类别是'接口 - 电信'
接口 - 电信 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 功率(瓦特) | 最大功率耗散 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | JESD-30代码 | 功能 | 资历状况 | 输出电压 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 温度等级 | 电源电压-最小值(Vsup) | 界面 | 电路数量 | 工作电源电流 | 电源电流 | 最大电源电流 | 电源电流-最大值 | 电流源 | 逻辑功能 | 数据率 | 通信IC类型 | 收发器数量 | 消费者集成电路类型 | 输出低电流-最大值 | 标准 | 发射器数量 | ISDN接入速率 | 参考点 | 输出高电压-最小 | 输出低电压-最大值 | 高度 | 座位高度(最大) | 长度 | 宽度 | 器件厚度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | ||
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![]() | TP3420AV309 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 20-LCC (J-Lead) | YES | 20 | 70°C | Tube | e0 | no | Obsolete | 3 (168 Hours) | 20 | Tin/Lead (Sn/Pb) | 4.75V~5.25V | QUAD | J BEND | 250 | 5V | TP3420 | 收发器 | 5V | 5V | COMMERCIAL | ISDN | 1 | 192 kbps | 数码单反 | 0.0032A | CCITT I.430 | BASIC | S/T | 2.4V | 0.4V | 4.57mm | 8.89mm | 8.89mm | 无 | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||||||||||||||||||
![]() | DS21Q48N | Maxim Integrated | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 144-BBGA | 144 | -40°C~85°C | Tube | 2006 | e0 | Obsolete | 3 (168 Hours) | 144 | Tin/Lead (Sn/Pb) | 4.75V~5.25V | BOTTOM | BALL | 240 | 5V | 1.27mm | not_compliant | 未说明 | DS21Q48 | Line Interface Unit (LIU) | 不合格 | 5V | 5V | LIU | 125mA | 95mA | pcm收发器 | 4 | 17mm | 17mm | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||||||||||||||||||||||
![]() | LMC567CMX/NOPB | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | ACTIVE (Last Updated: 1 day ago) | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | 540.001716mg | -25°C~100°C | Tape & Reel (TR) | LMCMOS™ | e3 | yes | 活跃 | 1 (Unlimited) | 8 | 500mW | 2V~9V | DUAL | 鸥翼 | 260 | 5V | LMC567 | 音频解码器 | 5V | 1 | 12mA | 800μA | Decoder | 1.75mm | 4.9mm | 3.91mm | 1.58mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||
![]() | VSC7429XJG-02 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 672-BGA | YES | 672 | Caracal™-2 | 活跃 | 4 (72 Hours) | 672 | 125°C | -40°C | BOTTOM | BALL | 1 | 1V | 1mm | AUTOMOTIVE | 以太网收发器 | 2.44mm | 27mm | 27mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | LM567CM/NOPB | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | ACTIVE (Last Updated: 6 days ago) | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | 540.001716mg | 0°C~70°C | Tube | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | Matte Tin (Sn) | 1.1W | 4.75V~9V | DUAL | 鸥翼 | 260 | 5V | 500kHz | LM567 | 音频解码器 | 1V | 5V | 1 | 12mA | 12mA | Decoder | 1.75mm | 4.9mm | 3.91mm | 1.58mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||
![]() | LM567CMX/NOPB | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | ACTIVE (Last Updated: 6 days ago) | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | 540.001716mg | 0°C~70°C | Tape & Reel (TR) | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 1.1W | 4.75V~9V | DUAL | 鸥翼 | 260 | 5V | 500kHz | LM567 | 音频解码器 | 5V | 1 | 12mA | Decoder | 1.75mm | 4.9mm | 3.91mm | 1.58mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||
![]() | MT8870DSR1 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 18-SOIC (0.295, 7.50mm Width) | 18 | -40°C~85°C | Tape & Reel (TR) | 2006 | e3 | yes | 活跃 | 3 (168 Hours) | 18 | Matte Tin (Sn) | 500mW | 4.75V~5.25V | DUAL | 鸥翼 | 260 | 5V | 3.58MHz | 30 | DTMF接收器 | 5V | 5V | 1 | 3mA | 3mA | Receiver | DTMF信号电路 | 2.65mm | 7.5mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||
![]() | VSC8504XKS-05 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 表面贴装 | 256-BGA | 256-PBGA (17x17) | Tray | 活跃 | 4 (72 Hours) | 1V | Ethernet | 1 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | VSC8512XJG-03 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 672-BGA | 672-HSBGA (27x27) | Tray | 活跃 | 4 (72 Hours) | 125°C | -40°C | 1V | Ethernet | 1 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | VSC8514XMK-11 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | QFN | YES | 138-QFN (12x12) | 125°C | Tray | 活跃 | 3 (168 Hours) | 138 | BOTTOM | 无铅 | 1 | 1V | S-PBCC-N138 | OTHER | 以太网收发器 | 0.85mm | 12mm | 12mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | ST7580TR | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 14 Weeks | ACTIVE (Last Updated: 6 months ago) | 表面贴装 | 48-VQFN Exposed Pad | YES | 48 | Industrial grade | -40°C~85°C | Tape & Reel (TR) | e4 | 活跃 | 3 (168 Hours) | 48 | 5A992.C | Nickel/Palladium/Gold (Ni/Pd/Au) | 8V~18V | QUAD | 无铅 | 未说明 | 13V | 0.5mm | 未说明 | ST7580 | Power Line Networking System-On-Chip | 不合格 | UART | 1 | 500μA | 28.8 kbps | 电信电路 | 7mm | 7mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||
![]() | VSC7428XJG-02 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 672-BGA | YES | 2010 | Caracal™-1 | 活跃 | 4 (72 Hours) | 672 | 125°C | -40°C | BOTTOM | BALL | 1 | 1V | 1mm | unknown | S-PBGA-B672 | AUTOMOTIVE | 以太网收发器 | 2.44mm | 27mm | 27mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | VSC8514XMK-14 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 2 Weeks | 表面贴装 | QFN | 138-QFN (12x12) | Tray | 活跃 | 3 (168 Hours) | 125°C | -40°C | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | ZL50232QCG1 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 100-LQFP | 100 | -40°C~85°C | Tray | e3 | yes | 活跃 | 3 (168 Hours) | 100 | 哑光锡 | 1.6V~2V | QUAD | 鸥翼 | 260 | 1.8V | 0.5mm | 30 | 回声消除 | 1 | 10mA | ISDN回音消除器 | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | VSC7425XJG-02 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 672-BGA | YES | Tray | 2011 | SparX™-III-18 | 活跃 | 4 (72 Hours) | 672 | 1V | BOTTOM | BALL | 1V | S-PBGA-B672 | 以太网交换机 | OTHER | Serial | 1 | 1 Gbps | 电信电路 | 2.44mm | 27mm | 27mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MT8870DS1 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 18-SOIC (0.295, 7.50mm Width) | 18 | -40°C~85°C | Tube | e3 | yes | 活跃 | 3 (168 Hours) | 18 | 哑光锡 | 500mW | 4.75V~5.25V | DUAL | 鸥翼 | 260 | 5V | 3.58MHz | 30 | DTMF接收器 | 5V | 5V | 1 | 3mA | 3mA | Receiver | DTMF信号电路 | 2.65mm | 7.5mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||
![]() | MT9172AP1 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 28-LCC (J-Lead) | 28 | -40°C~85°C | Tube | e3 | 活跃 | 3 (168 Hours) | 28 | 哑光锡 | 4.75V~5.25V | QUAD | J BEND | 5V | Subscriber Line Interface Concept (SLIC) | 5V | 1 | 10mA | 160 kbps | 数码单反 | 4.57mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | VSC8512XJG-02 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 672-BGA | 672-HSBGA (27x27) | Tray | 活跃 | 4 (72 Hours) | 125°C | 0°C | 1V | Ethernet | 1 | 1 Gbps | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | VSC8479YYY | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 244-BBGA, FCBGA | YES | Industrial grade | -5°C~90°C | Tray | 活跃 | 4 (72 Hours) | 1.8V | BOTTOM | BALL | 1.8V | S-PBGA-B244 | 收发器 | I2C, SPI | 1 | 11.3 Gbps | 16 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | VSC8664XIC | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | BGA | 256-BGA (17x17) | Tray | 活跃 | 3 (168 Hours) | 90°C | 0°C | Ethernet | 1 | 1.25 Gbps | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MT88L70ANR1 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 20-SSOP (0.209, 5.30mm Width) | 20 | 453.59237mg | -40°C~85°C | Tape & Reel (TR) | 2006 | e3 | yes | 活跃 | 3 (168 Hours) | 20 | 哑光锡 | 500mW | 2.7V~3.6V | DUAL | 鸥翼 | 260 | 3V | 0.65mm | 3.58MHz | 30 | DTMF接收器 | 3V | 3V | 1 | 2mA | 5.5mA | Receiver | DTMF信号电路 | 2mm | 7.2mm | 5.3mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||
![]() | VSC8662XIC-03 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 9 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 256-BGA | YES | Tray | 活跃 | 3 (168 Hours) | 256 | 100°C | -40°C | BOTTOM | BALL | 1.2V | S-PBGA-B256 | Ethernet | INDUSTRIAL | 1 | 1.25 Gbps | 2 | 2mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | SI3018-F-FS | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 16-SOIC (0.154, 3.90mm Width) | YES | 16 | 189.318115mg | 0°C~70°C | Tube | 1999 | e3 | yes | 活跃 | 3 (168 Hours) | 16 | Tin (Sn) | 3V~3.6V | DUAL | 鸥翼 | 260 | 40 | SI3018 | Direct Access Arrangement (DAA) | 3.3V | 3.6V | 3V | Parallel, SPI, UART | 1 | 8.5mA | 54.6875 kbps | 消费电路 | 9.9mm | 3.9mm | 无 | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||||||||||||||||
![]() | ZL50110GAG2 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 表面贴装 | 552-BGA | 552 | -40°C~85°C | Tray | 2009 | yes | 活跃 | 3 (168 Hours) | 552 | 1.65V~1.95V | BOTTOM | BALL | 1.8V | ZL50110 | Telecom Circuit | 1.8V | TDM | 1 | 950mA | 1 Gbps | 2.53mm | 35mm | 35mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MT8888CSR1 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 20-SOIC (0.295, 7.50mm Width) | YES | -40°C~85°C | Tape & Reel (TR) | e3 | yes | 活跃 | 3 (168 Hours) | 20 | EAR99 | 哑光锡 | 4.75V~5.25V | DUAL | 鸥翼 | 260 | 5V | 30 | R-PDSO-G20 | DTMF 收发器 | 不合格 | 5V | 1 | 7mA | DTMF信号电路 | 2.65mm | 7.5mm | ROHS3 Compliant |