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专用 (1453)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 表面安装 | 终端数量 | 包装 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | ECCN 代码 | 类型 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 引脚数量 | JESD-30代码 | 资历状况 | 电源电压-最大值(Vsup) | 温度等级 | 电源电压-最小值(Vsup) | 操作模式 | 电源电流-最大值 | 组织结构 | 座位高度-最大 | 内存宽度 | 待机电流-最大值 | 记忆密度 | 内存IC类型 | 混合内存类型 | 长度 | 宽度 | |||||||||||||||||
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![]() | SAA5051 | Philips Semiconductors | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC17S10VOG8I | AMD Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | XILINX INC | TSOP | TSOP2, | 3 | 95008 words | 95008 | 85 °C | -40 °C | PLASTIC/EPOXY | TSOP2 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | 5 V | 8 | 有 | e3 | 有 | EAR99 | Matte Tin (Sn) | 8542.32.00.71 | DUAL | 鸥翼 | 260 | 1 | 1.27 mm | compliant | 30 | 8 | R-PDSO-G8 | 不合格 | 5.5 V | INDUSTRIAL | 4.5 V | SYNCHRONOUS | 95008X1 | 1.2 mm | 1 | 95008 bit | 存储器电路 | 4.9 mm | 3.9 mm | |||||||||||
![]() | XC17S20PDG8I | AMD Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NO | Obsolete | XILINX INC | DIP | DIP, | 1 | 178144 words | 178144 | 85 °C | -40 °C | PLASTIC/EPOXY | DIP | RECTANGULAR | IN-LINE | 5 V | 8 | 有 | e3 | 有 | EAR99 | Matte Tin (Sn) | 8542.32.00.71 | DUAL | THROUGH-HOLE | 250 | 1 | 2.54 mm | compliant | 30 | 8 | R-PDIP-T8 | 不合格 | 5.5 V | INDUSTRIAL | 4.5 V | SYNCHRONOUS | 178144X1 | 4.5974 mm | 1 | 178144 bit | 存储器电路 | 9.3599 mm | 7.62 mm | |||||||||||
![]() | TMS4C2973-26DT | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | TEXAS INSTRUMENTS INC | SSOP, SOP36,.47,40 | 21 ns | 70 °C | PLASTIC/EPOXY | SSOP | SOP36,.47,40 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | 3.3 V | 36 | 无 | EAR99 | 8542.32.00.71 | DUAL | 鸥翼 | 1 mm | not_compliant | R-PDSO-G36 | 不合格 | COMMERCIAL | 0.05 mA | 0.01 A | |||||||||||||||||||||||||||||
![]() | M4-4111S-Z3 | Moujen Switch | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | NAND98R3M2AZBB5E | Micron Technology Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | MICRON TECHNOLOGY INC | FBGA, BGA107,10X14,32 | 85 °C | -30 °C | PLASTIC/EPOXY | FBGA | BGA107,10X14,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | 1.8 V | 107 | 有 | EAR99 | 8542.32.00.71 | BOTTOM | BALL | 0.8 mm | compliant | R-PBGA-B107 | 不合格 | OTHER | 存储器电路 | FLASH+SDRAM | |||||||||||||||||||||||||||||
![]() | PF38F5070M0Y0V0 | Micron Technology Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | MICRON TECHNOLOGY INC | FBGA, BGA165,12X15,25 | 96 ns | PLASTIC/EPOXY | FBGA | BGA165,12X15,25 | RECTANGULAR | GRID ARRAY, FINE PITCH | 1.8 V | 165 | 有 | EAR99 | 8542.32.00.71 | BOTTOM | BALL | 0.635 mm | compliant | R-PBGA-B165 | 不合格 | 0.00016 A | 存储器电路 | FLASH+PSRAM | ||||||||||||||||||||||||||||||
![]() | S71NS256PB0ZJETV0 | Spansion | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | SPANSION INC | BGA | TFBGA, | 16777216 words | 16000000 | 85 °C | -25 °C | PLASTIC/EPOXY | TFBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | 1.8 V | 56 | 有 | EAR99 | PSRAM IS ORGANIZED AS 2M X 16 | 8542.32.00.71 | BOTTOM | BALL | 260 | 1 | 0.5 mm | unknown | 40 | 56 | R-PBGA-B56 | 不合格 | 1.95 V | OTHER | 1.7 V | SYNCHRONOUS | 16MX16 | 1.2 mm | 16 | 268435456 bit | 存储器电路 | 9.2 mm | 8 mm | ||||||||||||||
![]() | NAND98W3M1AZBC5E | Micron Technology Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | MICRON TECHNOLOGY INC | FBGA, BGA137,10X15,32 | 85 °C | -30 °C | PLASTIC/EPOXY | FBGA | BGA137,10X15,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | 3 V | 137 | 有 | EAR99 | 8542.32.00.71 | BOTTOM | BALL | 0.8 mm | compliant | R-PBGA-B137 | 不合格 | OTHER | 存储器电路 | FLASH+SDRAM | |||||||||||||||||||||||||||||
![]() | M4-4112R-Z3 | Moujen Switch | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | S71PL127NC0HFW4U0 | Spansion | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | SPANSION INC | BGA | 8 X 11.60 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FBGA-64 | 70 ns | 3 | 8388608 words | 8000000 | 85 °C | -25 °C | PLASTIC/EPOXY | TFBGA | BGA64,10X12,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | 3 V | 64 | 有 | e1 | 有 | EAR99 | 锡银铜 | 8542.32.00.71 | BOTTOM | BALL | 260 | 1 | 0.8 mm | unknown | 40 | 64 | R-PBGA-B64 | 不合格 | 3.1 V | OTHER | 2.7 V | ASYNCHRONOUS | 8MX16 | 1.2 mm | 16 | 134217728 bit | 存储器电路 | FLASH+PSRAM | 11.6 mm | 8 mm | ||||||||
![]() | PF38F1030W0YBQF | Micron Technology Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | MICRON TECHNOLOGY INC | FBGA, BGA88,8X12,32 | 85 °C | -25 °C | PLASTIC/EPOXY | FBGA | BGA88,8X12,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | 88 | 有 | EAR99 | 8542.32.00.71 | BOTTOM | BALL | 0.8 mm | compliant | R-PBGA-B88 | 不合格 | OTHER | 0.055 mA | 0.000005 A | 存储器电路 | FLASH+PSRAM | ||||||||||||||||||||||||||||
![]() | S71PL129JC0BFW9U0 | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 活跃 | ADVANCED MICRO DEVICES INC | FBGA, BGA64,10X12,32 | 70 ns | 85 °C | -25 °C | PLASTIC/EPOXY | FBGA | BGA64,10X12,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | 64 | 有 | EAR99 | 8542.32.00.71 | BOTTOM | BALL | 0.8 mm | compliant | R-PBGA-B64 | 不合格 | OTHER | 0.07 mA | 0.000005 A | 存储器电路 | FLASH+PSRAM | |||||||||||||||||||||||||||
![]() | S71NS256PB0ZJETV2 | Spansion | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Transferred | SPANSION INC | , | 有 | EAR99 | 8542.32.00.71 | 260 | unknown | 40 | |||||||||||||||||||||||||||||||||||||||||||||
![]() | NAND99W3M1BZBC5E | Numonyx Memory Solutions | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | NUMONYX | BGA | FBGA, BGA137,10X15,32 | 85 °C | -30 °C | PLASTIC/EPOXY | FBGA | BGA137,10X15,32 | RECTANGULAR | 网格排列 | 3 V | 137 | 有 | 有 | EAR99 | 8542.32.00.71 | BOTTOM | BALL | 未说明 | 0.8 mm | unknown | 未说明 | 137 | R-PBGA-B137 | 不合格 | OTHER | 存储器电路 | FLASH+SDRAM | ||||||||||||||||||||||||
![]() | S71JL064HA0BAW01 | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | ADVANCED MICRO DEVICES INC | LFBGA, BGA73,10X12,32 | 70 ns | 4194304 words | 4000000 | 85 °C | -25 °C | PLASTIC/EPOXY | LFBGA | BGA73,10X12,32 | RECTANGULAR | GRID ARRAY, LOW PROFILE, FINE PITCH | 3 V | 73 | 有 | EAR99 | SRAM IS ORGANISED AS 1KX16 | 8542.32.00.71 | BOTTOM | BALL | 1 | 0.8 mm | compliant | R-PBGA-B73 | 不合格 | 3.3 V | OTHER | 2.7 V | ASYNCHRONOUS | 4MX16 | 1.4 mm | 16 | 67108864 bit | 存储器电路 | FLASH+SRAM | 11.6 mm | 8 mm | |||||||||||||||
![]() | MC-222253AF9-B85X-BT3 | NEC Electronics America Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | NEC ELECTRONICS AMERICA INC | 12 X 7 MM, FBGA-77 | 2097152 words | 2000000 | 85 °C | -25 °C | PLASTIC/EPOXY | TFBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | 77 | 无 | e0 | EAR99 | 锡铅 | SRAM IS ORGANISED AS 256 X 16 OR 512K X 8 AND FLASH CAN ALSO BE ORGANISED AS 4M X 8 | 8542.32.00.71 | BOTTOM | BALL | 1 | 0.8 mm | compliant | R-PBGA-B77 | 不合格 | 3.6 V | OTHER | 2.7 V | ASYNCHRONOUS | 2MX16 | 1.2 mm | 16 | 33554432 bit | 存储器电路 | 12 mm | 7 mm | |||||||||||||||||
![]() | MC-242453F9-B10-BT3 | Renesas Electronics Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | RENESAS ELECTRONICS CORP | FBGA, BGA77,8X14,32 | 100 ns | 70 °C | -20 °C | PLASTIC/EPOXY | FBGA | BGA77,8X14,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | 77 | Obsolete | EAR99 | 8542.32.00.71 | BOTTOM | BALL | 0.8 mm | unknown | R-PBGA-B77 | 不合格 | COMMERCIAL | 0.045 mA | 0.00001 A | 存储器电路 | FLASH+SRAM | ||||||||||||||||||||||||||||
![]() | SST34HF324G-70-4E-L3KE | Silicon Storage Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | SILICON STORAGE TECHNOLOGY INC | BGA | LFBGA, | 2097152 words | 2000000 | 85 °C | -20 °C | PLASTIC/EPOXY | LFBGA | RECTANGULAR | GRID ARRAY, LOW PROFILE, FINE PITCH | 3 V | 48 | Obsolete | EAR99 | SRAM IS ORGANISED AS 256K X 16 | 8542.32.00.71 | BOTTOM | BALL | 1 | 0.8 mm | unknown | 48 | R-PBGA-B48 | 不合格 | 3.3 V | OTHER | 2.7 V | ASYNCHRONOUS | 2MX16 | 1.4 mm | 16 | 33554432 bit | 存储器电路 | 8 mm | 6 mm | |||||||||||||||||
![]() | SST34HF324G-70-4E-L3KE | Greenliant Systems Ltd | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | GREENLIANT SYSTEMS LTD | , | Obsolete | EAR99 | 8542.32.00.71 | compliant | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | PTN3500 | Philips Semiconductors | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | DXM1200-X2 | Banner Engineering Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Box | DXM1200 | 活跃 | 无线控制器 | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC17S20XLVOG8I | AMD Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | XILINX INC | TSOP | TSOP2, | 3 | 179160 words | 179160 | 85 °C | -40 °C | PLASTIC/EPOXY | TSOP2 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | 3.3 V | 8 | 有 | e3 | 有 | EAR99 | Matte Tin (Sn) | 8542.32.00.71 | DUAL | 鸥翼 | 260 | 1 | 1.27 mm | compliant | 30 | 8 | R-PDSO-G8 | 不合格 | 3.6 V | INDUSTRIAL | 3 V | SYNCHRONOUS | 179160X1 | 1.2 mm | 1 | 179160 bit | 存储器电路 | 4.9 mm | 3.9 mm | |||||||||||
![]() | M4-4102RS-Z3 | Moujen Switch | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | S71GL064A08BFW0B0 | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 活跃 | ADVANCED MICRO DEVICES INC | FBGA, BGA56,8X8,32 | 100 ns | 85 °C | -25 °C | PLASTIC/EPOXY | FBGA | BGA56,8X8,32 | SQUARE | GRID ARRAY, FINE PITCH | 56 | 有 | EAR99 | 8542.32.00.71 | BOTTOM | BALL | 0.8 mm | compliant | S-PBGA-B56 | 不合格 | OTHER | 0.06 mA | 0.000005 A | 存储器电路 | FLASH+SRAM |