类别是'评估板 - 嵌入式 - 复杂逻辑器件(FPGA, CPLD)'
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 底架 | 表面安装 | 引脚数 | 终端数量 | JESD-609代码 | 无铅代码 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | 引脚数量 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 温度等级 | 电源电压-最小值(Vsup) | 最大电源电压 | 最小电源电压 | 内存大小 | 操作模式 | 传播延迟 | 电源电流-最大值 | 输入数量 | 组织结构 | 座位高度-最大 | 内存宽度 | 可编程逻辑类型 | 逻辑元件/单元数 | 待机电流-最大值 | 记忆密度 | 阀门数量 | 筛选水平 | 并行/串行 | 内存IC类型 | 速度等级 | 输出功能 | 编程电压 | 宏细胞数 | 耐力 | 写入周期时间 - 最大值 | 寄存器数量 | CLB-Max的组合延时 | 数据保持时间 | 逻辑块数量 | JTAG BST | 逻辑单元数 | 数据轮询 | 专用输入数量 | 拨动位 | 命令用户界面 | 页面尺寸 | 等效门数 | 系统内可编程 | 高度 | 长度 | 宽度 | 辐射硬化 | |||||||||||||||||||||||||||
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![]() | XCV1600E-8BGG560I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 有 | Obsolete | XILINX INC | BGA | LBGA, BGA560,33X33,50 | 5.82 | 416 MHz | 3 | PLASTIC/EPOXY | LBGA | BGA560,33X33,50 | SQUARE | GRID ARRAY, LOW PROFILE | 1.89 V | 1.8 V | 30 | 1.71 V | YES | 560 | XCV1600E-8BGG560I | e1 | 有 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 260 | 1.27 mm | compliant | 560 | S-PBGA-B560 | 404 | 不合格 | 1.2/3.6,1.8 V | 404 | 7776 CLBS, 419904 GATES | 1.7 mm | 现场可编程门阵列 | 0.4 ns | 7776 | 34992 | 419904 | 42.5 mm | 42.5 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCV1000E-7HQG240I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 有 | Obsolete | XILINX INC | QFP | FQFP, HQFP240,1.37SQ,20 | 5.79 | 400 MHz | 3 | PLASTIC/EPOXY | FQFP | HQFP240,1.37SQ,20 | SQUARE | FLATPACK, FINE PITCH | 1.89 V | 1.8 V | 30 | 1.71 V | YES | 240 | XCV1000E-7HQG240I | e3 | 有 | Matte Tin (Sn) | 8542.39.00.01 | QUAD | 鸥翼 | 245 | 0.5 mm | compliant | 240 | S-PQFP-G240 | 158 | 不合格 | 1.2/3.6,1.8 V | 158 | 6144 CLBS, 331776 GATES | 4.1 mm | 现场可编程门阵列 | 0.42 ns | 6144 | 27648 | 331776 | 32 mm | 32 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCS40XL-5PQG240C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 有 | Obsolete | XILINX INC | QFP | PLASTIC, QFP-240 | 8.59 | 250 MHz | 3 | 85 °C | PLASTIC/EPOXY | FQFP | QFP240,1.3SQ,20 | SQUARE | FLATPACK, FINE PITCH | 3.6 V | 3.3 V | 30 | Compliant | 3 V | YES | 240 | 240 | XCS40XL-5PQG240C | e3 | EAR99 | Matte Tin (Sn) | 85 °C | 0 °C | MAXIMUM USABLE GATES 40000 | 8542.39.00.01 | QUAD | 鸥翼 | 245 | 0.5 mm | unknown | 240 | S-PQFP-G240 | 192 | 不合格 | 3.3 V | 3.3 V | OTHER | 3.6 V | 3 V | 192 | 784 CLBS, 13000 GATES | 4.1 mm | 现场可编程门阵列 | 1862 | 40000 | 2016 | 1 ns | 784 | 1862 | 13000 | 3.4 mm | 32 mm | 32 mm | |||||||||||||||||||||||||||||||||||||
![]() | XCV200E-6PQG240I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 有 | Obsolete | XILINX INC | QFP | PLASTIC, QFP-240 | 5.8 | 357 MHz | 3 | PLASTIC/EPOXY | FQFP | QFP240,1.3SQ,20 | SQUARE | FLATPACK, FINE PITCH | 1.89 V | 1.8 V | 30 | 1.71 V | YES | 240 | XCV200E-6PQG240I | e3 | 有 | EAR99 | Matte Tin (Sn) | 8542.39.00.01 | QUAD | 鸥翼 | 245 | 0.5 mm | unknown | 240 | S-PQFP-G240 | 158 | 不合格 | 1.2/3.6,1.8 V | 158 | 1176 CLBS, 63504 GATES | 4.1 mm | 现场可编程门阵列 | 0.47 ns | 1176 | 5292 | 63504 | 32 mm | 32 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCV100E-6BGG352C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 有 | Obsolete | XILINX INC | BGA | BGA-352 | 5.81 | 357 MHz | 3 | 85 °C | PLASTIC/EPOXY | LBGA | BGA352,26X26,50 | SQUARE | GRID ARRAY, LOW PROFILE | 1.89 V | 1.8 V | 30 | 1.71 V | YES | 352 | XCV100E-6BGG352C | e1 | 有 | EAR99 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 260 | 1.27 mm | unknown | 352 | S-PBGA-B352 | 196 | 不合格 | 1.2/3.6,1.8 V | OTHER | 196 | 600 CLBS, 32400 GATES | 1.7 mm | 现场可编程门阵列 | 0.47 ns | 600 | 2700 | 32400 | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCV600E-7BGG432C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 有 | Obsolete | XILINX INC | BGA | BGA-432 | 5.8 | 400 MHz | 3 | 85 °C | PLASTIC/EPOXY | LBGA | BGA432,31X31,50 | SQUARE | GRID ARRAY, LOW PROFILE | 1.89 V | 1.8 V | 30 | 1.71 V | YES | 432 | XCV600E-7BGG432C | e1 | 有 | 3A991.D | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 260 | 1.27 mm | unknown | 432 | S-PBGA-B432 | 316 | 不合格 | 1.2/3.6,1.8 V | OTHER | 316 | 3456 CLBS, 186624 GATES | 1.7 mm | 现场可编程门阵列 | 0.42 ns | 3456 | 15552 | 186624 | 40 mm | 40 mm | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC73108-20PQ100C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 无 | Obsolete | XILINX INC | QFP | PLASTIC, QFP-100 | 5.85 | 35.7 MHz | 3 | 47 | 70 °C | PLASTIC/EPOXY | QFP | QFP100,.7X.9 | RECTANGULAR | FLATPACK | 5.25 V | 5 V | 4.75 V | YES | 100 | XC73108-20PQ100C | e0 | EAR99 | Tin/Lead (Sn85Pb15) | 108 MACROCELLS; CONFIGURABLE I/O OPERATION-3.3V OR 5V; 3 EXTERNAL CLOCKS; 198 FLIP-FLOPS | 8542.39.00.01 | QUAD | 鸥翼 | 0.65 mm | not_compliant | 100 | R-PQFP-G100 | 不合格 | 3.3/5,5 V | COMMERCIAL | 45 ns | 12 DEDICATED INPUTS, 47 I/O | 3.4 mm | OT PLD | MACROCELL | 108 | NO | 12 | NO | 20 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC3030-125PQ100C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 无 | Obsolete | XILINX INC | QFP | QFP, QFP100,.7X.9 | 5.82 | 125 MHz | 3 | 85 °C | PLASTIC/EPOXY | QFP | QFP100,.7X.9 | RECTANGULAR | FLATPACK | 5.25 V | 5 V | Non-Compliant | 4.75 V | YES | 100 | XC3030-125PQ100C | e0 | Tin/Lead (Sn85Pb15) | 360 FLIP-FLOPS; TYP. GATES = 1500-2000; POWER-DOWN SUPPLY CURRENT = 80UA | QUAD | 鸥翼 | 0.65 mm | not_compliant | 100 | R-PQFP-G100 | 80 | 不合格 | 5 V | OTHER | 80 | 100 CLBS, 1500 GATES | 2.87 mm | 现场可编程门阵列 | 2000 | 5.5 ns | 100 | 100 | 1500 | 20 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCV400E-8FGG676C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 有 | Obsolete | XILINX INC | BGA | FBGA-676 | 5.79 | 416 MHz | 3 | 85 °C | PLASTIC/EPOXY | BGA | BGA676,26X26,40 | SQUARE | 网格排列 | 1.89 V | 1.8 V | 30 | Compliant | 1.71 V | YES | 676 | XCV400E-8FGG676C | e1 | 有 | 3A991.D | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 85 °C | 0 °C | 8542.39.00.01 | BOTTOM | BALL | 250 | 1 mm | unknown | 676 | S-PBGA-B676 | 404 | 不合格 | 1.8 V | 1.2/3.6,1.8 V | OTHER | 20 kB | 404 | 2400 CLBS, 129600 GATES | 2.6 mm | 现场可编程门阵列 | 8 | 0.4 ns | 2400 | 10800 | 129600 | 27 mm | 27 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||
![]() | XCV300E-8BGG432I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 有 | Obsolete | XILINX INC | BGA | LBGA, BGA432,31X31,50 | 5.81 | 416 MHz | 3 | PLASTIC/EPOXY | LBGA | BGA432,31X31,50 | SQUARE | GRID ARRAY, LOW PROFILE | 1.89 V | 1.8 V | 30 | 1.71 V | YES | 432 | XCV300E-8BGG432I | e1 | 有 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 260 | 1.27 mm | compliant | 432 | S-PBGA-B432 | 316 | 不合格 | 1.2/3.6,1.8 V | 316 | 1536 CLBS, 82944 GATES | 1.7 mm | 现场可编程门阵列 | 0.4 ns | 1536 | 6912 | 82944 | 40 mm | 40 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCV300E-8FGG256I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 有 | Obsolete | XILINX INC | BGA | BGA, BGA256,16X16,40 | 5.81 | 416 MHz | 3 | PLASTIC/EPOXY | BGA | BGA256,16X16,40 | SQUARE | 网格排列 | 1.89 V | 1.8 V | 30 | 1.71 V | YES | 256 | XCV300E-8FGG256I | e1 | 有 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 260 | 1 mm | compliant | 256 | S-PBGA-B256 | 176 | 不合格 | 1.2/3.6,1.8 V | 176 | 1536 CLBS, 82944 GATES | 2 mm | 现场可编程门阵列 | 0.4 ns | 1536 | 6912 | 82944 | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCV600E-8FGG900C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 有 | Obsolete | XILINX INC | BGA | BGA, BGA900,30X30,40 | 5.8 | 416 MHz | 3 | 85 °C | PLASTIC/EPOXY | BGA | BGA900,30X30,40 | SQUARE | 网格排列 | 1.89 V | 1.8 V | 30 | 1.71 V | YES | 900 | XCV600E-8FGG900C | e1 | 有 | EAR99 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 250 | 1 mm | compliant | 900 | S-PBGA-B900 | 512 | 不合格 | 1.2/3.6,1.8 V | OTHER | 512 | 3456 CLBS, 186624 GATES | 2.6 mm | 现场可编程门阵列 | 0.4 ns | 3456 | 15552 | 186624 | 31 mm | 31 mm | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCS05XL-3VQG100C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 有 | Obsolete | XILINX INC | QFP | TFQFP, | 5.8 | 3 | 85 °C | PLASTIC/EPOXY | TFQFP | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | 3.6 V | 3.3 V | 30 | 3 V | YES | 100 | XCS05XL-3VQG100C | e3 | 有 | Matte Tin (Sn) | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | 100 | S-PQFP-G100 | 不合格 | OTHER | 100 CLBS, 2000 GATES | 1.2 mm | 现场可编程门阵列 | 100 | 2000 | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC3164A-5PG132C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 有 | Obsolete | XILINX INC | PGA | PGA, PGA132,14X14 | 5.82 | 188 MHz | 85 °C | CERAMIC, METAL-SEALED COFIRED | PGA | PGA132,14X14 | SQUARE | 网格排列 | 5.25 V | 5 V | 4.75 V | NO | 132 | XC3164A-5PG132C | TYP. GATES = 3500-4500 | 8542.39.00.01 | PERPENDICULAR | PIN/PEG | 2.54 mm | unknown | 132 | S-CPGA-P132 | 110 | 不合格 | 5 V | OTHER | 110 | 224 CLBS, 3500 GATES | 4.318 mm | 现场可编程门阵列 | 4.1 ns | 224 | 224 | 3500 | 37.084 mm | 37.084 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC9536XV-5PCG44C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 有 | Obsolete | XILINX INC | LCC | QCCJ, LDCC44,.7SQ | 5.66 | 3 | 34 | 70 °C | PLASTIC/EPOXY | QCCJ | LDCC44,.7SQ | SQUARE | CHIP CARRIER | 2.62 V | 2.5 V | 40 | 2.37 V | YES | 44 | XC9536XV-5PCG44C | e3 | Matte Tin (Sn) | YES | 8542.39.00.01 | QUAD | J BEND | 245 | 1.27 mm | compliant | 44 | S-PQCC-J44 | 不合格 | 1.8/3.3,2.5 V | COMMERCIAL | 5 ns | 0 DEDICATED INPUTS, 34 I/O | 4.57 mm | 闪存 PLD | MACROCELL | 36 | YES | YES | 16.5862 mm | 16.5862 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCV600E-6FGG680I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 有 | Obsolete | XILINX INC | BGA | FBGA-680 | 5.79 | 357 MHz | 3 | PLASTIC/EPOXY | BGA | BGA680,39X39,40 | SQUARE | 网格排列 | 1.89 V | 1.8 V | 30 | 1.71 V | YES | 680 | XCV600E-6FGG680I | e1 | 有 | 3A991.D | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 260 | 1 mm | unknown | 680 | S-PBGA-B680 | 512 | 不合格 | 1.2/3.6,1.8 V | 512 | 3456 CLBS, 186624 GATES | 1.9 mm | 现场可编程门阵列 | 0.47 ns | 3456 | 15552 | 186624 | 40 mm | 40 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCR3032XL-5VQ44I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 无 | 活跃 | XILINX INC | QFP | TQFP, | 5.14 | 200 MHz | 3 | 32 | 85 °C | -40 °C | PLASTIC/EPOXY | TQFP | SQUARE | FLATPACK, THIN PROFILE | 3.6 V | 3.3 V | 30 | 2.7 V | YES | 44 | XCR3032XL-5VQ44I | e0 | 无 | 锡铅 | 8542.39.00.01 | QUAD | 鸥翼 | 225 | 0.8 mm | compliant | 44 | S-PQFP-G44 | 不合格 | INDUSTRIAL | 5 ns | 32 I/O | 1.2 mm | EE PLD | MACROCELL | 10 mm | 10 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC4VFX140-12FFG1517C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 有 | 活跃 | XILINX INC | BGA | BGA, BGA1517,39X39,40 | 5.24 | 1181 MHz | 4 | 85 °C | PLASTIC/EPOXY | BGA | BGA1517,39X39,40 | SQUARE | 网格排列 | 1.26 V | 1.2 V | 30 | 1.14 V | YES | 1517 | XC4VFX140-12FFG1517C | e1 | 有 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | BOTTOM | BALL | 245 | 1 mm | not_compliant | 1517 | S-PBGA-B1517 | 768 | 不合格 | OTHER | 768 | 15792 CLBS | 3.4 mm | 现场可编程门阵列 | 15792 | 142128 | 40 mm | 40 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC4VLX160-12FFG1148I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 有 | 活跃 | XILINX INC | , | 5.29 | 4 | XC4VLX160-12FFG1148I | e1 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | not_compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCV300E-7FGG256C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 有 | Obsolete | XILINX INC | BGA | BGA, BGA256,16X16,40 | 5.81 | 400 MHz | 3 | 85 °C | PLASTIC/EPOXY | BGA | BGA256,16X16,40 | SQUARE | 网格排列 | 1.89 V | 1.8 V | 30 | 1.71 V | YES | 256 | XCV300E-7FGG256C | e1 | 有 | EAR99 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 260 | 1 mm | compliant | 256 | S-PBGA-B256 | 176 | 不合格 | 1.2/3.6,1.8 V | OTHER | 176 | 1536 CLBS, 82944 GATES | 2 mm | 现场可编程门阵列 | 0.42 ns | 1536 | 6912 | 82944 | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCV200E-7FGG456I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 有 | Obsolete | XILINX INC | BGA | FBGA-456 | 5.82 | 400 MHz | 3 | PLASTIC/EPOXY | BGA | BGA456,22X22,40 | SQUARE | 网格排列 | 1.89 V | 1.8 V | 30 | 1.71 V | YES | 456 | XCV200E-7FGG456I | e1 | 有 | 3A991.D | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 250 | 1 mm | unknown | 456 | S-PBGA-B456 | 284 | 不合格 | 1.2/3.6,1.8 V | 284 | 1176 CLBS, 63504 GATES | 2.6 mm | 现场可编程门阵列 | 0.42 ns | 1176 | 5292 | 63504 | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC5VFX200T-2FFG1738I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 有 | 活跃 | XILINX INC | BGA | BGA-1738 | 5.24 | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA1738,42X42,40 | SQUARE | 网格排列 | 1.05 V | 1 V | 30 | 0.95 V | YES | 1738 | XC5VFX200T-2FFG1738I | e1 | 3A001.A.7.A | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 245 | 1 mm | not_compliant | 1738 | S-PBGA-B1738 | 960 | 不合格 | 1,2.5 V | INDUSTRIAL | 960 | 15360 CLBS | 3.25 mm | FPGA | 0.77 ns | 15360 | 196608 | 42.5 mm | 42.5 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC4028EX-4PG299M | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Obsolete | XILINX INC | PGA | PGA, | 5.79 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | PGA | SQUARE | 网格排列 | 3.6 V | 3.3 V | 3 V | NO | 299 | XC4028EX-4PG299M | 3A001.A.2.C | CAN ALSO USE 50000 GATES | 8542.39.00.01 | PERPENDICULAR | PIN/PEG | 2.54 mm | unknown | 299 | S-CPGA-P299 | 不合格 | MILITARY | 1024 CLBS, 18000 GATES | 4.318 mm | 现场可编程门阵列 | 1024 | 18000 | 52.324 mm | 52.324 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC3020-100PG84B | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 有 | Obsolete | XILINX INC | PGA | PGA, PGA84M,11X11 | 5.81 | 100 MHz | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | PGA | PGA84M,11X11 | SQUARE | 网格排列 | 5 V | Military grade | NO | 84 | XC3020-100PG84B | 3A001.A.2.C | 256 FLIP-FLOPS; TYP. GATES = 1000-1500; POWER-DOWN SUPPLY CURRENT = 50UA | 8542.39.00.01 | PERPENDICULAR | PIN/PEG | 2.54 mm | compliant | 84 | S-CPGA-P84 | 64 | 不合格 | 5 V | MILITARY | 64 | 64 CLBS, 1000 GATES | 5.207 mm | 现场可编程门阵列 | MIL-STD-883 Class B | 7 ns | 64 | 64 | 1000 | 27.94 mm | 27.94 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | X28HC256P-90 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 无 | Obsolete | INTERSIL CORP | DIP | DIP, DIP28,.6 | 5.57 | 90 ns | 32768 words | 32000 | 70 °C | PLASTIC/EPOXY | DIP | DIP28,.6 | RECTANGULAR | IN-LINE | 5 V | 未说明 | NO | 28 | X28HC256P-90 | e0 | EAR99 | Tin/Lead (Sn/Pb) | 100000 ENDURANCE WRITE CYCLES; 100 YEARS DATA RETENTION | 8542.32.00.51 | DUAL | THROUGH-HOLE | 未说明 | 1 | 2.54 mm | not_compliant | 28 | R-PDIP-T28 | 不合格 | 5.5 V | 5 V | COMMERCIAL | 4.5 V | ASYNCHRONOUS | 0.06 mA | 32KX8 | 6.35 mm | 8 | 0.0005 A | 262144 bit | PARALLEL | EEPROM | 5 V | 1000000 Write/Erase Cycles | 5 ms | 100 | YES | YES | NO | 128 words | 37.4 mm | 15.24 mm |