类别是'专用'
专用 (1453)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 表面安装 | 终端数量 | Date Of Intro | JESD-609代码 | 无铅代码 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 引脚数量 | JESD-30代码 | 资历状况 | 电源电压-最大值(Vsup) | 温度等级 | 电源电压-最小值(Vsup) | 操作模式 | 电源电流-最大值 | 组织结构 | 输出特性 | 座位高度-最大 | 内存宽度 | 待机电流-最大值 | 记忆密度 | 筛选水平 | 并行/串行 | I/O类型 | 内存IC类型 | 串行总线类型 | 耐力 | 数据保持时间 | 写入保护 | 待机电压-最小值 | 混合内存类型 | 长度 | 宽度 | ||||||||||||||||||
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![]() | S71WS256NC0BFWAP2 | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 活跃 | ADVANCED MICRO DEVICES INC | FBGA, BGA84,10X12,32 | 80 ns | 85 °C | -25 °C | PLASTIC/EPOXY | FBGA | BGA84,10X12,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | 1.8 V | 84 | 有 | EAR99 | 8542.32.00.71 | BOTTOM | BALL | 0.8 mm | compliant | R-PBGA-B84 | 不合格 | OTHER | 0.066 mA | 0.00004 A | 存储器电路 | FLASH+PSRAM | |||||||||||||||||||||||||||||||||
![]() | FM24VN02-G | Ramtron International Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | RAMTRON INTERNATIONAL CORP | SOIC | SOP, SOP8,.25 | 3.4 MHz | 32768 words | 32000 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | 小概要 | 3.3 V | 8 | Obsolete | EAR99 | 8542.32.00.71 | DUAL | 鸥翼 | 1 | 1.27 mm | unknown | 8 | R-PDSO-G8 | 不合格 | 3.6 V | 2 V | SYNCHRONOUS | 0.0001 mA | 32KX8 | 1.75 mm | 8 | 0.00015 A | 262144 bit | SERIAL | FRAM | I2C | 100000000000000 Write/Erase Cycles | 10 | HARDWARE | 2 V | 4.9 mm | 3.9 mm | ||||||||||||||||
![]() | RD28F3204W30B70 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | INTEL CORP | BGA | LFBGA, | 2097152 words | 2000000 | 85 °C | -25 °C | PLASTIC/EPOXY | LFBGA | RECTANGULAR | GRID ARRAY, LOW PROFILE, FINE PITCH | 1.8 V | 80 | Obsolete | EAR99 | SRAM IS CONFIGURED AS 256K X 16 | 8542.32.00.71 | BOTTOM | BALL | 1 | 0.8 mm | unknown | 80 | R-PBGA-B80 | 不合格 | 1.9 V | OTHER | 1.7 V | SYNCHRONOUS | 2MX16 | 1.4 mm | 16 | 33554432 bit | 存储器电路 | 14 mm | 8 mm | ||||||||||||||||||||||||
![]() | S72NS512PE0KFFG00 | Spansion | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | SPANSION INC | BGA | TFBGA, | 33554432 words | 32000000 | 85 °C | -25 °C | PLASTIC/EPOXY | TFBGA | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | 1.8 V | 128 | 有 | 3A991.B.1.A | DRAM IS ORGANISED AS 16M X 16; SYNCHRONOUS BURST MODE ALSO POSSIBLE | 8542.32.00.51 | BOTTOM | BALL | 260 | 1 | 0.65 mm | unknown | 40 | 128 | S-PBGA-B128 | 不合格 | 1.95 V | OTHER | 1.7 V | ASYNCHRONOUS | 32MX16 | 1.05 mm | 16 | 536870912 bit | 存储器电路 | 12 mm | 12 mm | |||||||||||||||||||||
![]() | FM24VN02-GTR | Ramtron International Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | RAMTRON INTERNATIONAL CORP | SOIC | SOP, SOP8,.25 | 3.4 MHz | 32768 words | 32000 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | 小概要 | 3.3 V | 8 | Obsolete | EAR99 | 8542.32.00.71 | DUAL | 鸥翼 | 1 | 1.27 mm | unknown | 8 | R-PDSO-G8 | 不合格 | 3.6 V | 2 V | SYNCHRONOUS | 0.0001 mA | 32KX8 | 1.75 mm | 8 | 0.00015 A | 262144 bit | SERIAL | FRAM | I2C | 100000000000000 Write/Erase Cycles | 10 | HARDWARE | 2 V | 4.9 mm | 3.9 mm | ||||||||||||||||
![]() | TC57256D-20 | Toshiba America Electronic Components | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Transferred | TOSHIBA CORP | , | 无 | e0 | EAR99 | 锡铅 | 8542.32.00.71 | unknown | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC17S40SOG20I | AMD Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | XILINX INC | SOIC | SOP, | 3 | 329312 words | 329312 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | RECTANGULAR | 小概要 | 5 V | 20 | 有 | e3 | 有 | EAR99 | Matte Tin (Sn) | 8542.32.00.71 | DUAL | 鸥翼 | 260 | 1 | 1.27 mm | compliant | 30 | 20 | R-PDSO-G20 | 不合格 | 5.5 V | INDUSTRIAL | 4.5 V | SYNCHRONOUS | 329312X1 | 2.65 mm | 1 | 329312 bit | 存储器电路 | 12.8 mm | 7.5 mm | ||||||||||||||||||
![]() | MM5260N | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NO | Obsolete | NATIONAL SEMICONDUCTOR CORP | DIP, DIP16,.3 | 1024 words | 1000 | 70 °C | -25 °C | PLASTIC/EPOXY | DIP | DIP16,.3 | RECTANGULAR | IN-LINE | 16 | 无 | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.71 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-PDIP-T16 | 不合格 | OTHER | 1KX1 | 3-STATE | 1 | 1024 bit | COMMON | ||||||||||||||||||||||||||||||
![]() | S71PL032J80BAW070 | Spansion | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | SPANSION INC | BGA | TFBGA, | 3 | 2097152 words | 2000000 | 85 °C | -25 °C | PLASTIC/EPOXY | TFBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | 3 V | 56 | 有 | e1 | EAR99 | 锡银铜 | PSRAM IS ORGANIZED AS 512K X 16 | 8542.32.00.71 | BOTTOM | BALL | 1 | 0.8 mm | compliant | 56 | R-PBGA-B56 | 不合格 | 3.6 V | OTHER | 2.7 V | ASYNCHRONOUS | 2MX16 | 1.2 mm | 16 | 33554432 bit | 存储器电路 | 9 mm | 7 mm | ||||||||||||||||||||
![]() | S71PL032J80BAW070 | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | ADVANCED MICRO DEVICES INC | FBGA, BGA56,8X8,32 | 70 ns | 85 °C | -25 °C | PLASTIC/EPOXY | FBGA | BGA56,8X8,32 | SQUARE | GRID ARRAY, FINE PITCH | 3 V | 56 | 有 | EAR99 | 8542.32.00.71 | BOTTOM | BALL | 0.8 mm | compliant | S-PBGA-B56 | 不合格 | OTHER | 0.07 mA | 0.000005 A | 存储器电路 | FLASH+PSRAM | |||||||||||||||||||||||||||||||||
![]() | S72WS256NEEBFWUB0 | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 活跃 | ADVANCED MICRO DEVICES INC | FBGA, BGA137,10X14,32 | 70 ns | 85 °C | -25 °C | PLASTIC/EPOXY | FBGA | BGA137,10X14,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | 1.8 V | 137 | 有 | EAR99 | 8542.32.00.71 | BOTTOM | BALL | 0.8 mm | compliant | R-PBGA-B137 | 不合格 | OTHER | 0.06 mA | 0.00004 A | 存储器电路 | FLASH+SDRAM | |||||||||||||||||||||||||||||||||
![]() | M4-4101S-Z3 | Moujen Switch | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | SSDSC2KB240G701 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | INTEL CORP | , | 2018-07-23 | Obsolete | EAR99 | 8542.32.00.71 | compliant | 存储器电路 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | S82S141F883C | Signetics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NO | Obsolete | SIGNETICS CORP | CERAMIC, DIP-24 | 90 ns | 512 words | 512 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | DIP | DIP24,.6 | RECTANGULAR | IN-LINE | 5 V | 24 | 无 | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.71 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | R-CDIP-T24 | 不合格 | 5.5 V | MILITARY | 4.5 V | ASYNCHRONOUS | 0.185 mA | 512X8 | 8 | 4096 bit | MIL-STD-883 | 存储器电路 | |||||||||||||||||||||||
![]() | S82S141F883C | Philips Semiconductors | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NO | Obsolete | SIGNETICS CORP | DIP, DIP24,.6 | 90 ns | 512 words | 512 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | DIP | DIP24,.6 | RECTANGULAR | IN-LINE | 5 V | 24 | 无 | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.71 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | R-CDIP-T24 | 不合格 | 5.5 V | MILITARY | 4.5 V | ASYNCHRONOUS | 0.185 mA | 512X8 | 8 | 4096 bit | MIL-STD-883 | 存储器电路 | |||||||||||||||||||||||
![]() | S82S141F883C | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NO | Obsolete | SIGNETICS CORP | 90 ns | 512 words | 512 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | DIP | DIP24,.6 | RECTANGULAR | IN-LINE | 5 V | DIP, DIP24,.6 | DIP | 24 | 无 | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.71 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | 24 | R-CDIP-T24 | 不合格 | 5.5 V | MILITARY | 4.5 V | ASYNCHRONOUS | 0.185 mA | 512X8 | 8 | 4096 bit | MIL-STD-883 | 存储器电路 | |||||||||||||||||||||
![]() | S71PL129JB0BAW9Z0 | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 活跃 | ADVANCED MICRO DEVICES INC | FBGA, BGA64,10X12,32 | 70 ns | 85 °C | -25 °C | PLASTIC/EPOXY | FBGA | BGA64,10X12,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | 64 | 有 | EAR99 | 8542.32.00.71 | BOTTOM | BALL | 0.8 mm | compliant | R-PBGA-B64 | 不合格 | OTHER | 0.07 mA | 0.000005 A | 存储器电路 | FLASH+PSRAM | ||||||||||||||||||||||||||||||||||
![]() | RP-SMLF32RP0 | Panasonic Electronic Components | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M4-4106-Z3 | Moujen Switch | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | S71GL128NB0BFW9Z | Spansion | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | SD8SBAT-256G | Western Digital Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | WESTERN DIGITAL CORP | , | 274877906944 words | 256000000000 | 70 °C | UNSPECIFIED | RECTANGULAR | 微电子组件 | 接触制造商 | EAR99 | 8542.32.00.71 | UNSPECIFIED | 无铅 | 1 | unknown | R-XXMA-N | COMMERCIAL | ASYNCHRONOUS | 256GX8 | 8 | 2199023255552 bit | 存储器电路 | ||||||||||||||||||||||||||||||||||||||
![]() | FM1114-QGTR | Ramtron International Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | RAMTRON INTERNATIONAL CORP | , | Obsolete | EAR99 | 8542.32.00.71 | unknown | 存储器电路 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M4-4114S-Z2 | Moujen Switch | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | SSDSCKJR150G7XA | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | INTEL CORP | PACKAGE | 161061273600 words | 150000000000 | 70 °C | UNSPECIFIED | RECTANGULAR | 2018-07-27 | 活跃 | EAR99 | 8542.32.00.71 | 1 | compliant | COMMERCIAL | ASYNCHRONOUS | 150GX8 | 8 | 1288490188800 bit | 存储器电路 | ||||||||||||||||||||||||||||||||||||||||||
![]() | M4-4112-Z3 | Moujen Switch | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 |