N/A

-

无

活跃

MICROSEMI CORP

BGA, BGA484,22X22,40

5.3

PLASTIC/EPOXY

BGA

BGA484,22X22,40

SQUARE

网格排列

1.2 V

267

Non-Compliant

表面贴装

YES

484

M2GL025S-1FG484I

100 °C

-40 °C

BOTTOM

BALL

1 mm

unknown

S-PBGA-B484

267

不合格

1.2 V

138 kB

267

现场可编程门阵列

27696

27696

N/A

-

无

活跃

MICROSEMI CORP

5.88

PLASTIC/EPOXY

BGA

BGA484,22X22,40

SQUARE

网格排列

1.2 V

267

Non-Compliant

表面贴装

YES

484

M2GL050S-1FG484I

100 °C

-40 °C

BOTTOM

BALL

1 mm

unknown

S-PBGA-B484

267

不合格

1.2 V

228.3 kB

267

现场可编程门阵列

56340

56340

N/A

-

无

活跃

MICROSEMI CORP

35 X 35 MM, 1 MM PITCH, FBGA-1152

5.86

85 °C

PLASTIC/EPOXY

BGA

BGA1152,34X34,40

SQUARE

网格排列

1.26 V

1.2 V

未说明

1.14 V

YES

1152

M2S100T-1FC1152

e0

锡铅

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B1152

574

不合格

1.2 V

OTHER

574

2.9 mm

现场可编程门阵列

99512

35 mm

35 mm

N/A

-

有

活跃

TOREX SEMICONDUCTOR LTD

SOT-223

SOP, SOT-223

5.59

28 V

5.3 V

0.2247%

0.09%

1

85 °C

-40 °C

PLASTIC/EPOXY

SOP

SOT-223

RECTANGULAR

小概要

未说明

YES

3

XC6216D331FR

有

EAR99

8542.39.00.01

TAPE AND REEL

DUAL

鸥翼

未说明

1

2.3 mm

compliant

4

R-PDSO-G3

1

不合格

1.8 mm

1.3 V

3.333 V

3.267 V

固定正向单输出标准稳压器

1%

0.15 A

125 °C

30 V

FIXED

3.3 V

6.6 mm

3.5 mm

N/A

-

有

活跃

TOREX SEMICONDUCTOR LTD

,

5.75

1

XC9501B092AR

compliant

N/A

-

有

活跃

XILINX INC

FCBGA-1517

5.61

100 °C

PLASTIC/EPOXY

BGA

RECTANGULAR

网格排列

0.876 V

0.85 V

未说明

0.825 V

YES

1517

XCZU28DR-2FFVG1517E

8542.31.00.01

BOTTOM

BALL

未说明

compliant

R-PBGA-B1517

OTHER

微处理器电路

N/A

-

有

活跃

XILINX INC

FCBGA-1517

5.62

100 °C

PLASTIC/EPOXY

BGA

RECTANGULAR

网格排列

0.876 V

0.85 V

未说明

0.825 V

YES

1517

XCZU25DR-2FFVG1517E

Tray

*

活跃

8542.31.00.01

BOTTOM

BALL

未说明

compliant

R-PBGA-B1517

OTHER

微处理器电路

N/A

-

无

活跃

XILINX INC

FPBGA-1517

5.9

PLASTIC/EPOXY

BGA

SQUARE

网格排列

0.95 V

未说明

YES

1517

XQKU115-1RLD1517I

e0

锡铅

8542.39.00.01

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B1517

82920 CLBS

4.14 mm

现场可编程门阵列

82920

40 mm

40 mm

N/A

-

无

Obsolete

XILINX INC

BGA, BGA668,26X26,40

5.87

1205 MHz

4

PLASTIC/EPOXY

BGA

BGA668,26X26,40

SQUARE

网格排列

YES

668

XC4VLX40-11FF668CS2

e0

Tin/Lead (Sn63Pb37)

BOTTOM

BALL

1 mm

not_compliant

S-PBGA-B668

448

不合格

1.2,1.2/3.3,2.5 V

448

现场可编程门阵列

41472

N/A

-

A3PN125-Z1VQG100

有

Obsolete

MICROSEMI CORP

14 X 14 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, VQFP-100

5.83

70 °C

-20 °C

PLASTIC/EPOXY

TFQFP

TQFP100,.63SQ

SQUARE

FLATPACK, THIN PROFILE, FINE PITCH

1.575 V

1.5 V

71

Tray

A3PN125

Obsolete

1.425 V

表面贴装

100-TQFP

YES

100-VQFP (14x14)

100

微芯片技术

40

-20°C ~ 85°C (TJ)

ProASIC3 nano

8542.39.00.01

1.425V ~ 1.575V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

71

不合格

1.5,1.5/3.3 V

OTHER

71

3072 CLBS, 125000 GATES

1.2 mm

现场可编程门阵列

36864

125000

3072

3072

125000

14 mm

14 mm

N/A

-

有

Obsolete

MICROSEMI CORP

TQFP, TQFP80,.6SQ

5.28

50 MHz

3

70 °C

PLASTIC/EPOXY

TQFP

TQFP80,.6SQ

SQUARE

FLATPACK, THIN PROFILE

3.6 V

3.3 V

40

57

Compliant

3 V

表面贴装

YES

80

80

A10V10B-VQG80C

e3

哑光锡

70 °C

0 °C

MAX 57 I/OS

QUAD

鸥翼

260

0.65 mm

compliant

S-PQFP-G80

57

不合格

3.3 V

3.3 V

COMMERCIAL

6.5 ns

57

295 CLBS, 1200 GATES

1.2 mm

现场可编程门阵列

1200

295

147

4.5 ns

295

295

1200

14 mm

14 mm

无

N/A

-

Production (Last Updated: 2 months ago)

有

活跃

MICROSEMI CORP

31 X 31 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-896

5.29

250 MHz

3

40

1.2 V

1.575 V

网格排列

SQUARE

BGA896,30X30,40

BGA

PLASTIC/EPOXY

70 °C

1.2000 V

1.14 V

1.26 V

620

Tray

A3PE3000

活跃

8542310000/8542310000/8542310000/8542310000/8542310000

Compliant

1.14 V

表面贴装

表面贴装

896-BGA

YES

896

896-FBGA (31x31)

400.011771 mg

896

微芯片技术

A3PE3000L-1FGG896

0 to 70 °C

ProASIC3L

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

1.14V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

896

S-PBGA-B896

620

不合格

1.2 V

1.2/1.5,1.2/3.3 V

COMMERCIAL

1.26 V

1.14 V

63 kB

620

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

892.86 MHz

1

75264

75264

75264

3000000

1.73 mm

31 mm

31 mm

无

N/A

-

1.575 V

1.5 V

未说明

SQUARE

TFBGA

PLASTIC/EPOXY

-40 °C

100 °C

3

108 MHz

1.43

TFBGA,

MICROSEMI CORP

活跃

有

AGL1000V5-CSG281I

1.5000 V

1.425 V

1.575 V

215

Tray

AGL1000

活跃

1.425 V

表面贴装

281-TFBGA, CSBGA

YES

281-CSP (10x10)

281

微芯片技术

GRID ARRAY, THIN PROFILE, FINE PITCH

-40 to 85 °C

IGLOO

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

1.425V ~ 1.575V

BOTTOM

BALL

未说明

0.5 mm

compliant

281

S-PBGA-B281

不合格

INDUSTRIAL

24576 CLBS, 1000000 GATES

1.05 mm

现场可编程门阵列

24576

147456

1000000

STD

24576

1000000

10 mm

10 mm

N/A

-

有

活跃

MICROSEMI CORP

BGA,

5.25

108 MHz

3

100 °C

-40 °C

PLASTIC/EPOXY

BGA

SQUARE

网格排列

1.575 V

1.5 V

40

300

Tray

AGL1000

活跃

1.425 V

表面贴装

484-BGA

YES

484-FPBGA (23x23)

484

微芯片技术

AGL1000V5-FGG484I

-40°C ~ 85°C (TA)

IGLOO

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B484

不合格

INDUSTRIAL

24576 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

24576

147456

1000000

STD

24576

1000000

23 mm

23 mm

N/A

-

有

Obsolete

MICROSEMI CORP

VFBGA,

5.8

85 °C

-40 °C

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.575 V

1.5 V

未说明

1.425 V

YES

81

AGLN020V5-UCG81I

8542.39.00.01

BOTTOM

BALL

未说明

0.4 mm

compliant

S-PBGA-B81

不合格

INDUSTRIAL

520 CLBS, 20000 GATES

0.8 mm

现场可编程门阵列

520

20000

4 mm

4 mm

N/A

-

有

活跃

MICROSEMI CORP

TFBGA,

0.86

108 MHz

3

85 °C

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

1.575 V

1.2 V

未说明

1.2, 1.5 V

1.14 V

1.575 V

215

Tray

AGL1000

活跃

1.14 V

表面贴装

281-TFBGA, CSBGA

YES

281-CSP (10x10)

281

微芯片技术

AGL1000V2-CSG281

0 to 70 °C

IGLOO

3A001.A.7.A

8542.39.00.01

1.14V ~ 1.575V

BOTTOM

BALL

未说明

0.5 mm

compliant

281

S-PBGA-B281

不合格

OTHER

24576 CLBS, 1000000 GATES

1.05 mm

现场可编程门阵列

24576

147456

1000000

STD

24576

1000000

10 mm

10 mm

N/A

-

Production (Last Updated: 2 months ago)

无

活跃

MICROSEMI CORP

BGA, BGA484,22X22,40

5.3

FPGA ProASICu00ae3EL Family 3M Gates 781.25MHz 130nm Technology 1.2V 484-Pin FBGA Tray

250 MHz

3

85 °C

-40 °C

PLASTIC/EPOXY

BGA

BGA484,22X22,40

SQUARE

网格排列

1.575 V

1.2 V

30

1.2000 V

有

35000 LE

341 I/O

+ 100 C

0.014110 oz

- 40 C

60

SMD/SMT

Microchip Technology / Atmel

350 MHz

ProASIC3

N

Tray

A3PE3000

活跃

1.14 V

FPGA - Field Programmable Gate Array

表面贴装

表面贴装

FBGA-484

YES

484

484-FPBGA (23x23)

400.011771 mg

484

微芯片技术

A3PE3000L-FG484I

-40 to 85 °C

Tray

A3PE3000L

e0

Tin/Lead (Sn/Pb)

85 °C

-40 °C

8542.39.00.01

1.14V ~ 1.575V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B484

341

不合格

1.425 V to 1.575 V

1.2/1.5,1.2/3.3 V

INDUSTRIAL

1.26 V

1.14 V

63 kB

-

341

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

781.25 MHz

STD

-

75264

75264

75264

3000000

FPGA - Field Programmable Gate Array

1.73 mm

23 mm

23 mm

无

N/A

-

无

活跃

MICROSEMI CORP

BGA,

5.26

108 MHz

3

100 °C

-40 °C

PLASTIC/EPOXY

BGA

SQUARE

网格排列

1.575 V

1.2 V

30

300

Tray

AGL1000

活跃

1.14 V

表面贴装

484-BGA

YES

484-FPBGA (23x23)

484

微芯片技术

AGL1000V2-FG484I

-40°C ~ 85°C (TA)

IGLOO

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

1.14V ~ 1.575V

BOTTOM

BALL

230

1 mm

unknown

S-PBGA-B484

不合格

INDUSTRIAL

24576 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

24576

147456

1000000

STD

24576

1000000

23 mm

23 mm

N/A

-

有

活跃

MICROSEMI CORP

VFBGA,

5.59

3

85 °C

-40 °C

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.575 V

1.5 V

未说明

60

Tray

AGLN125

活跃

1.425 V

表面贴装

81-WFBGA, CSBGA

YES

81-CSP (5x5)

81

微芯片技术

AGLN125V5-CSG81I

-40°C ~ 100°C (TJ)

IGLOO nano

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

1.425V ~ 1.575V

BOTTOM

BALL

未说明

0.5 mm

compliant

S-PBGA-B81

不合格

INDUSTRIAL

3072 CLBS, 125000 GATES

0.8 mm

现场可编程门阵列

3072

36864

125000

STD

3072

125000

5 mm

5 mm

N/A

-

无

Obsolete

MICROSEMI CORP

TFBGA,

5.25

85 °C

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

1.575 V

1.5 V

1.425 V

YES

288

A2F060M3E-1CS288

8542.39.00.01

BOTTOM

BALL

0.5 mm

compliant

S-PBGA-B288

OTHER

1536 CLBS, 60000 GATES

1.05 mm

现场可编程门阵列

1536

60000

11 mm

11 mm

N/A

-

Production (Last Updated: 2 months ago)

无

活跃

MICROSEMI CORP

1 MM PITCH, FBGA-896

5.29

250 MHz

3

125 °C

-55 °C

PLASTIC/EPOXY

BGA

BGA896,30X30,40

SQUARE

网格排列

1.575 V

1.2 V

30

620

Compliant

Tray

A3PE3000

活跃

1.14 V

表面贴装

表面贴装

896-BGA

YES

896

896-FBGA (31x31)

400.011771 mg

896

微芯片技术

A3PE3000L-FG896M

-55°C ~ 125°C (TJ)

ProASIC3L

e0

3A001.A.2.C

Tin/Lead (Sn/Pb)

125 °C

-55 °C

8542.39.00.01

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B896

620

不合格

1.5 V

1.2/1.5,1.2/3.3 V

MILITARY

1.575 V

1.14 V

63 kB

620

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3e+06

75264

75264

75264

3000000

31 mm

31 mm

无

N/A

-

无

活跃

MICROSEMI CORP

TFBGA,

5.25

108 MHz

100 °C

-40 °C

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

1.575 V

1.2 V

未说明

1.2, 1.5 V

215

Tray

AGL1000

活跃

1.14 V

表面贴装

281-TFBGA, CSBGA

YES

281-CSP (10x10)

281

微芯片技术

AGL1000V2-CS281I

-40 to 85 °C

IGLOO

e0

3A001.A.7.A

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

1.14V ~ 1.575V

BOTTOM

BALL

未说明

0.5 mm

unknown

281

S-PBGA-B281

不合格

INDUSTRIAL

24576 CLBS, 1000000 GATES

1.05 mm

现场可编程门阵列

24576

147456

1000000

STD

24576

1000000

10 mm

10 mm

N/A

-

有

活跃

MICROSEMI CORP

LBGA,

1.54

108 MHz

3

85 °C

PLASTIC/EPOXY

LBGA

SQUARE

GRID ARRAY, LOW PROFILE

1.575 V

1.2 V

40

97

Tray

AGL1000

活跃

1.14 V

表面贴装

144-LBGA

YES

144-FPBGA (13x13)

144

微芯片技术

AGL1000V2-FGG144

0°C ~ 70°C (TA)

IGLOO

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

1.14V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

不合格

OTHER

24576 CLBS, 1000000 GATES

1.55 mm

现场可编程门阵列

24576

147456

1000000

STD

24576

1000000

13 mm

13 mm

N/A

-

有

活跃

MICROSEMI CORP

BGA, BGA484,26X26,40

5.29

313 MHz

3

70 °C

PLASTIC/EPOXY

BGA

BGA484,26X26,40

SQUARE

网格排列

2.75 V

2.5 V

40

2.5000 V

2.25 V

2.75 V

249

Tray

A54SX32

活跃

2.25 V

表面贴装

484-BGA

YES

484-FPBGA (27X27)

484

微芯片技术

A54SX32A-2FGG484

0 to 70 °C

SX-A

e1

Tin/Silver/Copper (Sn/Ag/Cu)

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

2.25V ~ 5.25V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

249

不合格

2.5,2.5/5 V

COMMERCIAL

249

2880 CLBS, 48000 GATES

2.44 mm

现场可编程门阵列

48000

2880

2

0.9 ns

2880

2880

48000

27 mm

27 mm

N/A

-

RN73R1J

活跃

XC7K325T

0603 (1608 Metric)

0603

KOA Speer Electronics, Inc.

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

-55°C ~ 155°C

RN73R

0.063 L x 0.031 W (1.60mm x 0.80mm)

±0.5%

2

±100ppm/°C

FPGA

203 kOhms

Thin Film

0.1W, 1/10W

-

P/N Breakdown: J = Japan version does not ship with a power supply

Board(s), Cable(s) - Power Supply Not Included -

Kintex-7 FPGA Connectivity Japan PCIe Card

Automotive AEC-Q200, Moisture Resistant

FMC

Vivado

0.022 (0.55mm)

AEC-Q200