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我的订单 我的询价 0755-82520436 3307104213

图片

产品型号

品牌

数据表

有效性

单价(CNY)

询价

认证

表面安装

终端数量

JESD-609代码

ECCN 代码

端子表面处理

附加功能

HTS代码

端子位置

终端形式

峰值回流焊温度(摄氏度)

端子间距

Reach合规守则

时间@峰值回流温度-最大值(s)

引脚数量

JESD-30代码

资历状况

温度等级

端口的数量

uPs/uCs/外围ICs类型

比特数

电源电流-最大值

座位高度-最大

地址总线宽度

筛选水平

外部数据总线宽度

内存(字)

总线兼容性

片上数据 RAM 宽度

时间-最小值

中断能力

易失性

信息访问方法

显示配置

长度

宽度

WD8250CL-20 WD8250CL-20

Western Digital Corp 数据表

N/A

-

最小起订量: 1

倍率: 1

NO

Obsolete

WESTERN DIGITAL CORP

70 °C

CERAMIC

DIP

DIP40,.6

RECTANGULAR

IN-LINE

5 V

40

e0

Tin/Lead (Sn/Pb)

8542.31.00.01

DUAL

THROUGH-HOLE

2.54 mm

unknown

R-XDIP-T40

不合格

COMMERCIAL

M29313-12P M29313-12P

MACOM 数据表

N/A

-

最小起订量: 1

倍率: 1

M/A-COM TECHNOLOGY SOLUTIONS INC

,

Obsolete

8542.31.00.01

compliant

M29313-12P M29313-12P

Mindspeed Technologies Inc 数据表

N/A

-

最小起订量: 1

倍率: 1

Transferred

MINDSPEED TECHNOLOGIES INC

,

8542.31.00.01

unknown

PSD403A2-C-15J PSD403A2-C-15J

Waferscale Integration Inc 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

WAFERSCALE INTEGRATION INC

PLASTIC, LDCC-68

40

70 °C

PLASTIC/EPOXY

QCCJ

SQUARE

CHIP CARRIER

5.5 V

4.5 V

5 V

68

Transferred

QUAD

J BEND

unknown

S-PQCC-J68

不合格

COMMERCIAL

5

PARALLEL IO PORT, GENERAL PURPOSE

4.57 mm

24.18 mm

24.2316 mm

SYM53C895 SYM53C895

Symbios Semiconductors 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

Transferred

SYMBIOS SEMICONDUCTORS

QFP, QFP208,1.2SQ,20

70 °C

PLASTIC/EPOXY

QFP

QFP208,1.2SQ,20

SQUARE

FLATPACK

3.3 V

208

e0

Tin/Lead (Sn/Pb)

8542.31.00.01

QUAD

鸥翼

0.5 mm

unknown

S-PQFP-G208

不合格

COMMERCIAL

130 mA

XCZU3EG-3SBVA484E XCZU3EG-3SBVA484E

AMD Xilinx 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

Transferred

XILINX INC

BGA,

4

100 °C

PLASTIC/EPOXY

BGA

SQUARE

网格排列

0.9 V

484

e1

锡银铜

8542.31.00.01

BOTTOM

BALL

250

compliant

30

S-PBGA-B484

OTHER

PROGRAMMABLE SoC

OTI95C71/30 OTI95C71/30

Qualcomm 数据表

N/A

-

最小起订量: 1

倍率: 1

XCZU9CG-2SBVA484I XCZU9CG-2SBVA484I

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

活跃

ADVANCED MICRO DEVICES INC

BGA-484

4

100 °C

-40 °C

PLASTIC/EPOXY

FBGA

BGA484,22X22,32

SQUARE

GRID ARRAY, FINE PITCH

0.876 V

0.825 V

0.85 V

484

e1

锡银铜

BOTTOM

BALL

250

0.8 mm

compliant

30

S-PBGA-B484

INDUSTRIAL

PROGRAMMABLE SoC

2.61 mm

I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)

19 mm

19 mm

THAT5171N32-U THAT5171N32-U

THAT Corporation 数据表

N/A

-

最小起订量: 1

倍率: 1

THAT CORP

,

接触制造商

8542.31.00.01

unknown

ZPSD813F2-15J ZPSD813F2-15J

Waferscale Integration Inc 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

WAFERSCALE INTEGRATION INC

PLASTIC, LDCC-52

25 MHz

27

70 °C

PLASTIC/EPOXY

QCCJ

SQUARE

CHIP CARRIER

5.5 V

4.5 V

5 V

52

Obsolete

QUAD

J BEND

unknown

S-PQCC-J52

不合格

COMMERCIAL

4

PARALLEL IO PORT, GENERAL PURPOSE

4.57 mm

16

19.1 mm

19.1 mm

XCZU4CG-1LSFVC784I XCZU4CG-1LSFVC784I

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

活跃

ADVANCED MICRO DEVICES INC

FCBGA-784

4

100 °C

-40 °C

PLASTIC/EPOXY

FBGA

BGA784,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

0.85 V

784

e1

锡银铜

BOTTOM

BALL

250

0.8 mm

compliant

30

S-PBGA-B784

INDUSTRIAL

PROGRAMMABLE SoC

3.32 mm

CAN, I2C, SPI, UART

23 mm

23 mm

BCM5628A1KTB BCM5628A1KTB

Broadcom Limited 数据表

N/A

-

最小起订量: 1

倍率: 1

S1D13706F00A100 S1D13706F00A100

Seiko Epson Corporation 数据表

N/A

-

最小起订量: 1

倍率: 1

TMS9902AJDL TMS9902AJDL

NA 数据表

N/A

-

最小起订量: 1

倍率: 1

NO

Obsolete

TEXAS INSTRUMENTS INC

DIP, DIP18,.3

70 °C

CERAMIC

DIP

DIP18,.3

RECTANGULAR

IN-LINE

18

8542.31.00.01

DUAL

THROUGH-HOLE

2.54 mm

not_compliant

R-XDIP-T18

不合格

COMMERCIAL

MCP795W12T-I/SLVAO MCP795W12T-I/SLVAO

Microchip Technology Inc 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

MICROCHIP TECHNOLOGY INC

SOIC-14

0.032 MHz

85 °C

-40 °C

PLASTIC/EPOXY

SOP

SOP14,.25

RECTANGULAR

小概要

3.6 V

4.5 V

3 V

14

活跃

ALSO OPEARTES AT 1.8 V MINIMUM SUPPLY AT 3 MHZ

DUAL

鸥翼

1.27 mm

compliant

R-PDSO-G14

TIMER, REAL TIME CLOCK

8

3 mA

1.75 mm

AEC-Q100

64

8

1/100 SECOND

Y

NO

SERIAL(SPI)

8.65 mm

3.9 mm

SED1522DOA SED1522DOA

Epson Electronics America Inc 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

S-MOS SYSTEMS

DIE

DIE,

0.021 MHz

75 °C

-20 °C

UNSPECIFIED

DIE

UNSPECIFIED

UNCASED CHIP

5.5 V

4.5 V

5 V

100

Obsolete

8542.31.00.01

UPPER

无铅

unknown

100

X-XUUC-N100

不合格

商业扩展

DISPLAY CONTROLLER, DOT MATRIX LCD DRIVER

1

8

80 FAMILY; 68 FAMILY

8 X 69 DOTS

LM8333 LM8333

National Semiconductor Corporation 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

Transferred

NATIONAL SEMICONDUCTOR CORP

TFBGA,

1

85 °C

-40 °C

UNSPECIFIED

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

2.75 V

2.25 V

49

e1

EAR99

Tin/Silver/Copper (Sn/Ag/Cu)

8542.31.00.01

BOTTOM

BALL

260

0.5 mm

compliant

40

S-XBGA-B49

不合格

INDUSTRIAL

微处理器电路

1.1 mm

4 mm

4 mm

TDA8005AH/C129 TDA8005AH/C129

Philips Semiconductors 数据表

N/A

-

最小起订量: 1

倍率: 1

XCZU6CG-2SBVA484E XCZU6CG-2SBVA484E

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

活跃

ADVANCED MICRO DEVICES INC

BGA-484

4

100 °C

PLASTIC/EPOXY

FBGA

BGA484,22X22,32

SQUARE

GRID ARRAY, FINE PITCH

0.876 V

0.825 V

0.85 V

484

e1

锡银铜

BOTTOM

BALL

250

0.8 mm

compliant

30

S-PBGA-B484

OTHER

PROGRAMMABLE SoC

2.61 mm

I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)

19 mm

19 mm

TA100T-Y240C2X01-00T-V43 TA100T-Y240C2X01-00T-V43

Microchip Technology Inc 数据表

N/A

-

最小起订量: 1

倍率: 1

XCZU7EG-2LFBVB900E XCZU7EG-2LFBVB900E

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

活跃

ADVANCED MICRO DEVICES INC

FCBGA-900

4

110 °C

PLASTIC/EPOXY

BGA

BGA900,30X30,40

SQUARE

网格排列

0.85 V

900

e1

锡银铜

BOTTOM

BALL

245

1 mm

compliant

30

S-PBGA-B900

OTHER

PROGRAMMABLE SoC

2.88 mm

CAN, I2C, SPI, UART

31 mm

31 mm

PCM16C010VJG PCM16C010VJG

National Semiconductor Corporation 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

Obsolete

NATIONAL SEMICONDUCTOR CORP

LFQFP, QFP100,.63SQ,20

70 °C

PLASTIC/EPOXY

LFQFP

QFP100,.63SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

5.25 V

4.75 V

5 V

100

e0

锡铅

8542.31.00.01

QUAD

鸥翼

0.5 mm

unknown

S-PQFP-G100

不合格

COMMERCIAL

微处理器电路

6.5 mA

1.6 mm

14 mm

14 mm

NRF9161-LACA-R NRF9161-LACA-R

Nordic Semiconductor 数据表

N/A

-

最小起订量: 1

倍率: 1

M-L-ET1310I-DT M-L-ET1310I-DT

Broadcom Limited 数据表

N/A

-

最小起订量: 1

倍率: 1

BROADCOM LTD

,

活跃

8542.31.00.01

compliant

XCZU9CG-L1SBVA484I XCZU9CG-L1SBVA484I

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

活跃

ADVANCED MICRO DEVICES INC

BGA-484

4

100 °C

-40 °C

PLASTIC/EPOXY

FBGA

BGA484,22X22,32

SQUARE

GRID ARRAY, FINE PITCH

0.742 V

0.698 V

0.72 V

484

e1

锡银铜

ALSO OPERATES AT 0.85V NOMINAL SUPPLY

BOTTOM

BALL

250

0.8 mm

compliant

30

S-PBGA-B484

INDUSTRIAL

PROGRAMMABLE SoC

2.61 mm

I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)

19 mm

19 mm