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图片

产品型号

品牌

数据表

有效性

单价(CNY)

询价

认证

表面安装

终端数量

JESD-609代码

无铅代码

端子表面处理

附加功能

HTS代码

包装方式

端子位置

终端形式

峰值回流焊温度(摄氏度)

端子间距

Reach合规守则

时间@峰值回流温度-最大值(s)

引脚数量

JESD-30代码

输出的数量

资历状况

温度等级

传播延迟

建筑学

输入数量

组织结构

座位高度-最大

可编程逻辑类型

输出功能

宏细胞数

JTAG BST

专用输入数量

系统内可编程

产品条款数量

长度

宽度

XCR5128C-12TQ128C XCR5128C-12TQ128C

AMD Xilinx 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

XILINX INC

QFP

LFQFP,

63 MHz

96

70 °C

PLASTIC/EPOXY

LFQFP

QFP128,.63X.87,20

RECTANGULAR

FLATPACK, LOW PROFILE, FINE PITCH

5.25 V

4.75 V

5 V

128

Obsolete

8542.39.00.01

QUAD

鸥翼

0.5 mm

unknown

128

R-PQFP-G128

不合格

COMMERCIAL

12 ns

2 DEDICATED INPUTS, 96 I/O

1.6 mm

EE PLD

MACROCELL

2

20 mm

14 mm

PAL16R8A-2CJ PAL16R8A-2CJ

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

NO

Obsolete

ADVANCED MICRO DEVICES INC

DIP

DIP, DIP20,.3

18 MHz

75 °C

CERAMIC, GLASS-SEALED

DIP

DIP20,.3

RECTANGULAR

IN-LINE

5.25 V

4.75 V

5 V

20

e0

锡铅

8542.39.00.01

DUAL

THROUGH-HOLE

2.54 mm

unknown

20

R-GDIP-T20

8

不合格

商业扩展

25 ns

PAL-TYPE

8

8 DEDICATED INPUTS, 0 I/O

OT PLD

REGISTERED

8

64

XCR3032-8PC44C XCR3032-8PC44C

AMD Xilinx 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

XILINX INC

LCC

QCCJ,

74 MHz

33

70 °C

PLASTIC/EPOXY

QCCJ

SQUARE

CHIP CARRIER

3.6 V

3 V

3.3 V

44

Obsolete

8542.39.00.01

QUAD

J BEND

1.27 mm

unknown

44

S-PQCC-J44

不合格

COMMERCIAL

10.5 ns

2 DEDICATED INPUTS, 33 I/O

4.57 mm

EE PLD

MACROCELL

2

16.5862 mm

16.5862 mm

MACH211SP-10JI MACH211SP-10JI

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

Obsolete

ADVANCED MICRO DEVICES INC

LCC

QCCJ, LDCC44,.7SQ

80 MHz

32

85 °C

-40 °C

PLASTIC/EPOXY

QCCJ

LDCC44,.7SQ

SQUARE

CHIP CARRIER

5.5 V

4.5 V

5 V

44

e0

锡铅

4 PAL BLOCKS; BURIED MACROCELLS; 2 EXTERNAL CLOCKS; SHARED INPUT/CLOCK

8542.39.00.01

QUAD

J BEND

1.27 mm

unknown

44

S-PQCC-J44

不合格

INDUSTRIAL

14 ns

0 DEDICATED INPUTS, 32 I/O

4.57 mm

EE PLD

MACROCELL

64

NO

YES

16.5862 mm

16.5862 mm

MACH211SP-10JI MACH211SP-10JI

Vantis Corporation 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

Transferred

VANTIS CORP

74 MHz

32

85 °C

-40 °C

PLASTIC/EPOXY

QCCJ

LDCC44,.7SQ

SQUARE

CHIP CARRIER

5.5 V

4.5 V

5 V

44

e0

Tin/Lead (Sn/Pb)

由PIA连接的PAL块

QUAD

J BEND

1.27 mm

unknown

S-PQCC-J44

不合格

INDUSTRIAL

14 ns

0 DEDICATED INPUTS, 32 I/O

EE PLD

MACROCELL

64

NO

YES

GAL16V8-35LP GAL16V8-35LP

Lattice Semiconductor Corporation 数据表

N/A

-

最小起订量: 1

倍率: 1

PZ3128IS15BE-S PZ3128IS15BE-S

Philips Semiconductors 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

Transferred

飞利浦半导体

QFP, QFP128,.63X.87,20

85 °C

-40 °C

PLASTIC/EPOXY

QFP

QFP128,.63X.87,20

RECTANGULAR

FLATPACK

3.3 V

128

e0

Tin/Lead (Sn/Pb)

YES

8542.39.00.01

TRAY

QUAD

鸥翼

0.5 mm

unknown

R-PQFP-G128

不合格

INDUSTRIAL

17.5 ns

EE PLD

128

YES

YES

PZ3128IS15BE-S PZ3128IS15BE-S

NXP Semiconductors 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

NXP SEMICONDUCTORS

LFQFP,

59 MHz

96

85 °C

-40 °C

PLASTIC/EPOXY

LFQFP

QFP128,.63X.87,20

RECTANGULAR

FLATPACK, LOW PROFILE, FINE PITCH

3.6 V

3 V

3.3 V

128

Transferred

8542.39.00.01

QUAD

鸥翼

0.5 mm

unknown

R-PQFP-G128

不合格

INDUSTRIAL

17.5 ns

2 DEDICATED INPUTS, 96 I/O

1.6 mm

EE PLD

MACROCELL

2

20 mm

14 mm

PZ3128IS15BE-S PZ3128IS15BE-S

AMD Xilinx 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

Obsolete

XILINX INC

QFP

LFQFP, QFP128,.63X.87,20

59 MHz

3

96

85 °C

-40 °C

PLASTIC/EPOXY

LFQFP

QFP128,.63X.87,20

RECTANGULAR

FLATPACK, LOW PROFILE, FINE PITCH

3.63 V

2.97 V

3.3 V

128

e0

锡铅

128 MACROCELLS

8542.39.00.01

TRAY

QUAD

鸥翼

0.5 mm

unknown

128

R-PQFP-G128

不合格

INDUSTRIAL

17.5 ns

2 DEDICATED INPUTS, 96 I/O

1.6 mm

EE PLD

MACROCELL

128

YES

2

YES

20 mm

14 mm

XH95180-7PQG160C XH95180-7PQG160C

AMD Xilinx 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

Transferred

XILINX INC

QFP

PLASTIC, QFP-160

3

133

PLASTIC/EPOXY

QFP

QFP160,1.2SQ

SQUARE

FLATPACK

5 V

160

e3

哑光锡

8542.39.00.01

QUAD

鸥翼

0.65 mm

compliant

160

S-PQFP-G160

不合格

0 DEDICATED INPUTS, 133 I/O

3.94 mm

MASK PLD

MACROCELL

28 mm

28 mm

PZ5032-6BC PZ5032-6BC

AMD Xilinx 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

Obsolete

XILINX INC

QFP, TQFP44,.47SQ,32

3

70 °C

PLASTIC/EPOXY

QFP

TQFP44,.47SQ,32

SQUARE

FLATPACK

5 V

44

NO

8542.39.00.01

QUAD

鸥翼

240

0.8 mm

unknown

30

S-PQFP-G44

不合格

COMMERCIAL

8 ns

EE PLD

32

NO

NO

XC95108F-15PQG100C XC95108F-15PQG100C

AMD Xilinx 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

Obsolete

XILINX INC

QFP

QFP,

56 MHz

3

81

70 °C

PLASTIC/EPOXY

QFP

RECTANGULAR

FLATPACK

5.25 V

4.75 V

5 V

100

e3

Matte Tin (Sn)

8542.39.00.01

QUAD

鸥翼

250

0.65 mm

compliant

40

100

R-PQFP-G100

不合格

COMMERCIAL

15 ns

0 DEDICATED INPUTS, 81 I/O

3.4 mm

闪存 PLD

MACROCELL

20 mm

14 mm

XC7372-12PQ100I XC7372-12PQ100I

AMD Xilinx 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

Obsolete

XILINX INC

QFP

PLASTIC, QFP-100

62.5 MHz

3

42

85 °C

-40 °C

PLASTIC/EPOXY

QFP

QFP100,.7X.9

RECTANGULAR

FLATPACK

5.5 V

4.5 V

5 V

100

e0

锡铅

72 MACROCELLS; CONFIGURABLE I/O OPERATION-3.3V OR 5V; 3 EXTERNAL CLOCKS; 126 FLIP-FLOPS

8542.39.00.01

QUAD

鸥翼

225

0.65 mm

not_compliant

30

100

R-PQFP-G100

不合格

INDUSTRIAL

28 ns

12 DEDICATED INPUTS, 42 I/O

3.4 mm

OT PLD

MACROCELL

72

NO

12

NO

20 mm

14 mm

XC2C128-7CPGG132C XC2C128-7CPGG132C

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

活跃

ADVANCED MICRO DEVICES INC

8 X 8 MM, 0.50 MM PITCH, CSP-132

119 MHz

100

70 °C

PLASTIC/EPOXY

TFBGA

BGA132,14X14,20

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

1.9 V

1.7 V

1.8 V

132

e3

哑光锡

BOTTOM

BALL

0.5 mm

compliant

S-PBGA-B132

100

不合格

COMMERCIAL

7.5 ns

PLA-TYPE

100

0 DEDICATED INPUTS, 100 I/O

1.1 mm

闪存 PLD

MACROCELL

128

8 mm

8 mm

XC2C128-7CPGG132C XC2C128-7CPGG132C

AMD Xilinx 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

Transferred

XILINX INC

BGA

8 X 8 MM, 0.50 MM PITCH, CSP-132

119 MHz

100

70 °C

PLASTIC/EPOXY

TFBGA

BGA132,14X14,20

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

1.9 V

1.7 V

1.8 V

132

e3

哑光锡

8542.39.00.01

BOTTOM

BALL

0.5 mm

compliant

132

S-PBGA-B132

100

不合格

COMMERCIAL

7.5 ns

PLA-TYPE

100

0 DEDICATED INPUTS, 100 I/O

1.1 mm

闪存 PLD

MACROCELL

128

8 mm

8 mm

XCR3384XL-7.5CS280C XCR3384XL-7.5CS280C

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

活跃

ADVANCED MICRO DEVICES INC

CHIP SCALE, BGA-280

3

216

70 °C

PLASTIC/EPOXY

TFBGA

BGA280,19X19,32

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

3.6 V

3 V

3.3 V

280

e0

锡铅

BOTTOM

BALL

0.8 mm

compliant

S-PBGA-B280

不合格

COMMERCIAL

7.5 ns

216 I/O

1.2 mm

EE PLD

MACROCELL

16 mm

16 mm

PZ5064C10BC PZ5064C10BC

Philips Semiconductors 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

Transferred

飞利浦半导体

70 °C

PLASTIC/EPOXY

QFP

TQFP44,.47SQ,32

SQUARE

FLATPACK

5 V

44

e0

Tin/Lead (Sn/Pb)

YES

8542.39.00.01

QUAD

鸥翼

0.8 mm

unknown

S-PQFP-G44

不合格

COMMERCIAL

12.5 ns

EE PLD

64

YES

YES

XC7236A-25WC44I XC7236A-25WC44I

AMD Xilinx 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

Obsolete

XILINX INC

QFJ

WQCCJ, LDCC44,.7SQ

33 MHz

1

30

85 °C

-40 °C

CERAMIC, METAL-SEALED COFIRED

WQCCJ

LDCC44,.7SQ

SQUARE

CHIP CARRIER, WINDOW

5.5 V

4.5 V

5 V

44

PAL BLOCKS INTERCONNECTED BY PIA; 36 MACROCELLS; CONFIGURABLE I/O OPERATION-3.3V OR 5V

8542.39.00.01

QUAD

J BEND

1.27 mm

unknown

44

S-CQCC-J44

不合格

INDUSTRIAL

40 ns

2 DEDICATED INPUTS, 30 I/O

4.826 mm

UV PLD

MACROCELL

36

NO

2

NO

16.51 mm

16.51 mm

PZ5064-10A44 PZ5064-10A44

Philips Semiconductors 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

Transferred

飞利浦半导体

QCCJ, LDCC44,.7SQ

70 °C

PLASTIC/EPOXY

QCCJ

LDCC44,.7SQ

SQUARE

CHIP CARRIER

5 V

44

e0

Tin/Lead (Sn/Pb)

NO

8542.39.00.01

QUAD

J BEND

1.27 mm

unknown

S-PQCC-J44

不合格

COMMERCIAL

12.5 ns

EE PLD

64

NO

NO

PZ5064-10A44 PZ5064-10A44

NXP Semiconductors 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

NXP SEMICONDUCTORS

LCC

PLASTIC, SOT-187-2, LCC-44

77 MHz

32

70 °C

PLASTIC/EPOXY

QCCJ

SQUARE

CHIP CARRIER

5.25 V

4.75 V

5 V

44

Obsolete

8542.39.00.01

QUAD

J BEND

1.27 mm

unknown

44

S-PQCC-J44

不合格

COMMERCIAL

12.5 ns

2 DEDICATED INPUTS, 32 I/O

4.57 mm

EE PLD

MACROCELL

2

16.5862 mm

16.5862 mm

PZ5064-10A44 PZ5064-10A44

AMD Xilinx 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

Obsolete

XILINX INC

3

70 °C

PLASTIC/EPOXY

QCCJ

LDCC44,.7SQ

SQUARE

CHIP CARRIER

5 V

44

e0

锡铅

NO

8542.39.00.01

QUAD

J BEND

225

1.27 mm

not_compliant

30

S-PQCC-J44

不合格

COMMERCIAL

12.5 ns

EE PLD

64

NO

NO

EPM5064LC44-1 EPM5064LC44-1

Cypress Semiconductor 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

CYPRESS SEMICONDUCTOR CORP

LCC

QCCJ,

50 MHz

28

70 °C

PLASTIC/EPOXY

QCCJ

SQUARE

CHIP CARRIER

5.25 V

4.75 V

5 V

44

Obsolete

64 MACROCELLS; SHARED INPUT/CLOCK; SHARED PRODUCT TERMS

8542.39.00.01

QUAD

J BEND

1.27 mm

unknown

44

S-PQCC-J44

不合格

COMMERCIAL

40 ns

7 DEDICATED INPUTS, 28 I/O

4.57 mm

OT PLD

MACROCELL

7

16.5862 mm

16.5862 mm

EPM5064LC44-1 EPM5064LC44-1

Altera Corporation 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

Transferred

ALTERA CORP

LCC

QCCJ, LDCC44,.7SQ

50 MHz

28

70 °C

PLASTIC/EPOXY

QCCJ

LDCC44,.7SQ

SQUARE

CHIP CARRIER

5.25 V

4.75 V

5 V

44

e0

锡铅

64 MACROCELLS; SHARED INPUT/CLOCK; SHARED PRODUCT TERMS

8542.39.00.01

QUAD

J BEND

220

1.27 mm

unknown

44

S-PQCC-J44

不合格

COMMERCIAL

40 ns

7 DEDICATED INPUTS, 28 I/O

4.57 mm

OT PLD

MACROCELL

64

NO

7

NO

16.5862 mm

16.5862 mm

PAL16R8BJC PAL16R8BJC

NA 数据表

N/A

-

最小起订量: 1

倍率: 1

NO

Obsolete

NATIONAL SEMICONDUCTOR CORP

DIP

DIP, DIP20,.3

40 MHz

75 °C

CERAMIC, GLASS-SEALED

DIP

DIP20,.3

RECTANGULAR

IN-LINE

5.25 V

4.75 V

5 V

20

e0

锡铅

8542.39.00.01

DUAL

THROUGH-HOLE

2.54 mm

unknown

20

R-GDIP-T20

8

不合格

商业扩展

15 ns

PAL-TYPE

8

8 DEDICATED INPUTS, 0 I/O

5.08 mm

OT PLD

REGISTERED

8

64

24.51 mm

7.62 mm

PZ3064I15A44 PZ3064I15A44

NXP Semiconductors 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

NXP SEMICONDUCTORS

LCC

PLASTIC, SOT-187-2, LCC-44

58 MHz

32

85 °C

-40 °C

PLASTIC/EPOXY

QCCJ

SQUARE

CHIP CARRIER

3.63 V

2.97 V

3.3 V

44

Obsolete

8542.39.00.01

QUAD

J BEND

1.27 mm

unknown

44

S-PQCC-J44

不合格

INDUSTRIAL

17.5 ns

2 DEDICATED INPUTS, 32 I/O

4.57 mm

EE PLD

MACROCELL

2

16.5862 mm

16.5862 mm

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