类别是'嵌入式 - 微控制器 - 应用特定'
嵌入式 - 微控制器 - 应用特定 (5239)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 表面安装 | 终端数量 | JESD-609代码 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 引脚数量 | JESD-30代码 | 资历状况 | 温度等级 | 端口的数量 | uPs/uCs/外围ICs类型 | 比特数 | 电源电流-最大值 | 座位高度-最大 | 地址总线宽度 | 筛选水平 | 外部数据总线宽度 | 内存(字) | 总线兼容性 | 片上数据 RAM 宽度 | 时间-最小值 | 中断能力 | 易失性 | 信息访问方法 | 显示配置 | 长度 | 宽度 | ||||||||||||||||||
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WD8250CL-20 | Western Digital Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NO | Obsolete | WESTERN DIGITAL CORP | 70 °C | CERAMIC | DIP | DIP40,.6 | RECTANGULAR | IN-LINE | 5 V | 40 | 无 | e0 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-XDIP-T40 | 不合格 | COMMERCIAL | |||||||||||||||||||||||||||||||||
M29313-12P | MACOM | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | M/A-COM TECHNOLOGY SOLUTIONS INC | , | Obsolete | 8542.31.00.01 | compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||
M29313-12P | Mindspeed Technologies Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Transferred | MINDSPEED TECHNOLOGIES INC | , | 无 | 8542.31.00.01 | unknown | |||||||||||||||||||||||||||||||||||||||||||||||||
PSD403A2-C-15J | Waferscale Integration Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | WAFERSCALE INTEGRATION INC | PLASTIC, LDCC-68 | 40 | 70 °C | PLASTIC/EPOXY | QCCJ | SQUARE | CHIP CARRIER | 5.5 V | 4.5 V | 5 V | 68 | Transferred | QUAD | J BEND | unknown | S-PQCC-J68 | 不合格 | COMMERCIAL | 5 | PARALLEL IO PORT, GENERAL PURPOSE | 4.57 mm | 24.18 mm | 24.2316 mm | ||||||||||||||||||||||||||||||
SYM53C895 | Symbios Semiconductors | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Transferred | SYMBIOS SEMICONDUCTORS | QFP, QFP208,1.2SQ,20 | 70 °C | PLASTIC/EPOXY | QFP | QFP208,1.2SQ,20 | SQUARE | FLATPACK | 3.3 V | 208 | 无 | e0 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | QUAD | 鸥翼 | 0.5 mm | unknown | S-PQFP-G208 | 不合格 | COMMERCIAL | 130 mA | |||||||||||||||||||||||||||||||
XCZU3EG-3SBVA484E | AMD Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Transferred | XILINX INC | BGA, | 4 | 100 °C | PLASTIC/EPOXY | BGA | SQUARE | 网格排列 | 0.9 V | 484 | 有 | e1 | 锡银铜 | 8542.31.00.01 | BOTTOM | BALL | 250 | compliant | 30 | S-PBGA-B484 | OTHER | PROGRAMMABLE SoC | |||||||||||||||||||||||||||||||
OTI95C71/30 | Qualcomm | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCZU9CG-2SBVA484I | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 活跃 | ADVANCED MICRO DEVICES INC | BGA-484 | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | 0.876 V | 0.825 V | 0.85 V | 484 | 有 | e1 | 锡银铜 | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | S-PBGA-B484 | INDUSTRIAL | PROGRAMMABLE SoC | 2.61 mm | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | 19 mm | 19 mm | |||||||||||||||||||||||
THAT5171N32-U | THAT Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | THAT CORP | , | 接触制造商 | 8542.31.00.01 | unknown | ||||||||||||||||||||||||||||||||||||||||||||||||||
ZPSD813F2-15J | Waferscale Integration Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | WAFERSCALE INTEGRATION INC | PLASTIC, LDCC-52 | 25 MHz | 27 | 70 °C | PLASTIC/EPOXY | QCCJ | SQUARE | CHIP CARRIER | 5.5 V | 4.5 V | 5 V | 52 | Obsolete | QUAD | J BEND | unknown | S-PQCC-J52 | 不合格 | COMMERCIAL | 4 | PARALLEL IO PORT, GENERAL PURPOSE | 4.57 mm | 16 | 19.1 mm | 19.1 mm | ||||||||||||||||||||||||||||
XCZU4CG-1LSFVC784I | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 活跃 | ADVANCED MICRO DEVICES INC | FCBGA-784 | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | BGA784,28X28,32 | SQUARE | GRID ARRAY, FINE PITCH | 0.85 V | 784 | 有 | e1 | 锡银铜 | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | S-PBGA-B784 | INDUSTRIAL | PROGRAMMABLE SoC | 3.32 mm | CAN, I2C, SPI, UART | 23 mm | 23 mm | |||||||||||||||||||||||||
BCM5628A1KTB | Broadcom Limited | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
S1D13706F00A100 | Seiko Epson Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
TMS9902AJDL | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NO | Obsolete | TEXAS INSTRUMENTS INC | DIP, DIP18,.3 | 70 °C | CERAMIC | DIP | DIP18,.3 | RECTANGULAR | IN-LINE | 18 | 无 | 8542.31.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | not_compliant | R-XDIP-T18 | 不合格 | COMMERCIAL | |||||||||||||||||||||||||||||||||||
MCP795W12T-I/SLVAO | Microchip Technology Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | MICROCHIP TECHNOLOGY INC | SOIC-14 | 0.032 MHz | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP14,.25 | RECTANGULAR | 小概要 | 3.6 V | 4.5 V | 3 V | 14 | 活跃 | ALSO OPEARTES AT 1.8 V MINIMUM SUPPLY AT 3 MHZ | DUAL | 鸥翼 | 1.27 mm | compliant | R-PDSO-G14 | TIMER, REAL TIME CLOCK | 8 | 3 mA | 1.75 mm | AEC-Q100 | 64 | 8 | 1/100 SECOND | Y | NO | SERIAL(SPI) | 8.65 mm | 3.9 mm | ||||||||||||||||||||
SED1522DOA | Epson Electronics America Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | S-MOS SYSTEMS | DIE | DIE, | 0.021 MHz | 75 °C | -20 °C | UNSPECIFIED | DIE | UNSPECIFIED | UNCASED CHIP | 5.5 V | 4.5 V | 5 V | 100 | Obsolete | 8542.31.00.01 | UPPER | 无铅 | unknown | 100 | X-XUUC-N100 | 不合格 | 商业扩展 | DISPLAY CONTROLLER, DOT MATRIX LCD DRIVER | 1 | 8 | 80 FAMILY; 68 FAMILY | 8 X 69 DOTS | ||||||||||||||||||||||||||
LM8333 | National Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Transferred | NATIONAL SEMICONDUCTOR CORP | TFBGA, | 1 | 85 °C | -40 °C | UNSPECIFIED | TFBGA | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | 2.75 V | 2.25 V | 49 | 有 | e1 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 0.5 mm | compliant | 40 | S-XBGA-B49 | 不合格 | INDUSTRIAL | 微处理器电路 | 1.1 mm | 4 mm | 4 mm | |||||||||||||||||||||||
TDA8005AH/C129 | Philips Semiconductors | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCZU6CG-2SBVA484E | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 活跃 | ADVANCED MICRO DEVICES INC | BGA-484 | 4 | 100 °C | PLASTIC/EPOXY | FBGA | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | 0.876 V | 0.825 V | 0.85 V | 484 | 有 | e1 | 锡银铜 | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | S-PBGA-B484 | OTHER | PROGRAMMABLE SoC | 2.61 mm | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | 19 mm | 19 mm | ||||||||||||||||||||||||
TA100T-Y240C2X01-00T-V43 | Microchip Technology Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCZU7EG-2LFBVB900E | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 活跃 | ADVANCED MICRO DEVICES INC | FCBGA-900 | 4 | 110 °C | PLASTIC/EPOXY | BGA | BGA900,30X30,40 | SQUARE | 网格排列 | 0.85 V | 900 | 有 | e1 | 锡银铜 | BOTTOM | BALL | 245 | 1 mm | compliant | 30 | S-PBGA-B900 | OTHER | PROGRAMMABLE SoC | 2.88 mm | CAN, I2C, SPI, UART | 31 mm | 31 mm | ||||||||||||||||||||||||||
PCM16C010VJG | National Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | NATIONAL SEMICONDUCTOR CORP | LFQFP, QFP100,.63SQ,20 | 70 °C | PLASTIC/EPOXY | LFQFP | QFP100,.63SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | 5.25 V | 4.75 V | 5 V | 100 | 无 | e0 | 锡铅 | 8542.31.00.01 | QUAD | 鸥翼 | 0.5 mm | unknown | S-PQFP-G100 | 不合格 | COMMERCIAL | 微处理器电路 | 6.5 mA | 1.6 mm | 14 mm | 14 mm | |||||||||||||||||||||||||
NRF9161-LACA-R | Nordic Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
M-L-ET1310I-DT | Broadcom Limited | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | BROADCOM LTD | , | 活跃 | 8542.31.00.01 | compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||
XCZU9CG-L1SBVA484I | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 活跃 | ADVANCED MICRO DEVICES INC | BGA-484 | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | 0.742 V | 0.698 V | 0.72 V | 484 | 有 | e1 | 锡银铜 | ALSO OPERATES AT 0.85V NOMINAL SUPPLY | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | S-PBGA-B484 | INDUSTRIAL | PROGRAMMABLE SoC | 2.61 mm | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | 19 mm | 19 mm |