类别是'接口 - 电信'
接口 - 电信 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 晶体管元件材料 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 功能数量 | 电源电压 | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 功能 | 资历状况 | 工作电源电压 | 电源 | 温度等级 | 配置 | 界面 | 电路数量 | 工作电源电流 | 操作模式 | 箱体转运 | 电流源 | 晶体管应用 | 极性/通道类型 | 最大漏极电流 (Abs) (ID) | 漏极-源极导通最大电阻 | 脉冲漏极电流-最大值(IDM) | 通信IC类型 | 雪崩能量等级（Eas） | 场效应管技术 | 收发器数量 | 运输载体类型 | 电池供电 | PSRR-Min | 混合动力车 | 马克斯噪音 | 座位高度(最大) | 长度 | 宽度 | 器件厚度 | 辐射硬化 | RoHS状态 | 无铅 | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | VSC7420XJG-04 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | 表面贴装 | 672-BGA | 672-HSBGA (27x27) | 活跃 | 4 (72 Hours) | 1V | 以太网交换机 | Serial | 1 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | HC5503CB | Rochester Electronics, LLC | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 24-SOIC (0.295, 7.50mm Width) | YES | 0°C~75°C | Tube | e0 | no | Obsolete | 1 (Unlimited) | 24 | 锡铅 | 4.75V~5.25V | DUAL | 鸥翼 | 240 | 5V | 未说明 | R-PDSO-G24 | Subscriber Line Interface Concept (SLIC) | COMMERCIAL | 1 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||
 | DS2155G | Rochester Electronics, LLC | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 100-LFBGA, CSPBGA | YES | 0°C~70°C | Tray | no | Obsolete | 3 (168 Hours) | 100 | 未说明 | 3.14V~3.47V | BOTTOM | BALL | 240 | 3.3V | 0.8mm | 20 | Single-Chip Transceiver | COMMERCIAL | E1, HDLC, J1, T1 | 1 | 75mA | FRAMER | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||
 | DS21554L | Rochester Electronics, LLC | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 100-LQFP | YES | 0°C~70°C | Tray | e0 | no | Obsolete | 3 (168 Hours) | 100 | 锡铅 | 4.75V~5.25V | QUAD | 鸥翼 | 245 | 5V | 0.5mm | 未说明 | Single-Chip Transceiver | COMMERCIAL | E1, HDLC, J1, T1 | 1 | 75mA | pcm收发器 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||
 | DS2175N | Rochester Electronics, LLC | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 通孔 | 16-DIP (0.300, 7.62mm) | NO | -40°C~85°C | Tube | e0 | no | Obsolete | 1 (Unlimited) | 16 | 锡铅 | 4.5V~5.5V | DUAL | 240 | 5V | 2.54mm | 20 | 弹性存储 | COMMERCIAL | PCM | 1 | 9mA | 弹性缓冲器 | 4.572mm | 7.62mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||
 | DS21Q554 | Rochester Electronics, LLC | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 256-BGA | YES | 70°C | Tray | no | Obsolete | 3 (168 Hours) | 256 | 未说明 | 5V | BOTTOM | BALL | 240 | 5V | 1.27mm | 20 | S-PBGA-B256 | 收发器 | COMMERCIAL | COMMERCIAL | E1 | 4 | 27mm | 27mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||
| DS3134 | Rochester Electronics, LLC | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 256-BGA | YES | 0°C~70°C | Tray | e0 | no | Obsolete | 3 (168 Hours) | 256 | 锡铅 | 3V~3.6V | BOTTOM | BALL | 225 | 3.3V | 未说明 | S-PBGA-B256 | Controller | COMMERCIAL | Serial | 1 | 500mA | FRAMER | 2.34mm | 27mm | 27mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||
 | CYP15G0201DXB-BBI | Rochester Electronics, LLC | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 196-LBGA | 196-FBGA (15x15) | -40°C~85°C | Tray | HOTlink II™ | Obsolete | 3 (168 Hours) | 3.135V~3.465V | 收发器 | LVTTL | 2 | 570mA | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CYP15G0403DXB-BGXI | Rochester Electronics, LLC | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 256-LBGA Exposed Pad | 256-BGA (27x27) | -40°C~85°C | Tray | HOTlink II™ | Obsolete | 3 (168 Hours) | 3.135V~3.465V | 收发器 | LVTTL | 4 | 900mA | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | DS3254 | Rochester Electronics, LLC | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 144-BGA, CSPBGA | YES | 0°C~70°C | Tray | no | Obsolete | 3 (168 Hours) | 144 | 未说明 | 3.135V~3.465V | BOTTOM | BALL | 240 | 3.3V | 1mm | 20 | Line Interface Unit (LIU) | COMMERCIAL | LIU | 4 | 290mA | pcm收发器 | 1.76mm | 13mm | 13mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||
| DS3141N | Rochester Electronics, LLC | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 144-BGA, CSPBGA | YES | -40°C~85°C | Tray | no | Obsolete | 3 (168 Hours) | 144 | 未说明 | 3.135V~3.465V | BOTTOM | BALL | 240 | 3.3V | 20 | Framer, Line Interface Unit (LIU) | COMMERCIAL | LIU | 1 | 80mA | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||
| DS3170N | Rochester Electronics, LLC | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 100-LBGA, CSBGA | YES | SILICON | 1 | -40°C~85°C | Tray | e4 | yes | Obsolete | 3 (168 Hours) | 8 | 镍钯金 | 3.135V~3.465V | DUAL | 鸥翼 | 260 | 未说明 | R-PDSO-G8 | Single-Chip Transceiver | COMMERCIAL | SINGLE WITH BUILT-IN DIODE | DS3, E3 | 1 | 增强型MOSFET | DRAIN | 120mA | SWITCHING | N-CHANNEL | 6.7A | 0.026Ohm | 60A | 360 mJ | METAL-OXIDE SEMICONDUCTOR | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||
| CYV15G0401DXB-BGC | Rochester Electronics, LLC | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 256-LBGA Exposed Pad | YES | 0°C~70°C | Tray | HOTlink II™ | e0 | no | Obsolete | 3 (168 Hours) | 256 | 锡铅 | 3.135V~3.465V | BOTTOM | BALL | 235 | 3.3V | 1.27mm | unknown | 未说明 | S-PBGA-B256 | 收发器 | COMMERCIAL | LVTTL | 4 | 870mA | 电信电路 | 27mm | 27mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||
.png) | LE9551DMQCT | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 28-QFN (4x5) | Tape & Reel (TR) | 活跃 | 3.3V | Subscriber Line Interface Concept (SLIC) | Serial | 1 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | DS2149QN | Rochester Electronics, LLC | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 28-LCC (J-Lead) | YES | -40°C~85°C | Tube | e0 | no | Obsolete | 1 (Unlimited) | 28 | 锡铅 | 4.75V~5.25V | QUAD | J BEND | 245 | 5V | 未说明 | S-PQCC-J28 | Line Interface Unit (LIU) | COMMERCIAL | LIU | 1 | pcm收发器 | 4.57mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||
 | ISL1550IRZ-T7 | Renesas Electronics America Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 33 Weeks | 表面贴装 | 16-TQFN Exposed Pad | -40°C~85°C | Tape & Reel (TR) | e3 | 活跃 | 1 (Unlimited) | EAR99 | Matte Tin (Sn) - annealed | ±4V~6.6V 8V~13.2V | 未说明 | 未说明 | ISL1550 | 线路驱动器 | 1 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DS21552L | Rochester Electronics, LLC | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 100-LQFP | YES | 0°C~70°C | Tray | e0 | no | Obsolete | 3 (168 Hours) | 100 | 锡铅 | 4.75V~5.25V | QUAD | 鸥翼 | 240 | 5V | 0.5mm | 20 | Single-Chip Transceiver | COMMERCIAL | E1, HDLC, J1, T1 | 1 | 75mA | pcm收发器 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||
 | ISL1561IRZ-T13 | Renesas Electronics America Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 表面贴装 | 24-VFQFN Exposed Pad | -40°C~85°C | Tape & Reel (TR) | e3 | 活跃 | 3 (168 Hours) | EAR99 | 哑光锡 | 10V~14.7V | 未说明 | 未说明 | ISL1561 | Driver | Serial | 2 | 19.5mA | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| DS3170N+T&R | Maxim Integrated | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 100-LBGA, CSBGA | 100-CSBGA (11x11) | -40°C~85°C | Tape & Reel (TR) | 2011 | Obsolete | 4 (72 Hours) | 3.135V~3.465V | DS3170 | Single-Chip Transceiver | DS3, E3 | 1 | 120mA | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DS2155GC2 | Maxim Integrated | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 100-LFBGA, CSPBGA | YES | 0°C~70°C | Tray | 2002 | no | Obsolete | 3 (168 Hours) | 100 | 3.14V~3.47V | BOTTOM | BALL | 225 | 3.3V | 0.8mm | not_compliant | 未说明 | DS2155 | Single-Chip Transceiver | 不合格 | 3.3V | E1, HDLC, J1, T1 | 1 | 75mA | FRAMER | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||
 | LE79R79-2FQCT | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 32-VQFN Exposed Pad | 0°C~70°C | Tape & Reel (TR) | e3 | Discontinued | 3 (168 Hours) | 32 | 哑光锡 | 4.75V~5.25V | QUAD | 无铅 | 5V | 0.8mm | S-XQCC-N32 | Subscriber Line Interface Concept (SLIC) | 不合格 | 5V | 5V | 2-Wire | 1 | 6.5mA | CONSTANT CURRENT | 30 dB | 2-4 CONVERSION | 79 dBrnC | 8mm | 8mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||
| LE79R79-1FQCT | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 32-VQFN Exposed Pad | 0°C~70°C | Tape & Reel (TR) | 1993 | e3 | Discontinued | 3 (168 Hours) | 32 | 哑光锡 | 4.75V~5.25V | QUAD | 无铅 | 5V | 0.8mm | S-XQCC-N32 | Subscriber Line Interface Concept (SLIC) | 不合格 | 5V | 5V | 2-Wire | 1 | 6.5mA | CONSTANT CURRENT | 30 dB | 2-4 CONVERSION | 79 dBrnC | 8mm | 8mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||
 | XRT75L06IB | Exar Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | BGA | 217 | e0 | no | 217 | Tin/Lead (Sn/Pb) | 85°C | -40°C | 8542.39.00.01 | BOTTOM | BALL | 1 | 3.3V | 1.27mm | 217 | 3.3V | INDUSTRIAL | pcm收发器 | E-3 | 2.5mm | 23mm | 23mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||
 | XRT83D10IW | Exar Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 28 | e0 | no | 28 | Tin/Lead (Sn/Pb) | 85°C | -40°C | 8542.39.00.01 | DUAL | J BEND | 1 | 3.3V | 1.27mm | 28 | 3.3/5V | INDUSTRIAL | pcm收发器 | CEPT PCM-30/E-1 | 3.56mm | 17.89mm | 7.52mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||
 | 82P2821BHG | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 17 Weeks | 表面贴装 | BGA | 640 | 2009 | e1 | yes | 活跃 | 3 (168 Hours) | 640 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 85°C | -40°C | BOTTOM | BALL | 260 | 1 | 1.8V | 640 | INDUSTRIAL | pcm收发器 | 1 | 2.44mm | 31mm | 31mm | 2.23mm | 无 | 符合RoHS标准 | 无铅 |