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图片

产品型号

品牌

数据表

有效性

单价(CNY)

询价

认证

表面安装

终端数量

JESD-609代码

无铅代码

ECCN 代码

端子表面处理

附加功能

HTS代码

端子位置

终端形式

峰值回流焊温度（摄氏度）

功能数量

端子间距

Reach合规守则

时间@峰值回流温度-最大值(s)

引脚数量

JESD-30代码

资历状况

电源电压-最大值(Vsup)

温度等级

电源电压-最小值(Vsup)

操作模式

电源电流-最大值

组织结构

座位高度-最大

内存宽度

待机电流-最大值

记忆密度

内存IC类型

混合内存类型

长度

宽度
XC17S40PDG8C XC17S40PDG8C

AMD Xilinx 数据表

N/A

-

最小起订量: 1

倍率: 1

NO

Obsolete

XILINX INC

DIP

DIP,

1

329312 words

329312

70 °C

PLASTIC/EPOXY

DIP

RECTANGULAR

IN-LINE

5 V

8

有

e3

有

EAR99

Matte Tin (Sn)

8542.32.00.71

DUAL

THROUGH-HOLE

250

1

2.54 mm

compliant

30

8

R-PDIP-T8

不合格

5.25 V

COMMERCIAL

4.75 V

SYNCHRONOUS

329312X1

4.5974 mm

1

329312 bit

存储器电路

9.3599 mm

7.62 mm

UPD41101C-2 UPD41101C-2

NEC Electronics Group 数据表

N/A

-

最小起订量: 1

倍率: 1

UPD41101C-2 UPD41101C-2

Renesas Electronics Corporation 数据表

N/A

-

最小起订量: 1

倍率: 1

NO

Obsolete

RENESAS ELECTRONICS CORP

DIP-24

27 ns

70 °C

-20 °C

PLASTIC/EPOXY

DIP

DIP24,.3

RECTANGULAR

IN-LINE

24

无

e0

EAR99

Tin/Lead (Sn/Pb)

8542.32.00.71

DUAL

THROUGH-HOLE

2.54 mm

unknown

R-PDIP-T24

不合格

COMMERCIAL

0.09 mA

0.09 A

存储器电路

CY7C274-55QMB CY7C274-55QMB

Teledyne e2v 数据表

N/A

-

最小起订量: 1

倍率: 1

E2V TECHNOLOGIES PLC

,

活跃

3A001.A.2.C

8542.32.00.61

compliant

SST32HF324C-70-4C-LBKE SST32HF324C-70-4C-LBKE

Greenliant Systems Ltd 数据表

N/A

-

最小起订量: 1

倍率: 1

GREENLIANT SYSTEMS LTD

,

Obsolete

EAR99

8542.32.00.71

compliant

XC17S05PDG8C XC17S05PDG8C

AMD Xilinx 数据表

N/A

-

最小起订量: 1

倍率: 1

NO

Obsolete

XILINX INC

DIP

DIP,

1

53984 words

53984

70 °C

PLASTIC/EPOXY

DIP

RECTANGULAR

IN-LINE

5 V

8

有

e3

有

EAR99

Matte Tin (Sn)

8542.32.00.71

DUAL

THROUGH-HOLE

250

1

2.54 mm

compliant

30

8

R-PDIP-T8

不合格

5.25 V

COMMERCIAL

4.75 V

SYNCHRONOUS

53984X1

4.5974 mm

1

53984 bit

存储器电路

9.3599 mm

7.62 mm

S71NS256NC0BJWVN3 S71NS256NC0BJWVN3

Spansion 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

Obsolete

SPANSION INC

BGA

11 X 10 MM, 1.20 MM HEIGHT, LEAD FREE, VFBGA-60

3

16777216 words

16000000

85 °C

-25 °C

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

1.8 V

60

有

e2

EAR99

TIN SILVER COPPER NICKEL

PSRAM IS ORGANIZED AS 16M X 16

8542.32.00.71

BOTTOM

BALL

260

1

0.5 mm

unknown

40

60

R-PBGA-B60

不合格

1.95 V

OTHER

1.7 V

SYNCHRONOUS

16MX16

1.2 mm

16

268435456 bit

存储器电路

11 mm

10 mm

S72NS256PD0AJBLG3 S72NS256PD0AJBLG3

Spansion 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

Obsolete

SPANSION INC

BGA

8 X 8 MM, 0.50 MM PITCH, LEAD FREE, FBGA-133

3

16777216 words

16000000

85 °C

-25 °C

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

1.8 V

133

有

e2

EAR99

TIN SILVER COPPER NICKEL

DRAM IS ORGANISED AS 16M X 16; SYNCHRONOUS BURST MODE ALSO POSSIBLE

8542.32.00.71

BOTTOM

BALL

260

1

0.5 mm

unknown

40

133

S-PBGA-B133

不合格

1.95 V

OTHER

1.7 V

ASYNCHRONOUS

16MX16

1.1 mm

16

268435456 bit

存储器电路

8 mm

8 mm

PF38F5060M0Y0B0 PF38F5060M0Y0B0

Intel Corporation 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

Transferred

INTEL CORP

BGA

TFBGA, BGA105,9X12,32

3

33554432 words

32000000

85 °C

-30 °C

PLASTIC/EPOXY

TFBGA

BGA105,9X12,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

1.8 V

105

有

e1

EAR99

锡银铜

PSEUDO SRAM IS ORGANIZED AS 8M X 16

8542.32.00.71

BOTTOM

BALL

1

0.8 mm

compliant

105

R-PBGA-B105

不合格

2 V

OTHER

1.7 V

SYNCHRONOUS

32MX16

1.2 mm

16

0.00012 A

536870912 bit

存储器电路

FLASH+PSRAM

11 mm

9 mm

TH50VSF2580AASB TH50VSF2580AASB

Toshiba America Electronic Components 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

Transferred

TOSHIBA CORP

BGA

LFBGA, BGA69,10X12,32

90 ns

2097152 words

2000000

85 °C

-40 °C

PLASTIC/EPOXY

LFBGA

BGA69,10X12,32

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

3 V

69

无

e0

无

EAR99

锡铅

USER CONFIGURABLE AS 4M X 8 FLASH AND CONTAINS SRAM CONFIGURED AS 256 X 16 OR 512K X 8

8542.32.00.71

BOTTOM

BALL

1

0.8 mm

unknown

69

R-PBGA-B69

不合格

3.6 V

INDUSTRIAL

2.7 V

ASYNCHRONOUS

0.05 mA

2MX16

1.4 mm

16

33554432 bit

存储器电路

FLASH+SRAM

12 mm

9 mm

HYG0UGG0MF1P-5SH0E HYG0UGG0MF1P-5SH0E

SK Hynix Inc 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

SK HYNIX INC

FBGA-149

33554432 words

32000000

85 °C

-30 °C

PLASTIC/EPOXY

LFBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

1.8 V

149

活跃

EAR99

IT ALSO CONTAINS 1GBIT(128M X 8BIT) NAND FLASH MEMORY OPERATES AT 2.7V NOM SUPPLY

8542.32.00.71

BOTTOM

BALL

1

0.8 mm

compliant

R-PBGA-B149

1.95 V

OTHER

1.7 V

SYNCHRONOUS

32MX16

1.4 mm

16

536870912 bit

存储器电路

14 mm

10 mm

ICS2121M001 ICS2121M001

Integrated Device Technology Inc 数据表

N/A

-

最小起订量: 1

倍率: 1

Obsolete

INTEGRATED CIRCUIT SYSTEMS INC

,

无

EAR99

8542.32.00.71

unknown

S71PL127JB0BAW9Z S71PL127JB0BAW9Z

Spansion 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

Obsolete

SPANSION INC

BGA

TFBGA,

3

8388608 words

8000000

85 °C

-25 °C

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

3 V

64

无

e0

EAR99

锡铅

PSEUDO STATIC RAM IS ORGANIZED AS 2M X 16

8542.32.00.71

BOTTOM

BALL

1

0.8 mm

compliant

64

R-PBGA-B64

不合格

3.6 V

OTHER

2.7 V

ASYNCHRONOUS

8MX16

1.2 mm

16

134217728 bit

存储器电路

11.6 mm

8 mm

SST34HF1641C-70-4C-L1P SST34HF1641C-70-4C-L1P

Silicon Storage Technology 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

SILICON STORAGE TECHNOLOGY INC

BGA

LFBGA,

1048576 words

1000000

70 °C

PLASTIC/EPOXY

LFBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

3 V

56

Obsolete

EAR99

SRAM IS ORGANIZED AS 256K X 16 / 512K X 8; FLASH CAN ALSO BE ORGANIZED AS 2M X 8

8542.32.00.71

BOTTOM

BALL

1

0.8 mm

unknown

56

R-PBGA-B56

不合格

3.3 V

COMMERCIAL

2.7 V

ASYNCHRONOUS

1MX16

1.4 mm

16

16777216 bit

存储器电路

10 mm

8 mm

AM27C2048-150PC AM27C2048-150PC

Cypress Semiconductor 数据表

N/A

-

最小起订量: 1

倍率: 1

CYPRESS SEMICONDUCTOR CORP

活跃

compliant

TMS4C1060-30SD TMS4C1060-30SD

NA 数据表

N/A

-

最小起订量: 1

倍率: 1

NO

Obsolete

TEXAS INSTRUMENTS INC

ZIP, ZIP20,.1

25 ns

70 °C

PLASTIC/EPOXY

ZIP

ZIP20,.1

RECTANGULAR

IN-LINE

5 V

20

无

EAR99

8542.32.00.71

ZIG-ZAG

THROUGH-HOLE

未说明

1.27 mm

not_compliant

未说明

R-PZIP-T20

不合格

COMMERCIAL

0.05 mA

0.01 A

存储器电路

SN74LS189N SN74LS189N

Motorola Mobility LLC 数据表

N/A

-

最小起订量: 1

倍率: 1

NO

MOTOROLA INC

DIP

DIP,

16 words

16

PLASTIC/EPOXY

DIP

RECTANGULAR

IN-LINE

5 V

16

Obsolete

e0

EAR99

Tin/Lead (Sn/Pb)

8542.32.00.71

DUAL

THROUGH-HOLE

1

unknown

16

R-PDIP-T16

不合格

ASYNCHRONOUS

16X4

4

64 bit

存储器电路

RD28F3208C3T70 RD28F3208C3T70

Intel Corporation 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

Obsolete

INTEL CORP

BGA

LFBGA, BGA68,8X12,32

70 ns

2097152 words

2000000

85 °C

-25 °C

PLASTIC/EPOXY

LFBGA

BGA68,8X12,32

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

3 V

66

无

EAR99

SRAM IS ORGANIZED AS 512K X 16

8542.32.00.71

BOTTOM

BALL

240

1

0.8 mm

compliant

30

66

R-PBGA-B66

不合格

3.3 V

商业扩展

2.7 V

ASYNCHRONOUS

0.055 mA

2MX16

1.4 mm

16

0.000006 A

33554432 bit

存储器电路

FLASH+SRAM

10 mm

8 mm

S71GL128NB0BFW9Z0 S71GL128NB0BFW9Z0

Spansion 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

Obsolete

SPANSION INC

BGA

8 X 11.60 MM, 1.20 MM HIEGHT, LEAD FREE, FBGA-64

3

8388608 words

8000000

85 °C

-25 °C

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

3 V

64

有

e1

3A991.B.1.A

锡银铜

PSRAM IS ORGANIZED AS 2M X 16

8542.32.00.71

BOTTOM

BALL

260

1

0.8 mm

unknown

40

64

R-PBGA-B64

不合格

3.1 V

OTHER

2.7 V

ASYNCHRONOUS

8MX16

1.2 mm

16

134217728 bit

存储器电路

11.6 mm

8 mm

LRS1806K LRS1806K

Sharp Microelectronics of the Americas 数据表

N/A

-

最小起订量: 1

倍率: 1

R8A66120FFA R8A66120FFA

Renesas Electronics Corporation 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

RENESAS ELECTRONICS CORP

QFP

LFQFP, QFP48,.35SQ,20

6 ns

2097152 words

2000000

70 °C

PLASTIC/EPOXY

LFQFP

QFP48,.35SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

3.3 V

48

Obsolete

EAR99

8542.32.00.71

QUAD

鸥翼

1

0.5 mm

unknown

48

S-PQFP-G48

不合格

3.6 V

COMMERCIAL

3 V

SYNCHRONOUS

0.15 mA

2MX4

1.7 mm

4

8388608 bit

存储器电路

7 mm

7 mm

XC17S20VOG8I XC17S20VOG8I

AMD Xilinx 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

Obsolete

XILINX INC

TSOP

TSOP2,

3

178144 words

178144

85 °C

-40 °C

PLASTIC/EPOXY

TSOP2

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

5 V

8

有

e3

有

EAR99

Matte Tin (Sn)

8542.32.00.71

DUAL

鸥翼

260

1

1.27 mm

compliant

30

8

R-PDSO-G8

不合格

5.5 V

INDUSTRIAL

4.5 V

SYNCHRONOUS

178144X1

1.2 mm

1

178144 bit

存储器电路

4.9 mm

3.9 mm

MD2201-D72 MD2201-D72

M-Systems Corp 数据表

N/A

-

最小起订量: 1

倍率: 1

TH50VSF1421ACXB TH50VSF1421ACXB

Toshiba America Electronic Components 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

Transferred

TOSHIBA CORP

BGA, BGA48,6X8,40

100 ns

85 °C

-20 °C

PLASTIC/EPOXY

BGA

BGA48,6X8,40

RECTANGULAR

网格排列

48

无

e0

EAR99

Tin/Lead (Sn/Pb)

8542.32.00.71

BOTTOM

BALL

1 mm

unknown

R-PBGA-B48

不合格

OTHER

0.04 mA

0.00003 A

存储器电路

FLASH+SRAM

SST34HF1642C-70-4E-L1PE SST34HF1642C-70-4E-L1PE

Silicon Storage Technology 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

SILICON STORAGE TECHNOLOGY INC

BGA

LFBGA,

1048576 words

1000000

85 °C

-20 °C

PLASTIC/EPOXY

LFBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

3 V

56

Obsolete

EAR99

SRAM IS ORGANIZED AS 256K X 16 / 512K X 8; FLASH CAN ALSO BE ORGANIZED AS 2M X 8

8542.32.00.71

BOTTOM

BALL

1

0.8 mm

unknown

56

R-PBGA-B56

不合格

3.3 V

OTHER

2.7 V

ASYNCHRONOUS

1MX16

1.4 mm

16

16777216 bit

存储器电路

10 mm

8 mm