V

5 V

40

无

e0

锡铅

8542.31.00.01

DUAL

THROUGH-HOLE

2.54 mm

unknown

40

R-PDIP-T40

不合格

INDUSTRIAL

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

10 mA

4.8 mm

1

NO

NO

8

0

2

Z80

0.09765625 MBps

ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; X.25; BISYNC; EXT SYNC

NRZ

50.7 mm

15.24 mm

N/A

-

N/A

-

YES

Obsolete

INTEL CORP

PLASTIC/EPOXY

QFP

QFP208,1.2SQ,20

SQUARE

FLATPACK

208

无

e0

Tin/Lead (Sn/Pb)

8542.31.00.01

QUAD

鸥翼

0.5 mm

compliant

S-PQFP-G208

不合格

N/A

-

YES

活跃

ADVANCED MICRO DEVICES INC

FCBGA-1156

4

100 °C

-40 °C

PLASTIC/EPOXY

BGA

BGA1156,34X34,40

SQUARE

网格排列

0.85 V

1156

有

e1

锡银铜

BOTTOM

BALL

1 mm

compliant

S-PBGA-B1156

INDUSTRIAL

PROGRAMMABLE SoC

3.42 mm

CAN, I2C, SPI, UART

35 mm

35 mm

N/A

-

NO

Obsolete

MOTOROLA SEMICONDUCTOR PRODUCTS

DIP, DIP40,.6

70 °C

PLASTIC/EPOXY

DIP

DIP40,.6

RECTANGULAR

IN-LINE

40

无

e0

Tin/Lead (Sn/Pb)

DUAL

THROUGH-HOLE

2.54 mm

unknown

R-PDIP-T40

不合格

COMMERCIAL

N/A

-

NO

Obsolete

SILICON STORAGE TECHNOLOGY INC

DIP

DIP, DIP32,.6

70 °C

PLASTIC/EPOXY

DIP

DIP32,.6

RECTANGULAR

IN-LINE

5.5 V

4.5 V

5 V

32

无

e0

Tin/Lead (Sn/Pb)

8542.31.00.01

DUAL

THROUGH-HOLE

2.54 mm

unknown

32

R-PDIP-T32

不合格

COMMERCIAL

SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE

5.8 mm

16

1.4 MBps

ATA

42.6 mm

15.24 mm

N/A

-

GENESIS MICROCHIP

Transferred

8542.31.00.01

unknown