类别是'嵌入式 - 片上系统（SoC）'
嵌入式 - 片上系统（SoC） (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 底架 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 界面 | 最大电源电压 | 最小电源电压 | 内存大小 | 工作电源电流 | 速度 | 内存大小 | 核心处理器 | 周边设备 | 连接方式 | 数据率 | 建筑学 | 输入数量 | 组织结构 | 可编程逻辑类型 | 逻辑元件/单元数 | 核心架构 | 阀门数量 | 最高频率 | 逻辑块数(LABs) | 主要属性 | 寄存器数量 | 逻辑单元数 | 等效门数 | 闪光大小 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | 无铅 | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | M2S005S-1VFG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 256-LBGA | YES | 161 | 0°C~85°C TJ | Tray | SmartFusion®2 | e3 | 活跃 | 3 (168 Hours) | 256 | 哑光锡 | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.2V | 0.8mm | 未说明 | S-PBGA-B256 | 161 | 不合格 | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 161 | 现场可编程门阵列 | FPGA - 5K Logic Modules | 6060 | 128KB | 1.56mm | 14mm | 14mm | 符合RoHS标准 | |||||||||||||||||||||||||||||
 | M2S005-1FGG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 484-BGA | 484 | 484-FPBGA (23x23) | 209 | 0°C~85°C TJ | Tray | 2009 | SmartFusion®2 | 活跃 | 3 (168 Hours) | 85°C | 0°C | 166MHz | M2S005 | 1.2V | CAN, Ethernet, I2C, SPI, UART, USART, USB | 1.26V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | ARM | FPGA - 5K Logic Modules | 128KB | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||
 | M2S005S-VFG400 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 400-LFBGA | YES | 169 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e3 | 活跃 | 3 (168 Hours) | 400 | 哑光锡 | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.2V | 0.8mm | 未说明 | S-PBGA-B400 | 171 | 不合格 | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 171 | 现场可编程门阵列 | FPGA - 5K Logic Modules | 6060 | 128KB | 1.51mm | 17mm | 17mm | 符合RoHS标准 | |||||||||||||||||||||||||||||
 | M2S005S-1TQG144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 144-LQFP | YES | 84 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e3 | 活跃 | 3 (168 Hours) | 144 | 哑光锡 | 8542.39.00.01 | QUAD | 鸥翼 | 未说明 | 1.2V | 0.5mm | 未说明 | S-PQFP-G144 | 84 | 不合格 | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 84 | 现场可编程门阵列 | FPGA - 5K Logic Modules | 6060 | 128KB | 1.6mm | 20mm | 20mm | 符合RoHS标准 | |||||||||||||||||||||||||||||
.png) | A2F200M3F-1CSG288I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 288-TFBGA, CSPBGA | YES | MCU - 31, FPGA - 78 | -40°C~100°C TJ | Tray | 2013 | SmartFusion® | e1 | 活跃 | 3 (168 Hours) | 288 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 260 | 1.5V | 0.5mm | 100MHz | 30 | A2F200 | S-PBGA-B288 | 78 | 不合格 | 1.5V | 1.51.82.53.3V | EBI/EMI, Ethernet, I2C, SPI, UART, USART | 1.575V | 1.425V | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, SPI, UART/USART | MCU, FPGA | 78 | 4608 CLBS, 200000 GATES | 现场可编程门阵列 | ARM | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 200000 | 256KB | 1.05mm | 11mm | 11mm | 符合RoHS标准 | |||||||||||||||||||||||||
| M2S010-1VFG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 256-LBGA | YES | 138 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e3 | 活跃 | 3 (168 Hours) | 256 | 哑光锡 | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.2V | 0.8mm | 未说明 | S-PBGA-B256 | 138 | 不合格 | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 138 | 现场可编程门阵列 | FPGA - 10K Logic Modules | 12084 | 256KB | 1.56mm | 14mm | 14mm | 符合RoHS标准 | ||||||||||||||||||||||||||||
| M2S005S-TQG144 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 144-LQFP | YES | 84 | 0°C~85°C TJ | Tray | 2014 | SmartFusion®2 | e3 | 活跃 | 3 (168 Hours) | 144 | 哑光锡 | 8542.39.00.01 | QUAD | 鸥翼 | 未说明 | 1.2V | 0.5mm | 未说明 | S-PQFP-G144 | 84 | 不合格 | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 84 | 现场可编程门阵列 | FPGA - 5K Logic Modules | 6060 | 128KB | 1.6mm | 20mm | 20mm | 符合RoHS标准 | |||||||||||||||||||||||||||||
| M2S005S-VFG400I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 400-LFBGA | YES | 169 | -40°C~100°C TJ | Tray | 2013 | SmartFusion®2 | e3 | yes | 活跃 | 3 (168 Hours) | 400 | 哑光锡 | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.2V | 0.8mm | 未说明 | S-PBGA-B400 | 1.26V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 现场可编程门阵列 | FPGA - 5K Logic Modules | 128KB | 1.51mm | 17mm | 17mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||
| M2S005S-1FGG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 484-BGA | 484-FPBGA (23x23) | 209 | 0°C~85°C TJ | Tray | 2010 | SmartFusion®2 | 活跃 | 3 (168 Hours) | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 5K Logic Modules | 128KB | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S005S-1VFG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 256-LBGA | YES | 161 | -40°C~100°C TJ | Tray | SmartFusion®2 | e3 | 活跃 | 3 (168 Hours) | 256 | 哑光锡 | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.2V | 0.8mm | 未说明 | S-PBGA-B256 | 161 | 不合格 | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 161 | 现场可编程门阵列 | FPGA - 5K Logic Modules | 6060 | 128KB | 1.56mm | 14mm | 14mm | 符合RoHS标准 | |||||||||||||||||||||||||||||
| M2S005S-1FGG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 484-BGA | 484-FPBGA (23x23) | 209 | -40°C~100°C TJ | Tray | SmartFusion®2 | 活跃 | 3 (168 Hours) | 100°C | -40°C | 166MHz | M2S005S | CAN, Ethernet, I2C, SPI, UART, USART, USB | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | ARM | FPGA - 5K Logic Modules | 128KB | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||
| M2S010T-VFG400 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 64KB | IN PRODUCTION (Last Updated: 1 month ago) | 400-LFBGA | 400 | 400-VFBGA (17x17) | 195 | 0°C~85°C TJ | Tray | 2009 | SmartFusion®2 | 活跃 | 3 (168 Hours) | 85°C | 0°C | 166MHz | M2S010T | 1.2V | CAN, Ethernet, I2C, SPI, UART, USART, USB | 166MHz | 256kB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 667 Mbps | MCU, FPGA | 12084 | ARM | 400MHz | 1007 | FPGA - 10K Logic Modules | 256KB | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||
| M2S010TS-1VFG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 256-LBGA | YES | 138 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e3 | 活跃 | 3 (168 Hours) | 256 | 哑光锡 | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.2V | 0.8mm | 未说明 | S-PBGA-B256 | 138 | 不合格 | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 138 | 现场可编程门阵列 | FPGA - 10K Logic Modules | 12084 | 256KB | 1.56mm | 14mm | 14mm | 符合RoHS标准 | |||||||||||||||||||||||||||||
| M2S010T-FGG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 64KB | IN PRODUCTION (Last Updated: 1 month ago) | 484-BGA | 484 | 484-FPBGA (23x23) | 233 | 0°C~85°C TJ | Tray | 2009 | SmartFusion®2 | 活跃 | 3 (168 Hours) | 85°C | 0°C | 166MHz | M2S010T | 1.2V | CAN, Ethernet, I2C, SPI, UART, USART, USB | 166MHz | 50kB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 12084 | ARM | 1007 | FPGA - 10K Logic Modules | 256KB | 23mm | 23mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||
| M2S010-1VFG400 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 400-LFBGA | 400 | 400-VFBGA (17x17) | 195 | 0°C~85°C TJ | Tray | SmartFusion®2 | 活跃 | 3 (168 Hours) | 85°C | 0°C | 166MHz | M2S010 | CAN, Ethernet, I2C, SPI, UART, USART, USB | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | ARM | FPGA - 10K Logic Modules | 256KB | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||
 | M2S060T-FCSG325I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 325-TFBGA, CSPBGA | 325-CSPBGA (11x11) | 200 | -40°C~100°C TJ | Tray | SmartFusion®2 | 活跃 | 3 (168 Hours) | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 60K Logic Modules | 256KB | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||
| A2F200M3F-FGG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 64KB | 256-LBGA | 256 | 256-FPBGA (17x17) | MCU - 25, FPGA - 66 | 0°C~85°C TJ | Tray | 2011 | SmartFusion® | 活跃 | 3 (168 Hours) | 85°C | 0°C | 80MHz | A2F200 | 1.5V | EBI/EMI, Ethernet, I2C, SPI, UART, USART | 1.575V | 1.425V | 7mA | 80MHz | 4.5kB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, SPI, UART/USART | 400 kbps | MCU, FPGA | 2500 | ARM | 200000 | 100MHz | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 4608 | 256KB | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||
| A2F060M3E-TQG144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 144-LQFP | 144-TQFP (20x20) | MCU - 21, FPGA - 33 | -40°C~100°C TJ | Tray | 2011 | SmartFusion® | Obsolete | 3 (168 Hours) | 100°C | -40°C | 80MHz | A2F060M3E | EBI/EMI, I2C, SPI, UART, USART | 80MHz | 16KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, I2C, SPI, UART/USART | MCU, FPGA | ARM | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | 128KB | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||
| M2S060T-1FG484M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 484-BGA | YES | 267 | -55°C~125°C TJ | Tray | SmartFusion®2 | e0 | yes | 活跃 | 3 (168 Hours) | 484 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.2V | 1mm | not_compliant | 未说明 | S-PBGA-B484 | 1.26V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 现场可编程门阵列 | FPGA - 60K Logic Modules | 256KB | 2.44mm | 23mm | 23mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||
| M2S025-FCSG325I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 325-TFBGA, CSPBGA | YES | 180 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e3 | 活跃 | 3 (168 Hours) | 325 | 哑光锡 | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.2V | 0.5mm | 未说明 | S-PBGA-B325 | 180 | 不合格 | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 180 | 现场可编程门阵列 | FPGA - 25K Logic Modules | 27696 | 256KB | 1.01mm | 11mm | 11mm | 符合RoHS标准 | ||||||||||||||||||||||||||||
| M2S150-FCVG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 484-BFBGA | YES | 273 | -40°C~100°C TJ | Tray | SmartFusion®2 | e3 | 活跃 | 4 (72 Hours) | 484 | 哑光锡 | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.2V | 0.8mm | 未说明 | S-PBGA-B484 | 273 | 不合格 | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 273 | 现场可编程门阵列 | FPGA - 150K Logic Modules | 146124 | 512KB | 3.15mm | 19mm | 19mm | 符合RoHS标准 | |||||||||||||||||||||||||||||
| M2S025T-VFG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 256-LBGA | YES | 138 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e3 | 活跃 | 3 (168 Hours) | 256 | 哑光锡 | LG-MIN, WD-MIN | BOTTOM | BALL | 未说明 | 1.2V | 0.8mm | 未说明 | S-PBGA-B256 | 138 | 不合格 | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 138 | 现场可编程门阵列 | FPGA - 25K Logic Modules | 27696 | 256KB | 1.56mm | 14mm | 14mm | 符合RoHS标准 | |||||||||||||||||||||||||||||
| M2S025-VFG400 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 400-LFBGA | 400 | 400-VFBGA (17x17) | 207 | 0°C~85°C TJ | Tray | 2009 | SmartFusion®2 | 活跃 | 3 (168 Hours) | 85°C | 0°C | 166MHz | M2S025 | CAN, Ethernet, I2C, SPI, UART, USART, USB | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | ARM | FPGA - 25K Logic Modules | 256KB | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||
| M2S010-FGG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | 64KB | IN PRODUCTION (Last Updated: 1 month ago) | 484-BGA | 484 | 484-FPBGA (23x23) | 233 | 0°C~85°C TJ | Tray | 2009 | SmartFusion®2 | 活跃 | 3 (168 Hours) | 85°C | 0°C | 166MHz | M2S010 | 1.2V | CAN, Ethernet, I2C, SPI, UART, USART, USB | 166MHz | 50kB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 12084 | ARM | 1007 | FPGA - 10K Logic Modules | 256KB | 23mm | 23mm | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||||||||||||
| M2S005-TQG144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 144-LQFP | YES | 144 | 84 | -40°C~100°C TJ | Tray | 2000 | SmartFusion®2 | e3 | 活跃 | 3 (168 Hours) | 144 | 哑光锡 | 8542.39.00.01 | QUAD | 鸥翼 | 未说明 | 1.2V | 0.5mm | 未说明 | 84 | 不合格 | 1.2V | 1.26V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 现场可编程门阵列 | FPGA - 5K Logic Modules | 6060 | 128KB | 1.6mm | 20mm | 20mm | 符合RoHS标准 | 无铅 |