类别是'评估板 - 嵌入式 - 复杂逻辑器件(FPGA, CPLD)'
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 表面安装 | 引脚数 | 终端数量 | 厂商 | 系列 | JESD-609代码 | 无铅代码 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | Reach合规守则 | 引脚数量 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源 | 温度等级 | 内存大小 | 传播延迟 | 输入数量 | 组织结构 | 座位高度-最大 | 可编程逻辑类型 | 阀门数量 | 速度等级 | 输出功能 | 宏细胞数 | 寄存器数量 | CLB-Max的组合延时 | 逻辑块数量 | JTAG BST | 逻辑单元数 | 专用输入数量 | 等效门数 | 系统内可编程 | 长度 | 宽度 | 辐射硬化 | |||||||||||||||||||||||||
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XCV1600E-8FGG900C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 有 | Obsolete | XILINX INC | BGA | BGA, BGA900,30X30,40 | 5.81 | 416 MHz | 3 | 85 °C | PLASTIC/EPOXY | BGA | BGA900,30X30,40 | SQUARE | 网格排列 | 1.89 V | 1.8 V | 30 | 1.71 V | 900 | XCV1600E-8FGG900C | e1 | 有 | 3A991.D | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 250 | 1 mm | compliant | 900 | S-PBGA-B900 | 700 | 不合格 | 1.2/3.6,1.8 V | OTHER | 700 | 7776 CLBS, 419904 GATES | 2.6 mm | 现场可编程门阵列 | 0.4 ns | 7776 | 34992 | 419904 | 31 mm | 31 mm | ||||||||||||||||||||||||||
XC9572XV-5TQG100I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 有 | Obsolete | XILINX INC | QFP | LFQFP, | 5.63 | 3 | 72 | 85 °C | -40 °C | PLASTIC/EPOXY | LFQFP | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | 2.62 V | 2.5 V | 30 | 2.37 V | 100 | XC9572XV-5TQG100I | e3 | Matte Tin (Sn) | 8542.39.00.01 | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | 100 | S-PQFP-G100 | 不合格 | INDUSTRIAL | 5 ns | 0 DEDICATED INPUTS, 72 I/O | 1.6 mm | 闪存 PLD | MACROCELL | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||
XCV1600E-6FGG900C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 有 | Obsolete | XILINX INC | BGA | BGA, BGA900,30X30,40 | 5.8 | 357 MHz | 3 | 85 °C | PLASTIC/EPOXY | BGA | BGA900,30X30,40 | SQUARE | 网格排列 | 1.89 V | 1.8 V | 30 | 1.71 V | 900 | XCV1600E-6FGG900C | e1 | 有 | 3A991.D | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 250 | 1 mm | compliant | 900 | S-PBGA-B900 | 700 | 不合格 | 1.2/3.6,1.8 V | OTHER | 700 | 7776 CLBS, 419904 GATES | 2.6 mm | 现场可编程门阵列 | 0.47 ns | 7776 | 34992 | 419904 | 31 mm | 31 mm | ||||||||||||||||||||||||||
XCV1000E-8FGG680I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 有 | Obsolete | XILINX INC | BGA | BGA, | 5.81 | 416 MHz | 3 | PLASTIC/EPOXY | BGA | SQUARE | 网格排列 | 1.89 V | 1.8 V | 30 | 1.71 V | 680 | XCV1000E-8FGG680I | e1 | 有 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 260 | 1 mm | compliant | 680 | S-PBGA-B680 | 不合格 | 6144 CLBS, 331776 GATES | 1.9 mm | 现场可编程门阵列 | 0.4 ns | 6144 | 331776 | 40 mm | 40 mm | ||||||||||||||||||||||||||||||||||
XCV1000E-8HQG240C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 有 | Obsolete | XILINX INC | QFP | FQFP, HQFP240,1.37SQ,20 | 5.79 | 416 MHz | 3 | 85 °C | PLASTIC/EPOXY | FQFP | HQFP240,1.37SQ,20 | SQUARE | FLATPACK, FINE PITCH | 1.89 V | 1.8 V | 30 | 1.71 V | 240 | XCV1000E-8HQG240C | e3 | 有 | Matte Tin (Sn) | 8542.39.00.01 | QUAD | 鸥翼 | 245 | 0.5 mm | compliant | 240 | S-PQFP-G240 | 158 | 不合格 | 1.2/3.6,1.8 V | OTHER | 158 | 6144 CLBS, 331776 GATES | 4.1 mm | 现场可编程门阵列 | 0.4 ns | 6144 | 27648 | 331776 | 32 mm | 32 mm | |||||||||||||||||||||||||||
XCR3064XL-6VQG44I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 有 | 活跃 | XILINX INC | QFP | TQFP, | 5.15 | 167 MHz | 3 | 32 | 85 °C | -40 °C | PLASTIC/EPOXY | TQFP | SQUARE | FLATPACK, THIN PROFILE | 3.6 V | 3.3 V | 30 | 2.7 V | 44 | XCR3064XL-6VQG44I | e3 | 有 | 哑光锡 | 8542.39.00.01 | QUAD | 鸥翼 | 260 | 0.8 mm | compliant | 44 | S-PQFP-G44 | 不合格 | INDUSTRIAL | 6 ns | 32 I/O | 1.2 mm | EE PLD | MACROCELL | 10 mm | 10 mm | |||||||||||||||||||||||||||||||
XCR3064XL-7PCG44C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 有 | Obsolete | XILINX INC | LCC | QCCJ, LDCC44,.7SQ | 5.61 | 119 MHz | 3 | 36 | 70 °C | PLASTIC/EPOXY | QCCJ | LDCC44,.7SQ | SQUARE | CHIP CARRIER | 3.6 V | 3.3 V | 30 | 2.7 V | 44 | XCR3064XL-7PCG44C | e3 | Matte Tin (Sn) | YES | 8542.39.00.01 | QUAD | J BEND | 245 | 1.27 mm | unknown | 44 | S-PQCC-J44 | 不合格 | 3.3 V | COMMERCIAL | 7.5 ns | 0 DEDICATED INPUTS, 36 I/O | 4.572 mm | EE PLD | MACROCELL | 64 | YES | YES | 16.5862 mm | 16.5862 mm | |||||||||||||||||||||||||||
XCR3032XL-10VQ44Q | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 活跃 | ROCHESTER ELECTRONICS LLC | QFP | VQFP-44 | 5.68 | 95 MHz | 3 | 36 | 125 °C | -40 °C | PLASTIC/EPOXY | TQFP | SQUARE | FLATPACK, THIN PROFILE | 3.6 V | 3.3 V | 30 | 32 | Non-Compliant | Bulk | 活跃 | 3 V | 44 | 44 | AMD 赛灵思 | XCR3032XL-10VQ44Q | * | e0 | 无 | 锡铅 | QUAD | 鸥翼 | 225 | 0.8 mm | unknown | 44 | S-PQFP-G44 | COMMERCIAL | AUTOMOTIVE | 10 ns | 0 DEDICATED INPUTS, 36 I/O | 1.2 mm | EE PLD | 750 | MACROCELL | 10 mm | 10 mm | |||||||||||||||||||||||||
XC3S4000-5FG1156C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 无 | Obsolete | XILINX INC | BGA | 35 X 35 MM, FBGA-1156 | 5.8 | 725 MHz | 3 | 85 °C | PLASTIC/EPOXY | BGA | BGA1156,34X34,40 | SQUARE | 网格排列 | 1.26 V | 1.2 V | 30 | Non-Compliant | 1.14 V | 1156 | XC3S4000-5FG1156C | e0 | 无 | 3A001.A.7.A | Tin/Lead (Sn63Pb37) | 8542.39.00.01 | BOTTOM | BALL | 225 | 1 mm | not_compliant | 1156 | S-PBGA-B1156 | 712 | 不合格 | 1.2,1.2/3.3,2.5 V | OTHER | 712 | 6912 CLBS, 4000000 GATES | 2.6 mm | 现场可编程门阵列 | 4e+06 | 0.53 ns | 6912 | 62208 | 4000000 | 35 mm | 35 mm | ||||||||||||||||||||||||
XCR5128C-12VQ100C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | XILINX INC | QFP | TFQFP, | 5.6 | 63 MHz | 80 | 70 °C | PLASTIC/EPOXY | TFQFP | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | 5.25 V | 5 V | 4.75 V | 100 | XCR5128C-12VQ100C | 8542.39.00.01 | QUAD | 鸥翼 | 0.5 mm | unknown | 100 | S-PQFP-G100 | 不合格 | COMMERCIAL | 12 ns | 2 DEDICATED INPUTS, 80 I/O | 1.2 mm | EE PLD | MACROCELL | 2 | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||
XC4VSX25-12FF668I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 无 | 活跃 | XILINX INC | BGA | 27 X 27 MM, 1 MM PITCH, MS-034-AAL-1, FBGA-668 | 5.28 | 4 | PLASTIC/EPOXY | BGA | SQUARE | 网格排列 | 1.26 V | 1.2 V | 30 | 1.14 V | 668 | XC4VSX25-12FF668I | e0 | 无 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 1 mm | not_compliant | 668 | S-PBGA-B668 | 不合格 | 2560 CLBS | 2.85 mm | 现场可编程门阵列 | 2560 | 27 mm | 27 mm | ||||||||||||||||||||||||||||||||||||||
XCR5064C-10VQ100C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | TFQFP | TQFP100,.63SQ | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | 5.25 V | 5 V | 70 °C | 64 | 3 | 80 MHz | 8.8 | TFQFP, TQFP100,.63SQ | QFP | XILINX INC | Obsolete | 无 | XCR5064C-10VQ100C | 4.75 V | 100 | PLASTIC/EPOXY | YES | 8542.39.00.01 | QUAD | 鸥翼 | 0.5 mm | unknown | 100 | S-PQFP-G100 | 不合格 | 5 V | COMMERCIAL | 10 ns | 2 DEDICATED INPUTS, 64 I/O | 1.2 mm | EE PLD | MACROCELL | 64 | YES | 2 | YES | 14 mm | 14 mm | ||||||||||||||||||||||||||||||
XC3090-100PG175M | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NO | 无 | Obsolete | XILINX INC | PGA | PGA, PGA175,16X16 | 5.82 | 100 MHz | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | PGA | PGA175,16X16 | SQUARE | 网格排列 | 5 V | 未说明 | Non-Compliant | 175 | 175 | XC3090-100PG175M | e0 | 3A001.A.2.C | 锡铅 | 125 °C | -55 °C | 928 FLIP-FLOPS; TYP. GATES = 5000-6000; POWER-DOWN SUPPLY CURRENT = 250UA | 8542.39.00.01 | PERPENDICULAR | PIN/PEG | 未说明 | 2.54 mm | unknown | 175 | S-CPGA-P175 | 144 | 不合格 | 5 V | 5 V | MILITARY | 7.8 kB | 144 | 320 CLBS, 5000 GATES | 3.81 mm | 现场可编程门阵列 | 100 | 928 | 7 ns | 320 | 320 | 5000 | 42.164 mm | 42.164 mm | ||||||||||||||||||||
XCV1600E-8BGG560C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 有 | Obsolete | XILINX INC | BGA | LBGA, BGA560,33X33,50 | 5.82 | 416 MHz | 3 | 85 °C | PLASTIC/EPOXY | LBGA | BGA560,33X33,50 | SQUARE | GRID ARRAY, LOW PROFILE | 1.89 V | 1.8 V | 30 | 1.71 V | 560 | XCV1600E-8BGG560C | e1 | 有 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 260 | 1.27 mm | compliant | 560 | S-PBGA-B560 | 404 | 不合格 | 1.2/3.6,1.8 V | OTHER | 404 | 7776 CLBS, 419904 GATES | 1.7 mm | 现场可编程门阵列 | 0.4 ns | 7776 | 34992 | 419904 | 42.5 mm | 42.5 mm | |||||||||||||||||||||||||||
XCV2000E-8FGG680C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 有 | Obsolete | XILINX INC | BGA | BGA, BGA680,39X39,40 | 5.81 | 416 MHz | 3 | 85 °C | PLASTIC/EPOXY | BGA | BGA680,39X39,40 | SQUARE | 网格排列 | 1.89 V | 1.8 V | 30 | 1.71 V | 680 | XCV2000E-8FGG680C | e1 | 有 | 3A001.A.7.A | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 260 | 1 mm | compliant | 680 | S-PBGA-B680 | 512 | 不合格 | 1.2/3.6,1.8 V | OTHER | 512 | 9600 CLBS, 518400 GATES | 1.9 mm | 现场可编程门阵列 | 0.4 ns | 9600 | 43200 | 518400 | 40 mm | 40 mm | ||||||||||||||||||||||||||
XCV1000E-7FGG860C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 有 | Obsolete | XILINX INC | BGA | BGA, BGA860,42X42,40 | 5.79 | 400 MHz | 3 | 85 °C | PLASTIC/EPOXY | BGA | BGA860,42X42,40 | SQUARE | 网格排列 | 1.89 V | 1.8 V | 30 | 1.71 V | 860 | XCV1000E-7FGG860C | e1 | 有 | 3A001.A.7.A | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 245 | 1 mm | compliant | 860 | S-PBGA-B860 | 660 | 不合格 | 1.2/3.6,1.8 V | OTHER | 660 | 6144 CLBS, 331776 GATES | 2.2 mm | 现场可编程门阵列 | 0.42 ns | 6144 | 27648 | 331776 | 42.5 mm | 42.5 mm | ||||||||||||||||||||||||||
XCV2000E-6BGG560C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 357 MHz | 3 | 85 °C | PLASTIC/EPOXY | LBGA | BGA560,33X33,50 | SQUARE | GRID ARRAY, LOW PROFILE | 1.89 V | 1.8 V | LBGA, BGA560,33X33,50 | BGA | XILINX INC | Obsolete | 有 | XCV2000E-6BGG560C | 30 | 1.71 V | 560 | 5.81 | e1 | 有 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 260 | 1.27 mm | compliant | 560 | S-PBGA-B560 | 404 | 不合格 | 1.2/3.6,1.8 V | OTHER | 404 | 9600 CLBS, 518400 GATES | 1.7 mm | 现场可编程门阵列 | 0.47 ns | 9600 | 43200 | 518400 | 42.5 mm | 42.5 mm | |||||||||||||||||||||||||||
XCV1000E-7HQG240C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 有 | Obsolete | XILINX INC | QFP | FQFP, HQFP240,1.37SQ,20 | 5.8 | 400 MHz | 3 | 85 °C | PLASTIC/EPOXY | FQFP | HQFP240,1.37SQ,20 | SQUARE | FLATPACK, FINE PITCH | 1.89 V | 1.8 V | 30 | 1.71 V | 240 | XCV1000E-7HQG240C | e3 | 有 | Matte Tin (Sn) | 8542.39.00.01 | QUAD | 鸥翼 | 245 | 0.5 mm | compliant | 240 | S-PQFP-G240 | 158 | 不合格 | 1.2/3.6,1.8 V | OTHER | 158 | 6144 CLBS, 331776 GATES | 4.1 mm | 现场可编程门阵列 | 0.42 ns | 6144 | 27648 | 331776 | 32 mm | 32 mm | |||||||||||||||||||||||||||
XCV1000E-8HQG240I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 有 | Obsolete | XILINX INC | QFP | FQFP, HQFP240,1.37SQ,20 | 5.8 | 416 MHz | 3 | PLASTIC/EPOXY | FQFP | HQFP240,1.37SQ,20 | SQUARE | FLATPACK, FINE PITCH | 1.89 V | 1.8 V | 30 | 1.71 V | 240 | XCV1000E-8HQG240I | e3 | 有 | Matte Tin (Sn) | 8542.39.00.01 | QUAD | 鸥翼 | 245 | 0.5 mm | compliant | 240 | S-PQFP-G240 | 158 | 不合格 | 1.2/3.6,1.8 V | 158 | 6144 CLBS, 331776 GATES | 4.1 mm | 现场可编程门阵列 | 0.4 ns | 6144 | 27648 | 331776 | 32 mm | 32 mm | |||||||||||||||||||||||||||||
XCV3200E-7FG1156C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 无 | Obsolete | XILINX INC | BGA | FBGA-1156 | 5.85 | 400 MHz | 1 | 85 °C | PLASTIC/EPOXY | BGA | BGA1156,34X34,40 | SQUARE | 网格排列 | 1.89 V | 1.8 V | 未说明 | Compliant | 1.71 V | 1156 | XCV3200E-7FG1156C | 3A001.A.7.A | 85 °C | 0 °C | 8542.39.00.01 | BOTTOM | BALL | 225 | 1 mm | unknown | 1156 | S-PBGA-B1156 | 804 | 不合格 | 1.8 V | 1.2/3.6,1.8 V | OTHER | 104 kB | 804 | 16224 CLBS, 876096 GATES | 2.6 mm | 现场可编程门阵列 | 7 | 0.42 ns | 16224 | 73008 | 876096 | 35 mm | 35 mm | 无 | ||||||||||||||||||||||
XCR3064XL-7PCG44I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 有 | Obsolete | XILINX INC | LCC | LEAD FREE, PLASTIC, LCC-44 | 5.61 | 119 MHz | 3 | 36 | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | LDCC44,.7SQ | SQUARE | CHIP CARRIER | 3.6 V | 3.3 V | 30 | 3 V | 44 | XCR3064XL-7PCG44I | e3 | Matte Tin (Sn) | YES | 8542.39.00.01 | QUAD | J BEND | 245 | 1.27 mm | unknown | 44 | S-PQCC-J44 | 不合格 | 3/3.3 V | INDUSTRIAL | 7.5 ns | 0 DEDICATED INPUTS, 36 I/O | 4.572 mm | EE PLD | MACROCELL | 64 | YES | YES | 16.5862 mm | 16.5862 mm | ||||||||||||||||||||||||||
XC3020-100CB100M | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 无 | Obsolete | XILINX INC | QFP | GQFF, TPAK100,2.6SQ,25 | 5.87 | 100 MHz | 1 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | GQFF | TPAK100,2.6SQ,25 | SQUARE | FLATPACK, GUARD RING | 5 V | 未说明 | 100 | XC3020-100CB100M | e0 | 3A991 | 锡铅 | 256 FLIP-FLOPS; TYP. GATES = 1000-1500; POWER-DOWN SUPPLY CURRENT = 50UA | 8542.39.00.01 | QUAD | FLAT | 225 | 0.65 mm | unknown | 100 | S-CQFP-F100 | 64 | 不合格 | 5 V | MILITARY | 64 | 64 CLBS, 1000 GATES | 2.921 mm | 现场可编程门阵列 | 7 ns | 64 | 64 | 1000 | 19.05 mm | 19.05 mm | |||||||||||||||||||||||||||
XC4028XLA-9BG256C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 无 | Obsolete | XILINX INC | BGA | BGA, | 5.81 | 227 MHz | 3 | 85 °C | PLASTIC/EPOXY | BGA | SQUARE | 网格排列 | 3.6 V | 3.3 V | 30 | 3 V | 256 | XC4028XLA-9BG256C | e0 | 无 | 锡铅 | CAN ALSO USE 50000 GATES | 8542.39.00.01 | BOTTOM | BALL | 225 | 1.27 mm | compliant | 256 | S-PBGA-B256 | 不合格 | OTHER | 1024 CLBS, 18000 GATES | 2.55 mm | 现场可编程门阵列 | 1.1 ns | 1024 | 18000 | 27 mm | 27 mm | |||||||||||||||||||||||||||||||
XC95288-20HQG208I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 有 | Obsolete | XILINX INC | QFP | HFQFP, | 5.61 | 50 MHz | 3 | 168 | 85 °C | -40 °C | PLASTIC/EPOXY | HFQFP | SQUARE | FLATPACK, HEAT SINK/SLUG, FINE PITCH | 5.5 V | 5 V | 30 | 4.5 V | 208 | XC95288-20HQG208I | e3 | 有 | Matte Tin (Sn) | 8542.39.00.01 | QUAD | 鸥翼 | 245 | 0.5 mm | compliant | 208 | S-PQFP-G208 | 不合格 | INDUSTRIAL | 20 ns | 0 DEDICATED INPUTS, 168 I/O | 4.1 mm | 闪存 PLD | MACROCELL | 28 mm | 28 mm | |||||||||||||||||||||||||||||||
XCR5064C-12VQ100I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 无 | Obsolete | XILINX INC | QFP | TFQFP, TQFP100,.63SQ | 5.87 | 67 MHz | 3 | 64 | 85 °C | -40 °C | PLASTIC/EPOXY | TFQFP | TQFP100,.63SQ | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | 5.5 V | 5 V | 4.5 V | 100 | XCR5064C-12VQ100I | YES | 8542.39.00.01 | QUAD | 鸥翼 | 0.5 mm | unknown | 100 | S-PQFP-G100 | 不合格 | 5 V | INDUSTRIAL | 12 ns | 2 DEDICATED INPUTS, 64 I/O | 1.2 mm | EE PLD | MACROCELL | 64 | YES | 2 | YES | 14 mm | 14 mm |