类别是'嵌入式 - 片上系统（SoC）'
嵌入式 - 片上系统（SoC） (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 终端数量 | 厂商 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 技术 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 温度等级 | 电源电压-最小值(Vsup) | 界面 | 最大电源电压 | 最小电源电压 | 速度 | 内存大小 | uPs/uCs/外围ICs类型 | 核心处理器 | 周边设备 | 时钟频率 | 程序内存大小 | 传播延迟 | 连接方式 | 建筑学 | 数据总线宽度 | 输入数量 | 座位高度-最大 | 可编程逻辑类型 | 核心架构 | 边界扫描 | 速度等级 | 内存(字) | 主要属性 | 寄存器数量 | 逻辑单元数 | 核数量 | 总线兼容性 | 闪光大小 | 可擦除紫外线 | 座位高度(最大) | 长度 | 宽度 | RoHS状态 | |||||||||||||||||||||||||||||||||||||||
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 | 10AS066H3F34E2SG | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 1152-BBGA, FCBGA | YES | 492 | 0°C~100°C TJ | Tray | Arria 10 SX | 活跃 | 3 (168 Hours) | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 0.9V | 1mm | 未说明 | S-PBGA-B1152 | 492 | 不合格 | 0.93V | 0.9V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 492 | 现场可编程门阵列 | FPGA - 660K Logic Elements | 660000 | 3.65mm | 35mm | 35mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 5CSEBA2U23C6N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 672-FBGA | YES | MCU - 181, FPGA - 145 | 0°C~85°C TJ | Tray | 2018 | Cyclone® V SE | 活跃 | 3 (168 Hours) | 672 | BOTTOM | BALL | 未说明 | 1.1V | 0.8mm | 未说明 | S-PBGA-B672 | 145 | 不合格 | 1.13V | 1.11.2/3.32.5V | 1.07V | 925MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 145 | 现场可编程门阵列 | FPGA - 25K Logic Elements | 25000 | 1.85mm | 23mm | 23mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | XCZU3EG-1SFVC784I | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | 784-BFBGA, FCBGA | 252 | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | 活跃 | 4 (72 Hours) | 8542.31.00.01 | 未说明 | 未说明 | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 10AS048H3F34E2SG | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | 1152-BBGA, FCBGA | YES | 492 | 0°C~100°C TJ | Tray | Arria 10 SX | 活跃 | 3 (168 Hours) | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 0.9V | 1mm | 未说明 | S-PBGA-B1152 | 492 | 不合格 | 0.93V | 0.9V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 492 | 现场可编程门阵列 | FPGA - 480K Logic Elements | 480000 | 3.65mm | 35mm | 35mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | XC7Z030-3SBG485E | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | 484-FBGA, FCBGA | 485 | 130 | 0°C~100°C TJ | Tray | 2009 | Zynq®-7000 | e1 | 活跃 | 4 (72 Hours) | 485 | EAR99 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1V | 0.8mm | 1GHz | 未说明 | 不合格 | 1.05V | 11.8V | 0.95V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | 微处理器电路 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | 256000 | Kintex™-7 FPGA, 125K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | N | 2.44mm | 19mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
.png) | M2S005S-1FGG484T2 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Details | SMD/SMT | 166 MHz | - | - | 64 kB | 6060 LE | 209 I/O | 0 C | + 85 C | 191 kbit | 有 | 505 LAB | 60 | 1.2000 V | Tray | M2S005 | 活跃 | , | 40 | 有 | M2S005S-1FGG484T2 | 活跃 | MICROSEMI CORP | 5.81 | BGA-484 | 484-FPBGA (23x23) | 微芯片技术 | This product may require additional documentation to export from the United States. | 0 to 85 °C | Tray | SmartFusion2 | e1 | 有 | Tin/Silver/Copper (Sn/Ag/Cu) | 250 | compliant | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 现场可编程门阵列 | 1 | FPGA - 5K Logic Modules | 1 Core | 128KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S025-VFG400I | Atmel (Microchip Technology) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | SMD/SMT | 166 MHz | - | - | 64 kB | 27696 LE | 有 | 2308 LAB | 90 | 0.227784 oz | VFPBGA-400 | Details | Tray | SmartFusion2 | 256 kB | 1 Core | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU3CG-1SFVC784E | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | 784-BFBGA, FCBGA | 252 | 0°C~100°C TJ | Bulk | 2016 | Zynq® UltraScale+™ MPSoC CG | 活跃 | 4 (72 Hours) | 8542.31.00.01 | 未说明 | 未说明 | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU3EG-2SFVC784I | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | 784-BFBGA, FCBGA | YES | 252 | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | 活跃 | 4 (72 Hours) | 784 | 8542.31.00.01 | BOTTOM | BALL | 未说明 | 0.85V | 未说明 | R-PBGA-B784 | 0.876V | 0.825V | 533MHz, 600MHz, 1.3GHz | 256KB | 微处理器电路 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | XA7Z020-1CLG400I | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Automotive grade | Copper, Silver, Tin | 表面贴装 | 400-LFBGA, CSPBGA | 400 | 130 | -40°C~100°C TJ | Tray | 2010 | Automotive, AEC-Q100, Zynq®-7000 XA | e1 | 活跃 | 4 (72 Hours) | 400 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 0.8mm | 667MHz | 未说明 | 不合格 | 1V | 11.8V | CAN, EBI/EMI, Ethernet, GPIO, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | 微处理器电路 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | Artix™-7 FPGA, 85K Logic Cells | N | 1.6mm | 17mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S025T-1FGG484I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Details | SMD/SMT | 166 MHz | - | - | 64 kB | 27696 LE | 有 | 2308 LAB | 60 | 1.2000 V | 267 | Tray | M2S025 | 活跃 | FPBGA-484 | 484-FPBGA (23x23) | 微芯片技术 | This product may require additional documentation to export from the United States. | -40 to 100 °C | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 25K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S010-1VFG400 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Details | SMD/SMT | 166 MHz | - | - | 64 kB | 12084 LE | 有 | 1007 LAB | 90 | 195 | Tray | M2S010 | 活跃 | VFBGA-400 | GRID ARRAY, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | BGA400,20X20,32 | 1.2 V | 40 | 1.14 V | 85 °C | 有 | M2S010-1VFG400 | LFBGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.77 | VFPBGA-400 | YES | 400-VFBGA (17x17) | 400 | 微芯片技术 | This product may require additional documentation to export from the United States. | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 0.8 mm | compliant | S-PBGA-B400 | 195 | 不合格 | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 195 | 1.51 mm | 现场可编程门阵列 | FPGA - 10K Logic Modules | 12084 | 1 Core | 256KB | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||
 | 5CSTFD6D5F31I7N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 896-BGA | YES | MCU - 181, FPGA - 288 | -40°C~100°C TJ | Tray | 2018 | Cyclone® V ST | e1 | 活跃 | 3 (168 Hours) | 896 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.1V | 1mm | 未说明 | 5CSTFD6 | S-PBGA-B896 | 288 | 不合格 | 1.13V | 1.11.2/3.32.5V | 1.07V | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 288 | 现场可编程门阵列 | FPGA - 110K Logic Elements | 110000 | 2mm | 31mm | 31mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU4CG-1FBVB900E | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | 900-BBGA, FCBGA | 204 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | 活跃 | 4 (72 Hours) | 8542.31.00.01 | 未说明 | 未说明 | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | XC7Z020-L1CLG484I | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | 484-LFBGA, CSPBGA | 130 | -40°C~100°C TJ | Tray | 2010 | Zynq®-7000 | e1 | 活跃 | 3 (168 Hours) | 484 | 3A991.D | Tin/Silver/Copper (Sn/Ag/Cu) | PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1V | 0.8mm | 667MHz | 未说明 | S-PBGA-B484 | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 1.05V | 950mV | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | 130 ps | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | ARM | YES | 256000 | Artix™-7 FPGA, 85K Logic Cells | 106400 | CAN; ETHERNET; I2C; SPI; UART; USB | 1.6mm | 19mm | 19mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S050-1VFG400I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Details | SMD/SMT | 166 MHz | - | - | 64 kB | 56340 LE | 有 | 4695 LAB | 90 | 207 | Tray | M2S050 | 活跃 | LFBGA, BGA400,20X20,32 | GRID ARRAY, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | BGA400,20X20,32 | 1.2 V | 40 | 1.14 V | 有 | M2S050-1VFG400I | LFBGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.76 | VFPBGA-400 | YES | 400-VFBGA (17x17) | 400 | 微芯片技术 | This product may require additional documentation to export from the United States. | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 0.8 mm | compliant | S-PBGA-B400 | 207 | 不合格 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 207 | 1.51 mm | 现场可编程门阵列 | FPGA - 50K Logic Modules | 56340 | 1 Core | 256KB | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||
| A2F500M3G-CS288 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | N | 80 MHz | - | - | 64 kB | 6000 LE | 有 | - | 176 | SmartFusion | MCU - 31, FPGA - 78 | Tray | A2F500 | 活跃 | 288-TFBGA, CSPBGA | 288-CSP (11x11) | 微芯片技术 | This product may require additional documentation to export from the United States. | 0°C ~ 85°C (TJ) | Tray | A2F500 | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 512 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 1 Core | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S005S-1VFG400T2 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Details | SMD/SMT | 166 MHz | - | - | 64 kB | 6060 LE | 171 I/O | 0 C | + 85 C | 191 kbit | 有 | 505 LAB | 90 | 0.652216 oz | 1.2000 V | Tray | M2S005 | 活跃 | BGA-400 | 400-VFBGA (17x17) | 微芯片技术 | This product may require additional documentation to export from the United States. | 0 to 85 °C | Tray | SmartFusion2 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 5K Logic Modules | 1 Core | 128KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S010TS-1VF256I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | N | SMD/SMT | 166 MHz | - | - | 64 kB | 12084 LE | 有 | 1007 LAB | 119 | 138 | Tray | M2S010 | 活跃 | VFBGA-256 | GRID ARRAY, LOW PROFILE, FINE PITCH | PLASTIC/EPOXY | BGA256,16X16,32 | 1.2 V | 30 | 1.14 V | 无 | M2S010TS-1VF256I | LFBGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.84 | Production (Last Updated: 1 month ago) | VFPBGA-256 | YES | 256-FPBGA (14x14) | 256 | 微芯片技术 | This product may require additional documentation to export from the United States. | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | S-PBGA-B256 | 138 | 不合格 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 138 | 1.56 mm | 现场可编程门阵列 | FPGA - 10K Logic Modules | 12084 | 1 Core | 256KB | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||
 | XC7Z045-L2FFG676I | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | 676-BBGA, FCBGA | 130 | -40°C~100°C TJ | Tray | 2010 | Zynq®-7000 | e1 | 活跃 | 4 (72 Hours) | 676 | 3A991.D | Tin/Silver/Copper (Sn/Ag/Cu) | PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1V | 1mm | 800MHz | 未说明 | S-PBGA-B676 | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 1.05V | 950mV | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | 100 ps | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | ARM | YES | 256000 | Kintex™-7 FPGA, 350K Logic Cells | 437200 | CAN; ETHERNET; I2C; SPI; UART; USB | 3.37mm | 27mm | 27mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 5CSEMA4U23I7N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 672-FBGA | YES | MCU - 181, FPGA - 145 | -40°C~100°C TJ | Tray | 2018 | Cyclone® V SE | 活跃 | 3 (168 Hours) | 672 | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.1V | 0.8mm | 未说明 | 5CSEMA4 | S-PBGA-B672 | 145 | 不合格 | 1.13V | 1.11.2/3.32.5V | 1.07V | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 145 | 现场可编程门阵列 | FPGA - 40K Logic Elements | 40000 | 1.85mm | 23mm | 23mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC7Z012S-2CLG485I | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 484-LFBGA, CSPBGA | YES | 150 | -40°C~100°C TJ | Tray | 2016 | Zynq®-7000 | e3 | yes | 活跃 | 3 (168 Hours) | 485 | Matte Tin (Sn) | 8542.31.00.01 | BOTTOM | BALL | 未说明 | 1V | 0.8mm | 未说明 | S-PBGA-B485 | 1.05V | 0.95V | 766MHz | 256KB | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | 800MHz | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | YES | 256000 | Artix™-7 FPGA, 55K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 1.6mm | 19mm | 19mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU17EG-2FFVC1760E | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | 1760-BBGA, FCBGA | 512 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | yes | 活跃 | 4 (72 Hours) | 8542.31.00.01 | 未说明 | 未说明 | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 5CSXFC5C6U23I7N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 672-FBGA | YES | MCU - 181, FPGA - 145 | -40°C~100°C TJ | Tray | 2018 | Cyclone® V SX | 活跃 | 3 (168 Hours) | 672 | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.1V | 0.8mm | 未说明 | 5CSXFC5 | S-PBGA-B672 | 145 | 不合格 | 1.13V | 1.11.2/3.32.5V | 1.07V | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 145 | 现场可编程门阵列 | FPGA - 85K Logic Elements | 85000 | 1.85mm | 23mm | 23mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | XCZU2CG-1SBVA484I | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | 484-BFBGA, FCBGA | 82 | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | 活跃 | 4 (72 Hours) | 8542.31.00.01 | 未说明 | 未说明 | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | ROHS3 Compliant |